CN2901587Y - Heat radiation device of LED - Google Patents
Heat radiation device of LED Download PDFInfo
- Publication number
- CN2901587Y CN2901587Y CNU2006201163543U CN200620116354U CN2901587Y CN 2901587 Y CN2901587 Y CN 2901587Y CN U2006201163543 U CNU2006201163543 U CN U2006201163543U CN 200620116354 U CN200620116354 U CN 200620116354U CN 2901587 Y CN2901587 Y CN 2901587Y
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- pedestal
- location notch
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title description 6
- 239000000463 material Substances 0.000 claims abstract description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 27
- 238000009434 installation Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract 3
- 238000011900 installation process Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This utility model relates to a heat abstractor for a light-emitting diode comprising a substrate (1), a positioning groove (2) with a jack bar (3), and heat emission material (7).Wherein, the positioning groove (2) is provided at the top surface of the substrate (1) with a shape suitable to that of the light-emitting diode for holding the light-emitting diode. The heat emission material (7) is painted on the positioning groove (2) and is fully connected with the light-emitting diode. When the light-emitting diode is connected with the substrate (1), a base pin of the light-emitting diode is directly put into the jack bar (3) in which an insulating sleeve 4 is provided. This utility model has the advantages of the longer service life, the good heat emission, the simple installation process, and the low cost of installation.
Description
Technical field
The utility model relates to a kind of heat abstractor of light-emitting diode.
Background technology
As everyone knows, temperature has material impact for the life cycle life-span and the reliability of various types of light-emitting diodes wafers.For example, for GaN type light-emittingdiode, the electric energy that this type LED wafer is accepted nearly all is converted into heat energy.Therefore for the light fixture that is assembled by high-capacity LED, it is even more important to dispel the heat.
A kind of high-capacity LED radiator structure is provided among the patent ZL200420012318.3, and what this radiator structure adopted is to add the heat radiation case.This structure includes a housing pedestal, wherein has an accommodation space; The heat radiation case is arranged in the accommodation space of this housing pedestal, and has sealed radiator liquid in this heat radiation case up for safekeeping; The heat radiation case comprises an agitation system of stirring cooling fluid.Therefore the shared volume of this structure is big, has increased the production complexity, thereby has increased production cost.
Also have some common radiator structures to adopt light-emitting diode directly being added on the fin, fin is connected with pedestal again, reaches the purpose of heat radiation by fin.But the volume of fin in the market is certain, is restricted with regard to the overall volume that has determined LED to install, thereby has also increased production cost.
The utility model content
The purpose of this utility model has been to overcome the above-mentioned shortcoming of existing radiator structure, and a kind of heat abstractor of light-emitting diode is provided, this device improved light-emitting diode radiating efficiency, simplified installation procedure, reduced installation cost.
In order to realize function of the present utility model, a series of measures have been taked.This device mainly includes pedestal 1, is provided with the location notch 2 of jack 3, heat sink material 7; Wherein, location notch 2 is arranged on the end face of pedestal 1, and the shape of its shape and light-emitting diode adapts, and is used to place light-emitting diode, and heat sink material 7 spreads upon in the location notch 2 and with light-emitting diode and contacts fully.When light-emitting diode is connected with pedestal 1, directly the pin of light-emitting diode is inserted in the jack 3.
Also be with insulating case 4 in jack 3, situation is short-circuited when avoiding a plurality of light-emitting diodes to be arranged on same pedestal 1.
Pedestal 1 can be made arbitrary shape as required, is used for the installation of many LED.Pedestal 1 is made by the good material of conductive coefficient, especially can be made by metal material, as aluminum alloy materials.According to the thermal capacity formula: thermal capacity=quality * specific heat, pedestal 1 heat dissipation capacity is not less than the caloric value of LED wafer.
Because the encapsulation of LED has fin usually, thus do not use extra fin, heating panel, and the fin that makes LED itself directly with the location notch 2 of pedestal 1 on heat sink material 7 contact fully, improved radiating efficiency.Do not use extra fin, heating panel, improved the closeness that is installed in light-emitting diode on the pedestal 1 greatly, thus relative saving the space, reduced volume.
In location notch 2, scribble heat sink material 7, be in order to increase radiating effect, and in location notch 2, smear the mismachining tolerance that heat sink material 7 can also compensate location notch 2, thereby reduce the machining accuracy of location notch 2, further cut down finished cost.
The utility model mainly is to utilize location notch jack 3 that light-emitting diode directly is installed.The utility model has the advantages that: the fin of (1) LED itself directly with the location notch 2 of pedestal 1 on heat sink material 7 contact the radiating efficiency height fully; (2) do not use extra fin, heating panel, saved the space, reduced volume; (3) be provided with location notch, make it accurate location; (4) simplify installation procedure, reduce installation cost.
Description of drawings
Fig. 1 vertical view of the present utility model.
The profile of Fig. 2 the utility model embodiment.
Among the figure, 1, pedestal, 2, location notch, 3, jack, 4, insulating case, 5, Luxeon EmitterLED, 6, led pins, 7, heat sink material.
Embodiment
Embodiment of the present utility model is referring to Fig. 2, and this device mainly includes pedestal 1, location notch 2, jack 3, insulating case 4, heat sink material 7, and what the heat sink material in the present embodiment was selected for use is thermal paste.Wherein, described location notch 2 is used to place light-emitting diode at pedestal 1 end face; Location notch 2 is provided with jack 3; In jack 3, be with insulating case 4; In location notch 2, scribble thermal paste.
That the present embodiment light-emitting diode is selected for use is Luxeon Emitter LED 5.Luxeon EmitterLED 5 belongs to large-power light-emitting diodes, and wherein, Luxeon Emitter LED 5 is positioned over location notch 2 places that scribble thermal paste, and two pin 6 directly inserts the jack 3 that is with insulating case 4, and welding.
Described pedestal 1 can be made arbitrary shape as required, is used for the installation of many LED.And pedestal 1 is made by the good material of conductive coefficient, especially can be made by metal material, as aluminum alloy materials.
Described location notch 2 is positioned at pedestal 1 center, is used to place Luxeon Emitter LED 5, and its characteristics also are to be beforehand with what a location notch 2, can be in advance accurately to Luxeon Emitter LED 5 location.As street lamp, then 2 couples of Luxeon Emitter of location notch LED5 location need make that the luminous point of Luxeon Emitter LED 5 is concentric with the reflector focus as Luxeon Emitter LED 5.Luxeon Emitter LED 5 firmly is positioned on the pedestal 1, strengthens its accurate positioning and steadiness by above-mentioned location notch 2.In location notch 2, scribble thermal paste, be in order to increase radiating effect, and in location notch 2, smear the defective workmanship that thermal paste can also be mended flat location notch 2, and then reduce the technology difficulty of location notch 2.
Be positioned at the jack 3 on the pedestal 1, can determine according to the position of required Luxeon Emitter LED 5.
Because the encapsulation of Luxeon Emitter LED 5 has fin, so do not use extra fin, heating panel, Luxeon Emitter LED 5 fin own are directly contacted fully with the thermal paste of pedestal 1, improved radiating efficiency.Do not use extra fin, heating panel, improved the closeness that is installed in Luxeon Emitter LED 5 on the pedestal 1 greatly, thus relative saving the space, reduced volume.
Claims (2)
1, LED radiating device is characterized in that: this device mainly includes pedestal (1), is provided with the location notch (2) of jack (3); Wherein, location notch (2) is arranged on the end face of pedestal (1), the shape of its shape and light-emitting diode adapts, be used to place light-emitting diode, heat sink material (7) spreads upon location notch (2) and goes up and contact fully with light-emitting diode, light-emitting diode and pedestal (1) directly insert the pin of light-emitting diode in the jack (3) when being connected.
2, LED radiating device according to claim 1 is characterized in that: be with insulating case (4) in the described jack (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201163543U CN2901587Y (en) | 2006-05-26 | 2006-05-26 | Heat radiation device of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201163543U CN2901587Y (en) | 2006-05-26 | 2006-05-26 | Heat radiation device of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2901587Y true CN2901587Y (en) | 2007-05-16 |
Family
ID=38085751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201163543U Expired - Fee Related CN2901587Y (en) | 2006-05-26 | 2006-05-26 | Heat radiation device of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2901587Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794739A (en) * | 2010-03-22 | 2010-08-04 | 苏州华菲特陶科技有限公司 | Diode ceramic packaging template |
-
2006
- 2006-05-26 CN CNU2006201163543U patent/CN2901587Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794739A (en) * | 2010-03-22 | 2010-08-04 | 苏州华菲特陶科技有限公司 | Diode ceramic packaging template |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JINTIAN ENTERPRISE MANAGEMENT CENTER OF BEIJING UN Free format text: FORMER OWNER: BEIJING POLYTECHNIC UNIV. Effective date: 20090918 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090918 Address after: No. 100 Ping Park, Beijing, Chaoyang District: 100124 Patentee after: Beijing Gongda Jintian enterprise management center Address before: No. 100 Ping Park, Beijing, Chaoyang District: 100022 Patentee before: Beijing University of Technology |
|
| ASS | Succession or assignment of patent right |
Owner name: BEIJING YITAI JINTIAN OPTO-ELECTRONIC TECHNOLOGY C Free format text: FORMER OWNER: BEIJING UNIVERSITY OF TECHNOLOGY JINTIAN ENTERPRISE MANAGEMENT CENTER Effective date: 20101008 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100124 NO.100, PINGYUEYUAN, CHAOYANG DISTRICT, BEIJING TO: 100089 2/F, NO.4, BEIWA ROAD, HAIDIAN DISTRICT, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20101008 Address after: 100089, Beijing, Haidian District, 4 North wa Road, two floor Patentee after: Beijing Yitai Jintian Photoelectric Technology Co., Ltd. Address before: 100124 Chaoyang District, Beijing Ping Park, No. 100 Patentee before: Beijing Gongda Jintian enterprise management center |
|
| ASS | Succession or assignment of patent right |
Owner name: BEIJING BJUT INVESTMENT MANAGEMENT CO., LTD. Free format text: FORMER OWNER: BEIJING YITAI JINTIAN PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20150204 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100089 HAIDIAN, BEIJING TO: 100124 CHAOYANG, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150204 Address after: 100124 Chaoyang District, Beijing Ping Park, No. 100 Patentee after: Beijing North tech Cci Capital Ltd Address before: 100089, Beijing, Haidian District, 4 North wa Road, two floor Patentee before: Beijing Yitai Jintian Photoelectric Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070516 Termination date: 20150526 |
|
| EXPY | Termination of patent right or utility model |