CN219800820U - Semiconductor device electrostatic chuck assembly installation alignment device - Google Patents
Semiconductor device electrostatic chuck assembly installation alignment device Download PDFInfo
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- CN219800820U CN219800820U CN202321237427.4U CN202321237427U CN219800820U CN 219800820 U CN219800820 U CN 219800820U CN 202321237427 U CN202321237427 U CN 202321237427U CN 219800820 U CN219800820 U CN 219800820U
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- electrostatic chuck
- chuck assembly
- alignment
- holes
- lifting
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000009434 installation Methods 0.000 title abstract description 29
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 230000001154 acute effect Effects 0.000 claims description 3
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000011900 installation process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
The utility model relates to an installation alignment device of an electrostatic chuck assembly of semiconductor equipment, which belongs to the technical field of semiconductor equipment and comprises a lifting plate, wherein the lifting plate is positioned right above the electrostatic chuck assembly, and a protective soft cushion is arranged on the lower surface of the lifting plate; two alignment holes and three bolt connection holes are formed in the lifting plate, and lifting bolts penetrate through the bolt connection holes; the lower end of the lifting bolt is correspondingly in threaded connection with a screw through hole of the electrostatic chuck assembly; a blind screw hole corresponding to the through screw hole of the electrostatic chuck assembly is formed in the bottom plate of the cavity of the semiconductor device, and alignment columns are connected in the two blind screw holes at two sides in a threaded manner; the upper end of the alignment column passes through the screw through hole and the alignment hole and then is exposed above the lifting plate; handles are arranged at the two sides of the upper part of the lifting plate and are adjacent to the alignment holes in a one-to-one correspondence. This scheme is connected steadily in the handling, and is convenient for observe, guarantees to put into the position and aims at, is showing improvement installation effectiveness and uniformity.
Description
Technical Field
The utility model belongs to the technical field of semiconductor equipment, and particularly relates to an installation alignment device for an electrostatic chuck assembly of semiconductor equipment.
Background
The electrostatic chuck assembly is a common component in semiconductor equipment, for example, in an existing chemical vapor deposition equipment, six mounting holes are formed in the bottom surface of the cavity of the equipment, six positioning holes corresponding to the electrostatic chuck assembly one by one are formed in the bottom surface of the electrostatic chuck assembly, and then the electrostatic chuck assembly is fastened and connected with the bottom surface of the cavity through special bolts. No auxiliary mounting tool for such an electrostatic chuck assembly is currently available on the market.
The prior art, for example, issued patent CN212740376U, provides an electrostatic chuck removing tool, which can avoid the problem that the parts at the bottom of the chuck are damaged during the removing process due to the application of bare-hand force, but cannot be applied in the mounting process. When the electrostatic chuck assembly is installed, the electrostatic chuck assembly is carried and placed in the equipment cavity, the positioning holes are aligned with the installation holes, and the problems of incapability of alignment, low installation efficiency and poor installation consistency often occur in actual operation.
In addition, unlike the independent electrostatic chuck of the prior art, the electrostatic chuck assembly of the present utility model has many other components, which are formed as a whole assembly, weighing about 25kg, and usually requires at least two people to carry, and the mounting orientation is difficult to control during the process of placing the electrostatic chuck assembly into the cavity for mounting, which is extremely easy to collide, scratch the side wall and the bottom surface of the cavity, and cause damage to the hardware surface and failure of sealing. The above-mentioned prior patent only connects the electrostatic chuck through a lift bar in the middle, is inconvenient to carry stably.
Disclosure of Invention
Based on the technical problems in the prior art, the utility model provides an installation alignment device for an electrostatic chuck assembly of semiconductor equipment, which solves the problems that a heavier electrostatic chuck assembly is inconvenient to install, is easy to collide with and damage, and the like, and realizes the alignment of installation holes and stable transportation.
According to the technical scheme, the utility model provides an installation alignment device for an electrostatic chuck assembly of semiconductor equipment, which comprises a lifting plate, wherein the lifting plate is positioned right above the electrostatic chuck assembly, and a protective soft cushion is arranged on the lower surface of the lifting plate; two alignment holes and three bolt connection holes are formed in the lifting plate, and lifting bolts penetrate through the bolt connection holes; the lower end of the lifting bolt is correspondingly in threaded connection with a screw through hole of the electrostatic chuck assembly; a blind screw hole corresponding to the through screw hole of the electrostatic chuck assembly is formed in the bottom plate of the cavity of the semiconductor device, and alignment columns are connected in the two blind screw holes at two sides in a threaded manner; the upper end of the alignment column passes through the screw through hole and the alignment hole and then is exposed above the lifting plate; handles are arranged at the two sides of the upper part of the lifting plate and are adjacent to the alignment holes in a one-to-one correspondence.
Further, the handle is fixed on the lifting plate in a bolt mode, and the handle is in an upwardly arched bridge shape.
Preferably, the junction of the handle and the pulling plate is adjacent to the alignment hole.
Preferably, the lifting bolt comprises a stud and an end nut; the lower end of the stud is provided with lower external threads and is in threaded connection with the screw through hole in a matched manner, and the upper end of the stud is provided with upper external threads and is in threaded connection with the end nut in a matched manner and is welded and fixed; the upper part of the end nut is provided with a circular ring part.
Further, an annular protrusion is arranged in the middle of the stud, and the lower surface of the end nut and the upper surface of the annular protrusion are respectively positioned on the upper side and the lower side of the pulling plate.
Preferably, the stud is further connected with a limit nut in a threaded manner, and the lower surface of the end nut and the upper surface of the limit nut are respectively located on the upper side and the lower side of the pulling plate.
Preferably, a locking nut is also connected to the stud in a threaded manner, and the locking nut is positioned under the limit nut in a close fit.
Preferably, the lifting bolt is an eye bolt, an annular gasket is sleeved on the lifting bolt, and the annular gasket is positioned between the eye above the lifting bolt and the lifting plate.
Preferably, the upper end of the alignment post is a screw part convenient for screwing
Preferably, the positions of the three bolting holes constitute three vertices of an acute triangle or a right triangle.
Compared with the prior art, the utility model has the following beneficial technical effects:
1. the semiconductor equipment electrostatic chuck assembly mounting alignment device adopts the lifting plate and the three lifting bolts which are connected with the shape characteristics of the electrostatic chuck assembly in a matched manner, so that the connection is stable in the carrying process; the two groups of alignment columns are matched with the alignment holes to ensure the alignment of the positions of the placed electrostatic chuck components during installation, so that the installation efficiency and consistency can be remarkably improved; in addition, the handles are arranged on two sides and correspond to the alignment holes and the alignment columns, so that observation is facilitated in the installation process, and the convenience and the accuracy of installation are further improved.
2. According to the semiconductor equipment electrostatic chuck assembly installation alignment device, the protective soft cushion is arranged below the lifting plate, so that a protective effect is achieved, the working face above the electrostatic chuck assembly is prevented from being rubbed and damaged, the protective soft cushion can be directly contacted with the electrostatic chuck assembly, and installation connection is facilitated.
3. The semiconductor equipment electrostatic chuck assembly mounting and aligning device fully utilizes the structures of the existing electrostatic chuck assembly and the semiconductor equipment chamber, thereby realizing simple structure, convenient use, low production cost and extremely high practical value.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present utility model.
Fig. 2 is a schematic perspective view of the embodiment shown in fig. 1.
Fig. 3 is a schematic top view of a chamber of a conventional semiconductor device to which the present utility model is applied.
Reference numerals in the drawings illustrate:
1. a lifting plate;
2. a protective cushion;
3. aligning the holes;
4. a bolt connection hole;
5. pulling the bolt;
6. an alignment post;
7. a handle;
8. a stud;
9. an end nut;
10. a circular ring portion;
11. a limit nut;
12. a lock nut;
13. a screwing part;
14. an annular gasket;
E. an electrostatic chuck assembly;
e1, a screw through hole;
C. a chamber floor;
and C1, a blind hole of the screw.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings. Embodiments of the utility model and features of the embodiments may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
The utility model provides an installation alignment device of an electrostatic chuck assembly of semiconductor equipment, which belongs to the technical field of semiconductor equipment and comprises a lifting plate, wherein the lifting plate is positioned right above the electrostatic chuck assembly, and a protective soft cushion is arranged on the lower surface of the lifting plate; two alignment holes and three bolt connection holes are formed in the lifting plate, and lifting bolts penetrate through the bolt connection holes; the lower end of the lifting bolt is correspondingly in threaded connection with a screw through hole of the electrostatic chuck assembly; a blind screw hole corresponding to the through screw hole of the electrostatic chuck assembly is formed in the bottom plate of the cavity of the semiconductor device, and alignment columns are connected in the two blind screw holes at two sides in a threaded manner; the upper end of the alignment column passes through the screw through hole and the alignment hole and then is exposed above the lifting plate; handles are arranged at the two sides of the upper part of the lifting plate and are adjacent to the alignment holes in a one-to-one correspondence. This scheme is connected steadily in the handling, and is convenient for observe, guarantees to put into the position and aims at, is showing improvement installation effectiveness and uniformity.
Referring to fig. 3, a semiconductor device according to the present utility model includes a chamber (vacuum chamber), a bottom plate C of the chamber is provided with a plurality of blind screw holes C1, so as to mount an electrostatic chuck assembly E, the bottom plate of the electrostatic chuck assembly E is provided with a plurality of through screw holes E1, the number of the through screw holes E1 is the same as that of the blind screw holes C1, and the positions of the through screw holes are in one-to-one correspondence for detachable mounting and fixing by means of bolts. In the illustrated embodiment, the blind screw holes C1 are six (the scheme of the present utility model is not limited to this, and at least five blind screw holes C1 may be provided, or more blind screw holes C1 may be provided). At present when installation electrostatic chuck subassembly E, alignment usually only through the visual inspection to because it is heavier, lift up the transport jointly by 2 to 3 people generally, place, the installation is difficult to guarantee stability more, accuracy, produces the collision easily, leads to equipment to be impaired, influences life, and waste time and energy, inefficiency, installation uniformity are poor.
Therefore, the utility model provides an electrostatic chuck assembly mounting alignment device for semiconductor equipment, referring to fig. 1 and 2, for guiding and limiting during the process of mounting an electrostatic chuck assembly E to a semiconductor equipment chamber, which comprises a pulling plate 1, wherein the pulling plate 1 is located right above the electrostatic chuck assembly E, and a protective cushion 2 is arranged on the lower surface of the pulling plate 1. The protection cushion 2 is preferably mainly a sponge cushion or a silica gel cushion, and is sleeved with non-woven fabrics on the outer side, so that the protection function is achieved, the working surface above the electrostatic chuck assembly E is ensured not to be rubbed and damaged, and the protection cushion 2 can be directly contacted with the upper surface of the electrostatic chuck assembly E, so that the installation and connection are facilitated.
Two alignment holes 3 are formed in the positions of two sides of the lifting plate 1, three bolt connecting holes 4 are formed in the lifting plate 1, the alignment holes 3 and the bolt connecting holes 4 are located on the outer side and distributed along the circumference, for example, six screw through holes E1 and six screw blind holes C1 are distributed in a regular hexagon; the positions of the two alignment holes 3 and the three bolt connection holes 4 are distributed at the five vertex positions of the same regular hexagon. The bolt connecting hole 4 is penetrated with a lifting bolt 5, and the lower end of the lifting bolt 5 is correspondingly in threaded connection with a screw through hole E1 of the electrostatic chuck assembly E. The three bolt connecting holes 4 are positioned in non-collinear, preferably form three vertexes of an acute triangle or a right triangle, so that the lifting force is uniform in the circumferential direction. The chamber bottom plate C of the semiconductor device is provided with screw blind holes C1 corresponding to the screw through holes E1 of the electrostatic chuck assembly E, wherein the two screw blind holes C1 positioned on two opposite sides of the chamber bottom plate C are connected with alignment columns 6 in a threaded manner, and the upper ends of the alignment columns 6 penetrate through the screw through holes E1 and the alignment holes 3 and are exposed above the lifting plate 1. Handles 7 are arranged at the positions of the two sides above the lifting plate 1, and the handles 7 are adjacent to the alignment holes 3 in a one-to-one correspondence.
More specifically, the handle 7 is in an upwardly arched bridge shape, the bottom of the handle 7 and the pulling plate 1 are provided with matched mounting connection holes, and the handle 7 is fixedly mounted on the pulling plate 1 by a bolt mode. The connection part of the handle 7 and the lifting plate 1 (i.e. the root of the bridge shape of the handle 7) is adjacent to the alignment hole 3, so that in the process of placing the electrostatic chuck assembly E into the equipment chamber, two people lift the electrostatic chuck assembly E through the handle 7 at two sides, can see whether the sides are aligned with the alignment column 6 or not and move through the alignment hole 3, place the electrostatic chuck assembly E after the alignment position, the alignment column 6 penetrates into the screw through hole corresponding to the alignment hole 3 to realize the limiting guide function, and after the electrostatic chuck assembly E is completely placed, the upper end of the alignment column 6 penetrates out from the alignment hole 3 and is exposed out of the lifting plate 1, so that the electrostatic chuck assembly E is placed in place and alignment is completed. By adopting the mode, the electrostatic chuck assembly E is placed and simultaneously the position alignment is completed, so that the installation efficiency and consistency can be remarkably improved. And the upper end of the alignment post 6 is preferably a screwing part 13 for facilitating screwing, for example, a quadrangular prism or a triangular prism shape is formed by cutting a part of a cylinder, so that the mounting alignment device is separated from the electrostatic chuck assembly E after being put in.
In a preferred embodiment, the pull bolt 5 comprises a stud 8 and an end nut 9. The lower end of the stud 8 is provided with lower external threads and is in threaded connection with the screw through hole E1 in a matched mode, and the upper end of the stud 8 is provided with upper external threads and is in threaded connection with the end nut 9 in a matched mode and is fixed in a welded mode. The end nut 9 has an outer diameter substantially greater than the inner diameter of the bolting hole 4 and is optionally provided with an annular spacer. The end nut 9 has a circular ring portion 10 above, and the circular ring portion 10 can be screwed more conveniently during the assembling and disassembling process.
It is further preferable that an annular protrusion is integrally or separately provided at the middle of the stud 8, and the lower surface of the end nut 9 and the upper surface of the annular protrusion are located at the upper and lower sides of the pulling plate 1, respectively, so as to ensure that the positions of the pulling bolt 5 and the pulling plate 1 remain fixed. For example, a limit nut 11 is screwed on the stud 8, the limit nut 11 forms an annular protrusion, the lower surface of the end nut 9 and the upper surface of the limit nut 11 are respectively located at the upper side and the lower side of the pulling plate 1, the pulling plate 1 is limited, and the pulling bolt 5 can also rotate along the axial direction. Further, a lock nut 12 is further connected to the stud 8 in a threaded manner, and the lock nut 12 is located under the limit nut 11 in a close contact manner, so that the anti-loosening of the limit nut 11 is realized.
In another embodiment, the lifting bolt 5 is an eye bolt, the upper end of the lifting bolt 5 is an integrated annular part, an annular gasket 14 is sleeved on the lifting bolt 5, the outer diameter of the annular gasket 14 is far greater than the inner diameter of the bolt connecting hole 4, and the annular gasket 14 is positioned between the eye above the lifting bolt 5 and the lifting plate 1. It will be appreciated that for the use of an integrated eye bolt, the annular projection structure described above requires a split structure such as a stop nut 11 to facilitate the installation connection; for the structure that the lifting bolt 5 is in split type screwed connection and welded, annular protrusions can be directly integrally formed on the stud 8.
When the utility model is used, the installation alignment device is connected to the electrostatic chuck assembly E to be installed to form a structure (excluding the alignment column 6) as shown in figure 2, and the alignment column 6 is installed on the bottom plate C of the chamber; then one or two persons carry the electrostatic chuck assembly E through the handle 7 and move the electrostatic chuck assembly E to the position above the semiconductor equipment chamber, and then the electrostatic chuck assembly E is aligned and guided through the matching of the two groups of alignment posts 6 and the alignment holes 3, so that the structure shown in figure 1 is formed; then the lifting bolt 5 is selected from the screw through hole E1, the lifting bolt 5 and the lifting plate 1 are removed, the alignment column 6 is unscrewed, and the parts are collected for the next installation and use; finally, in accordance with the existing operation, the electrostatic chuck assembly E is mounted and fixed to the chamber bottom plate C by means of dedicated bolts, so that the mounting is completed.
In summary, the electrostatic chuck assembly mounting and aligning device of the semiconductor device adopts the lifting plate and the three lifting bolts which are connected with the shape characteristics of the electrostatic chuck assembly in a matching way, so that the connection is stable in the carrying process; the two groups of alignment columns are matched with the alignment holes to ensure the alignment of the positions of the placed electrostatic chuck components during installation, so that the installation efficiency and consistency can be remarkably improved; in addition, handles are arranged on two sides, and correspond to the alignment holes and the alignment columns, so that observation in the installation process is facilitated, and the convenience and accuracy of installation are further improved; and make full use of the structure of the existing electrostatic chuck assembly and semiconductor equipment chamber, thereby realizing simple structure, convenient use and low production cost of the device and having extremely strong practical value.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. The mounting and aligning device for the electrostatic chuck assembly of the semiconductor equipment is characterized by comprising a lifting plate (1), wherein the lifting plate (1) is positioned right above the electrostatic chuck assembly (E), and a protective soft cushion (2) is arranged on the lower surface of the lifting plate (1); two alignment holes (3) and three bolt connection holes (4) are formed in the lifting plate (1), and lifting bolts (5) penetrate through the bolt connection holes (4); the lower end of the lifting bolt (5) is correspondingly in threaded connection with a screw through hole (E1) of the electrostatic chuck assembly (E); a chamber bottom plate (C) of the semiconductor device is provided with screw blind holes (C1) corresponding to the screw through holes (E1) of the electrostatic chuck assembly (E), wherein the two screw blind holes (C1) positioned at two sides are connected with an alignment column (6) through threads; the upper end of the alignment column (6) passes through the screw through hole (E1) and the alignment hole (3) and then is exposed above the lifting plate (1); handles (7) are arranged at the positions of the two sides above the lifting plate (1), and the handles (7) are adjacent to the alignment holes (3) in a one-to-one correspondence mode.
2. The electrostatic chuck assembly mounting alignment device for semiconductor equipment according to claim 1, wherein the handle (7) is fixed to the pulling plate (1) by means of bolts, and the handle (7) has an upwardly arched bridge shape.
3. The semiconductor device electrostatic chuck assembly mounting alignment apparatus of claim 2, wherein a junction of the handle (7) and the pulling plate (1) is adjacent to the alignment hole (3).
4. The semiconductor device electrostatic chuck assembly mounting alignment apparatus of claim 1, wherein the pull bolt (5) comprises a stud (8) and an end nut (9); the lower end of the stud (8) is provided with lower external threads and is in threaded connection with the screw through hole (E1) in a matched mode, and the upper end of the stud (8) is provided with upper external threads and is in threaded connection with the end nut (9) in a matched mode and is fixed in a welded mode; a circular ring part (10) is arranged above the end nut (9).
5. The electrostatic chuck assembly mounting alignment device for semiconductor equipment according to claim 4, wherein an annular protrusion is provided at a middle portion of the stud (8), and a lower surface of the end nut (9) and an upper surface of the annular protrusion are located at upper and lower sides of the pulling plate (1), respectively.
6. The electrostatic chuck assembly mounting alignment device for semiconductor equipment according to claim 4, wherein a limit nut (11) is further screwed on the stud (8), and a lower surface of the end nut (9) and an upper surface of the limit nut (11) are respectively located at upper and lower sides of the pulling plate (1).
7. The electrostatic chuck assembly mounting alignment device of claim 6, wherein a lock nut (12) is further screwed onto the stud (8), the lock nut (12) being located snugly under the limit nut (11).
8. The electrostatic chuck assembly mounting alignment device for semiconductor equipment according to claim 1, wherein the lifting bolt (5) is an eye bolt, an annular gasket (14) is sleeved on the lifting bolt (5), and the annular gasket (14) is located between the eye above the lifting bolt (5) and the lifting plate (1).
9. A semiconductor device electrostatic chuck assembly mounting alignment apparatus according to any of claims 1-8, characterized in that the upper end of the alignment post (6) is a screw (13) for facilitating screwing.
10. A semiconductor device electrostatic chuck assembly mounting alignment apparatus according to any of claims 1-8, wherein the positions of three of said bolting holes (4) form three vertices of an acute triangle or a right triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321237427.4U CN219800820U (en) | 2023-05-19 | 2023-05-19 | Semiconductor device electrostatic chuck assembly installation alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321237427.4U CN219800820U (en) | 2023-05-19 | 2023-05-19 | Semiconductor device electrostatic chuck assembly installation alignment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219800820U true CN219800820U (en) | 2023-10-03 |
Family
ID=88176943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321237427.4U Active CN219800820U (en) | 2023-05-19 | 2023-05-19 | Semiconductor device electrostatic chuck assembly installation alignment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219800820U (en) |
-
2023
- 2023-05-19 CN CN202321237427.4U patent/CN219800820U/en active Active
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