CN219861564U - Uniform gas spray head device for space isolation atomic layer deposition equipment - Google Patents
Uniform gas spray head device for space isolation atomic layer deposition equipment Download PDFInfo
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- CN219861564U CN219861564U CN202321323824.3U CN202321323824U CN219861564U CN 219861564 U CN219861564 U CN 219861564U CN 202321323824 U CN202321323824 U CN 202321323824U CN 219861564 U CN219861564 U CN 219861564U
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- air
- flow
- runner
- baffling
- gas
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- 238000000231 atomic layer deposition Methods 0.000 title claims abstract description 21
- 238000002955 isolation Methods 0.000 title claims abstract description 12
- 239000007921 spray Substances 0.000 title claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000007664 blowing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
The utility model belongs to the technical field of atomic layer deposition, and relates to a gas homogenizing nozzle device for space isolation atomic layer deposition equipment, which comprises a spliced main plate and a cover plate, wherein the inner wall of the main plate and the inner wall of the cover plate are surrounded to form a ventilation flow channel, the ventilation flow channel comprises a gas inlet, a gas dividing flow channel, a flow deflecting flow channel and a gas outlet slot which are sequentially arranged, the gas dividing flow channel is a multi-stage two-way flow channel, the flow deflecting flow channel is divided into a plurality of flow deflecting cavities which are arranged side by side, each flow deflecting cavity is connected with an outlet of a vertical section of a last-stage flow channel, and the flow deflecting cavity is of a narrow slot structure which turns back and forth. The air homogenizing nozzle device not only utilizes the air dividing flow channels to disperse air flow uniformly, but also utilizes the baffling flow channels to enable air blown out from the air outlet slits to form a uniform air flow layer, and the narrow slit structure of the baffling cavity is less prone to blockage compared with a structure with a plurality of air outlet holes, so that the air flow can be kept uniform and stable in the use process.
Description
Technical Field
The utility model relates to the technical field of atomic layer deposition, in particular to a gas homogenizing nozzle device for space isolation atomic layer deposition equipment.
Background
Atomic layer deposition is a thin film formation technique using successive chemical reactions in the gas phase, and can be classified into two types, spatial isolation and temporal isolation, according to the isolation method. The spray head of the space isolation atomic layer deposition equipment has higher requirements on tightness and air outlet uniformity, and the uniformity of the outlet gas flow velocity is difficult to realize when the traditional slit spray head is used for coating a large-size workpiece, so that the slit is easy to block and needs to be cleaned regularly.
Chinese patent CN217303517U discloses a uniform air flow air speed adjustable drying nozzle device which is operated by 2 times of n The air distribution flow passage structure distributes the air inlet to all the air outlets, and the air outlet can be uniformly distributed in a strip-shaped area because the resistance of each flow passage is the same, so that a uniform air flow layer is formed. However, after the gas is separated, each gas outlet hole is an outlet with smaller caliber, the smaller caliber is, the greater the blocking risk is, and once the individual gas outlets are blocked, uniform gas flow is not finally obtained.
There is a need for improved structure of the gas-homogenizing nozzle device to solve the above problems.
Disclosure of Invention
The utility model mainly aims to provide a gas homogenizing nozzle device for space isolation atomic layer deposition equipment, which can increase the uniformity of gas in the length direction and can avoid the problem of blockage caused by too narrow gas paths.
The utility model realizes the aim through the following technical scheme: the utility model provides a even gas nozzle device for space isolation atomic layer deposition equipment, includes mainboard and the apron of concatenation, the inner wall of mainboard with the inner wall of apron surrounds and forms the runner of ventilating, the runner of ventilating is including the air inlet that sets gradually, divide the gas runner, baffling runner and play air seam, divide the gas runner to be multistage bipartite runner, every level runner has from the inlet position to bilateral symmetry extension and go out horizontal segment and links up the vertical section at the end of horizontal segment, the inlet is as the inlet position of first level runner, the outlet of vertical section is as the inlet position of next level runner, baffling runner divide into a plurality of baffling chambeies of arranging side by side, every baffling chamber's inlet center links up with the vertical section outlet of last runner, baffling chamber is the slit structure of turn around.
Specifically, the horizontal section of each stage of flow channel is connected with the vertical section of the next stage of flow channel by a round angle section.
Further, the main board is connected with the cover board through a plurality of first bolts, and one first bolt is arranged on the inner side of each round corner section.
Specifically, the mainboard has the embedding the first platform face of apron, the apron is fixed in on the first platform face through a plurality of first bolts, the mainboard is in be equipped with on the first platform face and divide the gas channel, divide the gas channel by divide the inslot face in gas channel with the inner wall of apron encloses.
Further, the main board is a second platform surface lower than the first platform surface in the baffling flow channel area, the second platform surface is embedded with a baffling plate of a grid structure, the baffling plate comprises a plurality of fixing strips extending vertically and a plurality of baffling strips connected between the adjacent fixing strips, the fixing strips are fixed on the second platform surface by a plurality of second bolts, the baffling strips are alternately staggered from top to bottom, adjacent baffling cavities are separated by the fixing strips, and the baffling cavities are defined by the baffling strips, the inner wall of the main board and the inner wall of the cover plate.
Furthermore, the fixing strip is in a sharp angle structure in the air outlet direction.
Specifically, heating plates are arranged on two sides of a plate structure formed by the main plate and the cover plate.
Specifically, the mainboard is equipped with fixed part in its length direction's both sides, be provided with the fixed orifices on the fixed part.
The technical scheme of the utility model has the beneficial effects that:
in the gas homogenizing nozzle device, gas enters the gas dividing flow passages from the gas inlet, each branch of the gas dividing flow passages is of a symmetrical structure, the middle gas inlet and the structure between the baffling cavities are the same, and the flow resistance of the gas flowing through each flow passage is uniform, so that the gas flow can be equally divided into each gas dividing flow passage; after the air flows out of the air distribution channels, the air flows pass through the deflection cavities which are turned back and forth, so that uniform mixing along the length direction is realized, and finally the air flows are blown out of the air outlet gaps, so that a uniform air flow layer is formed. Meanwhile, the narrow slit structure of the baffle cavity is less prone to blockage than a structure with a plurality of air outlet holes, so that the uniform and stable air flow in the using process can be maintained.
Drawings
FIG. 1 is a perspective view of an embodiment of a gas distribution showerhead apparatus;
FIG. 2 is an exploded view of an embodiment of a gas distribution nozzle unit;
FIG. 3 is a perspective view of the extent of the split flow path;
FIG. 4 is a partial cross-sectional view of A-A in FIG. 3;
FIG. 5 is a perspective view of a motherboard;
FIG. 6 is a perspective view of a cover plate;
fig. 7 is a perspective view of a baffle.
The figures represent the numbers:
1-a main board, 11-a first platform surface, 111-an air distribution groove, 12-a second platform surface, 121-a first convex edge, 13-a fixing part and 131-a fixing hole;
2-a cover plate and 21-a second convex edge;
3-ventilation flow channels, 31-air inlets, 32-gas distribution flow channels, 321-horizontal sections, 322-vertical sections, 323-round angle sections, 33-baffling flow channels, 331-baffling cavities and 34-gas outlet slits;
4 A-A first bolt, 4 b-a second bolt;
5-baffle plates, 51-fixing strips, 511-sharp corner structures and 52-baffle strips;
6-heating plate.
Detailed Description
The present utility model will be described in further detail with reference to specific examples.
Examples:
as shown in fig. 1 to 3, the gas homogenizing nozzle device for space isolation atomic layer deposition equipment of the present utility model comprises a spliced main plate 1 and a cover plate 2, wherein the inner wall of the main plate 1 and the inner wall of the cover plate 2 are surrounded to form a ventilation flow channel 3, the ventilation flow channel 3 comprises a gas inlet 31, a gas dividing flow channel 32, a flow deflecting flow channel 33 and a gas outlet slot 34 which are sequentially arranged, the gas dividing flow channel 32 is a multi-stage two-stage flow channel, each stage flow channel is provided with a horizontal section 321 which symmetrically extends from a gas inlet position to two sides and a vertical section 322 which is connected with the tail end of the horizontal section 321, the gas inlet 31 is used as the gas inlet position of a first stage flow channel, the outlet of the vertical section 322 is used as the gas inlet position of a next stage flow channel, the flow deflecting flow channel 33 is divided into a plurality of flow deflecting cavities 331 which are arranged side by side, the inlet center of each flow deflecting cavity 331 is connected with the outlet of the vertical section 322 of the last stage flow channel, and the flow deflecting cavity 331 is in a narrow slot structure which is turned back and forth. In this embodiment, the split flow channel 32 is a two-stage split flow channel, so it has four outlets, and in other applications, it may be three-stage eight outlets, four-stage sixteen outlets, etc., which all meet the purpose of uniformly dispersing the airflow.
The gas enters the split-flow channels 32 from the gas inlet 31, each branch of the split-flow channels 32 is of a symmetrical structure, the middle gas inlet and the structure between the baffle cavities 331 are the same, and the flow resistance of the gas flowing through each channel is uniform, so that the gas flow is equally divided into each split-flow channel 32; after exiting the air separation flow channel 32, the air flow passes through the front-back turning baffle cavity 331 to be uniformly mixed along the length direction, and finally is blown out from the air outlet slits 334 to form a uniform air flow layer. Meanwhile, the narrow slit structure of the baffle cavity 331 is less prone to blockage than a structure with multiple air outlet holes, so that air flow can be kept uniform and stable in the use process.
As shown in fig. 3, the horizontal section 321 of each stage of flow channel is connected to the vertical section 322 of the next stage of flow channel by rounded sections 323.
The rounded section 323 can reduce the kinetic energy loss of the air flow from the horizontal direction to the vertical direction, and reduce the energy consumption of blowing under the condition of ensuring the same air outlet velocity.
As shown in fig. 2 and 3, the main plate 1 and the cover plate 2 are connected by a plurality of first bolts 4b, and one first bolt 4b is provided on the inner side of each rounded section 323.
The air flow will have a relatively large kinetic energy loss at the rounded section 323, so that the air pressure will be relatively large at this location, and if not tightly fixed, the main board 1 and the cover board 2 will be expanded to cause air leakage. It is necessary to provide a fixed position for the first bolt 4b inside the rounded segment 323, avoiding this risk of air leakage.
As shown in fig. 3 and 5, the main board 1 has a first flat surface 11 embedded in the cover board 2, the cover board 2 is fixed on the first flat surface 11 by a plurality of first bolts 4b, the main board 1 is provided with a gas dividing groove 111 on the first flat surface 11, and the gas dividing flow passage 32 is surrounded by the inner surface of the gas dividing groove 111 and the inner wall of the cover board 2.
The ventilation channel 32 must be formed by combining the main board 1 and the cover board 2, and the air dividing groove 111 is only arranged on one side of the main board 1, so that the component forming can be simplified, and the back surface of the cover board 2 is only designed to be a plane.
As shown in fig. 3, 4, 5 and 7, the main board 1 is a second platform surface 12 lower than the first platform surface 11 in the area of the baffle flow channel 33, the second platform surface 12 is embedded with baffle plates 4 with a grid structure, the baffle plates 4 comprise a plurality of fixing strips 13 extending vertically and a plurality of baffle strips 52 connected between the adjacent fixing strips 13, the fixing strips 51 are fixed on the second platform surface 12 by a plurality of second bolts 4b, the baffle strips 52 are alternately staggered from top to bottom, the adjacent baffle cavities 331 are separated by the fixing strips 51, and the baffle cavities 331 are surrounded by the baffle strips 52, the inner wall of the main board 1 and the inner wall of the cover board 2.
Although the risk of blockage of the baffling flow passage 33 of the device is smaller than that of a device with a multi-air outlet structure, dust can accumulate in the baffling cavity 331 for a period of time to cause uneven resistance, so that cleaning requirements still exist. The structure of the baffle cavity 331 is complex, and if the baffle cavity is directly arranged on the main board 1 or the cover board 2, the baffle cavity is inconvenient to clean. A removable baffle 5 is used here, the baffle 5 being fixed to the main plate 1 by means of a second bolt 4b. The baffle plate 5 is completely detached during cleaning, and the front and back corner positions of the baffle strips 52 can be fully cleaned, so that the uniform resistance of each flow passage can be ensured.
As shown in fig. 7, the fixing strip 51 has a pointed structure 511 in the air outlet direction.
Because of the width of the fixing strips 51, if the air outlet direction is set to be rectangular, a dead zone of blowing air is left between the adjacent air outlet slits 34. The sharp corner structure 511 enables the air outlet leaving the air outlet slot 34 to be properly opened towards both sides, so that the air outlet can be connected into a complete strip-shaped area, and the uniformity of air blowing is ensured.
As shown in fig. 4, a first flange 121 is provided at the lower portion of the second platform surface 12, a second flange 21 opposite to the first flange 121 is provided at the lower portion of the cover plate 2, and an air outlet slit 34 is formed between the first flange 121 and the second flange 21.
The air outlet of the air homogenizing nozzle device generally only needs to be continuous in the length direction, but does not need to have a wide range, so that the first convex edge 121 and the second convex edge 21 can control the width of the air outlet to be narrower than that of the baffle cavity. And the first flange 121 and the second flange 21 are each formed conveniently.
As shown in fig. 1, 2 and 4, heating plates 6 are provided on both sides of the plate structure formed by the main plate 1 and the cover plate 2.
The two heating plates 6 can supply heat from the two sides of the whole body formed by splicing the main plate 1 and the cover plate 2 together, so that the air flow can uniformly absorb heat in the flowing process, and the uniform air flow meeting certain temperature requirements is obtained, so that the atomic layer deposition requirement can be met.
As shown in fig. 5, the main board 1 is provided with fixing portions 13 on both sides in the longitudinal direction thereof, and fixing holes 131 are provided in the fixing portions 13.
The fixing positions are needed on two sides of the main board 1, so that the air homogenizing nozzle device can be fixed on equipment. The fixing portion 13 is the thickest region of the main board 1, and also helps the main board 1 to increase structural strength, and the fixing hole 131 is used to complete fixing.
What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.
Claims (9)
1. A even gas spray head device for space isolation atomic layer deposition equipment, its characterized in that: including mainboard and the apron of concatenation, the inner wall of mainboard with the inner wall of apron surrounds the runner of ventilating, the runner of ventilating is including the air inlet that sets gradually, branch gas flow way, baffling runner and play air seam, branch gas flow way is multistage bipartite runner, and every level runner has from the horizontal segment that advances out of both sides symmetry and links up the vertical section at the end of horizontal segment, the air inlet is as the position of admitting air of first level runner, the export of vertical section is as the position of admitting air of next level runner, baffling the runner divide into a plurality of baffling chambeies of arranging side by side, every baffling chamber links up with the vertical section export of last level runner, baffling chamber is the narrow slit structure of turn around.
2. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 1, wherein: the horizontal section of each stage of runner is connected with the vertical section of the next stage of runner by a round angle section.
3. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 2, wherein: the main board is connected with the cover plate through a plurality of first bolts, and one first bolt is arranged in a range surrounded by each round angle section.
4. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 1, wherein: the mainboard is provided with a first platform surface embedded into the cover plate, the cover plate is fixed on the first platform surface through a plurality of first bolts, the mainboard is provided with an air dividing groove in the air dividing runner, and the multistage split runner is formed by the inner surface of the air dividing groove and the inner wall of the cover plate in a surrounding mode.
5. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 4, wherein: the main board is in the baffling runner is a second platform surface lower than the first platform surface, the second platform surface is embedded with a baffle plate of a grid structure, the baffle plate comprises a plurality of fixing parts which extend vertically and a plurality of baffling strips connected between the adjacent fixing parts, the fixing parts are fixed on the second platform surface by a plurality of second bolts, the baffling strips are alternately staggered from top to bottom, adjacent baffling cavities are separated by the fixing parts, and the narrow slit structure is formed by the baffling strips, the inner wall of the main board and the inner wall of the cover plate.
6. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 5, wherein: the fixed part is in a sharp angle structure in the air outlet direction.
7. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 5, wherein: the lower part of the second platform surface is provided with a first convex edge, the lower part of the cover plate is provided with a second convex edge opposite to the first convex edge in position, and the air outlet seam is formed between the first convex edge and the second convex edge.
8. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 1, wherein: and heating plates are arranged on two sides of the plate structure formed by the main plate and the cover plate.
9. The gas homogenizing nozzle apparatus for a spatially isolated atomic layer deposition device of claim 1, wherein: the mainboard is equipped with fixed part in its length direction's both sides, be provided with the fixed orifices on the fixed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321323824.3U CN219861564U (en) | 2023-05-29 | 2023-05-29 | Uniform gas spray head device for space isolation atomic layer deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321323824.3U CN219861564U (en) | 2023-05-29 | 2023-05-29 | Uniform gas spray head device for space isolation atomic layer deposition equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219861564U true CN219861564U (en) | 2023-10-20 |
Family
ID=88319789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321323824.3U Active CN219861564U (en) | 2023-05-29 | 2023-05-29 | Uniform gas spray head device for space isolation atomic layer deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219861564U (en) |
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2023
- 2023-05-29 CN CN202321323824.3U patent/CN219861564U/en active Active
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