CN219201823U - Automatic testing device for steady-state performance of LED chip - Google Patents
Automatic testing device for steady-state performance of LED chip Download PDFInfo
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- CN219201823U CN219201823U CN202223202545.XU CN202223202545U CN219201823U CN 219201823 U CN219201823 U CN 219201823U CN 202223202545 U CN202223202545 U CN 202223202545U CN 219201823 U CN219201823 U CN 219201823U
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- 238000012360 testing method Methods 0.000 title claims abstract description 46
- 239000011324 bead Substances 0.000 claims abstract description 50
- 230000003287 optical effect Effects 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 238000006073 displacement reaction Methods 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductors, in particular to an automatic testing device for steady-state performance of an LED chip, which comprises an optical flat plate, an integrating sphere, a heater, a lamp bead bracket and the LED chip; the integrating sphere is arranged on the optical flat plate in a sliding way along an axis; the heater is arranged on the optical flat plate, the lamp bead support is arranged on the heater, and more than two LED chips are arranged on the lamp bead support at intervals along the direction parallel to the axis. The automatic testing device for the steady-state performance of the LED chip has the advantages of simple structure, easiness in implementation, high testing efficiency and high precision.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to an automatic testing device for steady-state performance of an LED chip.
Background
An LED, light emitting diode, is a solid state semiconductor device that converts electrical energy into light energy. As a novel light emitting device, LEDs have advantages of high light efficiency, energy saving, long service life, short response time, environmental protection, etc., and thus are called as the most potential new generation light sources, and are very commonly applied in the field of illumination. For the application field of high-grade LED chips, such as car light LED chips, the brightness attenuation at high temperature is required to be not more than 25% compared with normal temperature, so that the steady state performance of the LED chips at high temperature is particularly important to evaluate, and the existing evaluation and test device is such as China patent application number CN202011571436.8, and is named as a high-temperature aging test device for LED products. The high-temperature aging testing device for the LED products still has the defects of low testing efficiency and high precision in practical application.
Disclosure of Invention
In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to provide the automatic testing device for the steady-state performance of the LED chip, which is high in testing efficiency and high in precision.
In order to solve the technical problems, the utility model adopts the following technical scheme: an automatic testing device for the steady-state performance of an LED chip comprises an optical flat plate, an integrating sphere, a heater, a lamp bead bracket and the LED chip;
the integrating sphere is arranged on the optical flat plate in a sliding way along an axis;
the heater is arranged on the optical flat plate, the lamp bead support is arranged on the heater, and more than two LED chips are arranged on the lamp bead support at intervals along the direction parallel to the axis.
Further, the optical flat plate comprises an electric displacement assembly, wherein the electric displacement assembly is arranged on the optical flat plate and is used for controlling the integrating sphere to slide along an axis.
Further, electronic displacement subassembly includes base, motor, screw rod and slider, the base sets up on the optics flat board, the motor sets up on the base, the motor is connected with the screw rod, the screw rod rotates with the base to be connected, screw rod and slider screw thread fit, slider and base sliding connection, the integrating sphere sets up on the slider.
Further, the optical flat plate is provided with mounting holes in an array mode, the heat dissipation seat and the mounting Kong Suojie are arranged on the optical flat plate, the heat dissipation table is arranged on the heat dissipation seat, and the heater is arranged on the heat dissipation table.
Further, the lamp bead support further comprises a heat conduction copper sheet, and the heat conduction copper sheet is arranged between the heater and the lamp bead support.
Further, a thermocouple placing hole and a thermocouple fixing hole penetrating through the thermocouple placing hole are formed in the heat conducting copper sheet.
Further, the heat conducting copper sheet is respectively locked with the heater and the lamp bead bracket.
Further, still include lamp pearl mounting fixture, lamp pearl mounting fixture sets up on heat conduction copper sheet, lamp pearl mounting fixture is used for the centre gripping lamp pearl support.
Further, electrode pins are arranged on the lamp bead support.
The utility model has the beneficial effects that: an automatic testing device for the steady-state performance of an LED chip is provided, and an integrating sphere is slidably arranged on one side of an optical flat plate and used for receiving the light intensity emitted by the LED chip. The LED chip is packaged on the lamp bead support by solder paste, the lamp bead support is fixed on the other side of the optical flat plate, at room temperature, the integrating sphere respectively tests the light intensity record from the first LED chip to the last LED chip in the sliding process, then the heater is set to be stable for 5 minutes at the preset experimental temperature, the light intensity record from the first test to the last LED chip is respectively recorded, and the light intensity at each high temperature is divided by the light intensity at the room temperature to obtain the high-temperature stable performance of the LED. The automatic testing device for the steady-state performance of the LED chip has the advantages of simple structure, easiness in implementation, high testing efficiency and high precision.
Drawings
FIG. 1 is a schematic diagram of an automatic testing device for steady-state performance of an LED chip according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram showing a part of an automatic testing device for steady-state performance of an LED chip according to an embodiment of the present utility model;
FIG. 3 is another schematic diagram of a device for automatically testing steady-state performance of an LED chip according to an embodiment of the present utility model;
description of the reference numerals:
1. an optical plate; 11. a mounting hole; 2. an integrating sphere; 3. a heater; 4. a lamp bead bracket; 41. an electrode pin; 5. an LED chip; 6. an electric displacement assembly; 7. a heat dissipation seat; 8. a heat dissipation stage; 9. a thermally conductive copper sheet; 91. a thermocouple placement hole; 92. thermocouple fixing holes; 10. lamp bead fixation clamp.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
The utility model provides an automatic testing device for the steady-state performance of an LED chip, which is used for evaluating the steady-state performance of the LED chip at a high temperature.
Referring to fig. 1 to 3, the automatic testing device for steady-state performance of an LED chip 5 according to the present utility model includes an optical flat plate 1, an integrating sphere 2, a heater 3, a lamp bead bracket 4 and an LED chip 5;
the integrating sphere 2 is arranged on the optical flat plate 1 in a sliding way along an axis;
the heater 3 is arranged on the optical flat plate 1, the lamp bead support 4 is arranged on the heater 3, and more than two LED chips 5 are arranged on the lamp bead support 4 at intervals along the direction parallel to the axis.
From the above description, the beneficial effects of the utility model are as follows: an automatic testing device for the steady-state performance of an LED chip 5 is provided, and an integrating sphere 2 is slidably arranged on one side of an optical flat plate 1 and is used for receiving the light intensity emitted by the LED chip 5. The LED chip 5 is packaged on the lamp bead support 4 by solder paste, the lamp bead support 4 is fixed on the other side of the optical flat plate 1, at room temperature, the integrating sphere 2 tests the light intensity record from the first LED chip 5 to the last LED chip in the sliding process, then the heater 3 is set to be stable for 5min at the preset experimental temperature, the light intensity record from the first test to the last LED chip is respectively recorded, and the light intensity at each high temperature is divided by the light intensity at the room temperature, namely the high-temperature steady state performance of the LED. The automatic testing device for the steady-state performance of the LED chip 5 has the advantages of simple structure, easiness in implementation, high testing efficiency and high precision.
In an alternative embodiment, the optical flat 1 further comprises an electric displacement assembly 6, and the electric displacement assembly 6 is arranged on the optical flat 1 and used for controlling the integrating sphere 2 to slide along an axis.
From the above description, the motorized displacement assembly 6 is used to control the integrating sphere 2 to slide along an axis, so as to test the light intensity records of the LED chips 5 respectively.
In an alternative embodiment, the electric displacement assembly 6 comprises a base, a motor, a screw and a sliding block, wherein the base is arranged on the optical flat plate 1, the motor is arranged on the base, the motor is connected with the screw, the screw is rotationally connected with the base, the screw is in threaded fit with the sliding block, the sliding block is in sliding connection with the base, and the integrating sphere 2 is arranged on the sliding block.
From the above description, the base acts as a support, and the motor drives the screw to rotate so as to control the sliding block to slide on the base.
In an alternative embodiment, the optical flat plate 1 further comprises a heat dissipation seat 7 and a heat dissipation table 8, wherein the mounting holes 11 are arrayed on the optical flat plate 1, the heat dissipation seat 7 is locked with the mounting holes 11, the heat dissipation table 8 is arranged on the heat dissipation seat 7, and the heater 3 is arranged on the heat dissipation table 8.
As is apparent from the above description, the heat dissipation stage 8 made of copper material is arranged below the heater 3 to dissipate heat below the heater 3. The bottom of the heat dissipation table 8 is provided with screw holes which are connected with the base and arranged on the optical flat plate 1, and the heat dissipation device at the bottom is made of aluminum, so that the cost can be saved.
In an alternative embodiment, the lamp bulb comprises a heat conducting copper sheet 9, wherein the heat conducting copper sheet 9 is arranged between the heater 3 and the lamp bulb support 4.
As can be seen from the above description, the lamp bead fixture has a heat conducting copper sheet 9 thereon, and the heat of the heater 3 is transferred to the lamp bead fixture and then to the LED chip 5.
In an alternative embodiment, the heat conducting copper sheet 9 is provided with a thermocouple placement hole 91 and a thermocouple fixing hole 92 penetrating through the thermocouple placement hole 91.
As is apparent from the above description, a thermocouple is installed on the heat conductive copper sheet 9 to control the temperature of the heater 3.
In an alternative embodiment, the heat conducting copper sheet 9 is respectively locked with the heater 3 and the lamp bead bracket 4.
As can be seen from the above description, the lamp bead clamp has four screw holes, two screw holes in the middle for fixing the lamp bead bracket 4, and two screw holes at both ends for fixing the lamp bead clamp to the heat sink 8.
In an alternative embodiment, the lamp bead fixing clamp 10 is further included, the lamp bead fixing clamp 10 is arranged on the heat conducting copper sheet 9, and the lamp bead fixing clamp 10 is used for clamping the lamp bead support 4.
From the above description, it is clear that the bead support 4 is fixed on a fixing jig made of copper, which can obtain better heat conduction performance.
In an alternative embodiment, the electrode pins 41 are provided on the bead support 4.
The working principle of the utility model is as follows: the integrating sphere 2 was tested for light intensity recordings from the first to the LED chip 5 to the last at room temperature, respectively. After the heater 3 was set to the experimental temperature for 5min, the light intensities from the first test to the last test were recorded, respectively. Dividing the light intensity at each high temperature by the light intensity at the room temperature to obtain the high-temperature steady-state performance of the LED.
Referring to fig. 1 to 3, a first embodiment of the present utility model is as follows: an automatic testing device for the steady-state performance of an LED chip 5 comprises an optical flat plate 1, an integrating sphere 2, a heater 3, a lamp bead bracket 4 and the LED chip 5;
the integrating sphere 2 is arranged on the optical flat plate 1 in a sliding way along an axis;
the heater 3 is arranged on the optical flat plate 1, the lamp bead support 4 is arranged on the heater 3, and more than two LED chips 5 are arranged on the lamp bead support 4 at intervals along the direction parallel to the axis.
And the electric displacement assembly 6 is arranged on the optical flat plate 1, and the electric displacement assembly 6 is used for controlling the integrating sphere 2 to slide along an axis. The electric displacement assembly 6 comprises a base, a motor, a screw and a sliding block, wherein the base is arranged on the optical flat plate 1, the motor is arranged on the base, the motor is connected with the screw, the screw is rotationally connected with the base, the screw is in threaded fit with the sliding block, the sliding block is in sliding connection with the base, and the integrating sphere 2 is arranged on the sliding block. The optical flat plate 1 is provided with an array of mounting holes 11, the heat dissipation seat 7 is locked with the mounting holes 11, the heat dissipation table 8 is arranged on the heat dissipation seat 7, and the heater 3 is arranged on the heat dissipation table 8. The lamp bulb lamp further comprises a heat conduction copper sheet 9, and the heat conduction copper sheet 9 is arranged between the heater 3 and the lamp bulb support 4. The heat conducting copper sheet 9 is provided with a thermocouple placing hole 91 and a thermocouple fixing hole 92 penetrating through the thermocouple placing hole 91. The heat conducting copper sheet 9 is respectively locked with the heater 3 and the lamp bead bracket 4. The lamp bead fixing clamp 10 is arranged on the heat conducting copper sheet 9, and the lamp bead fixing clamp 10 is used for clamping the lamp bead support 4. The electrode pins 41 are arranged on the lamp bead support 4.
In summary, the present utility model provides an automatic testing device for steady-state performance of an LED chip, where an integrating sphere is slidably mounted on one side of an optical flat plate, and is used for receiving light intensity emitted by the LED chip. The LED chip is packaged on the lamp bead support by solder paste, the lamp bead support is fixed on the other side of the optical flat plate, at room temperature, the integrating sphere respectively tests the light intensity record from the first LED chip to the last LED chip in the sliding process, then the heater is set to be stable for 5 minutes at the preset experimental temperature, the light intensity record from the first test to the last LED chip is respectively recorded, and the light intensity at each high temperature is divided by the light intensity at the room temperature to obtain the high-temperature stable performance of the LED. The automatic testing device for the steady-state performance of the LED chip has the advantages of simple structure, easiness in implementation, high testing efficiency and high precision.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (9)
1. The automatic testing device for the steady-state performance of the LED chip is characterized by comprising an optical flat plate, an integrating sphere, a heater, a lamp bead bracket and the LED chip; the integrating sphere is arranged on the optical flat plate in a sliding way along an axis; the heater is arranged on the optical flat plate, the lamp bead support is arranged on the heater, and more than two LED chips are arranged on the lamp bead support at intervals along the direction parallel to the axis.
2. The device for automatically testing the steady state performance of an LED chip of claim 1, further comprising an electrically powered displacement assembly disposed on the optical plate, the electrically powered displacement assembly configured to control the sliding of the integrating sphere along an axis.
3. The device for automatically testing the steady-state performance of the LED chip according to claim 2, wherein the electric displacement assembly comprises a base, a motor, a screw and a sliding block, the base is arranged on the optical flat plate, the motor is arranged on the base, the motor is connected with the screw, the screw is rotationally connected with the base, the screw is in threaded fit with the sliding block, the sliding block is in sliding connection with the base, and the integrating sphere is arranged on the sliding block.
4. The device for automatically testing the steady-state performance of the LED chip according to claim 1, further comprising a heat dissipation base and a heat dissipation table, wherein the optical flat is provided with mounting holes in an array, the heat dissipation base and the mounting Kong Suojie are arranged on the heat dissipation base, the heat dissipation table is arranged on the heat dissipation table, and the heater is arranged on the heat dissipation table.
5. The device for automatically testing steady state performance of an LED chip of claim 1, further comprising a thermally conductive copper sheet disposed between the heater and the bead support.
6. The device for automatically testing the steady-state performance of the LED chip according to claim 5, wherein the heat conducting copper sheet is provided with a thermocouple placement hole and a thermocouple fixing hole penetrating through the thermocouple placement hole.
7. The device for automatically testing steady state performance of an LED chip of claim 5, wherein said thermally conductive copper sheet is respectively locked to the heater and the bead holder.
8. The device for automatically testing steady-state performance of an LED chip of claim 5, further comprising a bead fixture disposed on the thermally conductive copper sheet, the bead fixture configured to clamp the bead support.
9. The automatic testing device for steady-state performance of an LED chip according to claim 1, wherein electrode pins are arranged on the lamp bead support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223202545.XU CN219201823U (en) | 2022-11-30 | 2022-11-30 | Automatic testing device for steady-state performance of LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223202545.XU CN219201823U (en) | 2022-11-30 | 2022-11-30 | Automatic testing device for steady-state performance of LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219201823U true CN219201823U (en) | 2023-06-16 |
Family
ID=86726245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223202545.XU Active CN219201823U (en) | 2022-11-30 | 2022-11-30 | Automatic testing device for steady-state performance of LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219201823U (en) |
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2022
- 2022-11-30 CN CN202223202545.XU patent/CN219201823U/en active Active
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