CN219698050U

CN219698050U - Chip mounting device for integrated circuit board

Info

Publication number: CN219698050U
Application number: CN202321068648.3U
Authority: CN
Inventors: 黄预先; 龚文斌
Original assignee: Shenzhen Zhongkeyun Information Technology Co ltd
Current assignee: Shenzhen Zhongkeyun Information Technology Co ltd
Priority date: 2023-05-06
Filing date: 2023-05-06
Publication date: 2023-09-15
Anticipated expiration: 2033-05-06

Abstract

The utility model specifically relates to a paster device for an integrated circuit board, which comprises a supporting frame, wherein an insulation box is adhered to the outer wall of the top of the supporting frame, a pressing component is movably inserted into the top of the insulation box, a paster device is fixed at the bottom of the pressing component, a support plate is welded on the outer wall of one side of the supporting frame, a vertical plate is welded on the outer wall of the top of the support plate, a fixing plate is connected with the inner wall of the supporting frame through a screw, an electric push rod is fixed on the outer wall of one side of the vertical plate, which is close to the supporting frame, and a first clamping hand and a second clamping hand are connected with the outer wall of the top of the fixing plate in a sliding manner.

Description

Chip mounting device for integrated circuit board

Technical Field

The utility model relates to the technical field of circuit board tools, in particular to a surface mounting device for an integrated circuit board.

Background

The circuit board is an important component in the intelligent equipment, and in the production and processing process of the circuit board, the surface assembly technology is generally adopted for carrying out the surface mounting, so that the circuit board is the most popular technology and process in the electronic assembly industry. The electronic circuit surface mounting technology is called surface mounting or surface mounting technology, it is a circuit mounting technology that mounts the surface mounting component (SMC/SMD for short, chinese name slice component) without pin or short lead on the surface of the printed circuit board or other surface of the base plate, weld and assemble by reflow soldering or dip soldering, etc., but even when this kind of automatic chip mounter is carried on the paster, because the integrated circuit board is generally only simple to fix on the tray, move into the paster work along the orbit, but the tray is guided by the orbit or is easy to deviate from the paster recognition orientation when forcing to move in its moving process, the offset, standing stele, etc. problem still need to manually place the tray back to the orbit one by one after this kind of paster hidden trouble, it is more tedious, and, during manual placement, its tray is not high to go into orbit precision, still easy to appear the conventional problem of the paster, for this we propose a kind of integrated circuit board to use the paster device in order to solve the above-mentioned problem.

Disclosure of Invention

The present utility model is directed to a chip mounter for an integrated circuit board, so as to solve the above-mentioned problems in the prior art.

The technical scheme of the utility model is as follows: the utility model provides a paster device for integrated circuit board, includes the support frame, the top outer wall bonding of support frame has the insulation can, the top activity grafting of insulation can has the subassembly of pushing down, the bottom of pushing down the subassembly is fixed with the paster ware, one side outer wall welding of support frame has the extension board, the top outer wall welding of extension board has the riser, the inner wall of support frame has the fixed plate through the screw connection, one side outer wall that the riser is close to the support frame is fixed with electric putter, the top outer wall of fixed plate has tong one and tong two through sliding connection, and tong one keeps away from tong two one side outer wall and electric putter's output shaft through the shaft coupling fixed, the top outer wall of fixed plate has the change tooth through the bearing connection, and tong one and tong two all mesh with the change tooth, one side outer wall of support frame has seted up the draw-in groove, the inside grafting of draw-in groove has the removal workbin, the inner wall of removal workbin has the material support through the screw connection, the inner wall both sides of material support all welds spacing post, the bottom of removal workbin is equipped with the material conveying mechanism, the top of extension board is equipped with drive mechanism.

Preferably, the feeding mechanism comprises two electric rotating rods, each electric rotating rod is arranged on the inner wall of the bottom of the movable workbin, a spiral sheet is welded on the outer wall of each electric rotating rod, a plurality of material bearing mechanisms are arranged between the two limiting columns, and a material baffle is arranged on the outer wall of one side of the movable workbin, which is far away from the supporting frame, in an integrated manner.

Preferably, the material bearing mechanism comprises a circuit board disc and two disc movable frames, wherein the two disc movable frames are connected with corresponding limiting columns in a sliding manner, a movable plate is welded on the outer wall of one side, close to each other, of each disc movable frame, limiting grooves are formed in the outer wall of one side, far away from each other, of each disc movable frame, movable grooves are formed in the outer walls of two sides of the circuit board disc, the movable plate corresponds to the movable grooves one by one, each movable plate is movably inserted into the corresponding movable groove, and a plurality of springs are fixedly arranged between the outer wall of one side, far away from the corresponding disc movable frame, of each movable plate and the inner wall of the corresponding movable groove.

Preferably, a trough is formed in the outer wall of the top of the circuit board disc, three pressed branch strips are bonded to the inner wall of the bottom of the trough, and an integrated circuit board is placed at the tops of the three pressed branch strips.

Preferably, the two electric rotating rods are respectively in one-to-one correspondence with the two movable plate frames, each electric rotating rod is located between the corresponding movable plate frame and the circuit board disc, the corresponding spiral sheet of the corresponding electric rotating rod is in contact with the outer wall of the bottom of the corresponding movable plate frame, and the spiral sheet is not in contact with the circuit board disc.

Preferably, the transmission mechanism comprises a motor, the motor is fixed to be arranged on the top outer wall of the support plate, an output shaft of the motor is fixed with a driving rotary column through a coupler, the driving rotary column is inserted into and penetrates through the support frame, a plurality of passive rotary columns are inserted into and connected with the inner wall of the support frame, a plurality of the passive rotary columns are sleeved with a same conveying belt, a plurality of the passive rotary columns are sleeved with the outer wall of the driving rotary column, a material conveying rotary column is fixedly sleeved with the outer wall of the driving rotary column, and the material conveying rotary column is located inside the support frame.

Preferably, the outer wall of one side of the support frame, which is close to the movable feed box, is welded with two fixed blocks, a disc-entering rotary column is connected between the fixed blocks through a bearing, the outer wall of the driving rotary column and the outer wall of the disc-entering rotary column are sleeved with the same conveying belt II, and the inner walls of two sides of the support frame are provided with curved surface clamping guide grooves.

Preferably, the two sides of the inner wall of the movable feed box are fixed with limit bars through screws, and the limit bars are positioned right above the corresponding limit columns.

The utility model provides a patch device for an integrated circuit board through improvement, which has the following improvements and advantages compared with the prior art:

the method comprises the following steps: according to the utility model, the whole material bearing mechanism is directly fixed under the paster device when the paster is carried out, and the integrated circuit board can be stably pressed for paster by matching with the pressed supporting strips on the inner wall of the circuit board disc, and after the paster is finished, feeding is automatically continued, so that the paster efficiency of the whole device is improved, and the automation degree of the device is improved;

and two,: according to the utility model, when continuous feeding is carried out, the batch of integrated circuit boards can be integrally stacked in the movable feed box, so that the device is more flexible in mounting, the problem of mounting errors caused by part of integrated circuit boards which are difficult to identify in production is solved, the batch of integrated circuit boards are collected again and subjected to batch mounting operation, the batch of integrated circuit boards can be automatically fed and subjected to mounting operation through simple mechanical transmission, a large amount of working space is saved, the flexibility of mounting is improved, and the manual operation of placing a material tray into a rail is reduced.

Drawings

The utility model is further explained below with reference to the drawings and examples:

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic perspective view of a moving bin in the utility model;

FIG. 3 is a plan cross-sectional view of the mobile bin of the present utility model;

FIG. 4 is an enlarged view of portion B of FIG. 3;

FIG. 5 is a cross-sectional perspective view of a circuit board tray and its connectors in accordance with the present utility model;

FIG. 6 is an enlarged view of the portion A of FIG. 1

Fig. 7 is a schematic perspective view of a support frame according to the present utility model.

Reference numerals illustrate:

1. pressing down the assembly; 2. an insulation box; 3. a first conveyor belt; 4. a support plate; 5. a first clamping hand; 6. a vertical plate; 7. a support frame; 8. moving the feed box; 9. an integrated circuit board; 10. a limit bar; 11. a chip mounter; 12. a circuit board tray; 13. a material baffle; 14. a material conveying rotary column; 15. a tray movable frame; 16. a material bracket; 17. a limit column; 18. an electric rotating rod; 19. a spring; 20. a pressed branch; 21. a trough; 22. a spiral sheet; 23. a flap; 24. a movable groove; 25. a limit groove; 26. an electric push rod; 27. a motor; 28. a passive swivel; 29. an active steering column; 30. a clamping groove; 31. a disc-entering rotary column; 32. a fixed block; 33. a second clamping hand; 34. curved surface clamping guide groove; 35. a fixing plate; 36. rotating teeth; 37. and a second conveyor belt.

Detailed Description

The following detailed description of the present utility model clearly and fully describes the technical solutions of the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a patch device for an integrated circuit board through improvement, which comprises the following technical scheme:

as shown in fig. 1-7, a paster device for integrated circuit board, which comprises a supporting rack 7, the top outer wall of support frame 7 bonds there is insulation can 2, the top activity grafting of insulation can 2 has push down subassembly 1, push down the bottom of subassembly 1 and be fixed with paster 11, one side outer wall welding of support frame 7 has extension board 4, the top outer wall welding of extension board 4 has riser 6, the inner wall of support frame 7 has fixed plate 35 through the screw connection, one side outer wall that riser 6 is close to support frame 7 is fixed with electric putter 26, the top outer wall of fixed plate 35 has tong one 5 and tong two 33 through sliding connection, and one side outer wall that tong one side 5 kept away from tong two 33 and the output shaft of electric putter 26 pass through the shaft coupling fixed, the top outer wall of fixed plate 35 has the change tooth 36 through the bearing connection, and tong one 5 and tong two 33 all mesh with change tooth 36, draw-in groove 30 has been seted up to one side outer wall of support frame 7, the inside grafting of draw-in groove 30 has movable workbin 8, the inner wall of movable workbin 8 has material support 16 through the screw connection, material support 16's inner wall both sides 17 have the limit post 17, the bottom of movable workbin 8 is equipped with the guide slot 34, and the inner wall that has a plurality of curved surface sets up for the top of roller 34, and the transmission resistance is set up for the top of roller 4, the curved surface is reduced, the top is set up, the curved surface is provided with the guide groove 34, and the top is provided with the curved surface 34.

Further, the drive mechanism includes motor 27, motor 27 is fixed to be set up at the top outer wall of extension board 4, motor 27's output shaft is fixed with initiative column 29 through the shaft coupling, and initiative column 29 peg graft in the inside of support frame 7 and run through, the inside grafting of support frame 7 has a plurality of passive column 28, and a plurality of passive column 28 has cup jointed same conveyer belt one 3 with the outer wall of initiative column 29, a plurality of passive column 28 has all cup jointed fixedly with the outer wall of initiative column 29 and has passed material column 14, and it is located the inside of support frame 7 to pass material column 14, the outer wall of passing material column 14 is rubber material, increase and the frictional force of circuit board dish 12 bottom outer wall.

Specifically, when the electric push rod 26 pushes the first clamping hand 5 and the second clamping hand 33 to shrink inwards, the movable plates 23 on two sides can be completely pressed into the movable groove 24 to clamp, when the first clamping hand 5 and the second clamping hand 33 are clamped normally, the friction force generated by the rubber material arranged on the outer wall of the bottom material conveying rotary column 14 can drive the circuit board tray 12 to move forwards along the curved surface clamping guide groove 34, and when the clamping is carried out, the material conveying rotary column 14 can not continuously drive the whole material bearing mechanism through the friction force, in the process, although the outer wall of the material conveying rotary column 14 is worn locally, the material conveying rotary column 14 is matched with a plurality of rollers on the top, and even after the clamping is finished, the whole material bearing mechanism can still be driven to move continuously.

Further, send thing mechanism to include two electronic bull stick 18, every electronic bull stick 18 all sets up the bottom inner wall at removal workbin 8, and electronic bull stick 18 outer wall welding has flight 22, is equipped with a plurality of material mechanism between two spacing posts 17, and the one side outer wall integrated into one piece that removes workbin 8 and keep away from support frame 7 is provided with material baffle 13.

Specifically, the bottom of the movable feed box 8 is provided with four rollers for movement, and a handle is welded on the outer wall of one side of the material baffle 13, which is far away from the supporting frame 7.

Further, the material bearing mechanism comprises a circuit board disc 12 and two disc movable frames 15, the two disc movable frames 15 are connected with the corresponding limiting columns 17 in a sliding mode, movable plates 23 are welded on the outer walls of one sides, close to each other, of the two disc movable frames 15, limiting grooves 25 are formed in the outer walls of one sides, far away from each other, of the two disc movable frames 15, movable grooves 24 are formed in the outer walls of two sides of the circuit board disc 12, the two movable plates 23 are in one-to-one correspondence with the two movable grooves 24, each movable plate 23 is movably inserted into the corresponding movable groove 24, and a plurality of springs 19 are fixedly arranged between the outer walls of one sides, far away from the corresponding disc movable frames 15, of each movable plate 23 and the inner walls of the corresponding movable grooves 24.

Specifically, the material bearing mechanism can completely and smoothly enter the supporting frame 7, wherein the horizontal distance of the curved surface clamping guide groove 34 is gradually reduced, so that the tray movable frames 15 on the two expanded sides are gradually contracted, and the stability of the material bearing mechanism is maintained.

Further, a trough 21 is formed on the top outer wall of the circuit board disc 12, three pressed branch strips 20 are adhered to the bottom inner wall of the trough 21, and the integrated circuit board 9 is placed on the top of the three pressed branch strips 20.

Further, the two electric rotating rods 18 are respectively in one-to-one correspondence with the two movable trays 15, each electric rotating rod 18 is located between the corresponding movable tray 15 and the circuit board tray 12, the spiral piece 22 corresponding to the corresponding electric rotating rod 18 is in contact with the bottom outer wall of the corresponding movable tray 15, and the spiral piece 22 is not in contact with the circuit board tray 12.

Referring specifically to fig. 3, the two electric rotating rods 18 rotate simultaneously, and the rotation directions are opposite, and the spiral directions of the corresponding spiral slices 22 are opposite, so that the two electric rotating rods 18 can drive the whole material bearing mechanism to ascend when rotating, and when the material bearing mechanism moves to the top, the disc movable frames 15 on two sides can be outwards expanded under the action of the compression springs 19, so that the whole material bearing mechanism is clamped above the material support 16.

Further, two fixing blocks 32 are welded on the outer wall of one side of the support frame 7, which is close to the movable feed box 8, a tray-entering rotary column 31 is connected between the fixing blocks 32 through bearings, and the driving rotary column 29 is sleeved with the same conveying belt II 37 on the outer wall of the tray-entering rotary column 31, wherein the conveying belt II 37 is sleeved in a crossing mode, so that the motor 27 drives the tray-entering rotary column 31 to bring the circuit board 12 onto the tray-entering rotary column 14 between the support frames 7 for pasting.

Further, the two sides of the inner wall of the movable feed box 8 are fixed with limit strips 10 through screws, and the limit strips 10 are located right above the corresponding limit columns 17, so that the whole material bearing mechanism is prevented from being separated from the material support 16.

Working principle: after the circuit board disc 12 is placed in the movable feed box 8, the handle is pushed to enable the movable feed box 8 to be clamped in the clamping groove 30 and fixed with the supporting frame 7, the motor 27 is started, the first clamping hand 5 and the second clamping hand 33 are clamped and fixed through the meshing effect, the pressing component 1 above the motor drives the chip mounter 11 to chip the integrated circuit board 9 on the circuit board disc 12, the three support bars 20 at the bottom enable the integrated circuit board 9 to be uniformly stressed and stably fixed through clamping, and the whole chip mounter is clamped above the material support 16 and matched with the top-rotating tray-entering rotary column 31.

The previous description is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip mounter for an integrated circuit board, characterized in that: including support frame (7), the top outer wall bonding of support frame (7) has insulation can (2), the top activity grafting of insulation can (2) has pushing down subassembly (1), the bottom of pushing down subassembly (1) is fixed with paster ware (11), one side outer wall welding of support frame (7) has extension board (4), the top outer wall welding of extension board (4) has riser (6), the inner wall of support frame (7) has fixed plate (35) through the screw connection, one side outer wall that riser (6) is close to support frame (7) is fixed with electric putter (26), the top outer wall of fixed plate (35) has tong one (5) and tong two (33) through sliding connection, and one side outer wall that tong two (33) were kept away from to tong one side outer wall and electric putter (26) are fixed through the shaft coupling, the top outer wall of fixed plate (35) is connected with tooth (36) through the bearing, and tong one (5) and tong two (33) all mesh with tooth (36), one side outer wall (7) is close to support frame (35) has draw-in groove (30) inside material (8) through moving hopper (8), limiting columns (17) are welded on two sides of the inner wall of the material support (16), a material conveying mechanism is arranged at the bottom of the movable material box (8), and a transmission mechanism is arranged at the top of the support plate (4).

2. The chip mounter for an integrated circuit board according to claim 1, wherein: the material conveying mechanism comprises two electric rotating rods (18), each electric rotating rod (18) is arranged on the inner wall of the bottom of the movable material box (8), spiral sheets (22) are welded on the outer wall of each electric rotating rod (18), a plurality of material bearing mechanisms are arranged between the limiting columns (17), and a material baffle (13) is integrally formed on the outer wall of one side, far away from the supporting frame (7), of the movable material box (8).

3. A chip mounter for an integrated circuit board according to claim 2, wherein: the material bearing mechanism comprises a circuit board disc (12) and two disc movable frames (15), wherein the two disc movable frames (15) are connected with corresponding limiting columns (17) in a sliding mode, a movable plate (23) is welded on the outer wall of one side, close to each other, of each disc movable frame (15), limiting grooves (25) are formed in the outer wall of one side, far away from each other, of each disc movable frame (15), movable grooves (24) are formed in the outer walls of two sides of the circuit board disc (12), the movable plate (23) are in one-to-one correspondence with the two movable grooves (24), each movable plate (23) is movably inserted into the corresponding movable groove (24), and a plurality of springs (19) are fixedly arranged between the outer wall, far away from one side, of each disc movable frame (15), of each movable plate (23) and the inner wall of the corresponding movable groove (24).

4. A chip mounter for an integrated circuit board according to claim 3, wherein: the top outer wall of circuit board dish (12) has seted up silo (21), the bottom inner wall of silo (21) has adhered three pressurized branch strip (20), and integrated circuit board (9) have been placed at the top of three pressurized branch strip (20).

5. A chip mounter for an integrated circuit board according to claim 3, wherein: the two electric rotating rods (18) are respectively in one-to-one correspondence with the two movable disc frames (15), each electric rotating rod (18) is located between the corresponding movable disc frame (15) and the circuit board disc (12), the spiral piece (22) corresponding to the corresponding electric rotating rod (18) is in contact with the outer wall of the bottom of the corresponding movable disc frame (15), and the spiral piece (22) is not in contact with the circuit board disc (12).

6. The chip mounter for an integrated circuit board according to claim 1, wherein: the transmission mechanism comprises a motor (27), the motor (27) is fixedly arranged on the top outer wall of the support plate (4), an output shaft of the motor (27) is fixedly provided with a driving rotary column (29) through a coupler, the driving rotary column (29) is inserted into and penetrates through the support frame (7), a plurality of driven rotary columns (28) are inserted into and connected with the support frame (7), the driven rotary columns (28) and the outer wall of the driving rotary column (29) are sleeved with one conveying belt (3), the driven rotary columns (28) and the outer wall of the driving rotary column (29) are sleeved with and fixed with a conveying rotary column (14), and the conveying rotary column (14) is located inside the support frame (7).

7. The chip mounter for an integrated circuit board according to claim 6, wherein: two fixed blocks (32) are welded on the outer wall of one side of the supporting frame (7) close to the movable feed box (8), a disc-entering rotary column (31) is connected between the fixed blocks (32) through bearings, the outer wall of the driving rotary column (29) and the outer wall of the disc-entering rotary column (31) are sleeved with the same two conveyor belts (37), and curved surface clamping guide grooves (34) are formed in the inner walls of two sides of the supporting frame (7).

8. The chip mounter for an integrated circuit board according to claim 1, wherein: limiting strips (10) are fixed on two sides of the inner wall of the movable feed box (8) through screws, and the limiting strips (10) are located right above corresponding limiting columns (17).