CN219858059U - Turnover jig for semiconductor welding parts - Google Patents
Turnover jig for semiconductor welding parts Download PDFInfo
- Publication number
- CN219858059U CN219858059U CN202320923789.2U CN202320923789U CN219858059U CN 219858059 U CN219858059 U CN 219858059U CN 202320923789 U CN202320923789 U CN 202320923789U CN 219858059 U CN219858059 U CN 219858059U
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- baffle
- mounting groove
- semiconductor
- plate
- groove
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- 238000003466 welding Methods 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 230000007306 turnover Effects 0.000 title claims abstract description 25
- 238000005192 partition Methods 0.000 claims description 45
- 238000009434 installation Methods 0.000 claims description 12
- 230000004308 accommodation Effects 0.000 claims description 5
- 230000002146 bilateral effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a turnover jig for semiconductor welding parts, which comprises a transfer support and a baffle plate arranged on the transfer support, wherein the transfer support comprises a connecting plate and baffle plates arranged on two sides of the connecting plate in parallel, mounting grooves are symmetrically arranged on two sides of the baffle plates and used for placing the baffle plates, the mounting grooves are distributed at equal intervals along the height direction of the baffle plates, when the baffle plates are placed in the mounting grooves, one side of the baffle plates, which is far away from the connecting plate, is outwards extended to form a baffle edge perpendicular to the baffle plates, and the baffle plates are enclosed with the transfer support to form a containing space for placing welding parts. The semiconductor welding piece provided by the utility model can damage the chip during transportation, so that the chip is scrapped.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a turnover jig for semiconductor welding parts.
Background
The TVS chip is a solid semiconductor device, the heart of the TVS is a semiconductor chip, one end of the chip is attached to a bracket, the other end of the chip is a negative electrode, and the other end of the chip is connected with the positive electrode of a power supply, so that the whole chip is encapsulated by epoxy resin.
In the production process of semiconductor devices, after the steps of attaching and fixing devices, arranging wires and the like are completed on a substrate, the devices are often packaged, namely, the devices are packaged by adopting molding materials such as epoxy resin molding compound and the like. On one hand, the device is isolated from the outside, so that the electric performance of the device is prevented from being reduced due to corrosion of impurities in the air to a circuit of the device; on the other hand, the packaged device is also more convenient to install and transport.
In the manufacturing process of semiconductor package, the chip device and the lead frame need to be welded, and the welding parts need to be circulated, and the semiconductor welding parts are generally stacked together for circulation when in circulation in the prior art, so that two adjacent semiconductor welding parts can be clamped easily in the circulation process, and the chips can be damaged, so that the chips are scrapped.
Disclosure of Invention
Based on the above, the utility model aims to provide a turnover jig for semiconductor welding parts, which aims to solve the problem that chips are scrapped due to the fact that the semiconductor welding parts in the prior art damage the chips during transportation.
The utility model provides a turnover jig for semiconductor welding parts, which comprises a transfer support and baffle plates arranged on the transfer support, wherein the transfer support comprises a connecting plate and baffle plates arranged on two sides of the connecting plate in parallel, mounting grooves are symmetrically arranged on two sides of the baffle plates and used for placing the baffle plates, the mounting grooves are distributed at equal intervals along the height direction of the baffle plates, when the baffle plates are arranged in the mounting grooves, one side of the baffle plates, which is far away from the connecting plate, is outwards extended to form a baffle edge perpendicular to the baffle plates, and the baffle plates are enclosed with the transfer support to form a containing space for placing the welding parts.
Above-mentioned semiconductor welding turnover tool encloses the accommodation space that closes formation through putting the welding respectively at each baffle and transportation support for the welding is all restricted motion and is separated by the fore-and-aft direction about transporting the in-process, and then makes can not appear adjacent welding and remove each other to block, leads to the situation of chip damage. Specifically, transfer the support and include connecting plate and parallel arrangement at the baffle at connecting plate both ends, baffle bilateral symmetry equidistance is provided with the mounting groove that is used for placing the baffle, outwards extend on the baffle has the flange, the weldment is placed respectively on each baffle during the transportation, the flange, connecting plate and baffle are used for restricting the removal of weldment front and back and left and right, the baffle is used for restricting the removal of weldment direction of height from top to bottom, and then make the weldment separated when transporting, and by restricting and can not remove in the accommodation space, and then can not appear adjacent weldment and block the situation that leads to the chip damage each other, also can not appear the weldment rocks in turnover tool and the situation that the tool collides and leads to the chip damage. Thus, the method is applicable to a variety of applications. The utility model solves the problem that the chip is scrapped because the chip is damaged when the semiconductor welding piece is transported in the prior art.
In addition, the turnover jig for the semiconductor welding parts, provided by the utility model, can also have the following additional technical characteristics:
preferably, a groove is formed in one side, far away from the connecting plate, of the top of the mounting groove, so that the mounting groove is communicated with the outside, the thickness of the partition plate is smaller than the height of the mounting groove, and two ends of the partition plate are arranged in the mounting groove through the groove.
Preferably, a guiding inclined plane is arranged on one side of the groove away from the connecting plate, so that the partition plate can easily enter the mounting groove.
Preferably, the width of the mounting groove is smaller than that of the partition board, one side, close to the connecting plate, of the bottom of the mounting groove is inwards recessed to form a containing part, and the containing part and the bottom of the mounting groove are matched to contain the partition board.
Preferably, the bottom of the mounting groove is far away from one side of the connecting plate and is inwards recessed to form a clamping part, and the partition board is arranged at the bottom of the mounting groove and then moves towards the clamping part, so that the clamping part and the accommodating part limit the movement of the two sides of the partition board in the height direction.
Preferably, the baffle is adjacent to the two sides of the flange and extends outwards to form a limit edge, the limit edge is perpendicular to the baffle and opposite to the flange in direction, and the limit edge is matched with the baffle and used for limiting the baffle to move forwards and backwards.
Preferably, the baffle is provided with an arc groove, and the arc groove is positioned in the middle section of one side of the baffle, which is provided with the flange.
Preferably, an elliptical groove is formed in the top of the connecting plate.
Drawings
Fig. 1 is a schematic structural diagram of a turnover jig for semiconductor solder parts according to an embodiment of the utility model;
FIG. 2 is a schematic view of a transfer rack according to an embodiment of the present utility model;
FIG. 3 is a front view of FIG. 2;
FIG. 4 is a schematic view of a separator according to an embodiment of the present utility model;
description of main reference numerals:
the utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, a turnover fixture for semiconductor solder parts according to an embodiment of the utility model includes a transfer frame 10 and a partition 20 disposed on the transfer frame 10, wherein:
the transfer support 10 comprises a connecting plate 11 and baffle plates 12 which are arranged on two sides of the connecting plate 11 in parallel, mounting grooves 121 are symmetrically formed in two sides of the baffle plates 12 and used for placing the baffle plates 20, the mounting grooves 121 are distributed at equal intervals along the height direction of the baffle plates 12, when the baffle plates 20 are placed in the mounting grooves 121, baffle plates 20 are outwards extended to form baffle edges 21 perpendicular to the baffle plates 20, and the baffle plates 20 and the transfer support 10 enclose to form a containing space for placing welding pieces.
It can be appreciated that the welding pieces are respectively placed in the accommodating spaces formed by surrounding the partition boards 20 and the transferring support 10, so that the welding pieces are limited to move and separate in the front-back direction, the upper-lower direction, the left-right direction and the front-back direction in the transferring process, and further, the adjacent welding pieces can not move and be clamped with each other, so that the chip is damaged. Specifically, the transportation support 10 includes the connecting plate 11 and parallel baffle 12 that sets up at connecting plate 11 both ends, baffle 12 bilateral symmetry equidistance is provided with the mounting groove 121 that is used for placing baffle 20, outwards extend on the baffle 20 has flange 21, the welding piece is placed respectively on each baffle 20 during transportation, flange 21, connecting plate 11 and baffle 12 are used for restricting the removal of welding piece front and back, control, baffle 20 from top to bottom is used for restricting the removal of welding piece direction of height, and then make the welding piece separated when transporting, and be restricted and can not remove in the accommodation space, and then can not appear adjacent welding piece mutually block the situation that leads to the chip damage, also can not appear the welding piece rocks in turnover tool with the tool collision leads to the situation of chip damage. Thus, the method is applicable to a variety of applications. The utility model solves the problem that the chip is scrapped because the chip is damaged when the semiconductor welding piece is transported in the prior art.
By way of example and not limitation, in some alternative embodiments, a groove 122 is provided on the top of the mounting groove 121 on the side away from the connection plate 11 so that the mounting groove 121 communicates with the outside, the thickness of the partition 20 is smaller than the height of the mounting groove 121, and both ends of the partition 20 are placed in the mounting groove 12 through the groove 122. When the partition 20 is mounted, the side where the rib 21 is not provided is aligned with the groove 122, and the partition 20 is placed in the mounting groove 121 by moving along the length direction of the groove 122.
Further, the groove 122 is provided with a guide slope 1221 on a side away from the connection plate 11 to facilitate the insertion of the partition 20 into the installation groove 121. The guide inclined plane 1221 is provided, so that the partition board 20 is easier to align during installation, and a worker is convenient to identify the installation position of the partition board 20, and the partition board 20 only needs to move towards the direction of the guide inclined plane 1221 for exerting force during installation, and the guide inclined plane 1221 guides the partition board 20 into the installation groove 121, so that the installation of the partition board 20 is more convenient and quick.
In addition, the width of the mounting groove 121 is smaller than that of the partition 20, the bottom of the mounting groove 121 is recessed inwards to form a containing portion 1211 near the connecting plate 11, and the containing portion 1211 and the bottom of the mounting groove 121 are matched to contain the partition 20. The width of the installation groove 121 is set smaller than the width of the partition plate 20, and the accommodating part 1211 is arranged at the bottom of the installation groove 121, so that the partition plate 20 can be installed in the installation groove 121, and the top of the accommodating part 1211 can limit the partition plate 20 to move up and down, so that the partition plate 20 is prevented from shaking up and down during transferring. In particular, the partition 20 is inclined along the guide slope 1221 into the installation groove 121, and when the partition 20 is at least partially inserted into the receiving portion 1211, the partition 20 is rotated downward and moved in the length direction of the receiving portion 1211, so that the partition 20 is completely installed into the installation groove 121. Of course, to achieve this, the thickness of the spacer 20 needs to be less than the height of the recess 122.
Specifically, the bottom of the mounting groove 121 is recessed inward away from the side of the connecting plate 11 to form a clamping portion 1212, and the partition 20 is moved toward the clamping portion 1212 after being placed in the bottom of the mounting groove 121, so that the clamping portion 1212 and the receiving portion 1211 restrict the movement of the partition 20 in the height direction of both sides. The clamping portion 1212 is arranged at the bottom of the mounting groove 121, so that the heights of the two sides of the accommodating portion 1211 and the clamping portion 1212 can be limited, the limiting force to which the baffle 20 is subjected is more uniform, the baffle 20 is less prone to shaking in the mounting groove 121 and sliding out of the mounting groove 121, when the baffle 20 is positioned in the mounting groove 121 and props against the side wall of the clamping portion 1212 in the length direction, the distance between the baffle 12 and the connecting plate 11 is just the width of a welding piece, and the welding piece can be accommodated and limited on the left side and the right side of the welding piece, so that the widths of the baffle 20 and the baffle 12 can be reduced to the greatest extent, and the effect of saving materials is achieved.
In addition, two sides of the baffle 20 adjacent to the baffle edge 21 extend outwards to form a limiting edge 22, the limiting edge 22 is perpendicular to the baffle 20 and opposite to the baffle edge 21 in direction, and the limiting edge 22 is matched with the baffle 12 to limit the baffle 20 to move forwards and backwards. The limiting edges 22 are arranged, so that when the partition board 20 is placed in the mounting groove 121, the limiting edges 22 are erected near the mounting groove 121 on the outer side of the baffle 12, and then the limiting edges 22 on two sides are matched with the baffle 12 to limit the front-back movement of the partition board 20.
Further, the partition plate 20 is provided with an arc groove 23, and the arc groove 23 is positioned at the middle section of one side of the partition plate 20, which is provided with the flange 12. The arc groove 23 is arranged, so that when the welding piece is taken and placed, the palm of a worker can conveniently extend out of or extend into the accommodating space. In addition, an elliptical groove 111 is formed at the top of the connection plate 11. When the welding part is transported by the turnover jig, a worker can grasp the turnover jig by using the palm through the elliptical groove 111, so that the turnover jig is convenient to transport.
In summary, according to the turnover jig for semiconductor weldments in the above embodiments of the present utility model, the weldments are respectively placed in the accommodating spaces formed by enclosing the partition boards 20 and the transfer brackets 10, so that the weldments are restricted from moving and being separated in the vertical, horizontal and front-rear directions during the transfer process, and further, the situation that adjacent weldments are blocked by moving each other, resulting in chip damage is avoided. Specifically, the transportation support 10 includes the connecting plate 11 and parallel baffle 12 that sets up at connecting plate 11 both ends, baffle 12 bilateral symmetry equidistance is provided with the mounting groove 121 that is used for placing baffle 20, outwards extend on the baffle 20 has flange 21, the welding piece is placed respectively on each baffle 20 during transportation, flange 21, connecting plate 11 and baffle 12 are used for restricting the removal of welding piece front and back, control, baffle 20 from top to bottom is used for restricting the removal of welding piece direction of height, and then make the welding piece separated when transporting, and be restricted and can not remove in the accommodation space, and then can not appear adjacent welding piece mutually block the situation that leads to the chip damage, also can not appear the welding piece rocks in turnover tool with the tool collision leads to the situation of chip damage. Thus, the method is applicable to a variety of applications. The utility model solves the problem that the chip is scrapped because the chip is damaged when the semiconductor welding piece is transported in the prior art.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (8)
1. The utility model provides a semiconductor welding turnover tool, its characterized in that is in including transporting the support and setting baffle on the support is transported to the support includes connecting plate and parallel arrangement be in the baffle of connecting plate both sides, bilateral symmetry is provided with the mounting groove on the baffle and is used for placing the baffle, the mounting groove is followed baffle direction of height equidistance distributes, the baffle is arranged in during the mounting groove, the baffle keep away from connecting plate one side outwards extend have with baffle vertically flange, the baffle with it encloses to close to form the accommodation space that is used for placing the welding piece to transport the support.
2. The turnover jig for semiconductor weldments according to claim 1, wherein a groove is formed in one side, away from the connecting plate, of the top of the mounting groove so that the mounting groove is communicated with the outside, the thickness of the partition plate is smaller than the height of the mounting groove, and two ends of the partition plate are placed in the mounting groove through the groove.
3. The turnover jig for semiconductor weldments according to claim 2, wherein a guide slope is provided on a side of the groove away from the connection plate so that the partition plate is easily inserted into the installation groove.
4. The turnover jig for semiconductor weldments according to claim 1, wherein the width of the mounting groove is smaller than that of the partition board, the bottom of the mounting groove is recessed inwards to form a containing part near one side of the connecting plate, and the containing part and the bottom of the mounting groove are matched to contain the partition board.
5. The turnover jig for semiconductor weldments according to claim 4, wherein one side of the bottom of the mounting groove, which is far away from the connecting plate, is inwards recessed to form a clamping part, and the partition board is arranged at the bottom of the mounting groove and then moves towards the clamping part, so that the clamping part and the accommodating part limit the movement of the two sides of the partition board in the height direction.
6. The turnover jig for semiconductor weldments according to any one of claims 1 to 5, wherein the baffle plate is provided with limiting edges extending outwards from two sides adjacent to the baffle plate, the limiting edges are perpendicular to the baffle plate and opposite to the baffle plate in direction, and the limiting edges are matched with the baffle plate and used for limiting the baffle plate to move forwards and backwards.
7. The turnover jig for semiconductor weldments according to claim 6, wherein the partition plate is provided with an arc groove, and the arc groove is positioned in the middle section of one side of the partition plate provided with the flange.
8. The turnover jig for semiconductor weldments according to claim 6, wherein an elliptical groove is provided at the top of the connection plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320923789.2U CN219858059U (en) | 2023-04-23 | 2023-04-23 | Turnover jig for semiconductor welding parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320923789.2U CN219858059U (en) | 2023-04-23 | 2023-04-23 | Turnover jig for semiconductor welding parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219858059U true CN219858059U (en) | 2023-10-20 |
Family
ID=88330771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320923789.2U Active CN219858059U (en) | 2023-04-23 | 2023-04-23 | Turnover jig for semiconductor welding parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219858059U (en) |
-
2023
- 2023-04-23 CN CN202320923789.2U patent/CN219858059U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |