CN219659705U - Ultra-wideband frequency measurement front end assembly - Google Patents
Ultra-wideband frequency measurement front end assembly Download PDFInfo
- Publication number
- CN219659705U CN219659705U CN202320960046.2U CN202320960046U CN219659705U CN 219659705 U CN219659705 U CN 219659705U CN 202320960046 U CN202320960046 U CN 202320960046U CN 219659705 U CN219659705 U CN 219659705U
- Authority
- CN
- China
- Prior art keywords
- amplifier
- temperature compensation
- attenuation chip
- multistage
- attenuation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000003321 amplification Effects 0.000 abstract description 3
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Amplifiers (AREA)
Abstract
The utility model discloses an ultra-wideband frequency measurement front end component, which consists of a multistage amplifier, a multistage attenuation chip, a multistage temperature compensation attenuator and an amplitude equalizer; the multistage amplifier comprises a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a fifth amplifier and a sixth amplifier; the multistage attenuation chip comprises a first attenuation chip, a second attenuation chip, a third attenuation chip and a fourth attenuation chip; the multistage temperature compensation attenuator comprises a first temperature compensation attenuator and a second temperature compensation attenuator; the utility model adds a low noise amplifier on the radio frequency receiving input port to improve the noise level of the whole receiving system; the multi-stage amplification mode is adopted in the channel, and the high-performance microwave receiving front end is realized by reasonably distributing the gain of each stage of amplifier, necessary filters, temperature compensation circuits and an equalizer.
Description
Technical Field
The utility model relates to the field of microwave communication, in particular to an ultra-wideband frequency measurement front end assembly.
Background
The radio frequency signal enters the amplifying link, so that the whole microwave receiving front end is necessarily required to have good amplitude-frequency consistency, lower spurious level (-10 dBc) and lower noise coefficient in order to ensure the sensitivity and the receiving performance of the system. For a super-high speed sampling module, the input signal requires a power level of-5 dBm to +6dBm (the power range has smaller quantization random jitter). The input signal of the receiver has a larger dynamic range, and to achieve the sensitivity of-65 dBm, the input signal needs to be compressed into a constant level range, the small signal and the large signal are ensured not to be distorted, and the performance of the large signal input in a broadband microwave channel needs to be designed in detail on the premise of larger gain.
Therefore, the technical difficulties of the front end of the ultra-wideband microwave channel mainly include two points: firstly, the requirements of no obvious degradation and low noise of signal spurious and intermodulation in a channel are ensured under the condition that a large dynamic radio frequency signal is compressed to a constant level range; secondly, miniaturization and low power consumption are required.
Disclosure of Invention
The utility model aims to provide an ultra-wideband frequency measurement front-end component with low noise and high performance.
The purpose of the utility model is realized in the following way: an ultra-wideband frequency measurement front end component consists of a multi-stage amplifier, a multi-stage attenuation chip, a multi-stage temperature compensation attenuator and an amplitude equalizer;
the multistage amplifier comprises a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a fifth amplifier and a sixth amplifier;
the multistage attenuation chip comprises a first attenuation chip, a second attenuation chip, a third attenuation chip and a fourth attenuation chip;
the multistage temperature compensation attenuator comprises a first temperature compensation attenuator and a second temperature compensation attenuator;
the first amplifier, the first temperature compensation attenuator, the second amplifier, the first attenuation chip, the third amplifier, the second attenuation chip, the fourth amplifier, the second temperature compensation attenuator, the fifth amplifier, the third attenuation chip, the sixth amplifier, the amplitude equalizer and the fourth attenuation chip are sequentially cascaded to form the temperature compensation amplifier.
Preferably, the multistage amplifier, the multistage attenuation chip, the multistage temperature compensation attenuator and the amplitude equalizer are adhered in the cavity, and interconnection is realized by bonding the substrates through gold wires.
Preferably, the first amplifier is a low noise amplifier, and is a first stage device placed behind the radio frequency signal input port, and the fourth attenuation chip is provided with a radio frequency signal output port behind the fourth attenuation chip.
Compared with the prior art, the utility model has the following advantages:
1. low noise
The calculation of the noise coefficient is calculated according to a calculation formula of the cascade noise coefficient:
wherein the NF-cascading circuit has a total noise figure;
NF A -a noise figure of the first stage circuit;
NF B -a noise figure of the second stage circuit;
G A -a gain of the first stage circuit;
G B -gain of the second stage circuit.
According to the calculation formula of the cascade noise coefficient, the influence of the first-stage amplifier on the noise coefficient is large, and the influence of the later stage on the noise coefficient is small. Therefore, the first stage amplifier is a 1-18 GHz broadband low-noise amplifier with a gain of 15dB (GA=102.5).
2. Low spurious emissions
After the 1-18 GHz signals are subjected to power division filtering, the harmonic signals can be controlled below-10 dBc after being subjected to limiting amplification filtering.
3. Gain allocation/amplitude equalization
Corresponding microwave simulation design software is adopted in the design, and each stage of circuit is simulated to ensure reasonable link gain distribution and amplitude fluctuation balance of the whole channel. Because the channel design comprises a large number of amplifiers, filters, limiting amplifiers and the like, various microwave components have certain fluctuation, particularly the sideband loss of the filters is large, the gain fluctuation of the whole frequency band is large, and in order to ensure the gain fluctuation in the bandwidth, an amplitude equalizer with a reasonable curve is arranged, and the noise base and the gain fluctuation of a 1-18 GHz channel are ensured to be within +/-2 dB.
4. Large dynamic range
Setting the gain level of the amplifier under the sensitivity state to enable the input radio frequency signal to be the minimum detectable signal of the high-speed ADC; in the state of large signal, the gain link adopts limiting amplification. Therefore, the dynamic range of the whole machine of the ultra-wideband digital receiver can be improved.
5. Low power consumption and miniaturization
The hardware quantity of the whole broadband microwave channel is relatively reduced, and the microwave printing process technology is adopted to integrate various processes, so that the circuits such as a low noise amplifier, a power amplifier and the like are integrated together, and the power supply circuit adopts a low-dropout voltage regulator, thereby realizing the miniature, high-performance and low-power-consumption broadband microwave channel.
Drawings
FIG. 1 is a schematic flow chart of the present utility model.
Detailed Description
Further advantages and effects of the present utility model will become apparent to those skilled in the art from the disclosure of the present utility model, which is described by the following specific examples.
It should be noted that, in the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or directions or positional relationships in which the inventive product is conventionally put in use, are merely for convenience of describing the present utility model and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," "overhang," and the like do not denote that the component is required to be absolutely horizontal or overhang, but may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or communicating between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in FIG. 1, an ultra-wideband frequency measurement front end assembly consists of a multi-stage amplifier, a multi-stage attenuation chip, a multi-stage temperature compensation attenuator and an amplitude equalizer;
the multistage amplifier comprises a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a fifth amplifier and a sixth amplifier;
the multistage attenuation chip comprises a first attenuation chip, a second attenuation chip, a third attenuation chip and a fourth attenuation chip;
the multistage temperature compensation attenuator comprises a first temperature compensation attenuator and a second temperature compensation attenuator;
the first amplifier, the first temperature compensation attenuator, the second amplifier, the first attenuation chip, the third amplifier, the second attenuation chip, the fourth amplifier, the second temperature compensation attenuator, the fifth amplifier, the third attenuation chip, the sixth amplifier, the amplitude equalizer and the fourth attenuation chip are sequentially cascaded to form the temperature compensation amplifier.
As shown in fig. 1, the multistage amplifier, the multistage attenuation chip, the multistage temperature compensation attenuator and the amplitude equalizer are adhered in the cavity, and interconnection is realized by gold wire bonding through the substrate.
As shown in fig. 1, the first amplifier is a low noise amplifier, and is a first stage device placed behind the rf signal input port, and a fourth attenuation chip, and a rf signal output port is provided behind the fourth attenuation chip.
The working principle of the utility model is explained as follows: the ultra-wideband frequency measurement front end component consists of multistage amplifier cascade connection, attenuation chips are cascaded among the amplifiers at each stage, circuit stability is improved, gain fluctuation is compensated at high and low temperatures by a temperature compensation attenuator compensation device, gain fluctuation at high and low frequency ends is compensated by an amplitude equalizer compensation circuit, and final equalization ensures that link output power is consistent at the high and low frequency ends during saturated output and the output power is in the optimal working range of the digital sampling plate.
The above examples are merely illustrative of the preferred embodiments of the present utility model and are not intended to limit the spirit and scope of the present utility model. Various modifications and improvements of the technical scheme of the present utility model will fall within the protection scope of the present utility model without departing from the design concept of the present utility model, and the technical content of the present utility model is fully described in the claims.
Claims (3)
1. The ultra-wideband frequency measurement front end component is characterized by comprising a multi-stage amplifier, a multi-stage attenuation chip, a multi-stage temperature compensation attenuator and an amplitude equalizer;
the multistage amplifier comprises a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a fifth amplifier and a sixth amplifier;
the multistage attenuation chip comprises a first attenuation chip, a second attenuation chip, a third attenuation chip and a fourth attenuation chip;
the multistage temperature compensation attenuator comprises a first temperature compensation attenuator and a second temperature compensation attenuator;
the first amplifier, the first temperature compensation attenuator, the second amplifier, the first attenuation chip, the third amplifier, the second attenuation chip, the fourth amplifier, the second temperature compensation attenuator, the fifth amplifier, the third attenuation chip, the sixth amplifier, the amplitude equalizer and the fourth attenuation chip are sequentially cascaded to form the temperature compensation amplifier.
2. The ultra-wideband frequency measurement front end assembly of claim 1, wherein the multistage amplifier, the multistage attenuation chip, the multistage temperature compensation attenuator and the amplitude equalizer are bonded in the cavity, and the interconnection is realized by bonding the substrates through gold wires.
3. The ultra-wideband frequency-measuring front-end assembly of claim 1, wherein the first amplifier is a low noise amplifier, is a first stage device placed behind a radio frequency signal input port, and is provided with a radio frequency signal output port behind the fourth attenuation chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320960046.2U CN219659705U (en) | 2023-04-25 | 2023-04-25 | Ultra-wideband frequency measurement front end assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320960046.2U CN219659705U (en) | 2023-04-25 | 2023-04-25 | Ultra-wideband frequency measurement front end assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219659705U true CN219659705U (en) | 2023-09-08 |
Family
ID=87881089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320960046.2U Active CN219659705U (en) | 2023-04-25 | 2023-04-25 | Ultra-wideband frequency measurement front end assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219659705U (en) |
-
2023
- 2023-04-25 CN CN202320960046.2U patent/CN219659705U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204046583U (en) | High dynamically high-gain broadband receiver | |
| CN108199737B (en) | Large dynamic millimeter wave frequency conversion assembly | |
| CN205725734U (en) | A kind of multichannel transmitting-receiving subassembly | |
| CN219659705U (en) | Ultra-wideband frequency measurement front end assembly | |
| CN107171681A (en) | A kind of highly sensitive receiving circuit of Ku wave bands | |
| CN202004725U (en) | Miniaturized high-power X-band amplitude-limiting low-noise amplifier | |
| CN110927677B (en) | Broadband low-power-consumption four-in-one receiver | |
| CN204721339U (en) | A kind of signal receiving device of eight passage multimode systems | |
| US9793938B2 (en) | Intermediate-frequency analogue-to-digital conversion device | |
| CN201138799Y (en) | Integrated straight-forward station | |
| CN216649672U (en) | 1.8GHz attenuation filtering and amplifying circuit | |
| CN207732726U (en) | Miniaturization, low-power consumption low noise amplification module based on LTCC technology | |
| CN214480568U (en) | Analog receiving assembly for broadband radio frequency direct sampling | |
| CN113726447A (en) | Optimization system and method for receiving background noise in optical fiber transmission link | |
| KR100737539B1 (en) | A power amplifier matching circuit of mobile communication terminal | |
| CN111130462B (en) | Q/V frequency band ultra-wideband up-converter | |
| CN104702231B (en) | AGC and ALC high-gain active circuit components with synchronization control function | |
| CN211702041U (en) | Optimization system for receiving background noise in optical fiber transmission link | |
| CN109067413B (en) | Ultrashort wave channel receiver with high dynamic range | |
| CN111683027A (en) | Satellite up-converter based on intermediate frequency analog predistortion | |
| US20210242839A1 (en) | Multi-chip module of radio frequency power amplifier | |
| CN104954034A (en) | Signal receiving device of eight-channel multi-mode system | |
| CN220775817U (en) | Millimeter wave auxiliary receiving channel | |
| CN216959811U (en) | Ku frequency band scattering communication high-gain low-noise amplifier | |
| Rambeau et al. | Antenna and input stages of a 470-710 MHz silicon TV tuner for portable applications |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |