CN220493478U

CN220493478U - Radiator for semiconductor

Info

Publication number: CN220493478U
Application number: CN202322173549.8U
Authority: CN
Inventors: 王青英; 廖路娜; 廖加胜
Original assignee: Sichuan Jueyuanxiang Semiconductor Technology Co ltd
Current assignee: Sichuan Jueyuanxiang Semiconductor Technology Co ltd
Priority date: 2023-08-13
Filing date: 2023-08-13
Publication date: 2024-02-13
Anticipated expiration: 2033-08-13

Abstract

The utility model discloses a radiator for a semiconductor, which relates to the technical field of semiconductor heat radiation, and comprises a circuit board and a semiconductor, wherein the semiconductor is fixedly arranged on the upper wall surface of the circuit board, a heat radiation structure is movably arranged on the upper wall surface of the semiconductor, two side wall surfaces of the heat radiation structure are respectively fixedly provided with a fixing frame structure, a plurality of heat radiation holes are formed in the heat radiation structure, a water cooling structure is welded in the heat radiation holes of the heat radiation structure, an air cooling structure is arranged on the upper wall surfaces of the two fixing frame structures, and two mounting holes are formed in the upper wall surface of the circuit board; the utility model integrates two heat dissipation methods of air cooling heat dissipation and water cooling heat dissipation, can conduct targeted selective heat dissipation under the condition of ensuring normal operation of the semiconductor, ensures the lowest energy consumption and is quite environment-friendly.

Description

Radiator for semiconductor

Technical Field

The utility model relates to the technical field of semiconductor heat dissipation, in particular to a radiator for a semiconductor.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, most of electronic products such as a core unit in a computer, a mobile phone or a digital recorder are closely related with the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is one of the most influencing materials in the application of various semiconductor materials.

When the semiconductor works, the working efficiency of the semiconductor is closely related to the power consumption of the semiconductor, when the semiconductor works in a full load state, a large amount of heat can be generated, if the semiconductor does not dissipate heat, the semiconductor can be damaged at high temperature, the heat dissipation structure is divided into air cooling and water cooling at present, the air cooling consumes lower energy, the air cooling effect is general, the water cooling effect is good, but the energy consumption is higher, and if the water cooling works in a low power consumption state of the semiconductor, the heat dissipation redundancy can occur, so that unnecessary energy waste is caused. Thus, a heat sink for a semiconductor is proposed herein.

Disclosure of Invention

Technical problem to be solved

The utility model aims to overcome the defects of the prior art and provides a radiator for a semiconductor.

Technical proposal

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a radiator for semiconductor, includes circuit board and semiconductor, semiconductor fixed mounting is in the upper wall of circuit board, the upper wall movable mounting of semiconductor has heat radiation structure, two lateral wall faces of heat radiation structure fixed mounting have the mount structure respectively, a plurality of louvres have been seted up to heat radiation structure's inside, heat radiation structure's louvre inside welding has water-cooling structure, two air-cooling structure is installed to the upper wall of mount structure, two mounting holes have been seted up to the upper wall of circuit board.

Preferably, the heat dissipation structure includes: a heat conducting plate and a plurality of radiating fins; the heat conducting plate is movably arranged on the upper wall surface of the semiconductor, the radiating fins are respectively and fixedly arranged on the upper wall surface of the heat conducting plate, and the heat conducting plate is internally provided with a plurality of radiating holes.

Preferably, the fixing frame structure includes: the fixing plate, two fixing bolts and two fixing nuts; the fixing plate is fixedly arranged on the side wall surface of the heat conducting plate, two mounting holes are formed in the upper wall surface of the fixing plate, two fixing bolts respectively penetrate through the two mounting holes of the fixing plate and the two mounting holes formed in the circuit board, and two fixing nuts are movably arranged outside the two fixing bolts through threads.

Preferably, the water cooling structure includes: the cooling device comprises a cooling pipe, two guide pipes, a refrigerating pipe, a refrigerating box and a pump body; the cooling pipes are fixedly arranged in the plurality of cooling holes of the heat conducting plate, the two guide pipes are respectively and fixedly arranged at two ends of the cooling pipes, the cooling pipes are fixedly arranged on the side wall surfaces of the two guide pipes, the cooling box is sleeved outside the cooling pipes, and the pump body is sleeved outside the guide pipes.

Preferably, the air cooling structure includes: an air-cooled support frame, an air-cooled motor and air-cooled fan blades; the air cooling support frame is fixedly arranged on the upper wall surface of the fixing plate, the air cooling motor is fixedly arranged in the air cooling support frame, and the air cooling fan blade is fixedly arranged at the driving end of the air cooling motor.

Preferably, the side wall surface of the air cooling support frame is provided with a plurality of air inlet holes.

The beneficial effects are that: the utility model integrates two heat dissipation methods of air cooling heat dissipation and water cooling heat dissipation, can conduct targeted selective heat dissipation under the condition of ensuring normal operation of the semiconductor, ensures the lowest energy consumption and is quite environment-friendly.

Compared with the prior art, the radiator for the semiconductor has the following beneficial effects:

1. according to the utility model, the heat radiation structure can transfer heat generated by the semiconductor during operation, and the heat radiation structure can increase the contact area of the semiconductor and the atmosphere because the contact area of the semiconductor and the atmosphere is too small, so that the heat radiation effect of the semiconductor is improved.

2. According to the utility model, through the fixing frame structure, the fixing frame structure is used for fixing the heat dissipation structure, the heat dissipation structure can be tightly attached to the semiconductor by the fixing frame structure, and the heat transfer efficiency of the semiconductor is ensured.

3. According to the utility model, through the water cooling structure, the heat dissipation effect of the semiconductor can be further improved, and particularly, the semiconductor can be ensured to work normally when the semiconductor works at high power.

4. According to the utility model, the semiconductor can be cooled by the air cooling structure, and the semiconductor can work with minimum energy consumption on the premise of ensuring the normal working state of the semiconductor, so that the energy is saved to a certain extent.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a heat dissipating structure according to the present utility model;

FIG. 3 is a schematic view of a water cooling structure according to the present utility model;

fig. 4 is a schematic diagram of an air cooling structure of the present utility model.

In the figure:

1. a circuit board; 2. a semiconductor; 3. a heat conductive plate; 4. a heat sink; 5. a fixing plate; 6. a fixing bolt; 7. a fixing nut; 8. a heat radiating pipe; 9. a conduit; 10. a refrigeration tube; 11. a refrigeration box; 12. a pump body; 13. an air-cooled support frame; 14. an air-cooled motor; 15. air-cooled fan blades; 16. and an air inlet hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 to 4, the present utility model provides a technical solution: a heat spreader for a semiconductor, comprising: the circuit board 1 and the semiconductor 2, the semiconductor 2 fixed mounting is at the upper wall of circuit board 1, and semiconductor 2's upper wall movable mounting has heat radiation structure, and two lateral wall fixed mounting has the mount structure respectively, and a plurality of louvres have been seted up to heat radiation structure's inside, and heat radiation structure's louvre inside welding has water cooling structure, and air cooling structure is installed to two mount structure's upper wall, and two mounting holes have been seted up to circuit board 1's upper wall.

Referring to fig. 2, the heat dissipation structure includes: a heat-conducting plate 3 and a plurality of heat-radiating fins 4; the heat conducting plate 3 is movably arranged on the upper wall surface of the semiconductor 2, the plurality of radiating fins 4 are respectively and fixedly arranged on the upper wall surface of the heat conducting plate 3, a plurality of radiating holes are formed in the heat conducting plate 3, the radiating structure can transfer heat generated by the operation of the semiconductor 2, and the radiating structure can increase the contact area of the semiconductor 2 and the atmosphere because the contact area of the semiconductor 2 and the atmosphere is too small, so that the radiating effect of the semiconductor 2 is improved.

Referring to fig. 2, the fixing frame structure includes: a fixing plate 5, two fixing bolts 6 and two fixing nuts 7; the fixed plate 5 is fixedly installed on the side wall surface of the heat conducting plate 3, two mounting holes are formed in the upper wall surface of the fixed plate 5, two fixing bolts 6 respectively penetrate through the two mounting holes of the fixed plate 5 and the two mounting holes formed in the circuit board 1, two fixing nuts 7 are respectively movably installed outside the two fixing bolts 6 through threads, the fixing frame structure is used for fixing a heat dissipation structure, the heat dissipation structure can be tightly attached to the semiconductor 2, and the heat transfer efficiency of the semiconductor 2 is guaranteed.

Referring to fig. 3, the water cooling structure includes: a radiating pipe 8, two guide pipes 9, a refrigerating pipe 10, a refrigerating box 11 and a pump body 12; the radiating pipes 8 are fixedly arranged in the plurality of radiating holes of the heat conducting plate 3, the two guide pipes 9 are respectively and fixedly arranged at two ends of the radiating pipes 8, the refrigerating pipes 10 are fixedly arranged on the side wall surfaces of the two guide pipes 9, the refrigerating boxes 11 are sleeved outside the refrigerating pipes 10, the pump body 12 is sleeved outside the guide pipes 9, and the water cooling structure can further improve the radiating effect of the semiconductor device, especially the semiconductor device 2 can work at high power and ensure the normal work of the semiconductor device 2.

Referring to fig. 4, the air cooling structure includes: an air-cooled support frame 13, an air-cooled motor 14 and air-cooled fan blades 15; the air cooling support frame 13 is fixedly arranged on the upper wall surface of the fixed plate 5, the air cooling motor 14 is fixedly arranged in the air cooling support frame 13, the air cooling fan blades 15 are fixedly arranged at the driving end of the air cooling motor 14, a plurality of air inlet holes 16 are formed in the side wall surface of the air cooling support frame 13, the air cooling structure can radiate the semiconductor 2, and the semiconductor cooling device can work with minimum energy consumption on the premise of ensuring the normal working state of the semiconductor 2, so that energy sources are saved to a certain extent.

Working principle: when the utility model is used, an external alternating current power supply is firstly connected to the utility model to provide energy for the electric appliance, then an operator injects cooling liquid into a sealed space formed by the radiating pipe 8, the two guide pipes 9 and the refrigerating pipe 10, thus completing the preparation work of the utility model, the utility model has two working states, namely a light radiating state and a high-strength radiating state, when the light radiating is carried out, the semiconductor 2 is in low-power-consumption working, the air-cooled motor 14 starts working, the air-cooled fan blades 15 are driven to rotate by the rotation of the air-cooled motor 14, the heat generated by the working of the semiconductor 2 is transferred to the inside of the radiating fins 4 through the heat conducting plate 3, the air flow rate of the surfaces of the radiating fins 4 is accelerated by the rotating air-cooled fan blades 15, so that the radiating of the semiconductor 2 is accelerated, and when the high-strength radiating is carried out, the semiconductor 2 is in high-power-consumption working, the pump body 14 rotates and simultaneously starts working, the heat generated by the working of the semiconductor 2 is transferred to the cooling liquid through the pipe 8, and when the pump body 12 starts working, and the cooling liquid is circulated to the refrigerating pipe 10 at the inner side of the refrigerating pipe 10, and the cooling liquid is cooled by the cooling box 11 when the cooling liquid is cooled by the cooling pipe 10.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a radiator for semiconductor, includes circuit board (1) and semiconductor (2), its characterized in that, semiconductor (2) fixed mounting is at the upper wall of circuit board (1), the upper wall movable mounting of semiconductor (2) has heat radiation structure, two lateral wall of heat radiation structure fixed mounting have mount structure respectively, a plurality of louvres have been seted up to heat radiation structure's inside, heat radiation structure's louvre inside welding has water-cooling structure, two air-cooling structure is installed to mount structure's upper wall, two mounting holes have been seted up to circuit board (1) upper wall.

2. A heat sink for a semiconductor according to claim 1, wherein the heat dissipation structure comprises: a heat conducting plate (3) and a plurality of radiating fins (4);

the heat conducting plate (3) is movably arranged on the upper wall surface of the semiconductor (2), the radiating fins (4) are respectively and fixedly arranged on the upper wall surface of the heat conducting plate (3), and a plurality of radiating holes are formed in the heat conducting plate (3).

3. A heat sink for a semiconductor according to claim 1, wherein the mount structure comprises: a fixing plate (5), two fixing bolts (6) and two fixing nuts (7);

the fixing plate (5) is fixedly arranged on the side wall surface of the heat conducting plate (3), two mounting holes are formed in the upper wall surface of the fixing plate (5), two fixing bolts (6) respectively penetrate through the two mounting holes of the fixing plate (5) and the two mounting holes formed in the circuit board (1), and two fixing nuts (7) are respectively movably mounted outside the two fixing bolts (6) through threads.

4. The heat sink for a semiconductor according to claim 1, wherein the water cooling structure comprises: a radiating pipe (8), two guide pipes (9), a refrigerating pipe (10), a refrigerating box (11) and a pump body (12);

the cooling tube (8) is fixedly arranged in a plurality of cooling holes of the heat-conducting plate (3), the two guide tubes (9) are respectively and fixedly arranged at two ends of the cooling tube (8), the refrigerating tube (10) is fixedly arranged on the side wall surfaces of the two guide tubes (9), the refrigerating box (11) is sleeved outside the refrigerating tube (10), and the pump body (12) is sleeved outside the guide tubes (9).

5. A heat sink for a semiconductor according to claim 1, wherein the air cooling structure comprises: an air cooling support frame (13), an air cooling motor (14) and air cooling fan blades (15);

the air cooling support frame (13) is fixedly arranged on the upper wall surface of the fixed plate (5), the air cooling motor (14) is fixedly arranged in the air cooling support frame (13), and the air cooling fan blades (15) are fixedly arranged at the driving end of the air cooling motor (14).

6. The radiator for semiconductors according to claim 5, characterized in that the lateral wall of the air-cooled support frame (13) is provided with a plurality of air inlet holes (16).