CN219079637U

CN219079637U - Temperature adjusting device, evaporation source and evaporation device for quantum dot light emitting device

Info

Publication number: CN219079637U
Application number: CN202223253265.1U
Authority: CN
Inventors: 张成杰
Original assignee: Guangdong Juhua New Display Research Institute; TCL Technology Group Co Ltd
Current assignee: Guangdong Juhua New Display Research Institute; TCL Technology Group Co Ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-05-26
Anticipated expiration: 2032-12-02

Abstract

The application provides a temperature adjusting device, an evaporation source and a vapor deposition device for a quantum dot light emitting device. The accommodating groove for accommodating the evaporation assembly is formed in the surface of the shell, and the inner cavity of the shell surrounds the evaporation assembly, so that when the evaporation assembly is placed in the accommodating groove, the evaporation assembly can quickly exchange heat with a medium in the inner cavity of the shell. In addition, an extraction opening and a heat exchange opening are formed in the shell, and the air in the inner cavity is extracted through the vacuumizing assembly, so that the inner cavity is kept in a vacuum state, namely, a vacuum heat preservation layer is formed around the evaporating assembly, heat dissipation is greatly reduced, and the evaporating assembly is beneficial to keeping the temperature of the evaporating assembly so as to improve the evaporation efficiency of the evaporating assembly; and a large amount of gas is sent into the inner cavity through the air supply assembly, so that the evaporation assembly can perform heat exchange with the gas in the inner cavity to quickly cool down, and the maintenance waiting time is reduced.

Description

Temperature adjusting device, evaporation source and evaporation device for quantum dot light emitting device

Technical Field

The application relates to the technical field of vacuum evaporation, in particular to a temperature adjusting device, an evaporation source and an evaporation device for a quantum dot light emitting device.

Background

In the vacuum evaporation process of preparing an OLED display panel, an evaporator is often used, and the evaporator includes a vacuum cavity, and an evaporation tray, an evaporation source and other components mounted in the cavity; among them, a glass substrate to be vapor-deposited is usually mounted on a vapor deposition tray, and an evaporation source is used to heat and evaporate a vapor deposition material.

The evaporation source needs to keep higher self temperature in the use process so as to avoid the temperature reduction and condensation of evaporation materials in the evaporation source; in addition, after the evaporation source is used for a certain time, the evaporation source needs to be maintained, and then the evaporation source needs to be rapidly cooled so as to shorten the maintenance waiting time of technicians.

A temperature adjusting device can be arranged for the evaporation source to adjust the temperature of the evaporation source, but the current temperature adjusting device has single function and low adjusting efficiency for the temperature of the evaporation source.

Disclosure of Invention

The application provides a temperature regulating device, evaporation source and be used for quantum dot light emitting device's evaporation device to solve among the prior art to the low technical problem of temperature regulation inefficiency of evaporation source.

In one aspect, the present application provides a temperature adjustment device for adjusting the temperature of an evaporation assembly, comprising:

the shell is provided with an accommodating groove on the outer surface, the accommodating groove is used for accommodating the evaporation component, an inner cavity of the shell is arranged around the accommodating groove, and the shell is also provided with an air extraction opening and a heat exchange opening which are communicated with the inner cavity;

the vacuumizing assembly is communicated with the air extraction opening and is used for extracting the air in the inner cavity;

and the air supply assembly is communicated with the heat exchange port and is used for supplying air into the inner cavity.

In one possible implementation manner of the present application, the casing is further provided with an air outlet communicated with the inner cavity, and an air outlet valve is arranged at the air outlet.

In one possible implementation of the present application, the extraction opening, and/or the heat exchange opening, and/or the air outlet are/is arranged adjacently on the same side surface of the housing.

In one possible implementation manner of the present application, a plurality of baffles are arranged in the inner cavity, and the inner cavity is divided by the plurality of baffles to form an S-shaped circuitous heat exchange flow channel.

In one possible implementation of the present application, the heat exchange flow channel includes at least two sub flow channels arranged in parallel.

In one possible implementation manner of the present application, a plurality of micropores are arranged on the baffle at intervals.

In one possible implementation manner of the present application, the temperature adjusting device further includes a heat exchanger, the heat exchanger is disposed on the flow path of the air supply assembly communicated with the heat exchange port, and the heat exchanger is used for adjusting the temperature of the air flow sent into the inner cavity by the air supply assembly.

In one possible implementation manner of the present application, a temperature detector is disposed in the inner cavity, and is used for detecting a temperature value in the inner cavity, and the temperature detector is electrically connected with the air supply assembly and the heat exchanger;

the air supply assembly is used for adjusting the air supply quantity according to the temperature value, and/or the heat exchanger is used for adjusting the heat exchange power according to the temperature value.

On the other hand, the application also provides an evaporation source, which comprises a plurality of evaporation assemblies and the temperature regulating device, wherein a plurality of accommodating grooves are formed on the shell, wiring through holes penetrating through the shell are further formed at the bottoms of the accommodating grooves, and the wiring through holes are mutually isolated from the inner cavity;

the evaporation assembly comprises a crucible, a heating assembly and a nozzle, wherein one crucible is respectively placed in each of the accommodating grooves, a heating source of the heating assembly is arranged around the crucible, a power line of the heating assembly penetrates through the wiring through hole, and the nozzle is arranged on the crucible.

On the other hand, the application still provides a vapor deposition device, vapor deposition device includes evaporation cavity, evaporation tray and above-mentioned evaporation source, the evaporation cavity cover is established on the evaporation source, just a plurality of evaporation source the nozzle is located in the evaporation cavity, the evaporation tray is installed in the evaporation cavity and be located the top of evaporation source, the evaporation tray is used for fixed glass substrate.

The application provides a temperature regulating device, evaporation source and be used for evaporation device of quantum dot light emitting device, through offer the storage tank that is used for placing evaporation module at the surface of casing, and the inner chamber of casing encircles evaporation module and arranges for when evaporation module places in the storage tank, evaporation module can carry out heat exchange with the medium in the inner chamber of casing fast. In addition, an extraction opening and a heat exchange opening are formed in the shell, and the air in the inner cavity is extracted through the vacuumizing assembly, so that the inner cavity is kept in a vacuum state, namely, a vacuum heat preservation layer is formed around the evaporating assembly, heat dissipation is greatly reduced, and the evaporating assembly is beneficial to keeping the temperature of the evaporating assembly so as to improve the evaporation efficiency of the evaporating assembly; and a large amount of gas is sent into the inner cavity through the air supply assembly, so that the evaporation assembly can perform heat exchange with the gas in the inner cavity to quickly cool down, and the maintenance waiting time is reduced.

Drawings

Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an evaporation device according to an embodiment of the present disclosure;

fig. 2 is a front view of an evaporation source provided in an embodiment of the present application;

fig. 3 is a top view of a housing provided in an embodiment of the present application.

Reference numerals:

the vapor deposition apparatus 100, the vapor deposition chamber 200, the vapor deposition tray 300, the evaporation source 400, the temperature adjustment apparatus 500, the case 510, the inner chamber 511, the accommodation groove 512, the pumping port 513, the vacuum valve 514, the heat exchange port 515, the air intake valve 516, the air outlet 517, the air outlet 518, the wiring through hole 519, the baffle 520, the vacuumizing module 600, the air supply module 700, the evaporation module 800, the crucible 810, the heating module 820, the heating source 821, the power line 822, and the nozzle 830.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

Referring to fig. 1 to 3, an embodiment of the present application provides a temperature adjusting device 500 for adjusting a temperature of an evaporation assembly 800, including:

the shell 510, there is a holding groove 512 formed on the outer surface of the shell 510, the holding groove 512 is used for holding the evaporating assembly 800, the inner cavity 511 of the shell 510 is arranged around the holding groove 512, there are also pumping ports 513 and heat exchange ports 515 on the shell 510, which are communicated with the inner cavity 511;

the vacuumizing assembly 600, the vacuumizing assembly 600 is communicated with the air extracting opening 513, and the vacuumizing assembly 600 is used for extracting the air in the inner cavity 511;

and the air supply assembly 700, the air supply assembly 700 is communicated with the heat exchange port 515, and the air supply assembly 700 is used for supplying air into the inner cavity 511.

The evaporation module 800 is configured to heat and evaporate the evaporation material, and the evaporation material is usually an organic substance, and is placed in the evaporation module 800.

By providing the accommodating groove 512 on the surface of the housing 510 for accommodating the evaporation assembly 800, and disposing the inner cavity 511 of the housing 510 around the evaporation assembly 800, the evaporation assembly 800 can quickly exchange heat with the medium in the inner cavity 511 of the housing 510 when the evaporation assembly 800 is placed in the accommodating groove 512. In addition, the casing 510 is provided with an air extraction opening 513 and a heat exchange opening 515, and the air in the inner cavity 511 is extracted by the vacuum-extraction assembly 600, so that the inner cavity 511 is kept in a vacuum state, namely, a vacuum heat-insulating layer is formed around the evaporation assembly 800, heat dissipation is greatly reduced, and the evaporation assembly 800 is beneficial to keeping the temperature of the evaporation assembly 800 so as to improve the evaporation efficiency of the evaporation assembly 800; by providing the air supply assembly 700 to supply a large amount of air into the inner cavity 511, the evaporation assembly 800 can exchange heat with the air in the inner cavity 511 to quickly cool down, thereby reducing maintenance waiting time.

In particular, when it is desired to preserve heat from the evaporation module 800, the vacuum module 600 is activated and the air supply module 700 is turned off; when rapid cooling of the evaporation module 800 is required, the air supply module 700 and the vacuum pumping module 600 are activated. In order to ensure the cooling effect on the evaporation assembly 800, the air extraction opening 513 and the heat exchange opening 515 may be disposed at two ends of the housing 510 that are farthest from each other, which can ensure that the air sent into the inner cavity 511 of the housing 510 by the air supply assembly 700 exchanges heat with the evaporation assembly 800, thereby improving the heat exchange efficiency of the temperature adjusting device 500.

In particular, the evacuation assembly 600 may be a vacuum pump; the air supply assembly 700 may be a centrifugal fan.

Specifically, the evaporation module 800 is generally cylindrical, and the accommodating groove 512 is correspondingly cylindrical and matched with the evaporation module 800.

In some embodiments, the casing 510 is further provided with an air outlet 517 that communicates with the inner cavity 511, and an air outlet valve 518 is provided at the air outlet 517.

It will be appreciated that when the evaporation module 800 needs to be quickly cooled, the vacuumizing module 600 needs to be started to enable the air flow in the housing 510 to flow smoothly, but the opening of the vacuumizing module 600 and the air supply module 700 increases the energy consumption of the temperature adjusting device 500, which increases the use cost of the temperature adjusting device 500.

By providing the air outlet 517 on the housing 510 and providing the air outlet 518 at the air outlet 517, the air outlet 518 is used for opening or closing the air outlet 517; when the evaporation assembly 800 needs to be quickly cooled, the air flow can flow from the heat exchange port 515 to the air outlet 517 through the inner cavity 511 by only opening the air supply assembly 700 and the air outlet valve 518, and finally flows out of the air outlet 517, so that the air flow can smoothly flow in the housing 510 without opening the vacuumizing assembly 600, which reduces the energy consumption of the temperature adjusting device 500.

Further, in other embodiments, a vacuum valve 514 may be provided at the suction opening 513 and/or an air intake valve 516 may be provided at the heat exchange opening 515, without limitation.

In some embodiments, the extraction opening 513, and/or the heat exchange opening 515, and/or the air outlet 517 are disposed adjacent to one another on the same side surface of the housing 510.

The nozzles adjacently arranged on the same side can facilitate the connection of pipelines and the installation of valves by experimenters, and improve the assembly and maintenance efficiency of the temperature adjusting device 500.

Further, in other embodiments, the heat exchange port 515 and the air outlet 517 may be disposed at the ends of the housing 510 that are furthest apart, which may ensure that the air fed into the cavity 511 of the housing 510 by the air supply assembly 700 exchanges heat with the evaporation assembly 800 sufficiently, thereby improving the heat exchange efficiency of the temperature adjustment device 500.

In some embodiments, a plurality of baffles 520 are disposed within the interior cavity 511, the plurality of baffles 520 dividing the interior cavity 511 into S-shaped serpentine heat exchange flow passages.

The through-flow cross section is a cross section perpendicular to the flow direction of the liquid, and is also referred to as an over-flow cross section. The size of the area is positively correlated to the flow rate of the liquid through the pipeline. In addition, the flow rate is equal to the flow divided by the cross-sectional area of the through flow.

It can be appreciated that when the air supply assembly 700 is turned on to supply air into the inner cavity 511 of the housing 510, the air flow rate may be rapidly reduced due to the large expansion of the instantaneous through-flow cross-sectional area of the air entering the inner cavity 511 of the housing 510 through the heat exchange port 515, and the air is not constrained in the inner cavity 511 to flow around easily, which reduces the air flow rate and air flow rate near the accommodating groove 512, thereby reducing the temperature adjusting efficiency of the temperature adjusting device 500 on the evaporation assembly 800.

By arranging the plurality of baffles 520 to cooperate in the housing 510 to form an S-shaped heat exchange flow channel, on one hand, the through-flow cross-sectional areas of all the heat exchange flow channel are approximately similar, so that all the gas can flow through the heat exchange flow channel at a relatively stable flow rate, and the heat absorption of the evaporation assembly 800 by the temperature regulating device 500 is improved; on the other hand, the S-shaped heat exchanging channels can prolong the time for the gas to flow through the area near the accommodating groove 512, and improve the heat exchanging efficiency of the temperature adjusting device 500.

In some embodiments, the heat exchange flow path includes at least two sub-flow paths arranged in parallel.

It will be appreciated that, since the air supply assembly 700 generally sucks air from the external atmosphere and then sends the air into the inner cavity 511 of the housing 510 through the heat exchange port 515, when the external environment is severe, the air supply assembly 700 may send impurities or dust particles into the heat exchange flow channel, and some of the impurities or dust particles may be adsorbed on the baffle 520, which may cause blockage of the heat exchange flow channel after long-term use.

Through separating the heat exchange flow channel so as to form at least two mutually independent sub flow channels, when one of the sub flow channels is blocked, the other sub flow channel which is arranged in parallel can also supply gas to flow, thereby ensuring the normal operation of the heat exchange flow channel and improving the reliability of the temperature regulating device 500.

In some embodiments, a filter screen (not shown) is also provided at the heat exchange port 515. It can filter impurity or dust particle that gets into in the casing 510 inner chamber 511, effectively avoided the jam of heat transfer runner.

In some embodiments, the baffle 520 has a plurality of micro-holes (not shown) spaced apart thereon.

It will be appreciated that as the air supply assembly 700 supplies air into the heat exchange flow path, a portion of the high velocity air flow will impinge upon the baffle 520 immediately after it passes through the heat exchange port 515 and during the turn around in the heat exchange flow path, which may cause significant aerodynamic noise and wind loss.

By disposing a plurality of micro-holes on the baffle 520, the air flow striking the baffle 520 can flow through the micro-holes, and the air flow flowing through the micro-holes can also form a gas protection layer on the surface of the baffle 520; it effectively prevents the gas from directly striking the baffle 520, thereby reducing pneumatic noise and reducing air loss, thereby improving the heat exchange efficiency of the temperature adjusting device 500.

Preferably, the diameter of the micropores may range from 1 to 3mm.

Specifically, a plurality of micro-holes are arranged on the baffle 520 in an array manner, and the distance between two adjacent micro-holes is 10-20 mm.

The array arrangement may be a linear array, a rectangular array, a circular array, or the like, and is not limited thereto.

In some embodiments, the temperature adjustment device 500 further includes a heat exchanger (not shown) disposed in the flow path of the air supply assembly 700 that communicates with the heat exchange port 515, the heat exchanger being configured to adjust the temperature of the air flow supplied into the interior 511 by the air supply assembly 700.

It will be appreciated that in summer, when the external environment temperature is higher, the temperature of the air flow sent by the air supply assembly 700 is also higher, which may prolong the cooling time of the evaporating assembly 800 by the temperature adjusting device 500.

By providing a heat exchanger, it is possible to rapidly cool the air flow into the interior cavity 511, thereby reducing the cooling time of the evaporation assembly 800 to reduce the maintenance waiting time of the evaporation assembly 800.

In some embodiments, a temperature detector (not shown) is disposed in the inner cavity 511, the temperature detector is configured to detect a temperature value in the inner cavity 511, and the temperature detector is electrically connected to the air supply assembly 700 and the heat exchanger;

the air supply assembly 700 is used for adjusting the air supply amount according to the temperature value, and/or the heat exchanger is used for adjusting the heat exchange power according to the temperature value.

It will be appreciated that, since some of the components of the evaporation assembly 800 are made of metal, if the temperature of the gas introduced into the inner cavity 511 varies greatly, the surface temperature of the evaporation assembly 800 and the temperature of the gas in the heat exchange flow channel are greatly different, which may cause cracks on the surfaces of the components made of metal, thereby reducing the service life of the evaporation assembly 800.

By arranging the temperature detector in the inner cavity 511, the temperature variation in unit time in the inner cavity 511 can be obtained by calculation according to the detected temperature value in the inner cavity 511, and then the air supply assembly 700 and/or the heat exchanger can be adjusted to change the air supply quantity in the inner cavity 511 and/or the power of the heat exchanger so as to adjust the gas cooling speed of the inner cavity 511, so that the difference between the gas temperature in the inner cavity 511 and the surface temperature of the evaporation assembly 800 is kept in a safe interval, and the probability of generating cracks on the surfaces of parts in the evaporation assembly 800 can be reduced.

Alternatively, the difference between the temperature of the gas in the interior chamber 511 and the surface temperature of the vaporization assembly 800 may be maintained within a safe range of 10 ℃ to 50 ℃.

The application further provides an evaporation source 400, the evaporation source 400 comprises a plurality of evaporation assemblies 800 and the temperature adjusting device 500, a plurality of accommodating grooves 512 are formed on the shell 510, wiring through holes 519 penetrating through the shell 510 are further formed at the bottoms of the accommodating grooves 512, and the wiring through holes 519 are isolated from the inner cavity 511;

the evaporation module 800 includes a crucible 810, a heating module 820 and a nozzle 830, wherein one crucible 810 is respectively disposed in the plurality of receiving grooves 512, a heating source 821 of the heating module 820 is disposed around the crucible 810, a power line 822 of the heating module 820 is penetrated through the wiring through hole 519, and the nozzle 830 is mounted on the crucible 810. Since the evaporation source 400 has the temperature adjusting device 500, the present utility model is not described herein again.

By providing a power lead 822 to connect to the heating assembly 820, the power lead 822 can provide power to the heating assembly 820 to heat the crucible 810 when it is powered on; and a through-hole formed in the housing 510, a wiring through-hole 519, can accommodate the power line 822, which facilitates the arrangement of the power line 822.

Preferably, heating assembly 820 includes a heating source 821 and a power cord 822, heating source 821 being an electrical heating wire disposed around crucible 810 that provides for more uniform heating of crucible 810.

Preferably, a plurality of receiving grooves 512 are formed in the housing 510 in a linear arrangement, i.e., the evaporation source 400 is a linear evaporation source 400.

The application also provides a vapor deposition device 100 for quantum dot light emitting device, the vapor deposition device 100 includes the evaporation chamber 200, the evaporation tray 300 and the evaporation source 400 described above, and evaporation chamber 200 covers and establishes on evaporation source 400, and a plurality of nozzles 830 of evaporation source 400 are located the evaporation chamber 200, and the evaporation tray 300 is installed in evaporation chamber 200 and is located the top of evaporation source 400, and the evaporation tray 300 is used for fixed glass substrate. Since the evaporation device 100 has the evaporation source 400, the evaporation device has the same advantageous effects, and the present utility model is not described herein.

It should be noted that the vapor deposition apparatus 100 provided in the present application is particularly suitable for preparing a quantum dot light emitting device.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

The above describes in detail a temperature adjusting device 500, an evaporation source 400 and a vapor deposition device 100 provided in the embodiments of the present application, and specific examples are applied herein to illustrate the principles and embodiments of the present application, where the descriptions of the above examples are only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A temperature regulating device for regulating the temperature of an evaporation assembly, comprising:

2. The temperature regulating device of claim 1, wherein the housing is further provided with an air outlet communicating with the inner cavity, and an air outlet valve is arranged at the air outlet.

3. Temperature regulating device according to claim 2, wherein the extraction opening, and/or the heat exchange opening, and/or the air outlet opening are arranged adjacently on the same side surface of the housing.

4. The temperature regulating device of claim 2, wherein a plurality of baffles are disposed in said interior chamber, said plurality of baffles dividing said interior chamber into a serpentine heat exchange flow path.

5. The thermostat of claim 4 wherein the heat exchange flow path includes at least two sub-flow paths arranged in parallel.

6. The temperature-regulating device as claimed in claim 4, wherein the baffle plate is provided with a plurality of micro-holes at intervals.

7. The thermostat of any one of claims 1-6, further comprising a heat exchanger disposed in a flow path of the air supply assembly that communicates with the heat exchange port, the heat exchanger for regulating a temperature of an air flow from the air supply assembly into the interior cavity.

8. The thermostat of claim 7 wherein a temperature detector is disposed within said interior cavity, said temperature detector for detecting a temperature value within said interior cavity, said temperature detector electrically connecting said air supply assembly and said heat exchanger;

9. An evaporation source, characterized in that the evaporation source comprises a plurality of evaporation components and the temperature regulating device according to any one of claims 1-8, a plurality of accommodating grooves are formed on the shell, wiring through holes penetrating through the shell are further formed at the bottoms of the accommodating grooves, and the wiring through holes are mutually isolated from the inner cavity;

10. An evaporation device for a quantum dot light emitting device, comprising an evaporation chamber, an evaporation tray and the evaporation source of claim 9, wherein the evaporation chamber is covered on the evaporation source, a plurality of nozzles of the evaporation source are located in the evaporation chamber, the evaporation tray is installed in the evaporation chamber and above the evaporation source, and the evaporation tray is used for fixing a glass substrate.