CN220509869U - Patch type ceramic capacitor - Google Patents
Patch type ceramic capacitor Download PDFInfo
- Publication number
- CN220509869U CN220509869U CN202321694177.7U CN202321694177U CN220509869U CN 220509869 U CN220509869 U CN 220509869U CN 202321694177 U CN202321694177 U CN 202321694177U CN 220509869 U CN220509869 U CN 220509869U
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- CN
- China
- Prior art keywords
- welding
- pins
- chip
- welding part
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 61
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a patch type ceramic capacitor, which comprises a ceramic chip, an insulating encapsulation body and two pins, wherein electrodes are respectively arranged on the upper surface and the lower surface of the ceramic chip, the electrodes correspond to the pins one by one, the pins comprise first welding parts and extending parts, and the first welding parts are welded with the corresponding electrodes; the ceramic chip, the electrode and the first welding part are encapsulated by the insulating encapsulation body, and the extending parts of the pins are positioned outside the insulating encapsulation body, and the ceramic chip is characterized in that: at least one notch is formed in the edge of the first welding part. The chip ceramic capacitor can increase the welding area between the welding part of the pins and the electrode, so that the pins are welded more firmly.
Description
Technical Field
The utility model relates to a capacitor, in particular to a patch type ceramic capacitor.
Background
In recent years, mounted electronic components (also called chip electronic components, or electronic components suitable for surface mounting) have been increasingly used, and research and development of mounted electronic components have been widely conducted in the industry. The ceramic capacitor generally comprises a ceramic chip, an insulating encapsulation body and two pins, wherein the upper surface and the lower surface of the ceramic chip are respectively provided with electrodes, the pins comprise welding parts and extending parts, the welding parts of the pins are welded with the corresponding electrodes, the insulating encapsulation body encapsulates the welding parts of the ceramic chip, the electrodes and the pins, and the extending parts of the pins are positioned outside the insulating encapsulation body. Usually, the pin of the chip ceramic capacitor is in a sheet shape, the welding part of the pin is in a plane shape, the welding part of the pin is welded with the electrode by soldering tin, however, because the welding part of the pin is in a plane shape, the welding part of the pin is attached to the electrode during welding, and therefore the soldering tin is intensively distributed at the edge part of the welding part of the pin, so that only the edge part of the welding part of the pin and the electrode is actually welded, the connection between the pin and the electrode is not firm enough, and the situation of detachment easily occurs.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a patch type ceramic capacitor, which can increase the welding area between the welding part of a pin and an electrode and ensure that the pin is welded more firmly.
In order to solve the technical problems, the technical scheme adopted is as follows:
the surface-mounted ceramic capacitor comprises a ceramic chip, an insulating encapsulation body and two pins, wherein electrodes are respectively arranged on the upper surface and the lower surface of the ceramic chip, the electrodes correspond to the pins one by one, the pins comprise first welding parts and extending parts, and the first welding parts are welded with the corresponding electrodes; the ceramic chip, the electrode and the first welding part are encapsulated by the insulating encapsulation body, and the extending parts of the pins are positioned outside the insulating encapsulation body, and the ceramic chip is characterized in that: at least one notch is formed in the edge of the first welding part.
In the chip ceramic capacitor, the plurality of notches are formed in the edge of the first welding part, so that the outer edge distance of the first welding part can be prolonged, and when welding, soldering tin can infiltrate into the grooves formed by the notches after being heated and melted, so that the whole welding area of the first welding part and the electrode is increased, the welding area can be also made to be close to the middle position of the pin, and the pin is welded more firmly and is not easy to separate.
Typically, the insulating envelope is made of a material (such as epoxy resin, plastic, etc.) having an insulating flame retardant function.
In a preferred scheme, a plurality of notches are formed on the edge of the first welding part.
In the preferred scheme, a plurality of notches are formed on the edges of the two sides of the first welding part. Gaps are formed on the edges of two sides of the first welding part, so that the firmness of welding of the two sides of the first welding part can be ensured, and the first welding part is more firmly connected with the corresponding electrode.
In a further preferred embodiment, the number of notches on two side edges of the first welding part is the same, and the positions of the notches are in one-to-one correspondence.
In another further preferred embodiment, the notches at the two side edges of the first welding part are staggered.
In a preferred embodiment, the front end of the first welding portion is arc-shaped. The front and rear direction, the welding position of the first welding part and the electrode is the front, the connecting position of the first welding part and the extending part is the rear,
typically, the extension ends of the pins have a second weld, the second welds of the two pins being in the same plane. The second soldering portion serves as a portion where the chip ceramic capacitor is soldered to a pad on the printed circuit board.
The utility model has the beneficial effects that: the chip ceramic capacitor can improve the welding area between the pins and the electrodes, so that the pins are welded more firmly, and the welding part is not easy to separate.
Drawings
Fig. 1 is a schematic structural diagram of a chip ceramic capacitor according to embodiment 1 of the present utility model;
FIG. 2 is a top view of the lead in embodiment 1 of the utility model soldered to the electrode;
fig. 3 is a top view of the lead welded to the electrode in embodiment 2 of the present utility model.
Detailed Description
The utility model is further described with reference to the accompanying drawings and specific embodiments:
example 1
1-2, a chip ceramic capacitor comprises a ceramic chip 1, an insulating encapsulation body 2 and two pins 3, wherein electrodes 101 are respectively arranged on the upper surface and the lower surface of the ceramic chip 1, the electrodes 101 are in one-to-one correspondence with the pins 3, the pins 3 comprise first welding parts 301 and extension parts 302, and the first welding parts 301 are welded with the corresponding electrodes 101; the insulating encapsulation body 2 encapsulates the ceramic chip 1, the electrode 101 and the first welding part 301, the extension part 302 of the pin 3 is positioned outside the insulating encapsulation body 2, and a plurality of notches 3011 are formed at the edge of the first welding part 301.
In the chip ceramic capacitor, the plurality of notches 3011 are formed at the edge of the first welded portion 301, so that the distance between the outer edges of the first welded portion 301 can be increased, and during welding, solder can infiltrate into the grooves formed by the notches 3011 after being melted by heating, so that the whole welding area of the first welded portion 301 and the electrode 101 is increased, the welding area can be also made to be close to the middle position of the pin 3, and the pin 3 can be welded more firmly and is not easy to separate.
The insulating encapsulation body 2 is made of a material with an insulating flame-retardant function. A plurality of notches 3011 are formed on two side edges of the first welding portion 301, and the positions of the notches 3011 are in one-to-one correspondence. Gaps 3011 are formed at the edges of the two sides of the first welding part 301, so that the welding firmness of the two sides of the first welding part 301 can be ensured, and the first welding part 301 is more firmly connected with the corresponding electrode 101.
The extension 302 of the pin 3 has a second soldering portion 303 at the end thereof, and the second soldering portions 303 of the two pins 3 are on the same plane. The second soldering portion 303 serves as a site where the chip ceramic capacitor is soldered to a pad on the printed circuit board.
Example 2
This embodiment differs from embodiment 1 in that: as shown in fig. 3, the notches 3011 'on both side edges of the first welded portion 301' are offset from each other.
Claims (4)
1. The surface-mounted ceramic capacitor comprises a ceramic chip, an insulating encapsulation body and two pins, wherein electrodes are respectively arranged on the upper surface and the lower surface of the ceramic chip, the electrodes correspond to the pins one by one, the pins comprise first welding parts and extending parts, and the first welding parts are welded with the corresponding electrodes; the ceramic chip, the electrode and the first welding part are encapsulated by the insulating encapsulation body, and the extending parts of the pins are positioned outside the insulating encapsulation body, and the ceramic chip is characterized in that: the edge of the first welding part is provided with a plurality of notches.
2. A chip ceramic capacitor as defined in claim 1, wherein: a plurality of notches are formed on the edges of two sides of the first welding part.
3. A chip ceramic capacitor as claimed in claim 2, wherein: the number of the notches at the edges of the two sides of the first welding part is the same, and the positions of the notches are in one-to-one correspondence.
4. A chip ceramic capacitor as claimed in claim 2, wherein: notch positions at two side edges of the first welding part are staggered with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321694177.7U CN220509869U (en) | 2023-06-30 | 2023-06-30 | Patch type ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321694177.7U CN220509869U (en) | 2023-06-30 | 2023-06-30 | Patch type ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220509869U true CN220509869U (en) | 2024-02-20 |
Family
ID=89872543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321694177.7U Active CN220509869U (en) | 2023-06-30 | 2023-06-30 | Patch type ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220509869U (en) |
-
2023
- 2023-06-30 CN CN202321694177.7U patent/CN220509869U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |