CN209119048U - Silicon wafer separator - Google Patents
Silicon wafer separator Download PDFInfo
- Publication number
- CN209119048U CN209119048U CN201821568192.6U CN201821568192U CN209119048U CN 209119048 U CN209119048 U CN 209119048U CN 201821568192 U CN201821568192 U CN 201821568192U CN 209119048 U CN209119048 U CN 209119048U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- blow pipe
- wafer separator
- gas blow
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 81
- 239000010703 silicon Substances 0.000 title claims abstract description 81
- 230000000694 effects Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 235000008216 herbs Nutrition 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model provides a kind of silicon wafer separator, to the silicon wafer separation being successively arranged in the gaily decorated basket in pairs and along first direction, the silicon wafer separator includes the bracket of activity setting, offers along the bracket successively spaced several first manipulators and gas blow pipe, the gas blow pipe gas hole to blow to aforementioned silicon wafer to be separated.The silicon wafer separator blows to silicon wafer to be separated by the gas hole on gas blow pipe, reduces the adhesive force between silicon wafer, conducive to being separated from each other for silicon wafer, guarantees production efficiency, and can reduce the silicon wafer breakage probability in Slicing procedure.
Description
Technical field
The utility model relates to photovoltaic production equipment field, in particular to a kind of silicon wafer separator.
Background technique
Making herbs into wool is that set suede structure is formed in silicon chip surface, to reduce silicon wafer reflectivity, improves photogenerated current.With
The reduction of silicon wafer thickness, one texture-etching side technology have in terms of reducing silicon wafer thickness loss compared with the two-sided making herbs into wool technology of tradition huge
Advantage.
The prevailing technology method that wet-method etching is still industry is carried out to silicon wafer using acid, aqueous slkali.Wherein, slot type wet process system
Suede equipment need to separate the silicon wafer sticked together two-by-two after silicon wafer completes one texture-etching side, by existing manipulator and
When corresponding sucker carries out fragment, in fact it could happen that silicon wafer cannot be separated smoothly, or the situations such as die crack occur.Occur aforementioned
Under abnormal conditions, manual operation is generally required, reduces production efficiency, also results in fragment rate rising.
In consideration of it, it is necessary to provide a kind of new silicon wafer separators.
Utility model content
The purpose of this utility model is to provide a kind of silicon wafer separator, it can reduce and mutually recline when silicon wafer separation
Adhesive force between silicon wafer is conducive to silicon wafer and separates, guarantees production efficiency, and can reduce fragment rate.
To realize above-mentioned purpose of utility model, the utility model provides a kind of silicon wafer suitable for one texture-etching side equipment point
From device, to the silicon wafer separation being successively arranged in the gaily decorated basket in pairs and along first direction, the silicon wafer separator
Bracket including activity setting, along the bracket successively spaced several first manipulators and gas blow pipe, the air blowing
The gas hole to blow to aforementioned silicon wafer to be separated is offered on pipe.
The gas hole is uniformly arranged along the extending direction of the gas blow pipe as a further improvement of the utility model,
The spacing of the adjacent gas hole is set as 4.26mm~4.76mm.
The aperture of the gas hole is set as 0.8mm~1.2mm as a further improvement of the utility model,.
The angle setting for opening up direction and deviateing vertical direction of the gas hole as a further improvement of the utility model,
It is 3~5 °.
The spacing and the tooth pitch phase of the gaily decorated basket of adjacent first manipulator as a further improvement of the utility model,
It is corresponding, and first manipulator is equipped at least one sucker to draw silicon wafer.
Lower section and the edge of aforementioned silicon wafer to be separated is arranged in the gas blow pipe as a further improvement of the utility model,
First direction is extended.
The gas blow pipe is arranged on the bracket and with the bracket together as a further improvement of the utility model,
It is mobile.
The gas blow pipe is set as two as a further improvement of the utility model,.
As a further improvement of the utility model, the spacing of the gas blow pipe and silicon wafer to be separated be set as 5mm~
50mm。
The silicon wafer separator further includes being oppositely arranged along first direction as a further improvement of the utility model,
Two blocks of positioning side plates and the positioning cylinder to press the fixed aforementioned gaily decorated basket.
The beneficial effects of the utility model are: the utility model silicon wafer separator is suitable for one texture-etching side equipment, it can
It is blown by the gas hole on gas blow pipe to silicon wafer to be separated, reduces the adhesive force between silicon wafer, so that first is mechanical
The silicon wafer mutually sticked together can be smoothly detached by hand, guarantee production efficiency, and it is broken to reduce the silicon wafer in Slicing procedure
Damage probability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one preferred embodiment of the utility model silicon wafer separator；
Fig. 2 is that venthole opens up angle schematic diagram on gas blow pipe in Fig. 1；
Fig. 3 is the structural schematic diagram of the utility model silicon wafer separator another preferred embodiment；
Fig. 4 is silicon wafer separator partial structure diagram in Fig. 3.
Specific embodiment
The utility model is described in detail below with reference to embodiment shown in the drawings.But the embodiment is not
Limit the utility model, structure that those skilled in the art are made according to the embodiment, method or functionally
Transformation is all contained in the protection scope of the utility model.
Join shown in Fig. 1, silicon wafer separator 100 provided by the utility model is suitable for one texture-etching side equipment, to incite somebody to action
It completes one texture-etching side and the silicon wafer 300 being successively arranged in the gaily decorated basket 200 in pairs is separated.Herein by institute in Slicing procedure
The orientation for stating silicon wafer 300 is defined as first direction.
The silicon wafer separator 100 includes the bracket 1, successively spaced several along the bracket 1 of activity setting
First manipulator 2, gas blow pipe 3, positioning side plate 4 and positioning cylinder 5.Several first manipulators 2 are arranged in order at institute
State the lower section of bracket 1, in Slicing procedure, the bracket 1 is moved to the surface of the gaily decorated basket 200, and makes several described
One manipulator 2 is arranged successively along first direction.Preferably, the tooth of the spacing of adjacent first manipulator 2 and the gaily decorated basket 200
Away from corresponding, and first manipulator 2 is equipped at least one sucker 21 to draw silicon wafer.It is opened on the gas blow pipe 3
Equipped with the gas hole 31 to blow to aforementioned silicon wafer 300 to be separated.The positioning side plate 4 is set as two pieces and along first party
It is oppositely arranged forwards, backwards, the spacing of two blocks of positioning side plates 4 is slightly larger than the length of the aforementioned gaily decorated basket 200.The positioning cylinder 5 is set to
The side of one of positioning side plate 4, after the gaily decorated basket 200 is mobile and is placed between two blocks of positioning side plates 4,
The gaily decorated basket 200 is pressed along first direction by the positioning cylinder 5 again, to realize that the position of the gaily decorated basket 200 is fixed.
In practical processing procedure, the silicon wafer separator 100 further includes several second manipulators (not shown), second machine
Tool hand corresponds to each other setting with the first manipulator 2 two-by-two.Wherein, first manipulator 2 is in silicon wafer 300 in pairs
A piece of when carrying out drawing mobile, second manipulator is to remain fixed in the gaily decorated basket 200 for another in this group of silicon wafer 300
In initial position.After the gaily decorated basket 200 completes positioning, second manipulator is preferably arranged to be moved to flower in the horizontal direction
Basket 200 is interior and realizes the fixing of corresponding silicon wafer 300.
The gas hole 31 is uniformly arranged along the extending direction of the gas blow pipe 3, and the spacing of the adjacent gas hole 31 is also
It is corresponding with the tooth pitch of the gaily decorated basket 200, so that the gas hole 31 be able to be to the silicon wafer 300 sticked together in pairs
It blows.Herein, the tooth pitch of the gaily decorated basket 200 is preferably arranged to 4.26mm~4.76mm, and the gas hole 31 opens up
Direction is consistent, i.e., so that the spacing of extending direction of the adjacent gas hole 31 along gas blow pipe 3 is 4.26mm~4.76mm.
In the present embodiment, the gas blow pipe 3 uses diameter for the copper pipe of 8mm；The aperture of the gas hole 31 is set as
0.8mm~1.2mm.To make the airflow direction of the gas hole 31 more effectively reasonable, the gas hole 31 opens up direction
The angle [alpha] for deviateing vertical direction is set as 3~5 ° (as shown in Figure 2).Herein, the gas blow pipe 3 extends along the first direction
It is arranged and the lower section of the gaily decorated basket 200 after positioning and silicon wafer 300 to be separated, the gas blow pipe 3 is preferably arranged to two.
In practical operation, not only need to avoid 200 holding movable of the gaily decorated basket in the process may be to touching caused by gas blow pipe 3, but also need
Guarantee air-flow blow out from the gas hole 31 can useful effect in corresponding silicon wafer 300, the gas blow pipe 3 and silicon to be separated
The spacing of piece 300 is preferably arranged to 5mm~50mm.The pressure of compressed air in the gas blow pipe 3 is set as 0.4~
0.6MPa, generally, the gas blow pipe 3 are remoter apart from silicon wafer 300, and the pressure setting of aforementioned compression air is bigger.
It is illustrated in figure 3 another embodiment of the utility model, is with the distinguishing feature of previous embodiment:
Gas blow pipe 3 is arranged on the bracket 1 and moves together with the bracket 1.In such cases, the gas blow pipe 3 and external gas
Source is connected by flexible hose, and as shown in connection with fig. 4, the gas blow pipe 3 is preferably arranged to two and is located at first machine
The two sides of tool hand 2.Similarly, the gas hole 31 opens up direction diagonally downward, also sets with the deviation angle of vertical direction
It is set to 3~5 °.
In conclusion the utility model silicon wafer separator 100 can be by the gas hole 31 on gas blow pipe 3 to be separated
Silicon wafer 300 is blown, and adhesive force when silicon wafer 300 separates is reduced.Wherein, second manipulator is by silicon wafer in pairs
It is a piece of in 300 to be retained in the gaily decorated basket 200；Another in this group of silicon wafer is drawn and is lifted out upwards by first manipulator 2
The gaily decorated basket 200, the silicon wafer separator 100 can better ensure that production efficiency, and the silicon wafer 300 reduced in Slicing procedure is damaged
Probability.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiments of understanding.
Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model
Body explanation, they are all without departing from made by the utility model skill spirit not to limit the protection scope of the utility model
Equivalent implementations or change should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of silicon wafer separator, the silicon wafer will be successively arranged in the gaily decorated basket in pairs and along first direction is separated,
The silicon wafer separator includes the bracket of activity setting and along the bracket successively spaced several first manipulators,
Be characterized in that: the silicon wafer separator further includes gas blow pipe, and the gas blow pipe is extended along the first direction, and described
The gas hole to blow to aforementioned silicon wafer to be separated is offered on gas blow pipe.
2. silicon wafer separator according to claim 1, it is characterised in that: extension of the gas hole along the gas blow pipe
Direction is uniformly arranged, and the spacing of the adjacent gas hole is set as 4.26mm~4.76mm.
3. silicon wafer separator according to claim 1, it is characterised in that: the aperture of the gas hole is set as 0.8mm
~1.2mm.
4. silicon wafer separator according to claim 1, it is characterised in that: deviate vertically in the direction that opens up of the gas hole
The angle in direction is set as 3~5 °.
5. silicon wafer separator according to claim 1, it is characterised in that: the spacing of adjacent first manipulator and institute
The tooth pitch for stating the gaily decorated basket is corresponding, and first manipulator is equipped at least one sucker to draw silicon wafer.
6. silicon wafer separator according to claim 1, it is characterised in that: the gas blow pipe is arranged in be separated aforementioned
The lower section of silicon wafer.
7. silicon wafer separator according to claim 1, it is characterised in that: gas blow pipe setting on the bracket and
It is moved together with the bracket.
8. silicon wafer separator according to claim 6 or 7, it is characterised in that: the gas blow pipe is set as two.
9. silicon wafer separator according to claim 6 or 7, it is characterised in that: the gas blow pipe and silicon wafer to be separated
Spacing is set as 5mm~50mm.
10. silicon wafer separator according to claim 1, it is characterised in that: the silicon wafer separator further includes along
The two blocks of positioning side plates and the positioning cylinder to press the fixed aforementioned gaily decorated basket that one direction is oppositely arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821568192.6U CN209119048U (en) | 2018-09-25 | 2018-09-25 | Silicon wafer separator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821568192.6U CN209119048U (en) | 2018-09-25 | 2018-09-25 | Silicon wafer separator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209119048U true CN209119048U (en) | 2019-07-16 |
Family
ID=67199420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821568192.6U Active CN209119048U (en) | 2018-09-25 | 2018-09-25 | Silicon wafer separator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209119048U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113291814A (en) * | 2021-05-28 | 2021-08-24 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
-
2018
- 2018-09-25 CN CN201821568192.6U patent/CN209119048U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113291814A (en) * | 2021-05-28 | 2021-08-24 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
| CN113291814B (en) * | 2021-05-28 | 2022-09-16 | 艾华(无锡)半导体科技有限公司 | Suction disc group for sucking multiple wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 224000 No.66 Huangpujiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province (g) Patentee after: YANCHENG ARTES SUNSHINE ENERGY TECHNOLOGY Co.,Ltd. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: 224000 No.66 Huangpujiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province (g) Patentee before: YANCHENG ARTES SUNSHINE ENERGY TECHNOLOGY Co.,Ltd. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |