CN219204782U - White covering film for printed circuit board - Google Patents
White covering film for printed circuit board Download PDFInfo
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- CN219204782U CN219204782U CN202223166015.4U CN202223166015U CN219204782U CN 219204782 U CN219204782 U CN 219204782U CN 202223166015 U CN202223166015 U CN 202223166015U CN 219204782 U CN219204782 U CN 219204782U
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Abstract
The utility model relates to the field of circuit board covering films, and discloses a white covering film for a printed circuit board, which comprises the following components: the protective film comprises a protective film layer, a white ink layer, a self-repairing layer, an electric insulating layer, a polyimide film layer, an epoxy adhesive layer and a release material layer which are sequentially arranged, wherein the protective film layer is a PET protective film with high-temperature-resistant pressing. The white ink layer is one of the white ink added into the resin primer. The self-repairing layer is one of thermosetting polyurethane and photo-curing acrylic acid-polyurethane. According to the utility model, the white printing ink is covered with the protective film, the protective effect is utilized to prevent the adhesive overflow control process of the epoxy adhesive layer from softening and adhering to the release material, and meanwhile, the qualification rate of the white coating film production and the qualification rate of the white coating film in the processing process of the circuit board are greatly improved in the use process of the white coating film, the rotation shielding optical rotation performance is good, the light reflection rate is high, and the cohesiveness and the heat resistance are excellent.
Description
Technical Field
The utility model relates to the field of circuit board covering films, in particular to a white covering film for a printed circuit board.
Background
In recent years, printed circuit boards are widely used in various electronic products.
According to the white cover film for the printed circuit board disclosed in the patent No. CN205439460U, the problems that the white cover film is used for preventing the adhesive from being softened in the overflow control process of an epoxy adhesive and adhering to a release material, meanwhile, the ink surface is protected from being scratched caused by personnel operation, equipment roller friction and the like and yellowing caused by liquid medicine corrosion in the use process of the white cover film, and the abnormal phenomenon such as cracks generated on the ink surface caused by punching is avoided by utilizing the buffer effect of the protective film are solved, so that the qualification rate of the white cover film production and the qualification rate in the processing process of the circuit board are greatly improved.
The existing photosensitive material applied to the printed circuit board is mainly solder resist green paint ink, the solder resist green paint ink can provide an external protective layer which is heat-resistant, moisture-resistant and resistant to chemical attack for a bare conductive circuit, but has poor rotation shielding optical rotation performance, higher reflectivity and low reflectivity, in the production process of a white covering film, due to different characteristics of the white ink, some ink does not reach the degree of complete solidification after coating, in order to shorten the whole production time, epoxy adhesive is directly coated on the other surface of a polyimide film, a release material is coated, and baking is carried out to control the glue overflow amount, and due to the longer baking time, the ink is softened completely and is adhered to the back surface of the release material of the covering film due to uncured state, so that the qualification rate is lower due to pattern appearance defects generated on the surface of the ink, and the rotation shielding optical rotation performance of a finished product is greatly reduced.
For this reason, we propose a white cover film for printed wiring boards to solve the above-mentioned problems.
Disclosure of Invention
The present utility model is directed to a white cover film for a printed wiring board, which solves the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
a white cover film for a printed wiring board, comprising: the protection film layer, white printing ink layer, self-repairing, electric insulating layer, polyimide film layer, epoxy adhesive layer and release material layer that set gradually, wherein:
the protective film layer is a PET protective film with high-temperature-resistant pressing;
the white ink layer is one of the white ink added into the resin primer;
the self-repairing layer is one of thermosetting polyurethane and photo-curing acrylic acid-polyurethane;
the material of the electric insulating layer is polyethylene naphthalate film;
the polyimide film layer is one of a carboxyl terminated butadiene-acrylonitrile copolymer, an amino terminated butadiene-acrylonitrile copolymer or an epoxy terminated butadiene-acrylonitrile copolymer;
the epoxy adhesive layer is one of novolac epoxy, phenol A epoxy, aromatic epoxy, aliphatic epoxy or halogenated epoxy.
As a preferable improvement of the white cover film for the printed wiring board, the thickness of the protective film layer is 35-110 μm;
as a preferable modification of the white cover film for a printed wiring board provided by the utility model, further, the thickness of the white ink layer is 25-75 μm;
as a preferable improvement of the white cover film for the printed wiring board, the thickness of the self-repairing layer is 45-80 μm;
as a preferable improvement of the white cover film for the printed circuit board, the thickness of the electric insulating layer is 30-65 μm, the electric insulating layer is formed on the surface of the polyimide film layer, the electric insulating layer is formed on the surface of the conductive circuit board and covers the electric circuit board, and the electric insulating layer is formed on the surface of the conductive circuit board layer by heating and pressing;
as a preferable improvement of the white cover film for the printed wiring board, the thickness of the polyimide film layer is 35-150 μm;
as a preferable improvement of the white cover film for the printed circuit board, the viscosity of the epoxy adhesive layer is 1500cps to 5500cps, and the thickness of the epoxy adhesive layer is 15-25 μm;
as a preferable improvement of the white cover film for the printed wiring board provided by the utility model, the thickness of the release material layer is 35-160 μm.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the white printing ink is covered with the protective film, the protective effect is utilized to prevent the adhesive overflow control process of the epoxy adhesive layer from softening and adhering to the release material, and meanwhile, the qualification rate of the white coating film production and the qualification rate of the white coating film in the processing process of the circuit board are greatly improved in the use process of the white coating film, the rotation shielding optical rotation performance is good, the light reflection rate is high, and the cohesiveness and the heat resistance are excellent.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
fig. 1 is a schematic material structure diagram of a white cover film for a printed circuit board according to the present utility model.
Legend description:
l1, a protective film layer; l2, white ink layer; l3, a self-repairing layer; l4, an electrically insulating layer; l5, polyimide film layer; l6, an epoxy adhesive layer; and L7, a release material layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, one embodiment provided by the present utility model: including protection film layer L1, white printing ink layer L2, self-repairing L3, electric insulating layer L4, polyimide film layer L5, epoxy adhesive layer L6 and release material layer L7 that set gradually, wherein:
the protective film layer L1 is a PET protective film with high-temperature-resistant pressing;
the white ink layer L2 is one of the white ink added into the resin primer;
the self-repairing layer L3 is one of thermosetting polyurethane and photo-curing acrylic-polyurethane;
the material of the electric insulating layer L4 is polyethylene naphthalate film;
the polyimide film layer L5 is one of a carboxyl terminated butadiene-acrylonitrile copolymer, an amino terminated butadiene-acrylonitrile copolymer or an epoxy terminated butadiene-acrylonitrile copolymer;
the epoxy adhesive layer L6 is one of novolac epoxy resin, phenol A epoxy resin, aromatic epoxy resin, aliphatic epoxy resin or halogenated epoxy resin;
the release material layer L7 is one of release paper or PET release film with release effect.
Wherein; the thickness of the protective film layer L1 is 35-110 mu m;
wherein; the thickness of the white ink layer L2 is 25-75 μm;
wherein; the thickness of the self-repairing layer L3 is 45-80 mu m;
wherein; the thickness of the electric insulating layer L4 is 30-65 mu m, the electric insulating layer L4 is formed on the surface of the polyimide film layer L5, the electric insulating layer L4 is formed on the surface of the conductive circuit board and covers the conductive circuit board, and the electric insulating layer L4 is formed on the surface of the conductive circuit board layer through heating and pressing;
wherein; the thickness of the polyimide film layer L5 is 35-150 mu m;
wherein; the viscosity of the epoxy adhesive layer L6 is 1500cps to 5500cps, and the thickness of the epoxy adhesive layer L6 is 15-25 mu m;
wherein; the thickness of the release material layer L7 is 35-160 μm.
The white cover film for the printed circuit board is characterized in that a layer of protective film is covered on white ink, the protective film is used for preventing the epoxy adhesive layer from softening in the overflow control process and being adhered with release materials, and meanwhile, the qualification rate of the white cover film in production and the qualification rate of the white cover film in the processing process of the circuit board are greatly improved in the use process of the white cover film, the rotation shielding optical rotation performance is good, the light reflection rate is high, and the cohesiveness and the heat resistance are excellent.
The source of all the raw materials is not particularly limited in the present utility model, and is well known to those skilled in the art.
The preparation flow of the white covering film for the printed circuit board is as follows:
coating a release material layer, then coating an epoxy adhesive layer, then coating a polyimide film layer and an electric insulating layer on a base material, simultaneously coating a self-repairing layer on the electric insulating layer, coating a white ink layer, drying, and then compounding a protective film layer to obtain the white cover film for the printed circuit board.
The following specifically describes the preparation process of the white cover film for the printed wiring board by taking the actual preparation process as an example:
example 1
Three groups of epoxy adhesive layers are coated on a 35 mu m release material layer film, the release material layer film is dried at the temperature of 120 ℃ for 2min, the thickness of the epoxy adhesive layers is 15 mu m, the front surface of a 125 mu m polyimide film layer is compounded, at the moment, a backing film is peeled off, an electrical insulation layer which is prepared is coated, the release material layer film is dried at the temperature of 110 ℃ for 2min, the thickness of the release material layer film is 30 mu m, a self-repairing coating which is prepared is coated again, the solvent is dried at the temperature of 90 ℃ for 2min until the release material layer film is slightly dried, the thickness of the release material layer film is 45 mu m, a 75 mu m protective film layer is attached, the release material layer film is laminated by a compound roller with the pressure of 0.45MPa, and the release material layer film is cured in an oven at the temperature of 45 ℃ for 48h, so that the white cover film for the printed circuit board is obtained.
Example 2
Three groups of epoxy adhesive layers are coated on a 40 mu m release material layer film, the release material layer film is dried at 130 ℃ for 2min, the thickness of the epoxy adhesive layers is 20 mu m, the front surface of the 130 mu m polyimide film layer is compounded, at the moment, the backing film is peeled off, the prepared electric insulating layer is coated, the release material layer film is dried at 120 ℃ for 2min, the thickness of the coating layer is 40 mu m, the prepared self-repairing paint is coated, the drying solvent is dried at 80 ℃ for 2min until the coating layer is slightly dry, the thickness of the coating layer is 45 mu m, a 75 mu m protective film layer is attached, the lamination is carried out by a compound roller with the pressure of 0.45MPa, and the white covering film for the printed circuit board is obtained after curing for 48 hours in a 60 ℃ oven.
Example 3
Three groups of epoxy adhesive layers are coated on a 45 mu m release material layer film, the temperature of 140 ℃ is 2min, the thickness of the epoxy adhesive layers is 25 mu m, the front surface of a 140 mu m polyimide film layer is compounded, at the moment, a backing film is stripped off, an electrical insulation layer which is prepared is coated, the temperature of 120 ℃ is 2min, the thickness of the coating is 35 mu m, a self-repairing coating which is prepared is coated, the temperature of 95 ℃ is 2min, a drying solvent is dried until the coating is slightly dry, the thickness of the coating is 50 mu m, a 80 mu m protective film layer is attached, the lamination is carried out by a compound roller with the pressure of 0.45MPa, and the white covering film for the printed circuit board is obtained after curing for 48 hours in a 60 ℃ oven.
It is important to note that in this document relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A white cover film for a printed wiring board, characterized in that: including protection film layer (L1), white printing ink layer (L2), self-repairing layer (L3), electric insulating layer (L4), polyimide film layer (L5), epoxy adhesive layer (L6) and release material layer (L7) that set gradually, wherein:
the protective film layer (L1) is a PET protective film with high-temperature-resistant lamination;
the white ink layer (L2) is one of the white ink added into the resin primer;
the self-repairing layer (L3) is one of thermosetting polyurethane and photo-curing acrylic-polyurethane;
the material of the electric insulating layer (L4) is polyethylene naphthalate film;
the polyimide film layer (L5) is one of a carboxyl terminated butadiene-acrylonitrile copolymer, an amino terminated butadiene-acrylonitrile copolymer or an epoxy terminated butadiene-acrylonitrile copolymer;
the epoxy adhesive layer (L6) is one of novolac epoxy resin, phenol A type epoxy resin, aromatic epoxy resin, aliphatic epoxy resin or halogenated epoxy resin;
the release material layer (L7) is one of release paper or PET release film with release effect.
2. A white cover film for a printed wiring board according to claim 1, wherein: the thickness of the protective film layer (L1) is 35-110 mu m.
3. A white cover film for a printed wiring board according to claim 1, wherein: the thickness of the white ink layer (L2) is 25-75 μm.
4. A white cover film for a printed wiring board according to claim 1, wherein: the thickness of the self-repairing layer (L3) is 45-80 mu m.
5. A white cover film for a printed wiring board according to claim 1, wherein: the thickness of the electric insulating layer (L4) is 30-65 mu m, the electric insulating layer (L4) is formed on the surface of the polyimide film layer (L5), the electric insulating layer (L4) is formed on the surface of the conductive circuit board and covers the conductive circuit board, and the electric insulating layer (L4) is formed on the surface of the conductive circuit board layer through heating and pressing.
6. A white cover film for a printed wiring board according to claim 1, wherein: the thickness of the polyimide film layer (L5) is 35-150 μm.
7. A white cover film for a printed wiring board according to claim 1, wherein: the viscosity of the epoxy adhesive layer (L6) is 1500cps to 5500cps, and the thickness of the epoxy adhesive layer (L6) is 15-25 mu m.
8. A white cover film for a printed wiring board according to claim 1, wherein: the thickness of the release material layer (L7) is 35-160 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223166015.4U CN219204782U (en) | 2022-11-29 | 2022-11-29 | White covering film for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223166015.4U CN219204782U (en) | 2022-11-29 | 2022-11-29 | White covering film for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219204782U true CN219204782U (en) | 2023-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223166015.4U Active CN219204782U (en) | 2022-11-29 | 2022-11-29 | White covering film for printed circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN219204782U (en) |
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- 2022-11-29 CN CN202223166015.4U patent/CN219204782U/en active Active
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