CN219267672U - Tweezers for silicon chip - Google Patents
Tweezers for silicon chip Download PDFInfo
- Publication number
- CN219267672U CN219267672U CN202320472350.2U CN202320472350U CN219267672U CN 219267672 U CN219267672 U CN 219267672U CN 202320472350 U CN202320472350 U CN 202320472350U CN 219267672 U CN219267672 U CN 219267672U
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- Prior art keywords
- tweezers
- silicon wafers
- piece
- silicon
- control button
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 85
- 239000010703 silicon Substances 0.000 title claims abstract description 85
- 235000012431 wafers Nutrition 0.000 claims abstract description 81
- 238000009423 ventilation Methods 0.000 claims abstract description 37
- 230000001965 increasing effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses tweezers for silicon wafers, which comprise an upper tweezer piece and a lower tweezer piece, wherein an air vent pipeline is arranged in the upper tweezer piece, an air inlet hole is arranged at the tail end of the upper tweezer piece, an air outlet hole communicated with the air vent pipeline is arranged at the chuck end of the upper tweezer piece, the upper tweezer piece is inserted between two adjacent silicon wafers, and the air outlet hole is aligned with a gap between the two silicon wafers. The upper forceps sheets are internally provided with the ventilation pipeline, gas enters from the air inlet holes and is discharged from the air outlet holes, the silicon wafers clamped by the clamping head ends of the forceps are blown, and the gas is blown between the clamped silicon wafers and other silicon wafers attached together, so that the problem that a plurality of silicon wafers are attached together and are difficult to separate is solved.
Description
Technical Field
The utility model belongs to the technical field of solar silicon wafers, and particularly relates to tweezers for a silicon wafer.
Background
Along with the increasing excitation of the competition of the crystalline silicon battery, every family is extremely reducing the cost and enhancing the efficiency, and the silicon wafer is increasingly thinned and oversized, so that the number of the water dipping pieces (two or more pieces are dipped together) of the silicon wafer after the wet process is increased. At present, the water dipping sheets can only be taken out from the flower basket by using tweezers manually, and then the two sheets are separated by forcefully using hands or tweezers.
Disclosure of Invention
The utility model aims to provide tweezers for silicon wafers, and the purposes of separating and attaching silicon wafers together are achieved by arranging a ventilation pipeline inside, arranging corresponding air outlet holes at the clamping ends of the tweezers, discharging air from the air outlet holes, and blowing air between the silicon wafers clamped by the tweezers and other silicon wafers.
The technical scheme for realizing the aim of the utility model is as follows: the utility model provides a tweezers for silicon chip, includes tweezers piece, lower tweezers piece, be provided with the vent line in the tweezers piece of going up, the tail end of going up the tweezers piece is provided with the inlet port, go up the chuck end of tweezers piece be provided with the venthole of vent line intercommunication, go up the tweezers piece and insert between two adjacent silicon chips, and the venthole aligns the clearance between two silicon chips.
The upper forceps sheets are internally provided with the ventilation pipeline, gas enters from the air inlet holes and is discharged from the air outlet holes, the silicon wafers clamped by the clamping head ends of the forceps are blown, and the gas is blown between the clamped silicon wafers and other silicon wafers attached together, so that the problem that a plurality of silicon wafers are attached together and are difficult to separate is solved.
Furthermore, the upper forceps sheet is provided with an on-off mechanism for controlling the on-off of the ventilation pipeline, so that an operator can conveniently control the forceps to work.
Further, the on-off mechanism comprises a control button, a fixed groove is further formed in the upper forceps sheet, and the control button is movably connected in the fixed groove; the ventilation pipeline is communicated with the fixed groove, and the control button is provided with ventilation holes for being communicated with the ventilation pipeline. The control button is provided with the ventilation holes, and the communication of the ventilation pipeline can be controlled by adjusting the corresponding position relation between the ventilation holes and the ventilation pipeline.
Further, the control button is connected in the fixing groove through a spring, and when the spring is in a natural state, the ventilation holes are disconnected with the ventilation pipeline. When the tweezers are required to work to separate and attach together silicon wafers, the control button is pressed down, and when the positions of the air holes and the air vent pipeline correspond to each other, the air vent pipeline is communicated, and air enters from the air inlet holes and is discharged from the air outlet holes; when the tweezers are not needed to work, only the control button is needed to be loosened, the spring is reset to a relaxed natural state, the positions of the air holes and the air vent pipeline are staggered, the air vent pipeline is not communicated, and the air outlet hole is free from air discharge.
Further, the upper forceps sheet is provided with a holding part and a clamping block, and the air outlet hole is formed in the clamping block. The length of the clamping block is larger than the width of the upper forceps sheet, and the clamping block with the larger width can enable the silicon wafer to be uniformly stressed when clamping the silicon wafer, so that the silicon wafer is not only clamped stably, but also is not damaged as much as possible; the air outlet holes are arranged on the clamping blocks, the clamping blocks are mainly clamped on the silicon wafers when the tweezers are used, the air outlet holes are arranged on the clamping blocks and can be closer to the clamped silicon wafers, the effect of the air outlet holes is convenient to achieve, the gas pressure is high, and the purpose that discharged gas is separated and attached to the silicon wafers together is achieved.
Further, a smooth curved surface protruding towards the outer portion of the tweezers is arranged on the clamping blocks, and the air outlet holes are formed in the smooth curved surface. The smooth curved surface arranged on the clamping block is similar to a chamfer, and the risk of damaging the silicon wafer can be further prevented when the silicon wafer is contacted.
Further, the lower forceps sheet is provided with a holding part and a clamping plate, and the bottom end of the clamping plate is provided with a smooth chamfer. The length of the clamping plate is larger than the width of the lower forceps sheet, the sectional area of the clamping plate is larger than the sectional area of the clamping block, the clamping plate with a larger area can play a role in well supporting and supporting a silicon wafer to be clamped, and meanwhile, the contact area between the clamping plate with the silicon wafer with a large area can be increased, and the friction force is increased so as to facilitate better clamping.
Further, the limiting columns are arranged on the lower forceps sheets to limit the depth of the chuck ends of the forceps extending into the space between the silicon wafers, so that the silicon wafers are prevented from being scratched due to excessive extending into the space between the silicon wafers.
Further, the two limiting columns are respectively arranged at two sides of the upper forceps sheet; the height of the limiting column is the same as the thickness of the upper forceps sheet. Because the clamping blocks are arranged on the upper forceps sheets, the limiting columns respectively arranged on the two sides of the upper forceps sheets can well play a role in limiting when the upper forceps sheets extend into the silicon wafers, so that the clamping blocks can be ensured to be symmetrical in position when clamping the silicon wafers, and the problem that the inclined clamping silicon wafers easily cause silicon wafers to slide down is solved.
Further, the number of the air outlet holes is multiple, and the air is discharged from the air outlet holes at the same time, so that the purpose that the silicon wafers which are respectively clamped and other silicon wafers which are attached together are separated can be better achieved.
By adopting the technical scheme, the utility model has the following beneficial effects: (1) Through arranging the ventilation pipeline on the tweezers, gas can be discharged from the chuck end when the silicon wafers are taken out, and the silicon wafers which are adhered together can be separated; (2) The tweezers are provided with control buttons with ventilation holes, the control buttons are fixed through springs, and the ventilation holes and the ventilation pipeline are correspondingly communicated by pressing the control buttons; (3) The limiting column is arranged, so that the problem that the silicon wafer is scratched when the silicon wafer is stretched into a plurality of silicon wafers too deep during clamping can be prevented.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings, in which
FIG. 1 is a schematic view of the overall structure of tweezers according to the present utility model;
FIG. 2 is a schematic view of a structure of a fixing slot in the present utility model;
FIG. 3 is a schematic view of a control button according to the present utility model.
The reference numerals in the drawings are: 1, a forceps sheet is arranged; 2, lower forceps sheets; 3, a control button; 4, an air inlet hole; 5, air outlet holes; 6, fixing the groove; a vent line; 8, ventilation holes; 9, a spring; 10 clamping blocks; 11 smooth curved surfaces; 12 clamping plates; 13 limit posts; 14 smoothly chamfering.
Detailed Description
Examples:
as shown in fig. 1, this embodiment provides a pair of tweezers for silicon wafers, including last tweezers sheet 1, lower tweezers sheet 2, be provided with vent line 7 in going up the tweezers sheet 1, the tail end of going up the tweezers sheet 1 is provided with inlet port 4, go up the tweezers sheet 1 the chuck end be provided with vent hole 5 that vent line 7 communicates, go up tweezers sheet 1 and insert between two adjacent silicon wafers, and vent hole 5 aim at the clearance between two silicon wafers. The upper forceps sheet 1 is internally provided with the ventilation pipeline 7, gas enters from the air inlet hole 4, is discharged from the air outlet hole 5, blows the silicon wafer clamped by the clamping head end of the forceps, blows the gas from the clamped silicon wafer and other silicon wafers attached together, and achieves the problem that a plurality of silicon wafers are attached together and are difficult to separate. The upper forceps sheet 1 is provided with an on-off mechanism for controlling the on-off of the ventilation pipeline 7, so that an operator can conveniently control the forceps to work.
As shown in fig. 2-3, the on-off mechanism comprises a control button 3, a fixed groove 6 is further formed in the upper forceps sheet 1, and the control button 3 is movably connected in the fixed groove 6; the ventilation pipeline 7 is communicated with the fixed groove 6, and the control button 3 is provided with ventilation holes 8 which are used for being communicated with the ventilation pipeline 7. The control button 3 is provided with the ventilation holes 8, and the communication of the ventilation pipeline 7 can be controlled by adjusting the corresponding position relation between the ventilation holes 8 and the ventilation pipeline 7. The control button 3 is connected in the fixed groove 6 through a spring 9, and when the spring 9 is in a natural state, the ventilation hole 8 and the ventilation pipeline 7 are disconnected. When the tweezers are required to work to separate and attach together silicon wafers, the control button 3 is pressed, and when the positions of the ventilation holes 8 and the ventilation pipeline 7 correspond to each other, the ventilation pipeline 7 is communicated, and gas enters from the air inlet holes 4 and is discharged from the air outlet holes 5; when the tweezers are not needed to work, the control button 3 is only needed to be loosened, the spring 9 is reset to a relaxed natural state, the positions of the air holes 8 and the air vent pipeline 7 are staggered, the air vent pipeline 7 is not communicated, and the air outlet hole 5 is free from air discharge.
As shown in fig. 1, the upper forceps sheet 1 is provided with a holding part and a clamping block 10, and the air outlet hole 5 is arranged on the clamping block 10. The length of the clamping block 10 is larger than the width of the upper forceps sheet 1, and the clamping block 10 with larger width can enable the silicon wafer to be uniformly stressed when clamping the silicon wafer, so that the silicon wafer is not only clamped stably, but also is not damaged as much as possible; the air outlet holes 5 are arranged on the clamping blocks 10, when tweezers are used, the clamping blocks 10 are mainly clamped on silicon wafers, the air outlet holes 5 are arranged on the clamping blocks 10 and can be closer to the clamped silicon wafers, the effect of the air outlet holes 5 is convenient to achieve, the gas pressure is high, and the purpose that discharged gas is separated and attached to the silicon wafers together is achieved. The clamping block 10 is provided with a smooth curved surface 11 protruding towards the outer part of the tweezers, and the air outlet hole 5 is arranged on the smooth curved surface 11. The rounded curved surface 11 arranged on the clamping block 10 is similar to a chamfer, so that the risk of damaging the silicon wafer can be further prevented when the silicon wafer is contacted. The lower forceps sheet 2 is provided with a holding part and a clamping plate 12, and the bottom end of the clamping plate 12 is provided with a smooth chamfer 14. The length of the clamping plate 12 is larger than the width of the lower forceps sheet 2, the sectional area of the clamping plate 12 is larger than the sectional area of the clamping block 10, the clamping plate 12 with a larger area can play a good supporting role on a silicon wafer to be clamped, meanwhile, the contact area between the clamping plate 12 with the silicon wafer with a large area can be increased, and the friction force is increased so as to be better clamped. Limiting columns 13 are arranged on the lower forceps sheets 2 to limit the depth of the chuck ends of the forceps extending into the space between the silicon wafers, so that the silicon wafers are prevented from being scratched due to excessive extending into the space between the silicon wafers. The limiting columns 13 are two and are respectively arranged at two sides of the upper forceps sheet 1; the height of the limiting column 13 is the same as the thickness of the upper forceps sheet 1. Because the clamping blocks 10 are arranged on the upper forceps sheet 1, the limiting columns 13 respectively arranged at the two sides of the upper forceps sheet 1 can well play a role in limiting when the upper forceps sheet 1 stretches into a plurality of silicon wafers, so that the problem that the silicon wafers slide down easily due to the fact that the clamping blocks 10 clamp the silicon wafers in symmetrical positions and cannot be inclined is solved.
The number of the air outlets 5 is multiple, and a plurality of air outlets 5 can exhaust air simultaneously, so that the purpose that the silicon wafers which are respectively clamped and other silicon wafers which are attached together are separated can be better achieved.
Working principle: the upper forceps sheet 1 is internally provided with the ventilation pipeline 7, gas enters from the air inlet hole 4, is discharged from the air outlet hole 5, blows the silicon wafer clamped by the clamping head end of the forceps, blows the gas from the clamped silicon wafer and other silicon wafers attached together, and achieves the problem that a plurality of silicon wafers are attached together and are difficult to separate.
While the foregoing is directed to embodiments of the present utility model, other and further details of the utility model may be had by the present utility model, it should be understood that the foregoing description is merely illustrative of the present utility model and that no limitations are intended to the scope of the utility model, except insofar as modifications, equivalents, improvements or modifications are within the spirit and principles of the utility model.
Claims (10)
1. The utility model provides a tweezers for silicon chip, its characterized in that includes tweezers piece (1), lower tweezers piece (2), be provided with vent line (7) in going up tweezers piece (1), the tail end of going up tweezers piece (1) is provided with inlet port (4), go up tweezers piece (1) the chuck end be provided with vent hole (5) of vent line (7) intercommunication, go up tweezers piece (1) and insert between two adjacent silicon chips, and the clearance between two silicon chips is aimed at to vent hole (5).
2. The tweezers for silicon chips according to claim 1, wherein the upper tweezer piece (1) is provided with an on-off mechanism for controlling the on-off of the ventilation pipeline (7).
3. The tweezers for silicon wafers according to claim 2, wherein the on-off mechanism comprises a control button (3), a fixed groove (6) is further arranged on the upper tweezers sheet (1), and the control button (3) is movably connected in the fixed groove (6); the ventilation pipeline (7) is communicated with the fixed groove (6), and the control button (3) is provided with ventilation holes (8) which are used for being communicated with the ventilation pipeline (7).
4. A tweezers for silicon wafers according to claim 3, wherein said control button (3) is connected in said fixed groove (6) by means of a spring (9), said vent (8) being disconnected from said vent line (7) when said spring (9) is in its natural state.
5. Tweezers for silicon wafers according to claim 1, characterized in that the upper tweezer piece (1) is provided with a hand-held part and a clamping block (10), the gas outlet hole (5) being arranged on the clamping block (10).
6. The tweezers for silicon wafer according to claim 5, wherein the clamping block (10) is provided with a smooth curved surface (11) protruding towards the outside of the tweezers, and the air outlet hole (5) is arranged on the smooth curved surface (11).
7. Tweezers for silicon wafers according to claim 1, characterized in that the lower tweezer piece (2) is provided with a holding part and a clamping plate (12), the bottom end of the clamping plate (12) is provided with a rounded chamfer (14).
8. Tweezers for silicon wafers according to claim 1, characterized in that the lower tweezer piece (2) is provided with a limit post (13).
9. The tweezers for silicon chips according to claim 8, wherein the number of limit posts (13) is two, and the limit posts are respectively arranged at two sides of the upper tweezers sheet (1).
10. Tweezers for a silicon wafer according to any one of claims 1 to 9, characterized in that said gas outlet holes (5) are a plurality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320472350.2U CN219267672U (en) | 2023-03-14 | 2023-03-14 | Tweezers for silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320472350.2U CN219267672U (en) | 2023-03-14 | 2023-03-14 | Tweezers for silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219267672U true CN219267672U (en) | 2023-06-27 |
Family
ID=86870028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320472350.2U Active CN219267672U (en) | 2023-03-14 | 2023-03-14 | Tweezers for silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219267672U (en) |
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2023
- 2023-03-14 CN CN202320472350.2U patent/CN219267672U/en active Active
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