CN220324419U - Soaking device suitable for jumbo size silicon chip - Google Patents
Soaking device suitable for jumbo size silicon chip Download PDFInfo
- Publication number
- CN220324419U CN220324419U CN202321794863.1U CN202321794863U CN220324419U CN 220324419 U CN220324419 U CN 220324419U CN 202321794863 U CN202321794863 U CN 202321794863U CN 220324419 U CN220324419 U CN 220324419U
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- CN
- China
- Prior art keywords
- silicon wafer
- soaking
- silicon
- cylinder
- clamping grooves
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 125
- 239000010703 silicon Substances 0.000 title claims abstract description 125
- 238000002791 soaking Methods 0.000 title claims abstract description 78
- 235000012431 wafers Nutrition 0.000 claims abstract description 123
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 238000001802 infusion Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model discloses a soaking device suitable for large-size silicon wafers, which comprises: the soaking cylinder body is of a shell structure with an opening at the top and a closed periphery and bottom, and the inner space of the soaking cylinder body is used for containing silicon wafer soaking liquid; the silicon wafer bracket is suitable for being placed in the soaking cylinder body, a plurality of silicon wafer clamping grooves which are arranged side by side are formed on the silicon wafer bracket, each silicon wafer clamping groove is suitable for being vertically inserted into one silicon wafer, and the silicon wafers can be placed side by side at intervals through the silicon wafer clamping grooves. The soaking device provided by the utility model has a simple structure and is easy to operate, and when the silicon wafers are soaked, the silicon wafers are not required to be horizontally stacked, the condition of incomplete soaking can not occur any more, and after the silicon wafers are soaked, the silicon wafer support and the silicon wafers can be transferred into the oven together for drying, so that the use of the silicon wafer support in different scenes is realized, and the working efficiency is further improved.
Description
Technical Field
The utility model relates to the field of semiconductor chip manufacturing, in particular to a soaking device suitable for large-size silicon chips.
Background
In a laboratory, a large number of silicon wafers are required to be soaked after the photoetching experiment is finished, and the large-size silicon wafers cannot be uniformly fixed when being soaked because the diameters and the number of the round silicon wafers are different in each experiment. If the silicon wafers are stacked horizontally, incomplete soaking is easy to occur, and the risk that two or more silicon wafers are glued together exists. Meanwhile, the silicon wafers horizontally placed in the drying process occupy a large space, so that the use efficiency of the oven is reduced.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a soaking device suitable for large-size silicon wafers, which aims to enable the silicon wafers with different sizes to be vertically placed at intervals and avoid the condition of incomplete soaking.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a soaking device suitable for large-sized silicon wafers, comprising: the soaking cylinder body is of a shell structure with an opening at the top and a closed periphery and bottom, and the inner space of the soaking cylinder body is used for containing silicon wafer soaking liquid; the silicon wafer support is suitable for being placed in the soaking cylinder body, a plurality of silicon wafer clamping grooves which are arranged side by side are formed in the silicon wafer support, each silicon wafer clamping groove is suitable for being vertically inserted into one silicon wafer, and the silicon wafer clamping grooves can enable the silicon wafers to be placed side by side at intervals.
In the soaking device, preferably, the silicon wafer clamping grooves are formed in the lower half part of the silicon wafer support, and each silicon wafer clamping groove comprises two 1/4 circular arc clamping grooves which are symmetrically arranged at intervals, so that the silicon wafer clamping grooves can be suitable for inserting silicon wafers with different sizes.
The soaking device preferably further comprises a cylinder cover, wherein the cylinder cover can be covered on the opening end of the soaking cylinder body so as to seal the soaking cylinder body when the silicon wafer is soaked.
The soaking device is preferably provided with a handle on the cylinder cover.
The soaking device is characterized in that a plurality of silicon wafer supports are arranged in the soaking cylinder body, and two adjacent silicon wafer supports are fixed through buckles.
And the soaking device is characterized in that preferably, two sides of the upper half part of the silicon wafer support are provided with hollowed-out parts which are convenient for taking and placing the silicon wafer support.
In the soaking device, preferably, a liquid outlet is arranged at the bottom of one side of the soaking cylinder body, and a liquid outlet valve is arranged in the liquid outlet.
In the soaking device, preferably, the soaking cylinder body, the silicon wafer bracket and the cylinder cover are made of polytetrafluoroethylene materials.
Due to the adoption of the technical scheme, the utility model has the following advantages:
the soaking device provided by the utility model has a simple structure and is easy to operate, and when the silicon wafers are soaked, the silicon wafers are not required to be horizontally stacked, the condition of incomplete soaking can not occur any more, and after the silicon wafers are soaked, the silicon wafer support and the silicon wafers can be transferred into the oven together for drying, so that the use of the silicon wafer support in different scenes is realized, and the working efficiency is further improved.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model. Like parts are designated with like reference numerals throughout the drawings. In the drawings:
FIG. 1 is a schematic view of an overall structure of a soaking device according to an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of the soaking device according to the present embodiment;
fig. 3 is a top view of the soaking device according to the embodiment of the present utility model.
The reference numerals in the figures are as follows:
1-soaking a cylinder body; 2-a silicon wafer bracket; 3-a silicon wafer clamping groove; 4-a cylinder cover; 5-lifting handles; 6-clamping buckles; 7-liquid discharge port.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", "front", "rear", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the system or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Moreover, the use of the terms first, second, etc. to define elements is merely for convenience in distinguishing the elements from each other, and the terms are not specifically meant to indicate or imply relative importance unless otherwise indicated.
In the description of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "disposed," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The utility model provides a soaking device suitable for large-size silicon wafers, which comprises: the soaking cylinder body is of a shell structure with an opening at the top and a closed periphery and bottom, and the inner space of the soaking cylinder body is used for containing silicon wafer soaking liquid; the silicon wafer bracket is suitable for being placed in the soaking cylinder body, a plurality of silicon wafer clamping grooves which are arranged side by side are formed on the silicon wafer bracket, each silicon wafer clamping groove is suitable for being vertically inserted into one silicon wafer, and the silicon wafers can be placed side by side at intervals through the silicon wafer clamping grooves. The soaking device provided by the utility model has a simple structure and is easy to operate, and when the silicon wafers are soaked, the silicon wafers are not required to be horizontally stacked, the condition of incomplete soaking can not occur any more, and after the silicon wafers are soaked, the silicon wafer support and the silicon wafers can be transferred into the oven together for drying, so that the use of the silicon wafer support in different scenes is realized, and the working efficiency is further improved.
The soaking device suitable for large-size silicon wafers provided by the embodiment of the utility model is described in detail below with reference to the accompanying drawings.
Referring to fig. 1, an immersion apparatus for large-sized silicon wafers according to an embodiment of the present utility model includes: the soaking cylinder body 1 is of a shell structure with an opening at the top and a closed periphery and bottom, and the inner space of the soaking cylinder body is used for containing silicon wafer soaking liquid; the silicon wafer bracket 2 is suitable for being placed into the soaking cylinder body 1, a plurality of silicon wafer clamping grooves 3 which are arranged side by side are formed on the silicon wafer bracket 2, each silicon wafer clamping groove 3 is suitable for being vertically inserted into one silicon wafer, and the silicon wafers can be placed side by side at intervals through the silicon wafer clamping grooves 3.
In the above embodiment, preferably, the silicon wafer clamping grooves 3 are formed in the lower half of the silicon wafer support 2, and each silicon wafer clamping groove 3 includes two 1/4 circular arc clamping grooves symmetrically spaced, so that the silicon wafer clamping grooves 3 can accommodate the insertion of silicon wafers with different sizes.
In the above embodiment, it is preferable that the device further comprises a cylinder cover 4, wherein the cylinder cover 4 can be covered on the opening end of the soaking cylinder body 1 to seal the soaking cylinder body 1 when soaking the silicon wafer, so as to prevent the silicon wafer soaking liquid in the soaking cylinder body 1 from splashing; meanwhile, a handle 5 is arranged on the cylinder cover 4, so that the soaking cylinder body 1 can be conveniently opened or closed.
In the above embodiment, preferably, the number of the silicon wafer supports 2 is plural, the plural silicon wafer supports 2 are placed side by side inside the soaking cylinder 1, and the adjacent two silicon wafer supports 2 are fixed by the buckle 6 to prevent movement.
In the above embodiment, preferably, the two sides of the upper half of the silicon wafer support 2 are hollowed out, so as to facilitate the operator to take and place the silicon wafer support 2.
In the above embodiment, it is preferable that a liquid outlet 7 is provided at the bottom of one side of the soaking cylinder 1, and a liquid outlet valve (not shown) is provided in the liquid outlet 7 for discharging the waste liquid inside the soaking cylinder 1 after the silicon wafer is soaked.
In the above embodiment, preferably, the soaking cylinder 1, the silicon wafer support 2 and the cylinder cover 4 are made of polytetrafluoroethylene materials.
When the silicon wafer cleaning device is used, firstly, a plurality of silicon wafers are respectively inserted into each silicon wafer clamping groove of the silicon wafer support 2, the silicon wafer support 2 filled with the silicon wafers is placed into the soaking cylinder 1, then the silicon wafer soaking liquid is injected into the soaking cylinder 1 until all the silicon wafers are immersed by the silicon wafer soaking liquid, and the cylinder cover 4 is covered for a period of time to clean the silicon wafers; after the cleaning is finished, the cylinder cover 4 is opened, and the silicon wafer bracket 2 and the silicon wafer are taken out and transferred into an oven together for drying.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (7)
1. A soaking device suitable for large-size silicon wafers, comprising:
the soaking cylinder body is of a shell structure with an opening at the top and a closed periphery and bottom, and the inner space of the soaking cylinder body is used for containing silicon wafer soaking liquid;
the silicon wafer bracket is suitable for being placed in the soaking cylinder body, a plurality of silicon wafer clamping grooves which are arranged side by side are formed on the silicon wafer bracket, each silicon wafer clamping groove is suitable for being vertically inserted into one silicon wafer, and the silicon wafer clamping grooves can enable the silicon wafers to be placed side by side at intervals;
the silicon wafer clamping grooves are formed in the lower half part of the silicon wafer support, and each silicon wafer clamping groove comprises two 1/4 circular arc clamping grooves which are symmetrically arranged at intervals, so that the silicon wafer clamping grooves can be suitable for inserting silicon wafers with different sizes.
2. The soaking apparatus of claim 1, further comprising a cylinder cap that can be closed over an open end of the soaking cylinder to close the soaking cylinder when soaking the silicon wafer.
3. The infusion device of claim 2, wherein a handle is provided on the cylinder head.
4. The soaking device according to claim 1, wherein the number of the silicon wafer supports is plural, the plural silicon wafer supports are placed in the soaking cylinder side by side, and two adjacent silicon wafer supports are fixed by a buckle.
5. The soaking device according to claim 1, wherein hollowed-out parts which are convenient for taking and placing the silicon wafer support are arranged on two sides of the upper half part of the silicon wafer support.
6. The soaking device according to any one of claims 1 to 5, wherein a drain port is provided at a side bottom of the soaking cylinder, and a drain valve is provided in the drain port.
7. The soaking device according to claim 2, wherein the soaking cylinder, the silicon wafer support and the cylinder cover are made of polytetrafluoroethylene materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321794863.1U CN220324419U (en) | 2023-07-10 | 2023-07-10 | Soaking device suitable for jumbo size silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321794863.1U CN220324419U (en) | 2023-07-10 | 2023-07-10 | Soaking device suitable for jumbo size silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220324419U true CN220324419U (en) | 2024-01-09 |
Family
ID=89413614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321794863.1U Active CN220324419U (en) | 2023-07-10 | 2023-07-10 | Soaking device suitable for jumbo size silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220324419U (en) |
-
2023
- 2023-07-10 CN CN202321794863.1U patent/CN220324419U/en active Active
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