CN220041795U - Chip mounting device for processing semiconductor radio frequency direct picking chip - Google Patents
Chip mounting device for processing semiconductor radio frequency direct picking chip Download PDFInfo
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- CN220041795U CN220041795U CN202321082260.9U CN202321082260U CN220041795U CN 220041795 U CN220041795 U CN 220041795U CN 202321082260 U CN202321082260 U CN 202321082260U CN 220041795 U CN220041795 U CN 220041795U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 238000001179 sorption measurement Methods 0.000 claims abstract description 12
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a paster device for processing a semiconductor radio frequency direct picking chip, which comprises a vertical plate, wherein the vertical plate is connected with a mounting plate through a moving mechanism, the mounting plate is fixedly connected with a mounting frame through a plurality of fixing rods, the mounting plate is connected with a connecting plate through a telescopic mechanism, the bottom of the connecting plate is provided with an adsorption mechanism, and the adsorption mechanism is provided with a heating mechanism. According to the utility model, through the matched use of the mounting box, the first heating device, the fan, the air inlet pipe and the return air pipe, heated air is blown to the bottom of the patch, so that the hot air is fully contacted with the patch, the heating efficiency of the patch is improved, and the use of the return air pipe is matched, so that the hot air is convenient to recycle, waste is avoided, and meanwhile, the upper surface of the patch is convenient to heat through the matched use of the second heating device and the heat conducting plate, the patch is heated uniformly, the heating effect and the heating efficiency of the patch are further improved, and the patch is convenient to use.
Description
Technical Field
The utility model relates to the technical field of chip processing chip mounting equipment, in particular to a chip mounting device for processing a semiconductor radio frequency direct picking chip.
Background
The Integrated Circuit (IC) industry is a current high-speed growing point of global economic development, in which the progress of the semiconductor manufacturing process and the rapid growth of the market demand for micro chips make the I/O density of chips higher and higher, the pitch of chip leads and the diameter of bonding pads continuously decrease, and meanwhile, in order to improve the production efficiency and the packaging speed, the packaging speed is gradually increased year by year, so that extremely high requirements are put on the positioning precision and the running speed of post-packaging equipment, and the chip mounting equipment determines the precision, the efficiency and the stability of the chip mounting process, and is a key equipment of the chip packaging process.
According to the search, publication number CN218215237U discloses a chip mounting device for semiconductor chip processing, comprising: the device comprises a base and a support frame, wherein the support frame is fixedly connected with the base; the conveying belt is connected with the base; a patch storage tank; the surface mounting mechanism is arranged between the base and the supporting frame; wherein, the paster mechanism includes: the support assembly is connected with the support frame; and the adsorption assembly is arranged between the support assembly and the base and is connected with the support assembly.
This kind of paster device for semiconductor chip processing is through heating the paster for conductive paste direct fixation shaping has omitted the base plate heating step, has improved machining efficiency, but in the in-service use in-process, the outlet duct setting is in the paster top, leads to when heating the paster, and steam and the area of contact of paster are less, lead to the heating efficiency reduction to the paster, and simultaneously when heating, steam can directly spill in the air after contacting with the paster, is inconvenient for carrying out recycle, has extravagant problem, influences the use.
Disclosure of Invention
The utility model aims to solve the problems that a chip mounting device for semiconductor chip processing has low heating efficiency and waste in the prior art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a chip mounting device is used in direct picking of semiconductor radio frequency processing, includes the riser, the riser is connected with the mounting panel through moving mechanism, the mounting panel is through a plurality of dead lever fixedly connected with installing frame, be connected with the connecting plate through telescopic machanism on the mounting panel, the connecting plate bottom is equipped with adsorption mechanism, be equipped with heating mechanism on the adsorption mechanism, installing frame both ends lateral wall is all fixed to be provided with the mounting box, the inside fixed first heating device that is provided with of mounting box, the fixed fan that is provided with of mounting box inside wall, the fixed air-out frame that is the slope setting that is provided with of installing frame inside wall, the air outlet has been seted up to the air-out frame outside wall, fixedly provided with air-supply line between installing box and the air-out frame, fixedly provided with return air pipe between installing box and the installing frame.
Preferably, the moving mechanism comprises a motor fixedly connected with the outer side wall of the vertical plate, the output end of the motor is fixedly connected with a screw rod, the outer side wall of the screw rod penetrates through the vertical plate and is rotationally connected with a limiting plate, and the limiting plate is fixedly connected with the vertical plate.
Preferably, a guide rod is fixedly arranged between the vertical plate and the limiting plate, the outer side walls of the screw rod and the guide rod are respectively in threaded connection and are in sliding sleeve connection with an adjusting block, and the bottoms of the two adjusting blocks are fixedly connected with the top of the mounting plate.
Preferably, the telescopic mechanism comprises an electric push rod which penetrates through and is fixedly arranged on the mounting plate, the bottom of the electric push rod is fixedly connected with a movable plate, and two connecting rods which are symmetrically arranged are fixedly connected between the movable plate and the connecting plate.
Preferably, the adsorption mechanism comprises a mounting block fixedly connected with the bottom of the connecting plate, a connecting pipe is fixedly connected with the bottom of the mounting block, a sucker is fixedly connected with the bottom of the connecting pipe, a vacuum pump is fixedly arranged on the inner side wall of the mounting block, and a plurality of ventilation openings are formed in the inner side wall of the mounting block.
Preferably, the heating mechanism comprises a second heating device fixedly sleeved on the outer side wall of the mounting block, a heat conducting plate is fixedly connected to the bottom of the second heating device, the heat conducting plate is sleeved outside the sucker, and the bottom of the heat conducting plate is flush with the bottom of the sucker.
The beneficial effects of the utility model are as follows:
through the cooperation of mounting box, first heating device, the fan, air-supply line and return air pipe is used for the air after the heating blows to the paster bottom, make hot air fully contact with the paster, improve the heating efficiency to the paster, and the use of cooperation return air pipe, be convenient for carry out recycle to hot air, avoid causing extravagant, the cooperation through second heating device and heat-conducting plate is used simultaneously, be convenient for heat the paster upper surface, make the paster heating even, further improve heating effect and heating efficiency to the paster, facilitate the use.
Drawings
Fig. 1 is a schematic structural diagram of a chip mounting device for processing a semiconductor rf direct acquisition chip according to the present utility model;
fig. 2 is a schematic diagram of a connection structure between a neutral plate and a mounting plate of a chip mounting device for processing a semiconductor radio frequency direct acquisition chip;
fig. 3 is a schematic diagram of a connection structure between a mounting frame and a mounting box in a chip mounting device for processing a semiconductor rf direct-picking chip according to the present utility model.
In the figure: 1. a vertical plate; 2. a mounting plate; 3. a mounting frame; 4. a mounting box; 5. a first heating device; 6. a blower; 7. an air inlet pipe; 8. an air outlet frame; 9. an air return pipe; 10. a motor; 11. a screw rod; 12. a connecting rod; 13. a moving plate; 14. an electric push rod; 15. a mounting block; 16. a connecting pipe; 17. a suction cup; 18. a vacuum pump; 19. a second heating device; 20. a heat conducting plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-3, a chip mounting device for processing a semiconductor radio frequency direct picking chip comprises a vertical plate 1, wherein the vertical plate 1 is connected with a mounting plate 2 through a moving mechanism, the mounting plate 2 is fixedly connected with a mounting frame 3 through a plurality of fixing rods, the mounting plate 2 is connected with a connecting plate through a telescopic mechanism, an adsorption mechanism is arranged at the bottom of the connecting plate, and a heating mechanism is arranged on the adsorption mechanism.
Wherein, the moving mechanism includes motor 10 with riser 1 lateral wall fixed connection, and motor 10 is servo motor, is prior art, does not make in detail here, and motor 10 output fixedly connected with lead screw 11, lead screw 11 lateral wall run through riser 1 and rotate and be connected with the limiting plate, fixed connection between limiting plate and the riser 1.
Wherein, fixed guide bar that is provided with between riser 1 and the limiting plate, screw rod 11 and guide bar lateral wall have respectively threaded connection and sliding sleeve have been overlapped the regulating block, and two regulating block bottoms all with mounting panel 2 top fixed connection, through the cooperation of motor 10 and screw rod 11 use, be convenient for adjust mounting panel 2 and installing frame 3 and remove, adjust installing frame 3 position, through the setting of guide bar for the removal of mounting panel 2 is more steady.
The telescopic mechanism comprises an electric push rod 14 penetrating through and fixedly arranged on the mounting plate 2, the electric push rod 14 is of the prior art, details are omitted here, a moving plate 13 is fixedly connected to the bottom of the electric push rod 14, and two connecting rods 12 which are symmetrically arranged are fixedly connected between the moving plate 13 and the connecting plate.
Wherein, adsorption equipment includes the installation piece 15 with connecting plate bottom fixed connection, installation piece 15 bottom fixedly connected with connecting pipe 16, connecting pipe 16 bottom fixedly connected with sucking disc 17, installation piece 15 inside wall is fixed to be provided with vacuum pump 18, vacuum pump 18 is prior art, does not repeated the description here, a plurality of vents have been seted up to installation piece 15 inside wall, the vacuum pump 18 of being convenient for is through the vent with sucking disc 17 and the paster between the air discharge, the sucking disc 17 of being convenient for adsorbs fixedly to the paster.
Wherein, heating mechanism includes the fixed second heating device 19 of cup jointing on the mounting block 15 lateral wall, and second heating device 19 bottom fixedly connected with heat conduction board 20, and heat conduction board 20 cover is established in sucking disc 17 outside and heat conduction board 20 bottom and sucking disc 17 bottom flush setting, and the heat conduction board 20 of being convenient for contacts with the paster top, heats the paster.
The installation box 4 is all fixed to be provided with at installation frame 3 both ends lateral wall, the inside fixed first heating device 5 that is provided with of installation box 4, first heating device 5 and second heating device 19 are prior art, do not repeat here, the fixed fan 6 that is provided with of installation box 4 inside wall, fan 6 are prior art, do not do here and repeat the said, the fixed air-out frame 8 that is the slope setting that is provided with of installation frame 3 inside wall, the air outlet has been seted up to air-out frame 8 lateral wall, the fixed air-supply line 7 that is provided with between installation box 4 and the air-out frame 8, the fixed return air line 9 that is provided with between installation box 4 and the installation frame 3.
In the utility model, the electric push rod 14 drives the moving plate 13 to move downwards, so that the connecting rod 12 drives the sucker 17 to move downwards, the sucker 17 is in contact with the patch, air between the sucker 17 and the patch is discharged through the vacuum pump 18, the sucker 17 adsorbs the patch, the second heating device 19 heats the heat conducting plate 20, and the heat conducting plate 20 heats the top of the patch.
Through electric putter 14 shrink for sucking disc 17 resets, and first heating device 5 heats the air in the installation box 4, and fan 6 drives hot air and gets into in the air-out frame 8 through air-supply line 7, blows to the paster bottom by the air outlet again, heats the paster, and simultaneously fan 6 makes the installation box 4 in be negative pressure state, in the hot air suction installation box 4 in with the installation frame 3 through return air pipe 9, carries out cyclic recovery to hot air, avoids causing the waste.
The lead screw 11 is driven to rotate through forward rotation or reverse rotation of the motor 10, the mounting plate 2 moves on the guide rod towards the direction close to the motor 10 or away from the motor 10, the position of the mounting frame 3 is adjusted, and the electric push rod 14 stretches out, so that the heated chip is subjected to chip mounting processing.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The patch device for processing the semiconductor radio frequency direct picking chip comprises a vertical plate (1), and is characterized in that the vertical plate (1) is connected with a mounting plate (2) through a moving mechanism, the mounting plate (2) is fixedly connected with a mounting frame (3) through a plurality of fixing rods, the mounting plate (2) is connected with a connecting plate through a telescopic mechanism, an adsorption mechanism is arranged at the bottom of the connecting plate, and a heating mechanism is arranged on the adsorption mechanism;
the utility model discloses a fan, including installing frame (3), mounting box (4), air-out frame (8), air inlet pipe (7) are fixed between installing box (4) and air-out frame (8), install box (4) inside fixed first heating device (5) that is provided with, install box (4) inside wall is fixed to be provided with fan (6), install frame (3) inside wall is fixed to be provided with two air-out frames (8) that are the slope setting, the air outlet has been seted up to air-out frame (8) lateral wall, be provided with air-supply line (7) between install box (4) and air-out frame (8) fixedly, be provided with return air pipe (9) between install box (4) and the install frame (3).
2. The chip mounting device for processing the semiconductor radio frequency direct picking chip according to claim 1, wherein the moving mechanism comprises a motor (10) fixedly connected with the outer side wall of the vertical plate (1), the output end of the motor (10) is fixedly connected with a screw rod (11), the outer side wall of the screw rod (11) penetrates through the vertical plate (1) and is rotationally connected with a limiting plate, and the limiting plate is fixedly connected with the vertical plate (1).
3. The paster device for processing the semiconductor radio frequency direct acquisition chip according to claim 2, wherein a guide rod is fixedly arranged between the vertical plate (1) and the limiting plate, the outer side walls of the screw rod (11) and the guide rod are respectively in threaded connection and are in sliding sleeve connection with an adjusting block, and the bottoms of the two adjusting blocks are fixedly connected with the top of the mounting plate (2).
4. The patch device for processing the semiconductor radio frequency direct acquisition chip according to claim 1, wherein the telescopic mechanism comprises an electric push rod (14) penetrating through and fixedly arranged on the mounting plate (2), a movable plate (13) is fixedly connected to the bottom of the electric push rod (14), and two symmetrically arranged connecting rods (12) are fixedly connected between the movable plate (13) and the connecting plate.
5. The chip mounting device for processing the semiconductor radio frequency direct acquisition chip according to claim 1, wherein the adsorption mechanism comprises a mounting block (15) fixedly connected with the bottom of the connecting plate, a connecting pipe (16) is fixedly connected with the bottom of the mounting block (15), a sucking disc (17) is fixedly connected with the bottom of the connecting pipe (16), a vacuum pump (18) is fixedly arranged on the inner side wall of the mounting block (15), and a plurality of ventilation openings are formed in the inner side wall of the mounting block (15).
6. The chip mounting device for processing the semiconductor radio frequency direct acquisition chip according to claim 5, wherein the heating mechanism comprises a second heating device (19) fixedly sleeved on the outer side wall of the mounting block (15), a heat conducting plate (20) is fixedly connected to the bottom of the second heating device (19), the heat conducting plate (20) is sleeved outside the sucker (17), and the bottom of the heat conducting plate (20) is arranged flush with the bottom of the sucker (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321082260.9U CN220041795U (en) | 2023-05-08 | 2023-05-08 | Chip mounting device for processing semiconductor radio frequency direct picking chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321082260.9U CN220041795U (en) | 2023-05-08 | 2023-05-08 | Chip mounting device for processing semiconductor radio frequency direct picking chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220041795U true CN220041795U (en) | 2023-11-17 |
Family
ID=88742915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321082260.9U Active CN220041795U (en) | 2023-05-08 | 2023-05-08 | Chip mounting device for processing semiconductor radio frequency direct picking chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220041795U (en) |
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2023
- 2023-05-08 CN CN202321082260.9U patent/CN220041795U/en active Active
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