CN219679118U - High-efficient heat dissipation formula circuit board - Google Patents
High-efficient heat dissipation formula circuit board Download PDFInfo
- Publication number
- CN219679118U CN219679118U CN202320996811.6U CN202320996811U CN219679118U CN 219679118 U CN219679118 U CN 219679118U CN 202320996811 U CN202320996811 U CN 202320996811U CN 219679118 U CN219679118 U CN 219679118U
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- China
- Prior art keywords
- circuit board
- fan
- main body
- structures
- board main
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 15
- 238000001816 cooling Methods 0.000 claims description 10
- 238000010276 construction Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model discloses a high-efficiency heat-dissipation type circuit board, which belongs to the technical field of circuit boards and comprises a circuit board main body, wherein two mounting bracket structures are symmetrically arranged at two ends of the circuit board main body, two fan dustproof structures are symmetrically arranged at the upper ends of the two mounting bracket structures, three circuit board heat dissipation fans are uniformly arranged at the upper ends of the mounting bracket structures, the circuit board heat dissipation fans are positioned between the two fan dustproof structures, and the heat emitted by the circuit board main body and an electronic element arranged on the circuit board main body can be blown away by the circuit board heat dissipation fans in the working process of the circuit board main body, so that the flow of air near the circuit board main body is quickened, the heat of the circuit board main body can be efficiently and quickly dissipated, and finally the circuit board main body is not easy to burn out.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-efficiency heat dissipation type circuit board.
Background
The circuit board can be called a printed circuit board or a printed circuit board, and the circuit board can miniaturize and visualise the circuit and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board mainly comprises a bonding pad, a via hole, a mounting hole, a wire, a component, a connector, filling, an electric boundary and the like, and the main functions of each component are as follows: and (3) bonding pads: and the metal holes are used for welding pins of the components. And (3) through hole: there are metal vias and non-metal vias, where the metal vias are used to connect component pins between layers. And (3) mounting holes: for fixing the circuit board. A wire: an electrical network copper film for connecting pins of a component. A connector: and the component is used for connecting the circuit boards. Filling: the copper plating used for the grounding network can effectively reduce impedance. Electrical boundary: for determining the size of the circuit board, the boundary cannot be exceeded by all components on the circuit board.
In the use process of the circuit board, the circuit board and the electronic components mounted on the circuit board can emit a large amount of heat, so that the temperature of the circuit board can be raised, if the heat is not timely and efficiently dissipated, the circuit board and the electronic components mounted on the circuit board are easy to burn out, and therefore, the efficient heat dissipation type circuit board is required.
Disclosure of Invention
The utility model mainly aims to provide a high-efficiency heat-dissipation type circuit board which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a high-efficient heat dissipation formula circuit board, includes the circuit board main part, two installing support structures are installed to the both ends symmetry of circuit board main part, two equal symmetry of upper end of installing support structure installs two fan dustproof construction, two three circuit board radiator fan is all installed to the upper end of installing support structure, circuit board radiator fan is even setting in the upper end of installing support structure, circuit board radiator fan is located between two fan dustproof construction.
Preferably, four circuit board mounting holes are symmetrically formed in the circuit board main body, and the four circuit board mounting holes penetrate through the upper end and the lower end of the circuit board main body.
Preferably, the two mounting bracket structures are both L-shaped structures, and the two mounting bracket structures are fixedly mounted at two ends of the circuit board main body respectively through bolts.
Preferably, the four fan dustproof structures are fixedly installed at the upper ends of the two mounting bracket structures respectively through bolts.
Preferably, the fan dustproof structure comprises an installation frame structure and a dustproof net structure, the installation frame structure is a rectangular frame structure, the dustproof net structure is fixedly installed on the inner wall of the installation frame structure, a plurality of fan installation fixing holes are symmetrically formed in the installation frame structure, and the inner ends and the outer ends of the installation frame structure are all communicated through the fan installation fixing holes.
Preferably, the circuit board cooling fan is fixedly mounted on two mounting frame structures on the two fan dustproof structures through bolts.
Compared with the prior art, the utility model has the following beneficial effects:
through setting up fan dustproof construction and circuit board radiator fan, at the in-process that the circuit board main part worked, the heat that the circuit board main part and the electronic component of installing in the circuit board main part sent can be blown away by circuit board radiator fan to accelerate the flow of the nearby air of circuit board main part, and then make the heat of circuit board main part can be by high-efficient quick the dispelling, finally make the circuit board main part be difficult for burning out.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is an enlarged view of the utility model at A of FIG. 1;
fig. 3 is a split view of the mounting bracket structure, the fan dustproof structure and the circuit board cooling fan of the present utility model.
In the figure: 1. a circuit board main body; 2. a mounting bracket structure; 3. a fan dustproof structure; 4. a circuit board cooling fan; 5. a circuit board mounting hole; 6. installing a frame structure; 7. a dust screen structure; 8. and a fan mounting fixing hole.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Please refer to fig. 1, 2 and 3, a high-efficient heat dissipation type circuit board includes a circuit board main body 1, four circuit board mounting holes 5 are symmetrically provided on the circuit board main body 1, the upper and lower ends of the circuit board main body 1 are all penetrated by the four circuit board mounting holes 5, two mounting bracket structures 2 are symmetrically provided at the two ends of the circuit board main body 1, the two mounting bracket structures 2 are L-shaped structures, and the two mounting bracket structures 2 are fixedly provided at the two ends of the circuit board main body 1 respectively through bolts.
Referring to fig. 1, 2 and 3, two fan dustproof structures 3 are symmetrically installed at the upper ends of two mounting bracket structures 2, four fan dustproof structures 3 are respectively and fixedly installed at the upper ends of two mounting bracket structures 2 through bolts, each fan dustproof structure 3 is composed of a mounting frame structure 6 and a dustproof net structure 7, the mounting frame structure 6 is a rectangular frame structure, the dustproof net structure 7 is fixedly installed on the inner wall of the mounting frame structure 6, a plurality of fan installation fixing holes 8 are symmetrically formed in the mounting frame structure 6, the inner and outer ends of the mounting frame structure 6 are penetrated by the fan installation fixing holes 8, three circuit board cooling fans 4 are installed at the upper ends of the two mounting bracket structures 2, the upper end of the circuit board cooling fan 4 in the mounting bracket structure 2 is evenly provided, the circuit board cooling fan 4 is located between the two fan dustproof structures 3, the circuit board cooling fan 4 is fixedly installed on the two mounting frame structures 6 on the two fan dustproof structures 3 through bolts, the fan dustproof structures 3 and the circuit board cooling fan 4 are arranged, in the working process of the circuit board main body 1, heat emitted by the circuit board main body 1 and electronic components installed on the circuit board main body 1 can be blown away by the circuit board cooling fan 4, so that the flow of air nearby the circuit board main body 1 is quickened, and then the heat of the circuit board main body 1 can be efficiently and rapidly dissipated, and finally the circuit board main body 1 is not easy to burn out.
It should be noted that, the present utility model is a high-efficiency heat dissipation circuit board, when in use, the circuit board main body 1 and the electronic components mounted on the circuit board main body 1 will emit a large amount of heat, at this time, the circuit board heat dissipation fan 4 will start to work, the circuit board heat dissipation fan 4 will blow air to the circuit board main body 1, at this time, the air flow speed near the circuit board main body 1 will be accelerated, so that the heat emitted by the circuit board main body 1 and the electronic components mounted on the circuit board main body 1 can be quickly blown away, and the circuit board main body 1 can be efficiently and quickly cooled.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or that equivalents may be substituted for part of the technical features thereof. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a high-efficient heat dissipation formula circuit board, includes circuit board main part (1), its characterized in that: two installing support structures (2) are symmetrically installed at the both ends of circuit board main part (1), two equal symmetry of upper end of installing support structure (2) installs two fan dustproof construction (3), two three circuit board radiator fan (4) are all installed to the upper end of installing support structure (2), circuit board radiator fan (4) are evenly set up in the upper end of installing support structure (2), circuit board radiator fan (4) are located between two fan dustproof construction (3).
2. The high-efficiency heat-dissipating circuit board of claim 1, wherein: four circuit board mounting holes (5) are symmetrically formed in the circuit board main body (1), and the four circuit board mounting holes (5) penetrate through the upper end and the lower end of the circuit board main body (1).
3. The high-efficiency heat-dissipating circuit board of claim 2, wherein: the two mounting bracket structures (2) are L-shaped structures, and the two mounting bracket structures (2) are fixedly mounted at two ends of the circuit board main body (1) through bolts respectively.
4. A high efficiency heat dissipating circuit board of claim 3, wherein: the four fan dustproof structures (3) are fixedly installed at the upper ends of the two mounting bracket structures (2) respectively through bolts.
5. The high-efficiency heat-dissipating circuit board of claim 4, wherein: the fan dustproof structure (3) is composed of a mounting frame structure (6) and a dustproof net structure (7), the mounting frame structure (6) is of a rectangular frame structure, the dustproof net structure (7) is fixedly mounted on the inner wall of the mounting frame structure (6), a plurality of fan mounting fixing holes (8) are symmetrically formed in the mounting frame structure (6), and the fan mounting fixing holes (8) are communicated with the inner end and the outer end of the mounting frame structure (6).
6. The high-efficiency heat-dissipating circuit board of claim 5, wherein: the circuit board cooling fan (4) is fixedly arranged on two mounting frame structures (6) on the two fan dustproof structures (3) through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320996811.6U CN219679118U (en) | 2023-04-27 | 2023-04-27 | High-efficient heat dissipation formula circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320996811.6U CN219679118U (en) | 2023-04-27 | 2023-04-27 | High-efficient heat dissipation formula circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219679118U true CN219679118U (en) | 2023-09-12 |
Family
ID=87928034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320996811.6U Active CN219679118U (en) | 2023-04-27 | 2023-04-27 | High-efficient heat dissipation formula circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219679118U (en) |
-
2023
- 2023-04-27 CN CN202320996811.6U patent/CN219679118U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |