CN220432972U - Heating assembly - Google Patents

Abstract

The utility model discloses a heating component, which comprises a heating element, a telescopic part and a supporting part, wherein the supporting part comprises a plurality of sub-supporting parts, the plurality of sub-supporting parts are respectively connected to the same surface of the heating element through at least one telescopic part, and the telescopic part can be lengthened or shortened to adjust the distance between the sub-supporting parts connected with the telescopic part and the heating element. According to the heating assembly, the plurality of sub-supporting pieces are respectively connected to the same surface of the heating piece through the at least one telescopic component, and the distance between the connected sub-supporting pieces and the heating piece can be adjusted through the extension or shortening of the telescopic component, so that the temperature of each part of the carrier plate and the silicon wafer carried by the carrier plate on the plurality of sub-supporting pieces is the same, the fact that the same silicon wafer is heated at different positions is basically uniform is achieved, the temperature difference at different positions of the same silicon wafer is avoided, the same set temperature is achieved at each position of the silicon wafer during film coating, the film coating quality of the silicon wafer is improved, and the efficiency of the battery piece is guaranteed.

Description

Heating assembly

Technical Field

The utility model relates to the technical field of photovoltaics, in particular to a heating component.

Background

Along with the continuous development of the photovoltaic industry, photovoltaic products are continuously updated, and the requirements on the photovoltaic products are also higher and higher. In the production process of the solar cell, a Plasma Enhanced Chemical Vapor Deposition (PECVD) method is needed to complete film coating, and in the film coating process, the temperature of the silicon wafer has a great influence on film coating quality. The existing PECVD plate type coating machine is provided with a heating cavity in front of the process cavity for heating the carrier plate and the silicon wafer so as to ensure that the silicon wafer is in an optimal coating state during coating.

The heating device of the PECVD plate type coating machine can be realized in various types, and the currently excellent heating method is to heat the heating cavity in front of the process cavity of the PECVD plate type coating machine by using a planar heating plate with the same size as the carrier plate. The design structure of the planar heating plate is an integral cuboid plate, electric energy is converted into internal energy of the planar heating plate through the resistance wire, and heat is transferred to the silicon wafer and the carrier plate through heat radiation and heat conduction, so that the silicon wafer is at the optimal coating temperature when entering the process cavity for deposition, and the conversion efficiency of the battery piece is improved. The current plane hot plate and carrier plate are plane platy structure together, and arbitrary position on the plane hot plate is equal to the perpendicular distance of carrier plate, because resistance wire evenly distributed in the plane hot plate, plane hot plate central part can receive more heat conduction and heat radiation than its marginal portion to make plane hot plate central zone temperature be higher than its marginal zone temperature, lead to the temperature of the central zone of silicon chip on the carrier plate to be higher than the temperature of marginal zone, the silicon chip different positions on the same carrier plate are heated unevenly promptly, cause the temperature variation, the silicon chip different positions are difficult to reach the settlement temperature, influence the coating quality of silicon chip, cause the efficiency of partial battery piece to be lower.

Disclosure of Invention

Based on this, in the conventional technology, the temperature of the central area of the silicon wafer is higher than the temperature of the edge area, so that the same silicon wafer is heated unevenly to cause temperature difference, and when in film coating, the different positions on the silicon wafer are difficult to reach the set temperature, so that the film coating quality of the silicon wafer is affected, and the efficiency of part of the battery pieces is lower. The heating component can realize that the temperature of the central area of the silicon wafer is basically the same as the temperature of the edge area of the silicon wafer, realize that the same silicon wafer is basically heated at different positions, avoid the temperature difference at different positions of the same silicon wafer, ensure that each position on the silicon wafer reaches the same set temperature during film coating, improve the film coating quality of the silicon wafer and ensure the efficiency of the battery piece.

An embodiment of the present application provides a heating assembly.

The utility model provides a heating element, includes heating element, telescopic member and supporting part, the supporting part includes a plurality of sub-supports, and is a plurality of sub-supports respectively through at least one telescopic member connect in the same surface of heating element, telescopic member can lengthen or shorten in order to adjust its connection sub-support with distance between the heating element.

In some embodiments, the supporting component includes a first sub-supporting component and a plurality of second sub-supporting components, the second sub-supporting components are in ring structures, different sizes of the second sub-supporting components are different, the second sub-supporting components are all arranged around the first sub-supporting components, the second sub-supporting components with different sizes are sequentially sleeved from inside to outside to form concentric rings with the first sub-supporting components as centers, at least one telescopic component is connected to each of the first sub-supporting components and the second sub-supporting components, and any adjacent second sub-supporting components and adjacent second sub-supporting components can move relatively independently.

In some of these embodiments, the contact fit is between the adjacent second sub-supports and between the first sub-support and its adjacent second sub-support.

In some embodiments, mutually-matched grooves and protrusions are respectively arranged on the mutually-contacted side walls of the adjacent second sub-supports and the mutually-contacted side walls of the first sub-supports and the adjacent second sub-supports, the corresponding grooves are in embedded fit with the protrusions, and the protrusions can slide relative to the grooves.

In some embodiments, the groove is arranged on a side wall, close to the first sub-support, of the second sub-support, the lug is arranged on a side wall, far away from the first sub-support, of the second sub-support, and the lug is arranged on a side wall, facing the first sub-support, of the second sub-support adjacent to the first sub-support.

In some embodiments, the inner wall of the groove gradually narrows from the bottom of the groove to the direction of the notch, and the convex block gradually expands from the notch of the groove to the bottom of the groove, so that the convex block is in contact fit with the corresponding groove.

In some embodiments, the telescopic component includes a first telescopic member and a second telescopic member, the first sub-supporting member and the second sub-supporting member are respectively connected with the first telescopic member, the second telescopic member corresponding to the first telescopic member is respectively connected to the heating member, and the first telescopic member is movably connected with the corresponding second telescopic member.

In some embodiments, the first sub-support and the second sub-support are detachably connected to the corresponding first telescopic members, and each of the second telescopic members is detachably connected to the heating member.

In some of these embodiments, the telescoping members further comprise a drive member coupled to the first telescoping member and/or the second telescoping member, the drive member for driving to effect movement of the first telescoping member relative to the second telescoping member.

In some embodiments, the heating element is a multi-stage boss structure, the multi-stage boss structure is stepped from the center position to the edge position of the heating element, the boss structure at the most center position corresponds to the first sub-supporting element, and the other boss structures respectively correspond to one second sub-supporting element.

Above-mentioned heating element, through setting up a plurality of sub-supporting pieces, a plurality of sub-supporting pieces are connected in the same surface of heating piece through at least one telescopic part respectively, the distance between sub-supporting piece and the heating piece that can adjust its connection through telescopic part extension or shorten, thereby realize that the support plate on a plurality of sub-supporting pieces and the silicon chip each position temperature that bears are the same basically, it is basically even to realize that same silicon chip different positions are heated, avoid the temperature difference to appear in same silicon chip different positions, each position on the silicon chip reaches the same settlement temperature when the coating film, improve the coating film quality of silicon chip, guarantee the efficiency of battery piece. Further, the heating assembly can adjust the vertical distance between different sub-supporting pieces and the heating piece through different telescopic parts, more experimental schemes can be selected when temperature experiments are carried out, meanwhile, multiple temperature experiments in different areas on one carrier plate can be realized, the purpose of independently adjusting the temperature of different positions of the silicon wafer is achieved, and time is saved.

According to the heating assembly, the second sub-supporting piece is of the annular structure, the temperatures of the areas, which are approximately the same in distance from the center, on the carrier plate and the silicon wafer carried by the carrier plate can be basically the same, and when any second sub-supporting piece is adjusted, the temperature of an annular area can be adjusted simultaneously.

Above-mentioned heating element, through setting up lug and recess, realized between arbitrary adjacent second sub-support and between first sub-support and its adjacent second sub-support all can the relative independent motion outside, can also restrict between arbitrary adjacent second sub-support and between first sub-support and its adjacent second sub-support can not break away from, guaranteed the whole integrality of whole supporting part.

Above-mentioned heating element is through setting up multistage boss structure to multistage boss structure is the ladder from the central point of heating element to edge position and reduces and to realize that the temperature on the hot plate is ladder distribution, the temperature adjustment of second sub-support piece and first sub-support piece of convenient regulation different positions.

Above-mentioned heating element, through setting up first sub-support piece, second sub-support piece respectively with corresponding first extensible member detachable connection, each second extensible member is connected with heating element detachable respectively, the dismantlement and the maintenance of first sub-support piece, second sub-support piece of being convenient for.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort to a person skilled in the art.

For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.

FIG. 1 is a schematic front view of a heating assembly according to an embodiment of the present utility model;

FIG. 2 is a schematic front view of a portion of a heating element according to an embodiment of the present utility model;

FIG. 3 is a schematic side view of a heating assembly according to an embodiment of the present utility model;

fig. 4 is a schematic view of a telescopic member of a heating assembly according to an embodiment of the present utility model.

Description of the reference numerals

10. A heating assembly; 100. a heating member; 101. a boss structure; 200. a telescopic member; 201. a first telescopic member; 202. a second telescopic member; 300. a support member; 301. a first sub-support; 302. a second sub-support; 303. a bump; 304. a groove.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present utility model, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The embodiment of the application provides a heating component 10 to solve the temperature that the central region of silicon chip is higher than the temperature in marginal region among the conventional art, lead to same silicon chip different positions to be heated unevenly, cause the temperature difference, different positions on the silicon chip are difficult to reach the settlement temperature when the coating film, influence the coating film quality of silicon chip, cause the problem that the efficiency of partial battery piece is lower. The heating assembly 10 will be described with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic front view of a heating assembly 10 according to an embodiment of the present application. The heating assembly 10 of the present application can be used in a photovoltaic assembly production process, such as a PECVD coating process for a photovoltaic assembly, for heating a silicon wafer.

For a more clear description of the structure of the heating assembly 10, the heating assembly 10 will be described with reference to the accompanying drawings.

Referring to fig. 1, a heating assembly 10 includes a heating element 100, a telescoping member 200, and a support member 300. The support member 300 includes a plurality of sub-supports. The plurality of sub-supports are respectively connected to the same surface of the heating member 100 through at least one telescopic member 200. The telescopic member 200 can be extended or contracted to adjust the vertical distance between the sub-support to which it is coupled and the heating member 100, which refers to the straight distance in the vertical direction between the support member 300 and the heating member 100 in the angle shown in fig. 3.

In some of these embodiments, the support member 300 is generally a flat plate-like structure. The overall shape of the support member 300 may be configured as desired, such as square, rectangular, circular, triangular, etc.

In some of these embodiments, the support member 300 includes a first sub-support 301 and a plurality of second sub-supports 302. The second sub-support 302 has a ring-shaped structure. The different second sub-support 302 is different in size. The plurality of second sub-supports 302 are each disposed around the first sub-support 301. The second sub-supports 302 of different sizes are sleeved in sequence from inside to outside to form concentric rings centered on the first sub-support 301. At least one telescopic member 200 is connected to each of the first sub-support 301 and the second sub-support 302. Any adjacent second sub-support 302 and the first sub-support 301 and its adjacent second sub-support 302 are capable of relative independent movement. In the heating assembly 10, the second sub-supporting members 302 are arranged to be in an annular structure, so that the temperatures of the areas, which are approximately the same in distance from the center, on the carrier plate and the silicon wafer carried by the carrier plate are basically the same, and the temperature of an annular area can be synchronously adjusted when any second sub-supporting member 302 is adjusted.

In some of these embodiments, the shape of the first sub-support 301 and the plurality of second sub-supports 302 is not unique. For example, the first sub-supporting member 301 may be designed in a rectangular, square, triangular, circular shape, etc., and the second sub-supporting member 302 is correspondingly shaped in a strip-shaped annular structure, a square annular structure, a triangular annular structure, a circular annular structure, etc. The number of the second sub-supporters 302 may be set according to actual needs, for example, the number of the second sub-supporters 302 is two, three, four, etc. Referring to fig. 1, the number of first sub-supporters 301 is one, the first sub-supporters 301 are in a square plate-like structure, and the number of second sub-supporters 302 is eight. The second sub-support 302 is a square ring-like structure. Preferably, the width of each second sub-support 302 is equal.

In some embodiments, referring to fig. 1, the adjacent second sub-supports 302 and the first sub-support 301 are in contact fit with the adjacent second sub-supports 302, so that the second sub-supports 302 and the plurality of second sub-supports 302 form a complete flat plate in whole, which is convenient for supporting the silicon wafer.

In some embodiments, referring to fig. 1 and 2, fig. 2 is a schematic front view of a portion of a heating assembly 10 according to an embodiment of the present utility model, on the side walls of adjacent second sub-supports 302 that are in contact with each other, and on the side walls of adjacent first sub-supports 301 that are in contact with adjacent second sub-supports 302, mutually matched grooves 304 and protrusions 303 are respectively provided, and the corresponding grooves 304 are in embedded engagement with the protrusions 303, and the protrusions 303 are capable of sliding relative to the grooves 304. It should be noted that, since the first sub-support 301 and the second sub-support 302 have a certain thickness, the side walls of the first sub-support 301 and the second sub-support 302 may be provided with the grooves 304 and the protrusions 303, so as to define the positions between the adjacent second sub-supports 302, and avoid the falling-off phenomenon of the second sub-support 302. The thickness of the support member 300 may be set as desired.

In some of these embodiments, a groove 304 is provided in the sidewall of the second sub-support 302 adjacent to the first sub-support 301. The side wall of the second sub-support 302 far from the first sub-support 301 is provided with a bump 303, and the side wall of the first sub-support 301 facing the adjacent second sub-support 302 is provided with a bump 303.

In a specific example, referring to fig. 1, when the number of the first sub-supporters 301 is one and the number of the second sub-supporters 302 is eight, four sidewalls of the first sub-supporters 301 are respectively provided with one bump 303, four sidewall positions of the first to fourth second sub-supporters 302, which are far from the first sub-supporters 301, from inside to outside are respectively provided with one bump 303, and correspondingly, four sidewall positions of the first to fifth second sub-supporters 302, which are near the first sub-supporters 301, from inside to outside are respectively provided with one groove 304. Two protrusions 303 are respectively disposed at four side wall positions of the fifth to eighth second sub-supports 302 from inside to outside, which are far from the first sub-supports 301, and correspondingly, two grooves 304 are respectively disposed at four side wall positions of the sixth to eighth second sub-supports 302 from inside to outside, which are near to the first sub-supports 301.

In one embodiment, referring to fig. 1, one telescopic member 200 is connected to the first sub-support 301, and two telescopic members 200 are respectively disposed on each second sub-support 302, where the two telescopic members 200 on each second sub-support 302 may be disposed on two arms thereof in opposition, or disposed in opposite diagonal positions. The plurality of telescopic components 200 are respectively arranged on the second sub-support 302, so that the second sub-support 302 can move integrally, and the situation that one part of the second sub-support 302 does not move in unison with other parts can not occur.

In some of these embodiments, the groove inner wall of the groove 304 tapers from its groove bottom surface to its groove mouth direction, as shown in fig. 2. The protrusions 303 gradually expand from the notch of the groove 304 to the bottom of the groove, so that the protrusions 303 are in contact fit with the corresponding grooves 304. The heating assembly 10, through the provision of the protruding blocks 303 and the grooves 304, can realize that any adjacent second sub-supporting members 302 and any adjacent first sub-supporting members 301 and adjacent second sub-supporting members 302 can move independently, and can also limit any adjacent second sub-supporting members 302 and any adjacent first sub-supporting members 301 and adjacent second sub-supporting members 302 from being separated, so that the overall integrity of the whole supporting member 300 is ensured.

In some embodiments, the grooves 304 may be configured as trapezoid grooves, triangle grooves, and the like, and the protrusions 303 are correspondingly configured as trapezoid blocks, triangle blocks, and the like, that is, the shapes of the grooves 304 and the protrusions 303 can ensure that any adjacent second sub-supporting members 302 and the first sub-supporting members 301 and the adjacent second sub-supporting members 302 are not separated from each other, and the shapes of left and right movement are not generated.

In some embodiments, referring to fig. 3 and 4, fig. 3 is a schematic side view of a heating assembly 10 according to an embodiment of the utility model, and fig. 4 is a schematic view of a telescopic member 200 of the heating assembly 10 according to an embodiment of the utility model, wherein the telescopic member 200 includes a first telescopic member 201 and a second telescopic member 202. The first sub-supporting member 301 and the second sub-supporting member 302 are respectively connected with the first telescopic member 201. The second telescopic members 202 corresponding to the first telescopic members 201 are respectively connected to the heating members 100, and the first telescopic members 201 are movably connected with the corresponding second telescopic members 202.

In some embodiments, referring to fig. 3, the first sub-support 301 and the second sub-support 302 are detachably connected to the corresponding first telescopic member 201, respectively. Each second expansion member 202 is detachably connected to the heating element 100. The heating assembly 10 is provided with the first sub-supporting member 301 and the second sub-supporting member 302, which are detachably connected with the corresponding first telescopic members 201, respectively, and the second telescopic members 202 are detachably connected with the heating member 100, so that the first sub-supporting member 301 and the second sub-supporting member 302 can be conveniently detached and maintained.

In some of these embodiments, the telescoping member 200 also includes a drive member. The driving part is connected with the first telescopic part 201 and/or the second telescopic part 202, and the driving part is used for driving to realize the movement of the first telescopic part 201 relative to the second telescopic part 202. The driving member is not shown in the drawings. In this application, the cooperation of drive unit and first extensible member 201, second extensible member 202 has characteristics such as small, bearing capacity is strong, stationarity is good.

In some embodiments, referring to fig. 4, one end of the first telescopic member 201 has an external thread, one end of the second telescopic member 202 has an external thread, the first sub-supporting member 301 and the second sub-supporting member 302 are in threaded connection with the corresponding first telescopic member 201, and each second telescopic member 202 is in threaded connection with the heating member 100.

In some embodiments, referring again to fig. 3, the heating element 100 is a multi-stage boss structure 101. The multi-stage boss structure 101 is stepped from the center position to the edge position of the heating element 100, the boss structure 101 located at the most center position corresponds to the first sub-supporting element 301, and other boss structures 101 respectively correspond to one second sub-supporting element 302. Above-mentioned heating element 10 is through setting up multistage boss structure 101 to multistage boss structure 101 is the ladder from the central point of heating element 100 to edge position and reduces and can realize that the temperature on the hot plate is ladder distribution, conveniently adjusts the temperature adjustment of the second sub-support 302 and the first sub-support 301 of different positions.

In some of these embodiments, referring again to fig. 3, the heating member 100 may be a heating plate having a plate-like structure.

In summary, in the heating assembly 10, by arranging the plurality of sub-supporting members, the plurality of sub-supporting members are respectively connected to the same surface of the heating member 100 through at least one telescopic member 200, and the distance between the sub-supporting members connected with the heating member 100 can be adjusted by extending or shortening the telescopic member 200, so that the temperature of each part of the silicon wafer and the carrier plate on the plurality of sub-supporting members is the same, the same situation that the same silicon wafer is heated at different positions is basically uniform is realized, the temperature difference at different positions of the same silicon wafer is avoided, the same set temperature is reached at each position on the silicon wafer during film coating, the film coating quality of the silicon wafer is improved, and the efficiency of the battery piece is ensured. Further, the heating assembly 10 can adjust the vertical distance between different sub-supporting members (the first sub-supporting member 301 and the second sub-supporting member 302) and the heating member 100 through different telescopic members 200, so that more experimental schemes can be selected when temperature experiments are performed, meanwhile, multiple temperature experiments in different areas on one carrier plate can be realized, the purpose of independently adjusting the temperature of different positions of the silicon wafer is achieved, and the time for manufacturing the experiments is saved.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A heating assembly (10), characterized by comprising a heating element (100), a telescopic member (200) and a supporting member (300), wherein the supporting member (300) comprises a plurality of sub-supporting members, the plurality of sub-supporting members are respectively connected to the same surface of the heating element (100) through at least one telescopic member (200), and the telescopic member (200) can be extended or shortened to adjust the distance between the sub-supporting members connected with the heating element (100).

2. The heating assembly (10) according to claim 1, wherein the supporting component (300) comprises a first sub-supporting component (301) and a plurality of second sub-supporting components (302), the second sub-supporting components (302) are in a ring-shaped structure, different second sub-supporting components (302) are different in size, the plurality of second sub-supporting components (302) are all arranged around the first sub-supporting component (301), the second sub-supporting components (302) with different sizes are sequentially sleeved from inside to outside to form concentric rings with the first sub-supporting component (301) as a center, at least one telescopic component (200) is respectively connected to the first sub-supporting component (301) and the second sub-supporting component (302), and any adjacent second sub-supporting components (302) and the adjacent second sub-supporting components (302) can move independently.

3. The heating assembly (10) according to claim 2, wherein the contact fit between adjacent second sub-supports (302) and between the first sub-support (301) and its adjacent second sub-support (302) is made.

4. A heating assembly (10) according to claim 3, characterized in that on the mutually contacting side walls of the adjacent second sub-support (302), on the mutually contacting side walls of the first sub-support (301) and its adjacent second sub-support (302) are respectively provided mutually adapted grooves (304) and protrusions (303), the corresponding grooves (304) being in an embedded fit with the protrusions (303) and the protrusions (303) being slidable with respect to the grooves (304).

5. The heating assembly (10) according to claim 4, wherein the second sub-support (302) is provided with the recess (304) on a side wall close to the first sub-support (301), the second sub-support (302) is provided with the projection (303) on a side wall remote from the first sub-support (301), and the first sub-support (301) is provided with the projection (303) on a side wall facing the second sub-support (302) adjacent thereto.

6. The heating assembly (10) of claim 4, wherein the groove inner wall of the groove (304) tapers from its groove bottom to its groove opening, and the projection (303) tapers from the groove opening of the groove (304) to the groove bottom so that the projection (303) is in contact engagement with the corresponding groove (304).

7. The heating assembly (10) according to any one of claims 2 to 6, wherein the telescopic member (200) comprises a first telescopic member (201) and a second telescopic member (202), the first telescopic member (201) is connected to the first sub-support (301) and the second telescopic member (302) is connected to the second telescopic member (202) corresponding to the first telescopic member (201), and the first telescopic member (201) is movably connected to the second telescopic member (202) corresponding to the first telescopic member.

8. The heating assembly (10) of claim 7, wherein the first sub-support (301) and the second sub-support (302) are detachably connected to the corresponding first telescoping member (201), respectively, and each second telescoping member (202) is detachably connected to the heating member (100), respectively.

9. The heating assembly (10) of claim 7, wherein the telescoping member (200) further comprises a drive member coupled to the first telescoping member (201) and/or the second telescoping member (202), the drive member being configured to drive movement of the first telescoping member (201) relative to the second telescoping member (202).

10. The heating assembly (10) according to any one of claims 2 to 6 and 8 to 9, wherein the heating element (100) has a multi-stage boss structure, the multi-stage boss structure is stepped from a central position to an edge position of the heating element (100), the boss structure located at the most central position corresponds to the first sub-supporting element (301), and the other boss structures respectively correspond to one of the second sub-supporting elements (302).