CN220041860U

CN220041860U - IDF type lead frame of SOP10

Info

Publication number: CN220041860U
Application number: CN202321470738.5U
Authority: CN
Inventors: 廖邦雄; 廖海洋; 徐君; 孔朝玉; 易文涛
Original assignee: Guangdong Jiexin Semiconductor Materials Co ltd
Current assignee: Guangdong Jiexin Semiconductor Materials Co ltd
Priority date: 2023-06-10
Filing date: 2023-06-10
Publication date: 2023-11-17
Anticipated expiration: 2033-06-10

Abstract

The utility model discloses an IDF type lead frame of SOP10, which comprises a frame body, wherein the frame body is provided with 12 rows of 36 columns of crisscross small units, injection molding flow passages are arranged among every four columns of small units, straight holes which are staggered with the injection molding flow passages are also arranged among every four columns of small units, the upper edge and the lower edge of the frame body are respectively provided with positioning holes and identification holes which are regularly arranged along the longitudinal direction of the frame body, the small units comprise a central base island and pins which are arranged on the periphery of the central base island in parallel, and the adjacent small units are arranged in IDF type. The beneficial effects of the utility model are as follows: the small units are arranged in an IDF mode, the overall number is increased, the number of the small units is increased from 8R to 12R, and the production efficiency is improved, and meanwhile, the requirements of domestic and foreign markets can be fully met; the unit distance between the small unit bodies is the same as that of SOP8, so that the electroplating, forming and plastic packaging dies can be shared, the investment of die cost is reduced, the utilization rate of the dies is improved, and the production cost is reduced.

Description

IDF type lead frame of SOP10

Technical Field

The utility model belongs to the technical field of semiconductor materials, and particularly relates to an IDF type lead frame of SOP 10.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electric connection between an internal circuit leading-out end of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires), forms a bridge connected with an external lead, is a main way for heat dissipation inside the chip, and is an important basic material in the electronic information industry in most semiconductor integrated blocks.

As shown in FIG. 1, the SOP10 lead frame in the prior art is generally 8 rows in arrangement number, the internal pitch of pins is 1.00mm, the arrangement mode is alignment arrangement, the production efficiency is low, the material utilization rate is low, the SOP10 lead frame cannot be used together with a related mold of SOP8, and the investment cost is high when the SOP10 lead frame and the SOP8 lead frame are developed together.

Disclosure of Invention

The utility model aims to provide an IDF type lead frame of SOP10, which solves the problems that the existing lead frame cannot meet the demands of domestic and foreign markets, is not compact in arrangement, low in material utilization rate, high in production cost and low in production efficiency, and can solve at least one technical problem related to the background technology.

In order to solve the technical problems, the utility model is realized as follows:

the utility model provides an IDF type lead frame of SOP10, includes the frame body, the frame body is equipped with 12 rows 36 rows of crisscross little units, every four are listed as be equipped with the runner of moulding plastics between the little unit, every four are listed as still be equipped with between the little unit with the runner staggered arrangement's of moulding plastics a word hole, the frame body upper and lower edge is equipped with respectively and follows frame body longitudinal direction law arranges locating hole and identification hole, the little unit include central base island with arrange side by side in the pin of central base island week side is IDF formula between the adjacent little unit.

Optionally, a cell distance between adjacent small cells is the same as a cell distance between adjacent small cells of the leadframe of SOP 8.

Alternatively, two groups of small units are arranged in a longitudinal direction, the group spacing is 15mm, and the transverse spacing is 6.1mm.

Optionally, 10 pins are arranged on the periphery of the central base island of each small unit.

Optionally, the pins include inner pins connected with the central base island, and a distance between two adjacent inner pins is 1.075mm.

Optionally, a spacing between two small units adjacent along a longitudinal direction of the lead frame is 6.05mm.

Optionally, the size of the central base island is 3.3x2.35mm, and connecting ribs are arranged between adjacent small units.

Optionally, a glue injection port is formed beside the small unit.

The beneficial effects of the utility model are as follows: the small units are arranged in an IDF mode (pins are shared between every two rows of transverse small units and are longitudinally and alternately arranged), the overall number is increased, the row number is increased from the original 8R to 12R, and the production efficiency is improved, and meanwhile, the requirements of domestic and foreign markets can be fully met; the unit distance between the small unit bodies is the same as that of SOP8, so that the electroplating, forming and plastic packaging dies can be shared, the investment of die cost is reduced, the utilization rate of the dies is improved, and the production cost is reduced.

Drawings

For a clearer description of the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:

FIG. 1 is a schematic diagram of the overall structure of a conventional SOP10 leadframe;

fig. 2 is a schematic diagram of the overall structure of an IDF type lead frame of SOP10 provided in the present utility model;

FIG. 3 is a schematic view of a portion of an IDF type lead frame of the SOP10 of FIG. 2;

FIG. 4 is a schematic diagram of a small unit according to the present utility model;

fig. 5 is a schematic structural diagram of a plurality of small units provided by the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present utility model may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The IDF type lead frame of the SOP10 provided in the embodiment of the present utility model is described in detail below with reference to fig. 2-5 by means of specific embodiments and application scenarios thereof.

The embodiment of the utility model provides an IDF type lead frame of SOP10, which comprises a frame body 10, wherein the frame body 10 is provided with 12 rows of 36 rows of crisscross small units 11, injection molding flow channels 12 are arranged among every four rows of small units 11, and straight holes 13 which are staggered with the injection molding flow channels 12 are also arranged among every four rows of small units 11.

The upper and lower edges of the frame body 10 are respectively provided with positioning holes 14 and identification holes 15 which are regularly arranged along the longitudinal direction of the frame body 10.

The small units 11 comprise a central base island 112 and pins 111 which are arranged on the periphery of the central base island 112 in parallel, and specifically, 10 pins 111 are arranged on the periphery of the central base island 112 of each small unit 11.

The adjacent small units 11 are arranged in an IDF type. The cell distance between the adjacent small cells 11 is the same as the cell distance between the adjacent small cells of the lead frame of the SOP8, so that the arrangement is compact, the utilization rate of materials is improved, the production cost is reduced, and the production efficiency is improved.

The small units 11 are longitudinally arranged in a group, the group spacing is 15mm, and the transverse spacing is 6.1mm.

The pins 111 include inner pins connected to the central island 112, and a space between two adjacent inner pins is 1.075mm.

The spacing between two of the small units 11 adjacent in the longitudinal direction of the lead frame 10 is 6.05mm.

The central base island 112 has a size of 3.3x2.35mm, and connecting ribs 113 are arranged between adjacent small units 11.

In order to improve the glue feeding efficiency, reduce the impact force to the pressure welding gold wire during glue feeding, and facilitate the manufacture of the packaging mold, the side of the small unit 11 is provided with a glue injection port 114.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims

1. The IDF type lead frame of SOP10 is characterized by comprising a frame body, wherein the frame body is provided with 12 rows of 36 columns of crisscross small units, injection molding flow passages are arranged between every four columns of small units, a straight hole which is staggered with the injection molding flow passages is also arranged between every four columns of small units, the upper edge and the lower edge of the frame body are respectively provided with a positioning hole and an identification hole which are regularly arranged along the longitudinal direction of the frame body, the small units comprise a central base island and pins which are arranged on the periphery of the central base island in parallel, and the adjacent small units are arranged in an IDF mode.

2. The IDF type lead frame of SOP10 according to claim 1, characterized in that a cell distance between adjacent small cells is the same as a cell distance between adjacent small cells of a lead frame of SOP 8.

3. The IDF type lead frame of SOP10 according to claim 1, characterized in that the small cells are vertically arranged in two rows in a group, the group spacing is 15mm, and the lateral spacing is 6.1mm.

4. The IDF type lead frame of SOP10 according to claim 1, characterized in that 10 pins are provided on the peripheral side of the center island of each small cell.

5. The IDF type lead frame of SOP10 of claim 4, wherein the lead includes an inner lead connected to the center island, and a space between two adjacent inner leads is 1.075mm.

6. The IDF type lead frame of SOP10 according to claim 5, characterized in that a pitch between two of the small cells adjacent in the longitudinal direction of the lead frame is 6.05mm.

7. The IDF type lead frame of SOP10 according to claim 1, characterized in that the central island has a size of 3.3x2.35mm, and connecting ribs are provided between adjacent small cells.

8. The IDF-type lead frame of SOP10 of claim 1, wherein a glue injection port is opened at a side of the small unit.