CN220104357U

CN220104357U - Pressure core

Info

Publication number: CN220104357U
Application number: CN202321592033.0U
Authority: CN
Inventors: 葛娜; 赫鑫; 肖滨
Original assignee: Kunshan Lingke Sensing Technology Co ltd
Current assignee: Kunshan Lingke Sensing Technology Co ltd
Priority date: 2023-06-21
Filing date: 2023-06-21
Publication date: 2023-11-28
Anticipated expiration: 2033-06-21

Abstract

The utility model relates to a pressure core, comprising: a sintering base having a receiving cavity therein; the chip is positioned in the accommodating cavity; the flexible fixing structure is positioned in the accommodating cavity and at least positioned between the inner wall of the accommodating cavity and the chip and used for fixing the chip card in the accommodating cavity. The utility model improves the production efficiency of the pressure core body and improves the performance of the pressure core body.

Description

Pressure core

Technical Field

The utility model relates to the technical field of sensing, in particular to a pressure core body.

Background

Pressure sensors are devices for converting pressure signals into electrical signals, and have wide application in the semiconductor and mechanical fields. The pressure core is a core component of the pressure sensor and is used for sensing an external pressure signal and converting the detected pressure signal into an electric signal which can be used for output according to a certain rule or a certain mapping relation. The pressure core body comprises a chip for receiving a pressure signal and converting the pressure signal into an electric signal, and a base for bearing the chip. Currently, the chip is fixed on the base by means of glue (e.g. DB glue). However, on the one hand, the glue takes time to cure, thereby affecting the production efficiency of the pressure core; on the other hand, the cured glue is easy to have uneven thickness, so that the accuracy and reliability of the pressure signal detected by the pressure core body are reduced.

Therefore, how to improve the performance of the pressure core body and the production efficiency of the pressure core body is a technical problem to be solved at present.

Disclosure of Invention

The utility model provides a pressure core body, which is used for improving the performance of the pressure core body and improving the production efficiency of the pressure core body.

In order to solve the above problems, the present utility model provides a pressure core including:

a sintering base having a receiving cavity therein;

the chip is positioned in the accommodating cavity;

the flexible fixing structure is positioned in the accommodating cavity and at least positioned between the inner wall of the accommodating cavity and the chip and used for fixing the chip card in the accommodating cavity.

In some embodiments, the flexible fixing structure comprises a plurality of first flexible patches, the plurality of first flexible patches are distributed between the side wall of the accommodating cavity and the side wall of the chip, and the plurality of first flexible patches jointly fix the chip card in the accommodating cavity.

In some embodiments, the projection of the first flexible patch on the bottom surface of the accommodating cavity is arc-shaped, and the plurality of first flexible patches are symmetrically distributed about the center of the accommodating cavity.

In some embodiments, the flexible fixing structure comprises a first flexible patch, the first flexible patch comprises an attaching surface attached to a side wall of the accommodating cavity and a fixing surface facing the chip, the attaching surface is continuously attached to the whole side wall of the accommodating cavity, and the fixing surface is a circular arc fixing surface.

In some embodiments, further comprising:

the sensitive membrane is positioned on the top surface of the sintering base;

the oil filling structure is positioned in the sintering base and comprises an oil filling hole which is communicated with the accommodating cavity;

and the compression ring is positioned on the top surface of the sintering base and used for connecting the sensitive diaphragm and the sintering base.

In some embodiments, further comprising:

the steel ball is positioned at one side of the oil filling hole away from the sensitive membrane and is used for sealing the oil filling hole.

In some embodiments, at least a portion of the pressure ring is L-shaped in cross-section, and one end of the pressure ring is connected to the sintering base and the other end is connected to the sensitive diaphragm.

In some embodiments, the sintered base further comprises:

the ceramic substrate is positioned below the accommodating cavity, and a laser resistance adjusting circuit is arranged in the ceramic substrate;

and the pin is electrically connected with the chip and the laser resistance adjusting circuit.

In some embodiments, the holding cavity comprises a first holding cavity and a second holding cavity positioned above the first holding cavity, the first holding cavity is communicated with the second holding cavity, the chip is positioned in the first holding cavity, and the inner diameter of the second holding cavity is larger than that of the first holding cavity; the pressure core further comprises:

and the ceramic space occupying block is positioned in the second accommodating cavity, and is provided with through holes aligned with the pins, and the pins penetrate through the through holes and extend to the outside of the sintering base.

In some embodiments, a gage tube extending through the ceramic substrate and out of the bottom end of the sintering base is used to communicate the chip with the outside atmosphere.

According to the pressure core body, the flexible fixing structure is arranged in the accommodating cavity for accommodating the chip, and the chip is fixed in the accommodating cavity through the flexible fixing structure, so that the chip and the sintering base are not required to be fixed through glue, the operation of fixing the chip on the sintering base is simplified, and the production efficiency of the pressure core body is improved. Meanwhile, the chip card is fixed in the accommodating cavity through the flexible structure without glue curing, so that the accuracy and reliability of the pressure signals detected by the pressure core body by the cured glue layer with uneven thickness can be avoided, and the performance of the pressure core body is improved.

Drawings

FIG. 1 is a schematic cross-sectional view of a pressure core in an embodiment of the utility model;

FIG. 2 is a schematic top view of a sintered base and flexible fastening structure according to an embodiment of the present utility model.

Detailed Description

The following describes in detail the embodiments of the pressure core provided by the present utility model with reference to the accompanying drawings.

In this embodiment, a pressure core is provided, fig. 1 is a schematic cross-sectional view of the pressure core in the embodiment of the present utility model, and fig. 2 is a schematic top view of a sintering base and a flexible fixing structure in the embodiment of the present utility model. As shown in fig. 1 and 2, the pressure core includes:

a sintering base 10, wherein the sintering base 10 is provided with a containing cavity;

a chip 11 located in the accommodation chamber;

the flexible fixing structure is located in the accommodating cavity and at least located between the inner wall of the accommodating cavity and the chip 11, and is used for clamping and fixing the chip 11 in the accommodating cavity.

Specifically, the sintering base 10 may be made of a stainless steel material to improve the corrosion resistance of the entire pressure core, so that the pressure core can be applied to various environments, thereby expanding the application field of the pressure core and helping to improve the service life of the pressure core. The sintering base 10 comprises a bottom and a top which are oppositely distributed, and the accommodating cavity is positioned at the top of the sintering base 10. The chip 11 is configured to receive an external pressure signal, convert the pressure signal into an electrical signal, and output the electrical signal, so as to implement pressure sensing. The flexible fixing structure in this embodiment is a structure formed by using a flexible material. The flexible fixing structure has elasticity and can be elastically deformed, so that the chip 11 can be clamped and fixed inside the accommodating cavity by compressing the flexible fixing structure. The chip 11 is fastened in the accommodating cavity through the flexible fixing structure, so that the chip 11 is not required to be fixed on the sintering base 10 through glue, the operation of fixing the chip on the sintering base is simplified, and the production efficiency of the pressure core body is improved. Meanwhile, the chip card is fixed in the accommodating cavity through the flexible structure without glue curing, so that the accuracy and reliability of the pressure signals detected by the pressure core body by the cured glue layer with uneven thickness can be avoided, and the performance of the pressure core body is improved. In addition, since the flexible fixing structure has elasticity, elastic deformation can be generated, so that damage such as scratch to the chip 11 can be avoided, and the performance stability and reliability of the pressure core body can be further improved. The type of the chip 11 can be selected by those skilled in the art according to actual needs, so long as the chip can receive a pressure signal and convert the pressure signal into an electrical signal for output.

In some embodiments, the flexible fixing structure includes a plurality of first flexible patches 25, and the plurality of first flexible patches 25 are distributed between the side wall of the accommodating cavity and the side wall of the chip 11, and the plurality of first flexible patches 25 jointly fasten the chip 11 in the accommodating cavity.

For example, as shown in fig. 2, the accommodating cavity is a cylindrical accommodating cavity, the plurality of first flexible patches 25 in the flexible fixing structure are distributed along the side wall of the accommodating cavity, and the chip 11 is clamped and fixed in the accommodating cavity through the plurality of first flexible patches 25 together, so that the chip 11 can be further prevented from shaking in the accommodating cavity, the stability of the chip 11 is improved, and the accuracy and the reliability of the pressure core for detecting the pressure signal are further improved. The specific number of the first flexible patches 25 may be set by those skilled in the art according to actual needs, which is not limited in this embodiment.

To further improve the positional stability of the chip 11 within the receiving cavity, in some embodiments, a plurality of the first flexible patches 25 are symmetrically distributed about the center of the receiving cavity.

In some embodiments, the projection of the first flexible patch 25 on the bottom surface of the accommodating cavity is circular arc, and the plurality of first flexible patches 25 are symmetrically distributed about the center of the accommodating cavity.

For example, as shown in fig. 2, the first flexible patch 25 is a hemispherical patch, the surface of the first flexible patch 25 facing the chip 11 is a semicircular arc surface, and the plurality of first flexible patches 25 are symmetrically distributed about the center of the accommodating cavity, so that the first flexible patch 25 can be further prevented from damaging the chip, the manufacturing process of the flexible fixing structure can be simplified, and the manufacturing cost of the pressure core body can be reduced. This embodiment is described by taking the number of the first flexible patches 25 as 4 as an example. In other examples, the number of the first flexible patches 25 may be 2, 6 or 8 or more.

In other embodiments, the flexible fixing structure includes a first flexible patch 25, where the first flexible patch 25 includes an attaching surface attached to a side wall of the accommodating cavity and a fixing surface facing the chip 11, and the attaching surface is continuously attached to the entire side wall of the accommodating cavity, and the fixing surface is a circular arc fixing surface.

For example, by making the first flexible patch 25 continuously cover the entire side wall of the accommodating chamber, on the one hand, the connection stability between the first flexible patch 25 and the inner wall of the accommodating chamber can be enhanced, avoiding the falling-off of the first flexible patch 25; on the other hand, the contact area between the first flexible patch 25 and the chip 11 can be increased, so that the chip 11 can be more stably fixed inside the accommodating chamber.

In some embodiments, the pressure core further comprises:

a sensitive diaphragm 12 located on the top surface of the sintered base 10;

an oil-filled structure located in the sintering base 10, the oil-filled structure including an oil-filled hole 18, the oil-filled hole 18 being in communication with the receiving cavity;

and a pressure ring 13, which is positioned on the top surface of the sintering base 10 and is used for connecting the sensitive membrane 12 and the sintering base 10.

In some embodiments, the pressure core further comprises:

and the steel ball 19 is positioned on one side of the oil filling hole 18 away from the sensitive membrane 12 and is used for sealing the oil filling hole 18.

In some embodiments, at least part of the cross section of the pressure ring 13 is L-shaped, and one end of the pressure ring 13 is connected to the sintering base 10, and the other end is connected to the sensitive membrane 12.

For example, the sensitive membrane 12 is located on top of the sintered base 10. In one example, the sensing diaphragm 12 may also be a stainless steel diaphragm. The oil filling structure is positioned in the sintering base 10, silicone oil can be filled into the accommodating cavity through the oil filling holes 18 in the oil filling structure, and the oil filling holes 18 are sealed through the steel balls 19. When the pressure in the external environment acts on the sensitive diaphragm 12, the vibration of the sensitive diaphragm 12 generates a pressure signal, which can be transmitted to the chip 11 through the silicone oil, and the chip converts the detected pressure signal into an electrical signal, thereby realizing pressure sensing. At least part of the cross section of the pressing ring 13 is L-shaped, one end of the pressing ring 13 is connected with the sintering base 10, and the other end of the pressing ring is connected with the sensitive membrane 12. In an example, the material of the pressure ring 13 may be stainless steel. One end of the pressure ring 13 and the sintering base 10 can be connected through laser welding or argon arc welding, and the other end of the pressure ring 13 and the sensitive diaphragm 12 can also be connected through laser welding or argon arc welding, so that the pressure ring 13, the sensitive diaphragm 12 and the sintering base 10 integrally form an all-welded structure, and the stainless steel pressure core of the all-welded structure has strong corrosion resistance and can be applied to special environments.

In some embodiments, the pressure core further comprises:

a ceramic substrate 22 located below the accommodating cavity, wherein a laser resistance adjusting circuit is arranged in the ceramic substrate 22;

and the pin 15 is electrically connected with the chip 11, and the pin 15 is electrically connected with the laser resistance adjusting circuit.

In some embodiments, the accommodating cavities include a first accommodating cavity 241 and a second accommodating cavity 242 located above the first accommodating cavity 241, and the first accommodating cavity 241 communicates with the second accommodating cavity 242, the chip 11 is located within the first accommodating cavity 241, and an inner diameter of the second accommodating cavity 242 is larger than that of the first accommodating cavity 241; the pressure core further comprises:

a ceramic placeholder block 17 is located in the second receiving cavity, the ceramic placeholder block 17 having therein through holes aligned with pins 15 in the sintering base 10, the pins 15 passing through the through holes and extending outside the sintering base 10.

Specifically, the accommodating chambers include the first accommodating chamber 241, and a second accommodating chamber 242 located above the first accommodating chamber 241, the second accommodating chamber 242 communicates with the first accommodating chamber 241, and an inner diameter of the second accommodating chamber 242 is larger than an inner diameter of the first accommodating chamber 241. The second accommodation chamber 242 has the ceramic space block 17 therein, and the ceramic space block 17 has a through hole therein which communicates with the pin 15 in the sintering base 10. The sintering base 10 is further provided with a conductive Wire 14, and the conductive Wire 14 electrically connects the pin 15 and the chip 11 through WB (Wire Bonding) so as to lead out a signal (for example, an electrical signal generated according to the pressure signal) output by the chip 11 to the outside. In one example, the ceramic spacer 17 is an alumina ceramic. The ceramic space occupying block 17 is used for filling the second accommodating cavity 242, so as to reduce the filling amount of silicone oil, save the cost and improve the performance of the pressure core. The pressure core further comprises a bonding layer 16 located in the sintering base 10, a ceramic substrate 22 located on the bonding layer 16, and an insulating pad 20 located on the ceramic substrate 22, wherein the bonding layer 16 is used for protecting the ceramic substrate 22, the ceramic substrate 22 is electrically connected with the pins 15 in a soldering manner, and the insulating pad 20 is made of an insulating material and is used for electrically isolating the sintering base 10 and the ceramic substrate 22. The ceramic substrate 22 is provided with an adjustable resistor structure such as a laser resistor adjusting circuit, and the resistance value of the adjustable resistor structure can be adjusted in a laser resistor adjusting mode so as to perform temperature compensation on the pressure core, thereby simplifying the temperature compensation process of the pressure core and further improving the accuracy of pressure core detection.

In an example, the pressure core further includes a gauge pressure pipe 23 penetrating through the ceramic substrate 22 and extending from the bottom end of the sintering base 10 to the sintering base 10, and the gauge pressure pipe 23 is used to communicate the chip 11 with the external atmosphere, so that the pressure value detected by the pressure core is a pressure value relative to the external atmosphere environment, thereby facilitating analysis. For example, the bottom of the first accommodating chamber 241 is provided with a gauge pressure hole 26, and the gauge pressure hole 26 is connected with the gauge pressure pipe 23, so that the gauge pressure pipe 23 measures the pressure value in the accommodating chamber.

In an example, the side wall of the sintering base 10 is further provided with grooves distributed along the side wall of the sintering base 10, and an O-ring 21 is located in the grooves to perform assembly sealing on the pressure core through the O-ring 21.

The pressure core body provided by the specific embodiment is provided with the flexible fixing structure in the accommodating cavity for accommodating the chip, and the chip is fixed in the accommodating cavity by the flexible fixing structure, so that the chip and the sintering base are not required to be fixed by glue, the operation for fixing the chip on the sintering base is simplified, and the production efficiency of the pressure core body is improved. Meanwhile, the chip card is fixed in the accommodating cavity through the flexible structure without glue curing, so that the accuracy and reliability of the pressure signals detected by the pressure core body by the cured glue layer with uneven thickness can be avoided, and the performance of the pressure core body is improved.

The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.

Claims

1. A pressure core, comprising:

a sintering base having a receiving cavity therein;

the chip is positioned in the accommodating cavity;

2. The pressure core of claim 1, wherein the flexible securing structure comprises a plurality of first flexible patches distributed between the side walls of the receiving cavity and the side walls of the chip, the plurality of first flexible patches collectively securing the chip within the receiving cavity.

3. The pressure core of claim 2, wherein the projection of the first flexible patch onto the bottom surface of the receiving cavity is circular arc-shaped, and the plurality of first flexible patches are symmetrically distributed about the center of the receiving cavity.

4. The pressure core of claim 1, wherein the flexible mounting structure comprises a first flexible patch including an attachment surface attached to a side wall of the receiving cavity and a mounting surface facing the chip, the attachment surface being continuously attached to the entire side wall of the receiving cavity, the mounting surface being a circular arc-shaped mounting surface.

5. A pressure core according to claim 1, further comprising:

the sensitive membrane is positioned on the top surface of the sintering base;

6. A pressure core according to claim 5, further comprising:

7. A pressure core according to claim 5, wherein at least part of the cross section of the pressure ring is L-shaped, and one end of the pressure ring is connected to the sintering base and the other end is connected to the sensitive diaphragm.

8. The pressure core of claim 1, wherein the sintered base further comprises:

9. The pressure core of claim 8, wherein the containment chamber comprises a first containment chamber and a second containment chamber positioned above the first containment chamber, and wherein the first containment chamber is in communication with the second containment chamber, the chip being positioned within the first containment chamber, the second containment chamber having an inner diameter greater than the first containment chamber; the pressure core further comprises:

10. The pressure core of claim 8, further comprising a gage tube extending through the ceramic substrate and out of the sintering base from a bottom end of the sintering base, the gage tube for communicating the chip with an external atmosphere.