CN216491767U - Circuit board heat radiation structure - Google Patents
Circuit board heat radiation structure Download PDFInfo
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- CN216491767U CN216491767U CN202123134438.3U CN202123134438U CN216491767U CN 216491767 U CN216491767 U CN 216491767U CN 202123134438 U CN202123134438 U CN 202123134438U CN 216491767 U CN216491767 U CN 216491767U
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- circuit board
- fixed
- mounting
- shaped frame
- heat dissipation
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Abstract
The utility model provides a circuit board heat radiation structure, which comprises a housin, inside one side fixed mounting of casing has four mount pads, the mount pad symmetry sets up, the mounting groove has been seted up on the mount pad top, the mounting groove embeds there is the circuit board, the circuit board passes through the bolt fastening in the mounting groove, the inside one side of keeping away from the circuit board of casing is equipped with the I-shaped frame, the bottom of I-shaped frame is fixed on the casing bottom, the equal fixed mounting in one side both ends that the circuit board was kept away from to the I-shaped frame has the hang plate, the other end of hang plate is fixed on the lateral wall of casing, two at least mounting holes have been seted up to one side that is close to the circuit board of I-shaped frame, the mounting hole equidistance sets up, be equipped with the fan in the mounting hole, the coaxial two at least supports that are equipped with of fan one end, the support free end is fixed on the lateral wall of mounting hole, the equal fixed mounting in one side both ends that the I-shaped frame is close to the circuit board has the guide plate. This application can blow the air through the fan, runs off the heat that produces in the circuit board working process fast, improves the radiating effect.
Description
Technical Field
The utility model belongs to the technical field of heat radiation structure, especially, indicate a circuit board heat radiation structure.
Background
The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, when the circuit board is used, components on the circuit board can generate heat, and the existing heat dissipation mechanism dissipates heat of the circuit board, namely, a heat dissipation fan can only dissipate heat of air blowing on one side of the circuit board, so that the heat dissipation is not uniform enough, and the heat dissipation effect is poor, therefore, the circuit board heat dissipation structure is provided.
SUMMERY OF THE UTILITY MODEL
For solving the not enough of above prior art, the utility model provides a circuit board heat radiation structure.
The technical scheme of the utility model is realized like this: a circuit board heat dissipation structure comprises a shell, wherein four mounting seats are fixedly mounted on one side inside the shell, the mounting seats are symmetrically arranged, and a circuit board is mounted on each mounting seat;
one side of keeping away from the circuit board inside the casing is equipped with the I-shaped frame, and the bottom of I-shaped frame is fixed on the casing bottom, two at least mounting holes have been seted up to one side of I-shaped frame that is close to the circuit board, and the mounting hole is the equidistance setting, is equipped with the fan in the mounting hole, and fan one end is coaxial to be equipped with two at least supports, the support free end is fixed on the lateral wall of mounting hole.
Preferably, the two ends of one side of the I-shaped frame, which is far away from the circuit board, are fixedly provided with inclined plates, and the other ends of the inclined plates are fixed on the side wall of the shell.
Preferably, both ends of one side of the I-shaped frame, which is close to the circuit board, are fixedly provided with guide plates, and the other ends of the guide plates are fixed on the mounting seat; a triangular inclined plate is arranged between the guide plates, the bottom of the triangular inclined plate is fixed on the shell, and the two ends of the triangular inclined plate are fixed on the mounting seat.
Preferably, both sides of the shell are provided with dust screens, the dust screens cover the air inlet and the air outlet respectively, and the dust screens are fixed on the shell through bolts.
Preferably, the top end of the mounting seat is provided with a mounting groove, and the edge of the circuit board is fixed in the mounting groove through a bolt.
Preferably, the two sides of the shell are provided with ventilation mechanisms, and each ventilation mechanism comprises an air inlet arranged on one side of the shell close to the fan and an air outlet arranged on one side of the shell close to the circuit board.
Compared with the prior art, the utility model discloses a fan can blow outside air to the circuit board through the air inlet, and when the air was through the guide plate, the air that can blow off the fan under the effect of guide plate again was with higher speed to can accelerate circuit board radiating rate, improve the radiating effect.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a top view of a circuit board heat dissipation structure according to the present invention.
Fig. 2 is a left side view of the structure of a circuit board heat dissipation structure provided by the present invention.
In the figure: the air conditioner comprises a shell 1, a mounting seat 2, a mounting groove 3, a circuit board 4, an I-shaped frame 5, a mounting hole 51, a fan 6, a support 7, an air inlet 8, an air outlet 9, an inclined plate 10, a guide plate 11, a triangular inclined plate 12 and a dust screen 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a circuit board heat dissipation structure comprises a shell 1, wherein four mounting seats 2 are fixedly mounted on one side inside the shell 1, the mounting seats 2 are symmetrically arranged, mounting grooves 3 are formed in the top ends of the mounting seats 2, circuit boards 4 are arranged in the mounting grooves 3, the circuit boards 4 are fixed in the mounting grooves 3 through bolts, and the circuit boards 4 can be jacked up through the mounting seats 2, so that air blown out by a fan 6 can dissipate heat of the upper side and the lower side of the circuit boards 4 during heat dissipation, and the heat dissipation effect is improved;
the side, far away from the circuit board 4, of the inside of the shell 1 is provided with an I-shaped frame 5, the bottom of the I-shaped frame 5 is fixed to the bottom end of the shell 1, one side, close to the circuit board 4, of the I-shaped frame 5 is provided with at least two mounting holes 51, the mounting holes 51 are arranged at equal intervals, fans 6 are arranged in the mounting holes 51, one end of each fan 6 is coaxially provided with at least two supports 7, the free ends of the supports 7 are fixed to the side walls of the mounting holes 51, the fans 6 are connected with an external power supply through wires, during heat dissipation, external air can be blown to the upper side and the lower side of the circuit board 4 through the fans 6, the air flow speed near the circuit board 4 is increased, heat dissipation is sufficient, and the heat dissipation speed is increased;
the ventilation mechanism has been seted up to the both sides of casing 1, and ventilation mechanism is including seting up air inlet 8 on casing 1 is close to one side of fan 6 and seting up the gas outlet 9 on casing 1 is close to one side of circuit board 4, and fan 6 during operation inhales casing 1 with the outside air through air inlet 8 in, blows to circuit board 4 again, dispels the heat to circuit board 4, and at last, the high temperature air rethread gas outlet 9 after the heat dissipation is discharged.
During the heat dissipation, fan 6 inhales the casing 1 with the outside air through air inlet 8 in, then blows to circuit board 4 department, and the air can be accelerated by guide plate 11 when through guide plate 11 to multiplicable air flow velocity improves the radiating effect, and the high temperature air rethread gas outlet 9 after the heat dissipation is discharged.
Further, as shown in fig. 1, two ends of one side of the i-shaped frame 5 away from the circuit board 4 are both fixedly provided with an inclined plate 10, the other end of the inclined plate 10 is fixed on the side wall of the casing 1, and the area of the air suction port of the fan 6 can be increased through the inclined plate 10, so that the air suction amount can be increased, and the heat dissipation effect can be improved.
Furthermore, as shown in fig. 1, the two ends of one side of the i-shaped frame 5 close to the circuit board 4 are both fixedly provided with the air deflectors 11, the other ends of the air deflectors 11 are fixed on the mounting seat 2, the air deflectors 11 are splayed, and the openings close to the circuit board 4 are smaller, so that the air blown out by the fan 6 can increase the air speed after passing through the air deflectors 11, and the heat dissipation effect is further improved;
be equipped with triangle swash plate 12 between guide plate 11, triangle swash plate 12 bottom is fixed on casing 1, and the both ends of triangle swash plate 12 are all fixed on mount pad 2, and the air that fan 6 blew off can blow to the bottom of circuit board 4 along the surface of triangle swash plate 12, conveniently dispels the heat to circuit board 4 bottom, and the heat dissipation is abundant.
Furthermore, as shown in fig. 1, both sides of the housing 1 are provided with dust screens 13, the dust screens 13 respectively cover the air inlet 8 and the air outlet 9, and the dust screens 13 are fixed on the housing 1 by bolts, so that dust in the outside air can be blocked by the dust screens 13, and the dust is prevented from permeating into the housing 1 and adhering to the circuit board 4, thereby preventing the service life of the circuit board 4 from being affected.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A circuit board heat dissipation structure comprises a shell (1) and is characterized in that four mounting seats (2) are fixedly mounted on one side of the interior of the shell (1), the mounting seats (2) are symmetrically arranged, and a circuit board (4) is mounted on each mounting seat (2);
casing (1) inside one side of keeping away from circuit board (4) is equipped with I-shaped frame (5), and the bottom of I-shaped frame (5) is fixed on casing (1) bottom, at least two mounting holes (51) have been seted up to one side that is close to circuit board (4) of I-shaped frame (5), and mounting hole (51) set up for the equidistance, are equipped with fan (6) in mounting hole (51), and fan (6) one end is coaxial to be equipped with two at least supports (7), support (7) free end is fixed on the lateral wall of mounting hole (51).
2. The circuit board heat dissipation structure according to claim 1, wherein two ends of one side of the i-shaped frame (5) away from the circuit board (4) are fixedly provided with an inclined plate (10), and the other end of the inclined plate (10) is fixed on the side wall of the housing (1).
3. The circuit board heat dissipation structure of claim 1, wherein the two ends of one side of the I-shaped frame (5) close to the circuit board (4) are fixedly provided with a guide plate (11), and the other end of the guide plate (11) is fixed on the mounting seat (2); be equipped with triangle swash plate (12) between guide plate (11), triangle swash plate (12) bottom is fixed on casing (1), and the both ends of triangle swash plate (12) are all fixed on mount pad (2).
4. A circuit board heat dissipation structure according to claim 1, wherein both sides of the housing (1) are provided with dust screens (13), the dust screens (13) respectively cover the air inlet (8) and the air outlet (9), and the dust screens (13) are fixed on the housing (1) by bolts.
5. The circuit board heat dissipation structure of claim 1, wherein the top end of the mounting seat (2) is provided with a mounting groove (3), and the edge of the circuit board (4) is fixed in the mounting groove (3) by a bolt.
6. A circuit board heat dissipation structure according to claim 1, wherein the housing (1) is provided with ventilation mechanisms at two sides thereof, and the ventilation mechanisms comprise an air inlet (8) provided at a side of the housing (1) close to the fan (6) and an air outlet (9) provided at a side of the housing (1) close to the circuit board (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123134438.3U CN216491767U (en) | 2021-12-14 | 2021-12-14 | Circuit board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123134438.3U CN216491767U (en) | 2021-12-14 | 2021-12-14 | Circuit board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491767U true CN216491767U (en) | 2022-05-10 |
Family
ID=81423173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123134438.3U Active CN216491767U (en) | 2021-12-14 | 2021-12-14 | Circuit board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216491767U (en) |
-
2021
- 2021-12-14 CN CN202123134438.3U patent/CN216491767U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230904 Address after: Card 6, the first floor, No. 199 Yong'an Road, Tongle Industrial Park, Anle Village, Dongfeng Town, Zhongshan City, Guangdong Province, 528400 Patentee after: ZHONGSHAN QIANFU HAOTAITAI ELECTRICAL APPLIANCE INDUSTRIAL CO.,LTD. Address before: 510000 room 101-110, No. 230, Huangge section, Shinan highway, Huangge Town, Nansha District, Guangzhou City, Guangdong Province Patentee before: Guangzhou Bojin Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |