CN219935572U - Electrostatic chuck thermal shock test device - Google Patents
Electrostatic chuck thermal shock test device Download PDFInfo
- Publication number
- CN219935572U CN219935572U CN202320538196.4U CN202320538196U CN219935572U CN 219935572 U CN219935572 U CN 219935572U CN 202320538196 U CN202320538196 U CN 202320538196U CN 219935572 U CN219935572 U CN 219935572U
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- electrostatic chuck
- thermal shock
- heating
- shock test
- chuck
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- 230000035939 shock Effects 0.000 title claims abstract description 37
- 238000012360 testing method Methods 0.000 title claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 71
- 239000000919 ceramic Substances 0.000 claims abstract description 53
- 238000001816 cooling Methods 0.000 claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000003028 elevating effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 30
- 230000008569 process Effects 0.000 abstract description 30
- 239000012790 adhesive layer Substances 0.000 abstract description 13
- 239000010410 layer Substances 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 5
- 238000004321 preservation Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000011946 reduction process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the field of test equipment and discloses an electrostatic chuck thermal shock test device which comprises a chuck connecting tool, a water cooling base, an adhesive layer, a ceramic disc body and a heating mechanism which are sequentially arranged from top to bottom, wherein the side surface of the chuck connecting tool is provided with a lifting mechanism which is connected with the chuck connecting tool and can drive the chuck connecting tool to vertically move, the chuck connecting tool is detachably connected with the water cooling base, and the water cooling base is connected with the ceramic disc body through the adhesive layer. The electrostatic chuck thermal shock test device can evaluate the reliability of the bonding layer by simulating the temperature rise and fall of the process aiming at the electrostatic chuck with the bonding structure, and has the advantages of simple operation and capability of corresponding to the actual working condition.
Description
Technical Field
The utility model relates to the field of test equipment, in particular to an electrostatic chuck thermal shock test device.
Background
In a process chamber of a semiconductor device, an electrostatic chuck is a precision component that holds a wafer and is subject to temperature rise and drop during the process in addition to maintaining a stable suction force to the wafer during the process.
In some types of electrostatic chuck products, the ceramic substrate and the water-cooling base are connected in a bonding mode, repeated temperature rising and reducing cycles are generated along with the process in the use process of the ceramic substrate, and the water-cooling base maintains a stable temperature state through refrigerating fluid, so that heat generated in the process is conducted away, and accurate temperature control is provided for a wafer. After the preparation of the electrostatic chuck is completed, the reliability of the bonding layer should be evaluated so as to avoid the phenomena of debonding, cracking and the like in the process flow of the semiconductor. However, there is no electrostatic chuck thermal shock test apparatus for evaluating the reliability of the adhesive layer.
Disclosure of Invention
The utility model aims to solve the problem that the prior art has no electrostatic chuck thermal shock test device for evaluating the reliability of an adhesive layer, and provides the electrostatic chuck thermal shock test device which can evaluate the reliability of the adhesive layer by simulating the temperature rise and fall of an electrostatic chuck with an adhesive structure.
In order to achieve the above purpose, the utility model provides an electrostatic chuck thermal shock test device, which comprises a chuck connecting tool, a water cooling base, an adhesive layer, a ceramic disc body and a heating mechanism which are sequentially arranged from top to bottom, wherein the side surface of the chuck connecting tool is provided with a lifting mechanism which is connected with the chuck connecting tool and can drive the chuck connecting tool to vertically move, the chuck connecting tool is detachably connected with the water cooling base, and the water cooling base is connected with the ceramic disc body through the adhesive layer.
Preferably, the heating mechanism comprises a heating groove capable of being inserted into the ceramic disc body, and a heating surface attached to the bottom surface of the ceramic disc body is arranged on the bottom surface of the heating groove.
Preferably, the heating surface comprises a plurality of heating units uniformly distributed on the bottom surface of the heating groove.
Preferably, the contact position between the heating unit and the bottom surface of the ceramic tray body is a ceramic sheet.
Preferably, the bottom of the ceramic sheet is sequentially connected with a heater, a temperature sensor and an elastic mechanism.
Preferably, the elastic mechanism is a spring.
Preferably, the periphery of the heating groove is matched with the periphery of the ceramic disc body in a step mode.
Preferably, the heating mechanism is a thermostatic water bath.
Preferably, the lifting mechanism is a hydraulic cylinder, an air cylinder or an electric cylinder.
Preferably, a refrigerating system pipeline penetrating through the chuck connecting tool is arranged at the upper end of the water cooling base.
Through the technical scheme, the electrostatic chuck thermal shock test device can evaluate the reliability of the bonding layer by simulating the temperature rise and fall of the process for the electrostatic chuck with the bonding structure, and has the advantages of being simple and convenient to operate and capable of corresponding to actual working conditions.
Drawings
FIG. 1 is a schematic diagram of a preferred embodiment of an electrostatic chuck thermal shock test apparatus;
FIG. 2 is a schematic top view of a preferred embodiment of a heating tank;
FIG. 3 is a schematic view of a preferred embodiment connection structure between a ceramic disk and a heating tank.
Description of the reference numerals
1-a water-cooling base; 2-an adhesive layer; 3-ceramic tray body; 4-a lifting mechanism; 5-a refrigeration system pipeline; 6-chuck connecting tool; 7-a heating tank; 8-ceramic flakes; 9-a heater; 10-a temperature measurement sensor; 11-spring.
Detailed Description
The following describes specific embodiments of the present utility model in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the utility model, are not intended to limit the utility model.
In the present utility model, unless otherwise indicated, terms such as "upper, lower, left, right, front, rear, and inner and outer" and the like are used merely to denote the orientation of the term in a conventional use state or are commonly understood by those skilled in the art, and should not be construed as limiting the term.
Referring to the electrostatic chuck thermal shock test device shown in fig. 1-2, the electrostatic chuck thermal shock test device comprises a chuck connecting tool 6, a water cooling base 1, an adhesive layer 2, a ceramic disc body 3 and a heating mechanism which are sequentially arranged from top to bottom, wherein the side surface of the chuck connecting tool 6 is provided with a lifting mechanism 4 which is connected with the chuck connecting tool and can drive the chuck connecting tool 6 to vertically move, the chuck connecting tool 6 is detachably connected with the water cooling base 1, and the water cooling base 1 is connected with the ceramic disc body 3 through the adhesive layer 2.
By implementing the above technical scheme, due to the difference of the thermal expansion coefficients of the ceramic material and the metal material, the stability of the structure of the bonding layer 2 is a very important part for evaluating the reliability of the electrostatic chuck product in the process of repeated temperature rise and drop caused by the actual process. The electrostatic chuck thermal shock test device can evaluate the reliability of the bonding layer 2 by simulating the temperature rise and fall in the process of the process aiming at the electrostatic chuck with the bonding structure, and has the advantages of being simple and convenient to operate and being capable of corresponding to the actual working condition.
The water-cooling base 1 comprises a water-cooling tray body arranged at the bottom and in adhesive connection with the adhesive layer 2, and after the water-cooling base 1 is connected with an external circulating cooling system, circulating cooling liquid can be led into the water-cooling tray body to keep the tray body constant temperature, and the temperature is set according to the requirement. The circulation cooling system can use the existing mature system, and is not used as a structure to be protected by the utility model, and is not described herein.
The heating mechanism simulates heat generated by a wafer in the process of the semiconductor equipment, the heat is conducted to the water-cooling base 1 through the ceramic disc body 3, the water-cooling base 1 is connected with an external circulating cooling system through a refrigerating system pipeline 5, circulating cooling liquid is continuously supplied through the refrigerating system in the circulating cooling system, the refrigerating system can realize temperature control of-20 ℃ to 20 ℃, and the temperature is set according to different actual working conditions of the semiconductor equipment. Of course, the static chuck thermal shock test device is matched with the static chuck thermal shock test device, and the static chuck thermal shock test device further comprises a control system which is mainly used for providing temperature control for the heating mechanism, so that the static chuck thermal shock test device can quickly raise the temperature and keep the temperature stable, and can be cooled along with the surface of the static chuck after temperature impact is finished, and has the characteristic of low heat capacity and quick heating and quick cooling. The main object of the electrostatic chuck thermal shock test device in the utility model is an adhesive layer 2 in the thermal shock process, and the adhesive reliability of the electrostatic chuck thermal shock test device in the repeated temperature rise and reduction process of a ceramic disc body 3 is examined.
In addition, elevating system 4 is connected with chuck connection frock 6, is connected between chuck connection frock 6 and the water-cooling base 1, for example connects through a plurality of bolts between chuck connection frock 6 and the water-cooling base 1 can dismantle, just so can control the whole lift of chuck connection frock 6, water-cooling base 1, adhesive linkage 2 and ceramic disk body 3 through elevating system 4, and this whole in the in-service use, can lift and descend along with the technology circulation according to the technological condition.
In this embodiment, as shown in fig. 3, there is further provided a heating mechanism including a heating groove 7 provided so as to be capable of being inserted into the ceramic disc 3, wherein a heating surface attached to the bottom surface of the ceramic disc 3 is provided on the bottom surface of the heating groove 7. The heating surface may be in contact with the bottom surface of the ceramic tray 3 for transferring heat to the ceramic tray 3, the adhesive layer 2 and the water-cooled base 1. The bottom of the ceramic disc body 3 can be matched with the heating groove 7 for use through the plug-in design, so that the unstable heating condition caused by shaking is avoided.
In this embodiment, the heating surface includes a plurality of heating units uniformly distributed on the bottom surface of the heating tank 7. The heating units are uniformly distributed in the grooves of the heating groove 7 and play a role in supporting and heating the electrostatic chuck, and the heating units in the grooves are mainly used for heating the chuck surface, for example, in one embodiment, the heating units are of rectangular design and are divided into a plurality of groups and uniformly distributed in the size range of the electrostatic chuck surface, and each heating power supply is independently controlled by a control system so as to realize uniformity control of temperatures of different areas of the whole chuck surface.
In this embodiment, the contact position between the heating unit and the bottom surface of the ceramic disk 3 is a ceramic sheet 8. The bottom of the ceramic sheet 8 is sequentially connected with a heater 9, a temperature sensor 10 and an elastic mechanism. The elastic mechanism is a spring 11.
In one embodiment, the contact position between the heating unit and the chuck is formed by a ceramic sheet 8, a heater 9, a temperature sensor 10 and a spring 11 are connected below the ceramic sheet 8, the control system realizes the heating and heat preservation process through the heating of the heater 9 and the feedback of the temperature sensor 10, and the spring 11 mainly aims to ensure that each heating unit in the heating tank 7 can be stably attached to the electrostatic chuck and timely conduct hot spots generated by the heater 9 to the chuck body. The heating unit contacts with the chuck body of the chuck to select ceramic materials, so that the pollution to the electrostatic chuck can be avoided, meanwhile, the heat capacity of the thin ceramic plate is relatively small, when the thermal shock process of mechanism lifting is not adopted, the heating unit can rapidly maintain the temperature consistency with the surface of the chuck after stopping heating, meanwhile, the temperature reduction process of the chuck body cannot be interfered, the thermal shock experimental result is matched with the technological process in the chamber of the actual semiconductor device, and the aim of evaluating the reliability of the bonding structure of the electrostatic chuck is fulfilled.
In this embodiment, as shown in fig. 3, the peripheral edge of the heating groove 7 is in step fit with the peripheral edge of the ceramic disk 3. By adopting the matching mode, the heat loss from the periphery can be reduced as much as possible, and the heating effect is improved.
In the above embodiment, the electrostatic chuck thermal shock test device is used by placing the electrostatic chuck assembly in the heating tank 7, wherein the periphery of the ceramic disc body 3 of the electrostatic chuck is provided with a step structure, the heating tank 7 is also provided with a step structure to match with the steps of the electrostatic chuck, and meanwhile, the disc surface can be fully contacted with the heating units in different areas in the heating tank 7, and the heating units are pressed down for a certain distance, so that the internal spring 11 of the heating unit acts, and the ceramic sheet 8 is tightly attached to the disc surface of the electrostatic chuck, thereby realizing good contact. Then, the chuck connecting tool 6 is fixed on the water-cooling base 1 through screws, and meanwhile, the refrigerating system pipeline 5 is installed. Starting a refrigerating system, and setting the refrigerating temperature within the range of-20 ℃ to 20 ℃ according to the actual process requirements of the semiconductor equipment. After the water cooling base 1 reaches the set temperature, starting to perform temperature impact test, realizing a one-time temperature impact process by setting the heating rate, the target temperature, the heat preservation time, the heating starting temperature and the like, and after the heat preservation is finished, heating the system off, so that the electrostatic chuck ceramic disc body 3 is cooled along with the water cooling base 1, and when the temperature is reduced to the preset starting temperature, starting a new temperature impact process by the system. The process is repeated until the target number of impacts is reached.
In another embodiment, the heating mechanism may also be a thermostatic water bath. The heating tank 7 is replaced by a constant-temperature water bath tank, the water temperature in the constant-temperature water bath tank can be set, and the lifting mechanism 4 can drive the electrostatic chuck assembly to move up and down. The temperature impact process is that the time that the electrostatic chuck stays in the constant-temperature water tank is set, the temperature of the ceramic disc body 3 of the chuck is increased through heat transfer, when the ceramic disc body 3 reaches the target temperature, the chuck is lifted off the water surface, then the temperature is reduced, when the ceramic disc body 3 is reduced to the target temperature, the lifting mechanism 4 is lowered, the ceramic disc body 3 enters the constant-temperature water tank again, and the process is repeated until the bonding structure of the chuck is invalid or the target impact times are reached.
Because the temperature of the ceramic disc body 3 after being separated from the constant temperature water tank cannot be measured and monitored in real time, the temperature sensor can be arranged at the surface position close to the ceramic disc body 3 through the through hole arranged on the disc body and used for measuring the temperature of the ceramic disc body 3.
In this embodiment, the lifting mechanism 4 is a hydraulic cylinder, an air cylinder, or an electric cylinder. The hydraulic cylinder, the air cylinder or the electric cylinder is of a vertically arranged columnar structure which can be lifted, and the telescopic end of the hydraulic cylinder, the air cylinder or the electric cylinder is detachably connected with the chuck connecting tool 6 through bolts.
In this embodiment, a refrigerating system pipeline 5 penetrating through the chuck connection tool 6 is arranged at the upper end of the water cooling base 1. In order to facilitate the arrangement of the refrigeration system piping 5, the water-cooled base 1 is connected to the refrigeration system by such an arrangement that the water-cooled base 1 is maintained at a constant temperature.
The electrostatic chuck thermal shock test device is designed for testing the reliability of the bonding structure of the electrostatic chuck ceramic tray body 3 and the water cooling base 1, and adopts a multi-point temperature mode to perform a controllable heating and heat preservation process on the surface of the chuck so as to accurately simulate the thermal shock environment. The device can simulate the temperature change of the wafer in the process of the semiconductor equipment to be transmitted to the ceramic disc body 3, so as to cause the repeated temperature impact process between the ceramic and the constant-temperature water-cooling base 1. The device has the advantages of simple operation, no damage to the chuck in the process of process execution, accurate simulation of actual working conditions in the process of temperature impact, and the like.
The preferred embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present utility model within the scope of the technical concept of the present utility model, and all the simple modifications belong to the protection scope of the present utility model.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the utility model can be made without departing from the spirit of the utility model, which should also be considered as disclosed herein.
Claims (10)
1. The utility model provides an electrostatic chuck thermal shock test device, its characterized in that, electrostatic chuck thermal shock test device includes chuck connection frock (6), water-cooling base (1), adhesive linkage (2), ceramic disk body (3) and the heating mechanism that top-down set up in order, the side of chuck connection frock (6) is provided with rather than being connected and can drive elevating system (4) that chuck connection frock (6) vertically removed, chuck connection frock (6) with can dismantle between water-cooling base (1) and be connected, water-cooling base (1) with pass through between ceramic disk body (3) adhesive linkage (2).
2. The electrostatic chuck thermal shock test apparatus according to claim 1, wherein the heating mechanism comprises a heating groove (7) provided with a heating surface capable of being inserted into the ceramic disk body (3), and a bottom surface of the heating groove (7) is provided with a heating surface attached to a bottom surface of the ceramic disk body (3).
3. The electrostatic chuck thermal shock test apparatus according to claim 2, wherein the heating surface comprises a plurality of heating units uniformly distributed on the bottom surface of the heating tank (7).
4. An electrostatic chuck thermal shock test apparatus according to claim 3, wherein the contact position of the heating unit and the bottom surface of the ceramic disk body (3) is a ceramic sheet (8).
5. The electrostatic chuck thermal shock test apparatus according to claim 4, wherein the bottom of the ceramic sheet (8) is sequentially connected with a heater (9), a temperature sensor (10) and an elastic mechanism.
6. The electrostatic chuck thermal shock test apparatus of claim 5, wherein the elastic mechanism is a spring (11).
7. The electrostatic chuck thermal shock test apparatus according to any one of claims 2-6, wherein a step fit is provided between the periphery of the heating groove (7) and the periphery of the ceramic disk body (3).
8. The electrostatic chuck thermal shock test apparatus of claim 1, wherein the heating mechanism is a thermostatic water bath.
9. The electrostatic chuck thermal shock test apparatus according to claim 1, wherein the lifting mechanism (4) is a hydraulic cylinder, an air cylinder or an electric cylinder.
10. The electrostatic chuck thermal shock test device according to claim 1, wherein a refrigerating system pipeline (5) penetrating through the chuck connecting tool (6) is arranged at the upper end of the water cooling base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320538196.4U CN219935572U (en) | 2023-03-15 | 2023-03-15 | Electrostatic chuck thermal shock test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320538196.4U CN219935572U (en) | 2023-03-15 | 2023-03-15 | Electrostatic chuck thermal shock test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219935572U true CN219935572U (en) | 2023-10-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320538196.4U Active CN219935572U (en) | 2023-03-15 | 2023-03-15 | Electrostatic chuck thermal shock test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219935572U (en) |
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2023
- 2023-03-15 CN CN202320538196.4U patent/CN219935572U/en active Active
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