CN219717496U - Laser and light emitting device - Google Patents

Abstract

The utility model provides a laser and a light-emitting device, wherein the laser comprises a tube shell, a laser chip and a reflecting piece, wherein the laser chip and the reflecting piece are assembled in the tube shell, the fast axis direction of the laser chip is arranged along the length direction of the reflecting piece, and light emitted by the laser chip is reflected to the outside of the laser through the reflecting piece. Therefore, as the divergence angle of the fast axis direction of the laser chip is larger, the length direction of the reflecting piece is matched with the fast axis direction of the laser chip, so that the luminous quantity of the reflecting piece in the fast axis direction of the laser chip can be improved, the effective light proportion of the laser chip can be improved, and the efficient light emitting of the laser can be ensured.

Description

Laser and light emitting device

Technical Field

The utility model relates to the technical field of lasers, in particular to a laser and a light-emitting device.

Background

With the development of laser technology, in the technical field of lasers, lasers generally emit laser light through a laser chip. The divergence angle of the laser chip in the fast axis direction and the divergence angle of the laser chip in the slow axis direction have large differences, so that the structure of the laser needs to be studied to effectively realize efficient light emission of the laser.

Disclosure of Invention

The embodiment of the utility model provides a laser and a light emitting device, so as to improve at least one technical problem.

The embodiments of the present utility model achieve the above object by the following technical means.

In a first aspect, an embodiment of the present utility model provides a laser, where the laser includes a package, a laser chip, and a reflecting member, both of which are assembled in the package, a fast axis direction of the laser chip is set along a length direction of the reflecting member, and light emitted from the laser chip is reflected to the outside of the laser by the reflecting member.

In some embodiments, the laser further comprises a mounting base, the mounting base is mounted in the tube shell, and the laser chip is attached to the mounting base.

In some embodiments, the mounting base comprises a carrier and a heat sink, the carrier is mounted in the tube shell, the heat sink is arranged on the carrier, and the laser chip is attached to the surface of the heat sink, which is away from the carrier.

In some embodiments, the carrier is an integral structure with the cartridge.

In some embodiments, the mounting base includes a first surface and a second surface opposite to each other, the number of the laser chips is plural, the first surface and the second surface are both attached with the laser chips, and a light emitting direction of the laser chips located on the first surface is the same as or opposite to a light emitting direction of the laser chips located on the second surface.

In some embodiments, the reflector comprises a mirror with a reflective surface facing the light emitting surface of the laser chip, and the fast axis direction of the laser chip is disposed along the length direction of the reflective surface.

In some embodiments, the number of the laser chips is a plurality, the plurality of laser chips include a first laser chip and a second laser chip, the light emitting directions of the first laser chip and the second laser chip are distributed in an included angle mode, the reflecting piece includes a half-wave plate and a polarization beam splitter, the half-wave plate is located on an outgoing light path of the first laser chip and is used for transmitting light emitted by the first laser chip to the polarization beam splitter, the polarization beam splitter is located on an outgoing light path of the half-wave plate and an outgoing light path of the second laser chip, and the polarization beam splitter is used for transmitting light of the half-wave plate and reflecting light emitted by the second laser chip.

In some embodiments, the number of the laser chips is a plurality, the plurality of laser chips comprise a first laser chip and a second laser chip with the same light emitting direction, the reflecting piece comprises a quarter wave plate and a polarization beam splitter, the quarter wave plate is located on an emergent light path of the first laser chip and is used for reflecting light emergent from the first laser chip to the polarization beam splitter, the polarization beam splitter is located on an emergent light path of the quarter wave plate and an emergent light path of the second laser chip, and the polarization beam splitter is used for transmitting light of the quarter wave plate and reflecting light emergent from the second laser chip.

In some embodiments, the laser further comprises a light transmissive sealing member and a collimating member, the light transmissive sealing member is connected to the package and located on a reflection light path of the reflecting member, the collimating member is disposed on a side of the light transmissive sealing member facing away from the reflecting member, and the light transmissive sealing member guides the reflected light of the reflecting member to the collimating member.

In a second aspect, an embodiment of the present utility model provides a light emitting device, where the light emitting device includes a housing and the laser provided in any of the above embodiments, and the laser is assembled in the housing.

The laser and the light-emitting device provided by the utility model comprise the tube shell, the laser chip and the reflecting piece, wherein the laser chip and the reflecting piece are assembled in the tube shell, so that the tube shell can provide certain protection for the laser chip and the reflecting piece, and the laser chip or the reflecting piece is prevented from being damaged due to the fact that the laser chip or the reflecting piece is exposed out of the tube shell. The fast axis direction of the laser chip is arranged along the length direction of the reflecting piece, and the light emitted by the laser chip is reflected to the outside of the laser through the reflecting piece. Therefore, as the divergence angle of the fast axis direction of the laser chip is larger, the length direction of the reflecting piece is matched with the fast axis direction of the laser chip, so that the luminous quantity of the reflecting piece in the fast axis direction of the laser chip can be improved, the effective light proportion of the laser chip can be improved, and the efficient light emitting of the laser can be ensured.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic structural diagram of a laser according to an embodiment of the present utility model.

Fig. 2 shows a schematic diagram of the laser of fig. 1 in another view.

Fig. 3 shows a schematic diagram of the structure of a laser chip of the laser of fig. 1.

Fig. 4 shows a schematic structural diagram of a laser according to another embodiment of the present utility model.

Fig. 5 shows a schematic structural diagram of a laser according to another embodiment of the present utility model.

Fig. 6 shows a schematic structural diagram of a laser according to still another embodiment of the present utility model.

Fig. 7 shows a schematic structural diagram of a laser according to still another embodiment of the present utility model.

Fig. 8 shows a schematic structural diagram of a laser according to still another embodiment of the present utility model.

Fig. 9 is a schematic diagram showing a structure of a light emitting device according to an embodiment of the present utility model.

Detailed Description

In order to make the present utility model better understood by those skilled in the art, the following description of the present utility model will be made in detail with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the utility model. All other embodiments, based on the embodiments of the utility model, which a person skilled in the art would obtain without making any inventive effort, are within the scope of the utility model.

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

In the use process of the related art laser, a part of the length direction of the laser chip is arranged on the laser along the horizontal direction, and the fast axis direction of the laser chip is arranged along the height direction of the laser, so that the process manufacturing is facilitated, but because the light divergence angle of the fast axis direction of the laser chip is larger, light can leak from the top of a reflecting piece of the laser, and power loss is caused.

Referring to fig. 1 and fig. 2 together, an embodiment of the present utility model provides a laser 10, where the laser 10 can emit laser light. The laser 10 includes a tube 11, a laser chip 12, and a reflecting member 13, where the reflecting member 13 can reflect the light emitted from the laser chip 12, so as to help ensure that the laser 10 emits laser light normally. The laser chip 12 and the reflecting piece 13 are assembled in the tube shell 11, so that the tube shell 11 can provide a containing space for the laser chip 12 and the reflecting piece 13, the tube shell 11 can also provide a certain protection for the laser chip 12 and the reflecting piece 13, and the laser chip 12 or the reflecting piece 13 is prevented from being damaged due to the fact that the laser chip 12 or the reflecting piece 13 is exposed out of the tube shell 11.

The angle between the reflecting surface of the reflecting element 13 and the bottom of the tube shell 11 is 135 degrees, which helps to ensure that the reflecting element 13 can reflect the light emitted from the laser chip 12 out of the laser 10 along the height direction Z of the tube shell 11.

In some embodiments, the fast axis direction of the laser chip 12 is set along the length direction Y of the reflecting member 13, and the light emitted from the laser chip 12 is reflected to the outside of the laser 10 by the reflecting member 13. Illustratively, the package 11 has a length direction X, the laser chip 12 may be a long strip chip, and the length direction of the laser chip 12 may be disposed in the package 11 along the length direction X of the package 11, and the length direction of the laser chip 12 may be substantially parallel to the length direction X of the package 11. The reflector 13 has a longitudinal direction Y, and the longitudinal direction X of the envelope 11 may be substantially perpendicular to the longitudinal direction Y of the reflector 13. The reflecting member 13 is located on the outgoing light path of the laser chip 12, and since the fast axis direction of the laser chip 12 is along the length direction Y of the reflecting member 13, the reflecting member 13 can receive the light emitted from the laser chip 12 along the length direction Y thereof and reflect the received light out of the laser 10.

Since the laser chip 12 corresponds to a rectangular waveguide resonant cavity in structure, in the two cross-sectional directions perpendicular to each other, as shown in fig. 3, the divergence angle of the field of view point is greatly different, the light emission size in the fast axis direction of the laser chip 12 (the direction perpendicular to the front surface of the laser chip 12) is small, the divergence angle is large, and the light emission size in the slow axis direction of the laser chip 12 (the direction parallel to the surface of the laser chip 12) is large, so that the divergence angle in the fast axis direction of the laser chip 12 is large, and by adapting the length direction Y of the reflecting member 13 to the fast axis direction of the laser chip 12, the light emission amount of the reflecting member 13 in the fast axis direction of the laser chip 12 is improved, the effective light proportion of the laser chip 12 is improved, and the efficient light emission of the laser 10 is ensured.

In addition, since the longitudinal direction of the laser chip 12 is substantially parallel to the longitudinal direction X of the package 11, this contributes to a reduction in the space occupied by the laser chip 12 in the height direction Z of the package 11, a reduction in the height of the laser 10, and a miniaturization of the laser 10.

Wherein the solid lines with arrows in the figure are the directions of the outgoing light rays of the laser 10.

In some embodiments, the laser 10 may further include a mounting base 14, where the mounting base 14 is mounted in the package 11, for example, a length direction of the mounting base 14 may be set along a length direction X of the package 11, and the laser chip 12 is attached to the mounting base 14, for example, a length direction of the laser chip 12 may be set along the length direction X of the package 11 and attached to a side portion of the mounting base 14, so as to help ensure compactness of the structure of the laser 10.

The mount 14 may include a carrier 141 and a heat sink 142, where the carrier 141 is installed in the package 11, the carrier 141 may be a metal with better heat dissipation, and the carrier 141 may satisfy the heat dissipation requirement of the package 11, so as to help ensure that the laser 10 is in a suitable temperature environment. In addition, when the temperature of the laser chip 12 increases, the carrier 141 can also meet the requirement of heat dissipation of the laser chip 12, which is helpful for reducing the risk of damage of the laser chip 12 due to over-high temperature.

The heat sink 142 can be disposed on the carrier 141, and the laser chip 12 is attached to the surface of the heat sink 142 facing away from the carrier 141, so that the heat sink 142 can cool the laser chip 12 when the temperature of the laser chip 12 increases, which is helpful for reducing the risk of damage to the laser chip 12. Thus, the heat sink 142 and the carrier 141 can jointly meet the heat dissipation requirement of the laser chip 12, which is helpful for improving the heat dissipation efficiency of the laser chip 12.

In some embodiments, the laser 10 further includes a transparent sealing member 15 and a collimating member 16, where the transparent sealing member 15 may seal the package 11 while allowing light to pass through, and the transparent sealing member 15 may be made of a transparent material such as sapphire, glass, or the like. The light-transmitting sealing member 15 is connected to the package 11 and is located on the reflection light path of the reflecting member 13, so that the reflected light of the reflecting member 13 can be emitted to the outside of the laser 10 through the light-transmitting sealing member 15, which helps to ensure the normal operation of the laser 10.

The light-transmitting sealing member 15 and the tube shell 11 may be connected by welding, which helps to ensure stability of the light-transmitting sealing member 15 connected to the tube shell 11, and helps to ensure normal operation of the laser 10.

The collimating element 16 may collimate the received light and emit the collimated light. The collimating element 16 is arranged on one side of the transparent sealing element 15, which is away from the reflecting element 13, so that the transparent sealing element 15 can guide the reflected light of the reflecting element 13 to the collimating element 16, and the collimating element 16 can collimate the light guided by the transparent sealing element 15 and then emit the collimated light out of the laser 10, thereby being helpful for ensuring the normal operation of the laser 10.

In some embodiments, the reflecting member 13 may include a reflecting mirror 131, the reflecting surface of the reflecting mirror 131 faces the light emitting surface of the laser chip 12, and the fast axis direction of the laser chip 12 is set along the length direction Y of the reflecting surface, which is the length direction Y of the reflecting mirror 131. For example, the length direction of the laser chip 12 may be set along the length direction X of the package 11, the laser chip 12 is disposed in the package 11, the reflecting member 13 is located on the outgoing light path of the laser chip 12, and the reflecting surface of the reflecting member 13 faces the outgoing light surface of the laser chip 12, and since the fast axis direction of the laser chip 12 is set along the length direction Y of the reflecting surface, the reflecting surface of the reflecting member 13 may receive the light emitted from the outgoing light surface along the length direction Y thereof and reflect the received light out of the laser 10.

Since the divergence angle of the fast axis direction of the laser chip 12 is large, the length direction Y of the reflecting surface of the reflecting member 13 is adapted to the fast axis direction of the laser chip 12, which is helpful for increasing the light emission amount of the reflecting surface of the reflecting member 13 in the fast axis direction of the laser chip 12, increasing the effective light proportion of the laser chip 12, and ensuring the efficient light emission of the laser 10.

In some embodiments, the mounting base 14 may include a first surface 1411 and a second surface 1412 opposite each other, and the number of laser chips 12 is multiple, so that multiple laser chips 12 may help increase the output of the laser 10. The first surface 1411 and the second surface 1412 are attached with the laser chip 12, and the light emitting direction of the laser chip 12 located on the first surface 1411 is the same as or opposite to the light emitting direction of the laser chip 12 located on the second surface 1412.

As shown in fig. 2, the number of the laser chips 12 may be two, the two laser chips 12 are respectively attached to the first surface 1411 and the second surface 1412 through the heat sink 142, the light emitting directions of the two laser chips 12 are the same, and at this time, the number of the reflecting members 13 may be one, so that the light emitted from the two laser chips 12 may reflect the light emitted from the laser chips 12 out of the laser 10 through the same reflecting member 13, which is helpful for simplifying the structure of the laser 10 and facilitating the manufacture.

For example, as shown in fig. 4, the number of the laser chips 12 may be two, the two laser chips 12 are respectively attached to the first surface 1411 and the second surface 1412 through the heat sink 142, and the light emitting directions of the two laser chips 12 are opposite, and at this time, the number of the reflecting members 13 is two, so that the light emitted by the two laser chips 12 can reflect the light emitted by the laser chips 12 out of the laser 10 through different reflecting members 13, which is helpful for meeting the light emitting requirements of the laser 10 in different directions.

Where the above and below "plurality" means two or more, for example, the number of laser chips 12 may be two, three, four or other numbers, as the case may be.

In some embodiments, the carrier 141 and the package 11 are integrally formed, which helps to simplify the structure of the laser 10 and facilitate manufacture. The first surface 1411 and the second surface 1412 may be opposite surfaces of the stage 141, and the number of the laser chips 12 may be plural.

As shown in fig. 5, the number of the laser chips 12 may be two, the carrier 141 and the package 11 are integrally formed through the first surface 1411, the number of the heat sinks 142 is two, the two laser chips 12 are respectively attached to two ends of the second surface 1412 of the carrier 141 through the heat sinks 142, and the light emitting directions of the two laser chips 12 are opposite, at this time, the number of the reflecting members 13 is two, so that the light emitted by the two laser chips 12 can reflect the light emitted by the laser chips 12 out of the laser 10 through different reflecting members 13, which is helpful for meeting the light emitting requirements of the laser 10 in different directions.

In addition, since the carrier 141 is integrally formed with the package 11 through the first surface 1411, the first surface 1411 of the carrier 141 and the bottom surface of the carrier 141 are in contact with the package 11, which is helpful to increase the contact area between the carrier 141 and the package 11 and to improve the heat dissipation efficiency of the carrier 141 to the package 11, thereby ensuring efficient operation of the laser 10.

For example, as shown in fig. 6, the number of the laser chips 12 may be two, the carrier 141 and the tube shell 11 are integrally formed through the first surface 1411, the number of the heat sinks 142 is two, the two laser chips 12 are respectively attached to the second surface 1412 of the carrier 141 through the heat sinks 142, and the light emitting directions of the two laser chips 12 are the same, at this time, the number of the reflecting members 13 may be one, so that the light emitted by the two laser chips 12 may reflect the light emitted by the laser chips 12 out of the laser 10 through the same reflecting member 13, which is helpful for simplifying the structure of the laser 10 and facilitating the manufacture.

In addition, since the carrier 141 is integrally formed with the package 11 through the first surface 1411, the first surface 1411 of the carrier 141 and the bottom surface of the carrier 141 are in contact with the package 11, which is helpful to increase the contact area between the carrier 141 and the package 11 and to improve the heat dissipation efficiency of the carrier 141 to the package 11, thereby ensuring efficient operation of the laser 10.

Referring to fig. 7, in some embodiments, the number of the laser chips 12 is plural, and the plurality of laser chips 12 includes a first laser chip 121 and a second laser chip 122 with light emitting directions distributed at an included angle, for example, a length direction of the first laser chip 121 may be set along a height direction Z of the package 11, and a length direction of the second laser chip 122 may be set along a length direction X of the package 11, where a main optical axis of the first laser chip 121 may be substantially perpendicular to a main optical axis of the second laser chip 122. The first laser chip 121 and the second laser chip 122 contribute to increase the light output amount of the laser 10.

In the case where the principal optical axis of the first laser chip 121 is substantially perpendicular to the principal optical axis of the second laser chip 122, the reflecting member 13 may replace the reflecting mirror 131 described above with another structure, for example, the reflecting member 13 includes a half-wave plate 132 and a polarization beam splitter 133, and the half-wave plate 132 and the polarization beam splitter 133 may replace the reflecting mirror 131 described above. Wherein the half-wave plate 132 is used to change the polarization state of the transmitted light beam. The half-wave plate 132 is located on the outgoing light path of the first laser chip 121 and is used for transmitting the light emitted from the first laser chip 121 to the polarization beam splitter 133, where the light emitted from the first laser chip 121 can change the polarization state under the action of the half-wave plate 132 and is transmitted to the polarization beam splitter 133, for example, the polarization direction of the light transmitted through the half-wave plate 132 is perpendicular to the polarization direction of the light emitted from the second laser chip 122. The polarization beam splitter 133 is located on the outgoing light path of the half-wave plate 132 and the outgoing light path of the second laser chip 122, where the polarization beam splitter 133 is used to transmit the light of the half-wave plate 132 and reflect the light outgoing from the second laser chip 122, so that the polarization beam splitter 133 can combine the light polarized by the first laser chip 121 through the half-wave plate 132 with the photosynthetic light reflected by the second laser chip 122 through the polarization beam splitter 133, which helps to ensure the normal light outgoing of the laser 10.

The long axis direction of the first laser chip 121 may be disposed along the length direction of the half-wave plate 132, and the long axis direction of the second laser chip 122 may be disposed along the length direction of the polarization beam splitter 133. The length direction of the half-wave plate 132 may be substantially parallel to the length direction of the polarization beam splitter 133, and the half-wave plate 132 and the polarization beam splitter 133 may be integrally provided.

Referring to fig. 8, in some embodiments, the light emitting direction of the first laser chip 121 and the light emitting direction of the second laser chip 122 may be distributed in the same direction, and then the main optical axis of the first laser chip 121 and the main optical axis of the second laser chip 122 are substantially parallel.

In the case that the main optical axes of the first laser chip 121 and the second laser chip 122 are substantially parallel, the reflecting member 13 may adopt other structures instead of the half-wave plate 132, for example, the reflecting member 13 may further include a quarter-wave plate 134, and a surface of the quarter-wave plate 134 is coated with a reflecting film, so that the surface of the quarter-wave plate 134 may reflect light, and the quarter-wave plate 134 is located on an outgoing light path of the first laser chip 121 and is used to reflect the light outgoing from the first laser chip 121 to the polarization splitter 133, and at this time, the light outgoing from the first laser chip 121 may be reflected, changed in polarization state and transmitted to the polarization splitter 133 under the action of the quarter-wave plate 134, for example, the quarter-wave plate 134 rotates the polarization direction of the light by 90 degrees while the light path is turned. The polarization beam splitter 133 is located on the outgoing light path of the quarter wave plate 134 and the outgoing light path of the second laser chip 122, where the polarization beam splitter 133 is used to transmit the light of the quarter wave plate 134 and reflect the light outgoing from the second laser chip 122, so that the polarization beam splitter 133 can be used to combine the light polarized by the quarter wave plate 134 of the first laser chip 121 with the photosynthetic light reflected by the polarization beam splitter 133 by the second laser chip 122, which helps to ensure the normal light outgoing of the laser 10. In addition, the combined action of the quarter wave plate 134 and the polarizing beamsplitter 133 helps to reduce the optical loss of the laser 10.

The long axis direction of the first laser chip 121 may be along the length direction of the quarter wave plate 134, and the length direction of the quarter wave plate 134 and the length direction of the polarization beam splitter 133 may be substantially parallel.

Referring to fig. 9, an embodiment of the present utility model provides a light emitting device 100, where the light emitting device 100 can project laser, and the light emitting device 100 can be a light emitting device 100 such as an illumination light emitting device, a vehicle-mounted light emitting device, a cinema light emitting device, etc.

The light emitting device 100 includes a housing 20 and the laser 10 according to any of the above embodiments, where the laser 10 is assembled in the housing 20, the housing 20 may provide a certain protection for the laser 10, so as to help avoid damage to the laser 10 caused by exposure.

The laser 10 and the light emitting device 100 provided by the utility model, the laser 10 comprises the tube shell 11, the laser chip 12 and the reflecting piece 13, wherein the laser chip 12 and the reflecting piece 13 are assembled in the tube shell 11, so that the tube shell 11 can provide a certain protection for the laser chip 12 and the reflecting piece 13, and the laser chip 12 or the reflecting piece 13 is prevented from being damaged due to the fact that the laser chip 12 or the reflecting piece 13 is exposed out of the tube shell 11. The fast axis direction of the laser chip 12 is set along the length direction of the reflecting member 13, and the light emitted from the laser chip 12 is reflected to the outside of the laser 10 by the reflecting member 13. In this way, since the divergence angle of the fast axis direction of the laser chip 12 is larger, the length direction of the reflecting member 13 is adapted to the fast axis direction of the laser chip 12, which is helpful for improving the light emission amount of the reflecting member 13 in the fast axis direction of the laser chip 12, improving the effective light ratio of the laser chip 12, and ensuring the efficient light emission of the laser 10.

In the present utility model, the term "assembled" and the like should be construed broadly unless explicitly stated or limited otherwise. For example, the connection can be fixed connection, detachable connection or integral connection; may be a mechanical connection; the connection may be direct, indirect, or internal, or may be surface contact only, or may be surface contact via an intermediate medium. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for understanding as a specific or particular structure. The description of the term "some embodiments" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In the present utility model, the schematic representations of the above terms are not necessarily for the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples of the present utility model and features of various embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting thereof; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model, and they should be included in the protection scope of the present utility model.

Claims (10)

1. A laser, comprising:

a tube shell;

the laser chip and the reflecting piece are assembled in the tube shell, the fast axis direction of the laser chip is arranged along the length direction of the reflecting piece, and light emitted by the laser chip is reflected to the outside of the laser through the reflecting piece.

2. The laser of claim 1, further comprising a mount mounted in the package, the laser chip being mounted to the mount.

3. The laser of claim 2, wherein the mounting base comprises a carrier and a heat sink, the carrier is mounted in the package, the heat sink is disposed on the carrier, and the laser chip is attached to a surface of the heat sink facing away from the carrier.

4. The laser of claim 3, wherein the carrier is of unitary construction with the package.

5. The laser device according to claim 2, wherein the mounting base comprises a first surface and a second surface which are opposite to each other, the number of the laser chips is plural, the laser chips are attached to the first surface and the second surface, and the light emitting direction of the laser chips located on the first surface is the same as or opposite to the light emitting direction of the laser chips located on the second surface.

6. The laser of claim 1, wherein the reflecting member comprises a reflecting mirror, a reflecting surface of the reflecting mirror faces a light emitting surface of the laser chip, and a fast axis direction of the laser chip is disposed along a length direction of the reflecting surface.

7. The laser device according to claim 1, wherein the number of the laser chips is plural, the plural laser chips include a first laser chip and a second laser chip, the light emitting directions of which are distributed in an included angle, the reflecting member includes a half-wave plate and a polarization beam splitter, the half-wave plate is located on an outgoing light path of the first laser chip and is used for transmitting light outgoing from the first laser chip to the polarization beam splitter, the polarization beam splitter is located on an outgoing light path of the half-wave plate and an outgoing light path of the second laser chip, and the polarization beam splitter is used for transmitting light of the half-wave plate and reflecting light outgoing from the second laser chip.

8. The laser device according to claim 1, wherein the number of the laser chips is plural, the plural laser chips include a first laser chip and a second laser chip which are distributed in the same direction in the light emitting direction, the reflecting member includes a quarter wave plate and a polarization splitter, the quarter wave plate is located on the outgoing light path of the first laser chip and is used for reflecting the light outgoing from the first laser chip to the polarization splitter, the polarization splitter is located on the outgoing light path of the quarter wave plate and the outgoing light path of the second laser chip, and the polarization splitter is used for transmitting the light of the quarter wave plate and reflecting the light outgoing from the second laser chip.

9. The laser of claim 1, further comprising a light transmissive seal coupled to the package and positioned in a reflected light path of the reflector, and a collimator positioned on a side of the light transmissive seal facing away from the reflector, the light transmissive seal directing reflected light from the reflector to the collimator.

10. A light emitting device, comprising:

a housing; and

the laser according to any one of claims 1 to 9, which is fitted within the housing.