CN216218338U - Power module with good heat dissipation effect - Google Patents
Power module with good heat dissipation effect Download PDFInfo
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- CN216218338U CN216218338U CN202122306275.6U CN202122306275U CN216218338U CN 216218338 U CN216218338 U CN 216218338U CN 202122306275 U CN202122306275 U CN 202122306275U CN 216218338 U CN216218338 U CN 216218338U
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- power module
- heat dissipation
- module body
- fixedly connected
- heat
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Abstract
The utility model discloses a power module with a good heat dissipation effect, which comprises a power module body, wherein a structure for dissipating heat of the power module body is arranged on the surface of the power module body, the structure for dissipating heat of the power module body comprises a shell arranged on the surface of the power module body, the bottom of the shell is fixedly connected with a heat dissipation box, the bottom of the shell is provided with a through groove, and the bottom of the power module body is fixedly connected with a heat conduction sheet. The semiconductor refrigeration pieces are arranged to dissipate heat of the power module body, the cooling fan dissipates heat of the semiconductor refrigeration pieces through the cooling fins, and the ventilation fan dissipates heat of the power module body through the heat dissipation holes and the cooling fins, so that the problems that the power module generates heat during working, the existing power module is poor in heat dissipation effect, and the temperature of the power module is easily overhigh after long-time use, and the power is damaged are solved.
Description
Technical Field
The utility model relates to the technical field of power modules, in particular to a power module with a good heat dissipation effect.
Background
The power module is a module used for supplying power to other modules, the power module can generate heat when working, the heat dissipation effect of the existing power module is poor, and the temperature of the power module is easily too high after long-time use, so that the power is damaged.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the background art, the utility model aims to provide a power module with a good heat dissipation effect, which has the advantage of good heat dissipation effect and solves the problems that the power module generates heat when in work, the existing power module has poor heat dissipation effect, and the temperature of the power module is easily overhigh after long-time use, so that the power is damaged.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a power module that radiating effect is good, includes the power module body, the surface of power module body is provided with and is used for carrying out radiating structure to the power module body for carry out radiating structure to the power module body is including setting up the casing on power module body surface, the bottom fixedly connected with heat dissipation box of casing, logical groove has been seted up to the bottom of casing, the bottom fixedly connected with conducting strip of power module body, the bottom fixedly connected with semiconductor refrigeration piece of conducting strip, the bottom fixedly connected with heat radiation fins of semiconductor refrigeration piece one, the bottom fixedly connected with connecting plate of conducting strip, the bottom fixedly connected with radiator fan that uses with heat radiation fins one cooperation of connecting plate, radiator fan's quantity is two.
Preferably, the two sides of the heat dissipation box are both provided with four ventilation holes matched with the heat dissipation fan for use.
Preferably, the two sides of the shell are provided with heat dissipation holes, the left side of the inner wall of the shell is fixedly connected with a fixing plate, the top of the fixing plate is fixedly connected with a ventilation fan, and the top of the power module body is fixedly connected with a second heat dissipation fin matched with the ventilation fan for use.
Preferably, the interior of the heat dissipation hole is fixedly connected with a dust screen, and the dust screen is made of metal.
Preferably, the surfaces of the shell and the heat dissipation box are both provided with corrosion-resistant layers, and the thickness of each corrosion-resistant layer is 150 microns.
Compared with the prior art, the utility model has the following beneficial effects:
1. the semiconductor refrigeration pieces are arranged to dissipate heat of the power module body, the cooling fan dissipates heat of the semiconductor refrigeration pieces through the cooling fins, and the ventilation fan dissipates heat of the power module body through the heat dissipation holes and the cooling fins, so that the problems that the power module generates heat during working, the existing power module is poor in heat dissipation effect, and the temperature of the power module is easily overhigh after long-time use, and the power is damaged are solved.
2. According to the utility model, the semiconductor refrigeration piece, the first heat dissipation fins and the heat dissipation fan are arranged, so that the heat dissipation of the power module body can be carried out, and the heat dissipation effect of the power module body is improved.
3. The utility model can increase the heat radiation effect of the heat radiation fan on the semiconductor refrigeration sheet by arranging the vent holes, thereby improving the practicability of the heat radiation fan.
4. According to the utility model, through the arrangement of the heat dissipation holes, the ventilation fans and the second heat dissipation fins, the top of the power module body can be dissipated, and the heat dissipation effect of the power module body is improved.
5. According to the utility model, the dust screen is arranged, so that dust can be prevented from entering the shell through the heat dissipation holes, and the service life of the power module body is prolonged.
6. According to the utility model, the corrosion-resistant layer is arranged, so that the shell and the heat dissipation box can be prevented from being corroded, and the service lives of the shell and the heat dissipation box are prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1 according to the present invention;
fig. 3 is a schematic perspective view of the housing of the present invention.
In the figure: 1. a power module body; 2. a housing; 3. a heat dissipation box; 4. a through groove; 5. a heat conductive sheet; 6. a semiconductor refrigeration sheet; 7. a first heat dissipation fin; 8. a connecting plate; 9. a heat radiation fan; 10. a vent hole; 11. heat dissipation holes; 12. a fixing plate; 13. a ventilating fan; 14. a second heat dissipation fin; 15. a dust screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, the power module with a good heat dissipation effect provided by the utility model comprises a power module body 1, wherein a structure for dissipating heat of the power module body 1 is arranged on the surface of the power module body 1, the structure for dissipating heat of the power module body 1 comprises a shell 2 arranged on the surface of the power module body 1, a heat dissipation box 3 is fixedly connected to the bottom of the shell 2, a through groove 4 is formed in the bottom of the shell 2, a heat conduction sheet 5 is fixedly connected to the bottom of the power module body 1, a semiconductor refrigeration sheet 6 is fixedly connected to the bottom of the heat conduction sheet 5, a first heat dissipation fin 7 is fixedly connected to the bottom of the semiconductor refrigeration sheet 6, a connecting plate 8 is fixedly connected to the bottom of the heat conduction sheet 5, a first heat dissipation fan 9 matched with the first heat dissipation fin 7 is fixedly connected to the bottom of the connecting plate 8, and the number of the heat dissipation fans 9 is two.
As a technical optimization scheme of the utility model, the semiconductor refrigeration sheet 6, the first heat dissipation fins 7 and the heat dissipation fan 9 are arranged, so that the heat dissipation of the power module body 1 can be realized, and the heat dissipation effect of the power module body 1 is improved.
Referring to fig. 1, two sides of the heat dissipation box 3 are both provided with four ventilation holes 10 used in cooperation with the heat dissipation fan 9.
As a technical optimization scheme of the present invention, the ventilation holes 10 are provided to increase the heat dissipation effect of the cooling fan 9 on the semiconductor cooling fins 6, thereby improving the practicability of the cooling fan 9.
Referring to fig. 2, heat dissipation holes 11 are formed in both sides of the housing 2, a fixing plate 12 is fixedly connected to the left side of the inner wall of the housing 2, a ventilation fan 13 is fixedly connected to the top of the fixing plate 12, and a second heat dissipation fin 14 used in cooperation with the ventilation fan 13 is fixedly connected to the top of the power module body 1.
As a technical optimization scheme of the utility model, the heat dissipation holes 11, the ventilation fans 13 and the second heat dissipation fins 14 are arranged, so that the top of the power module body 1 can be dissipated, and the heat dissipation effect of the power module body 1 is improved.
Referring to fig. 2, a dust screen 15 is fixedly connected inside the heat dissipation hole 11, and the dust screen 15 is made of metal.
As a technical optimization scheme of the utility model, by arranging the dust screen 15, dust can be prevented from entering the housing 2 through the heat dissipation holes 11, and the service life of the power module body 1 is prolonged.
Referring to fig. 1, the surfaces of the case 2 and the heat-dissipating box 3 are each provided with a corrosion-resistant layer having a thickness of 150 μm.
As a technical optimization scheme of the utility model, the corrosion-resistant layer is arranged, so that the shell 2 and the heat dissipation box 3 can be prevented from being corroded, and the service life of the shell 2 and the heat dissipation box 3 is prolonged.
The working principle and the using process of the utility model are as follows: during the use, when needs dispel the heat to power module body 1, start semiconductor refrigeration piece 6 and radiator fan 9, semiconductor refrigeration piece 6 dispels the heat to power module body 1 through conducting strip 5, radiator fan 9 dispels the heat to semiconductor refrigeration piece 6 through heat radiation fins 7, start ventilation fan 13 simultaneously, ventilation fan 13 dispels the heat to power module body 1 through louvre 11 and heat radiation fins two 14, can possess the advantage that the radiating effect is good.
In summary, the following steps: this power module that radiating effect is good, dispel the heat to power module body 1 through semiconductor refrigeration piece 6, radiator fan 9 dispels the heat to semiconductor refrigeration piece 6 through heat radiation fins 7, ventilation fan 13 dispels the heat to power module body 1 through louvre 11 and heat radiation fins two 14, it can produce the heat at the during operation to have solved power module, and current power module radiating effect is poor, power module's temperature is too high easily after using for a long time, thereby lead to the problem of power damage.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A power module with good heat dissipation effect comprises a power module body (1);
the method is characterized in that: the surface of the power module body (1) is provided with a structure for dissipating heat of the power module body (1), the structure for dissipating heat of the power module body (1) comprises a shell (2) arranged on the surface of the power module body (1), the bottom of the shell (2) is fixedly connected with a heat dissipation box (3), the bottom of the shell (2) is provided with a through groove (4), the bottom of the power module body (1) is fixedly connected with a heat conduction sheet (5), the bottom of the heat conduction sheet (5) is fixedly connected with a semiconductor refrigeration sheet (6), the bottom of the semiconductor refrigeration sheet (6) is fixedly connected with a first heat dissipation fin (7), the bottom of the heat conduction sheet (5) is fixedly connected with a connecting plate (8), and the bottom of the connecting plate (8) is fixedly connected with a heat dissipation fan (9) matched with the first heat dissipation fin (7) for use, the number of the heat radiation fans (9) is two.
2. The power module with good heat dissipation effect as claimed in claim 1, wherein: the both sides of heat dissipation box (3) all seted up with radiator fan (9) cooperation use ventilation hole (10), the quantity of ventilation hole (10) is four.
3. The power module with good heat dissipation effect as claimed in claim 1, wherein: louvre (11) have all been seted up to the both sides of casing (2), left side fixedly connected with fixed plate (12) of casing (2) inner wall, the top fixedly connected with ventilating fan (13) of fixed plate (12), the top fixedly connected with of power module body (1) and the radiating fin two (14) of ventilating fan (13) cooperation use.
4. The power module with good heat dissipation effect as claimed in claim 3, wherein: the inside fixedly connected with dust screen (15) of louvre (11), the material of dust screen (15) is the metal.
5. The power module with good heat dissipation effect as claimed in claim 1, wherein: the surfaces of the shell (2) and the heat dissipation box (3) are both provided with corrosion-resistant layers, and the thickness of each corrosion-resistant layer is 150 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122306275.6U CN216218338U (en) | 2021-09-23 | 2021-09-23 | Power module with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122306275.6U CN216218338U (en) | 2021-09-23 | 2021-09-23 | Power module with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216218338U true CN216218338U (en) | 2022-04-05 |
Family
ID=80921275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122306275.6U Active CN216218338U (en) | 2021-09-23 | 2021-09-23 | Power module with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216218338U (en) |
-
2021
- 2021-09-23 CN CN202122306275.6U patent/CN216218338U/en active Active
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