CN117239517A - Cooling system and laser - Google Patents
Cooling system and laser Download PDFInfo
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- CN117239517A CN117239517A CN202311274322.0A CN202311274322A CN117239517A CN 117239517 A CN117239517 A CN 117239517A CN 202311274322 A CN202311274322 A CN 202311274322A CN 117239517 A CN117239517 A CN 117239517A
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- cooling
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- 238000001816 cooling Methods 0.000 title claims abstract description 287
- 239000002826 coolant Substances 0.000 claims abstract description 92
- 238000004891 communication Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 238000005086 pumping Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000007710 freezing Methods 0.000 description 3
- 230000008014 freezing Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- AEDZKIACDBYJLQ-UHFFFAOYSA-N ethane-1,2-diol;hydrate Chemical compound O.OCCO AEDZKIACDBYJLQ-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QMYDVDBERNLWKB-UHFFFAOYSA-N propane-1,2-diol;hydrate Chemical compound O.CC(O)CO QMYDVDBERNLWKB-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a cooling system and a laser, wherein the cooling system comprises a shell, a fan, a mounting seat, a condenser and a cooling assembly, and the shell comprises a cooling air duct; the fan is connected with the shell and is used for providing air flow into the cooling air duct so that the air flow in the cooling air duct flows from the inlet to the outlet of the cooling air duct; the mounting seat is connected with the shell and positioned in the cooling air duct, and a first cooling flow passage is arranged in the mounting seat; the condenser is connected with the shell and positioned in the cooling air duct, and a second cooling flow passage is arranged in the condenser; the outlet of the cooling component is communicated with the inlets of the first cooling flow channel and the second cooling flow channel, and the cooling component is used for providing cooling medium for the first cooling flow channel and the second cooling flow channel, and the temperature of the cooling medium entering the first cooling flow channel is higher than that of the cooling medium entering the second cooling flow channel. The cooling system provided by the embodiment of the application can cool the mounting seat and the condenser, simultaneously dry the cooling air duct and has lower power consumption of the cooling component.
Description
Technical Field
The application relates to the technical field of lasers, in particular to a cooling system and a laser.
Background
The high-power fiber laser core device is a pumping source, an ytterbium-doped fiber, an electrical control device and the like, wherein the photoelectric conversion efficiency and the service life of the pumping source directly determine the photoelectric conversion efficiency and the service life of the fiber laser, in order to improve the photoelectric conversion efficiency and the service life of the pumping source, the pumping source is usually cooled by a cooling system, and moisture in air is removed, so that the pumping source is prevented from being cooled by the cooling system, condensed water is generated to the pumping source, and the service life of the pumping source is further influenced. However, in the prior art, the cooling system requires a large power consumption for forming condensed water from moisture in the air.
Disclosure of Invention
The embodiment of the application provides a cooling system and a laser, which aim to solve the problem of high power consumption required by the cooling system for forming condensed water from moisture in air.
An embodiment of the present application provides a cooling system including:
a housing including a cooling air duct;
the fan is connected with the shell and is used for providing air flow into the cooling air duct so that the air flow in the cooling air duct flows from the inlet to the outlet of the cooling air duct;
the mounting seat is connected with the shell and positioned in the cooling air duct, and a first cooling flow passage is arranged in the mounting seat;
the condenser is connected with the shell and positioned in the cooling air duct, and a second cooling flow passage is arranged in the condenser;
and the outlet of the cooling assembly is communicated with the inlets of the first cooling flow channel and the second cooling flow channel, and the cooling assembly is used for providing cooling medium for the first cooling flow channel and the second cooling flow channel, and the temperature of the cooling medium entering the first cooling flow channel is higher than that of the cooling medium entering the second cooling flow channel.
In some embodiments, the cooling assembly includes a cooling medium supply member, a first cooling member, and a second cooling member, an outlet of the cooling medium supply member being in communication with an inlet of the first cooling flow channel and an inlet of the second cooling flow channel to provide the cooling medium to the first cooling flow channel and the second cooling flow channel;
the first cooling part is used for cooling the cooling medium in the cooling medium supply part, and the second cooling part is used for cooling the cooling medium between the cooling medium supply part and the inlet of the second cooling flow channel, so that the temperature of the cooling medium entering the first cooling flow channel is higher than the temperature of the cooling medium entering the second cooling flow channel.
In some embodiments, the cooling medium supply means comprises a first container, a second container, and a circulation pump disposed within the first container, the first container and the second container for containing the cooling medium, an outlet of the circulation pump being in communication with an inlet of the first cooling flow channel and the second container, an outlet of the second container being in communication with an inlet of the second cooling flow channel;
the first cooling component comprises a first heat exchanger arranged in the first container, and the first heat exchanger is used for cooling a cooling medium in the first container; the second cooling component comprises a second heat exchanger arranged in the second container, and the second heat exchanger is used for cooling the cooling medium in the second container.
In some embodiments, the inlet of the first container communicates with the outlet of the first cooling flow channel and the outlet of the second cooling flow channel.
In some embodiments, the mounting seat and the condenser are distributed in sequence along the direction from the inlet to the outlet of the cooling air duct; or,
the condenser and the mounting seat are distributed in sequence along the direction from the inlet to the outlet of the cooling air duct.
In some embodiments, the housing further comprises a return air duct, an inlet of the return air duct being in communication with an outlet of the cooling air duct, the outlet of the return air duct being in communication with the inlet of the cooling air duct to form an enclosed space.
In some embodiments, the fan is disposed at an inlet of the cooling duct; the cooling air duct extends along the up-down direction, the fan is positioned above the mounting seat, and the condenser is positioned below the mounting seat; alternatively, the fan is located above the condenser, and the mount is located below the condenser.
In some embodiments, the return air duct is disposed circumferentially of the cooling air duct.
In some embodiments, the cooling air duct extends laterally.
The embodiment of the application also provides a laser, which comprises:
a pump source;
a cooling system, the cooling system being as described above, the cooling system comprising:
a housing including a cooling air duct;
the fan is connected with the shell and is used for providing air flow into the cooling air duct so that the air flow in the cooling air duct flows from the inlet to the outlet of the cooling air duct;
the mounting seat is connected with the shell and positioned in the cooling air duct, a first cooling flow passage is arranged in the mounting seat, and the pumping source is mounted on the mounting seat of the cooling system;
the condenser is connected with the shell and positioned in the cooling air duct, and a second cooling flow passage is arranged in the condenser;
and the outlet of the cooling assembly is communicated with the inlets of the first cooling flow channel and the second cooling flow channel, and the cooling assembly is used for providing cooling medium for the first cooling flow channel and the second cooling flow channel, and the temperature of the cooling medium entering the first cooling flow channel is higher than that of the cooling medium entering the second cooling flow channel.
According to the cooling system provided by the embodiment of the application, the mounting seat and the condenser are arranged in the cooling air duct of the shell, the air flow is provided for the cooling air duct through the fan, so that the air flow in the cooling air duct flows from the inlet to the outlet of the cooling air duct, the cooling medium is provided for the first cooling flow channel of the mounting seat and the second cooling flow channel of the condenser through the cooling component, the temperature of the cooling medium entering the first cooling flow channel is higher than that of the cooling medium entering the second cooling flow channel, and therefore, the mounting seat and the condenser are cooled, the temperature of the condenser is lower, condensed water is formed on the surface of the condenser more conveniently, the cooling air duct is dried, and the power consumption of the cooling component is lower.
Drawings
The technical solution and other advantageous effects of the present application will be made apparent by the following detailed description of the specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an embodiment of a cooling system according to an embodiment of the present application.
A cooling system 100; a housing 110; a cooling air duct 111; a return air duct 112; a fan 120; a mounting base 130; a first cooling flow passage 131; a condenser 140; fins 141; a connection pipe 142; a second cooling flow path 143; a cooling assembly 150; a cooling medium supply part 151; a first container 152; a second container 153; a first heat exchanger 155; a second heat exchanger 156; the device 200 is to be cooled.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The embodiment of the application provides a cooling system and a laser. The following will describe in detail.
First, an embodiment of the present application provides a cooling system.
Fig. 1 is a schematic structural diagram of an embodiment of a cooling system according to an embodiment of the present application. As shown in fig. 1, the cooling system 100 includes a mount 130 and a cooling assembly 150, the mount 130 for mounting a device 200 to be cooled. The device 200 to be cooled may be a pump source of a laser or other component requiring heat dissipation. Of course, the cooling system 100 may also be used in other devices other than lasers to cool and dissipate heat of the device 200 to be cooled of the other devices.
The cooling assembly 150 is connected with the mounting seat 130 to cool the mounting seat 130, and further cool and dissipate heat of the device 200 to be cooled mounted on the mounting seat 130. The mounting base 130 is provided with a first cooling flow passage 131 therein. The outlet of the cooling assembly 150 is communicated with the inlet of the first cooling flow channel 131, and the cooling assembly 150 is used for providing cooling medium for the first cooling flow channel 131, and exchanging heat with the mounting seat 130 through the cooling medium so as to realize cooling and heat dissipation of the mounting seat 130.
Wherein the cooling assembly 150 includes a cooling medium supply part 151 and a first cooling part, an outlet of the cooling medium supply part 151 communicates with an inlet of the first cooling flow passage 131 to supply the cooling medium to the first cooling flow passage 131. The first cooling component is configured to cool the cooling medium in the cooling medium supply component 151, thereby reducing the temperature of the cooling medium, and making the cooling medium entering the first cooling flow channel 131 of the mounting seat 130 have a higher temperature difference from the mounting seat 130, so as to improve the cooling and heat dissipation effects of the cooling medium on the mounting seat 130.
Specifically, the cooling medium supply part 151 includes a first container 152 and a circulation pump (not shown in the drawing) provided in the first container 152, the first container 152 being for accommodating the cooling medium, and an outlet of the circulation pump being in communication with the first cooling flow passage 131 of the mount 130. The first cooling means comprises a first heat exchanger 155 provided in the first container 152, the first heat exchanger 155 being adapted to cool the cooling medium in the first container 152.
Accordingly, the temperature of the cooling medium in the first container 152 can be reduced by exchanging heat with the cooling medium in the first container 152 by the first heat exchanger 155, and then the cooled cooling medium is pumped into the first cooling flow passage 131 of the mount 130 by the first heat exchanger 155 to cool and dissipate heat from the mount 130.
The cooling medium may be a low freezing point cooling medium to avoid freezing due to too low a temperature of the cooling medium. Wherein the freezing point of the cooling medium can be made smaller than 0 ℃, concretely, for example: ethylene glycol-water, propylene glycol-water, and the like.
As shown in fig. 1, the inlet of the first container 152 communicates with the outlet of the first cooling flow passage 131 to realize the recycling of the cooling medium.
In some embodiments, the cooling system 100 further includes a housing 110, a fan 120, and a condenser 140, the housing 110 including a cooling air duct 111. The fan 120 is connected to the housing 110, and the fan 120 is configured to provide an airflow into the cooling air duct 111, so that the airflow in the cooling air duct 111 flows from the inlet to the outlet of the cooling air duct 111. The fan 120 may be disposed at an inlet of the cooling air duct 111, and the fan 120 may blow air into the cooling air duct 111, so that air flow in the cooling air duct 111 flows from the inlet to the outlet of the cooling air duct 111. The fan 120 may be disposed at the outlet of the cooling air duct 111, and the fan 120 may suck air into the cooling air duct 111 to cause air flow in the cooling air duct 111 to flow from the inlet to the outlet of the cooling air duct 111.
The mounting seat 130 and the condenser 140 are respectively connected with the shell 110 and positioned in the cooling air duct 111, the cooling assembly 150 is connected with the condenser 140 to cool down the condenser 140, so that water vapor in the air in the cooling air duct 111 is condensed on the surface of the condenser 140 to form condensed water, and the drying treatment of the air in the cooling air duct 111 is realized.
Wherein, the condenser 140 is provided therein with a second cooling flow path 143. The outlet of the cooling assembly 150 communicates with the inlet of the second cooling flow passage 143 of the condenser 140, thereby supplying the cooling medium to the second cooling flow passage 143 of the condenser 140. The cooling medium entering the second cooling flow channel 143 is used for cooling the condenser 140, so that the temperature of the condenser 140 is reduced, and water vapor in the air in the cooling air duct 111 is condensed on the surface of the condenser 140 to form condensed water.
In some embodiments, the temperature of the cooling medium entering the first cooling flow channel 131 is greater than the temperature of the cooling medium entering the second cooling flow channel 143, so that the temperature of the condenser 140 is lower than the temperature of the mounting base 130, which is more advantageous for forming condensed water on the surface of the condenser 140.
According to the cooling system 100 provided by the embodiment of the application, the mounting seat 130 and the condenser 140 are arranged in the cooling air duct 111 of the shell 110, the air flow in the cooling air duct 111 is provided to the cooling air duct 111 through the fan 120, so that the air flow in the cooling air duct 111 flows from the inlet to the outlet of the cooling air duct 111, the cooling medium is provided to the first cooling flow channel 131 of the mounting seat 130 and the second cooling flow channel 143 of the condenser 140 through the cooling assembly 150, the temperature of the cooling medium entering the first cooling flow channel 131 is higher than that of the cooling medium entering the second cooling flow channel 143, and therefore, the temperature of the condenser 140 is lower while the mounting seat 130 and the condenser 140 are cooled, condensed water is formed on the surface of the condenser 140 more favorably, the cooling air duct 111 is dried, and the power consumption of the cooling assembly 150 is lower.
As shown in fig. 1, the outlet of the cooling medium supply part 151 communicates with the inlet of the first cooling flow passage 131 and the inlet of the second cooling flow passage 143 to supply the cooling medium to the first cooling flow passage 131 and the second cooling flow passage 143. In some embodiments, the cooling assembly 150 further includes a second cooling part for cooling the cooling medium in the cooling medium supply part 151 such that the cooling medium supplied from the cooling medium supply part 151 to the first cooling flow passage 131 of the mount 130 and the second cooling flow passage 143 of the condenser 140 has a lower temperature.
The second cooling member is for cooling the cooling medium between the cooling medium supply member 151 and the inlet of the second cooling flow passage 143, thereby further reducing the temperature of the cooling medium supplied from the cooling medium supply member 151 to the second cooling flow passage 143 of the condenser 140 so that the temperature of the cooling medium entering the first cooling flow passage 131 is greater than the temperature of the cooling medium entering the second cooling flow passage 143.
Specifically, the cooling medium supply part 151 further includes a second container 153 for containing the cooling medium, an outlet of the circulation pump communicates with the first cooling flow passage 131 and an inlet of the second container 153, and an outlet of the second container 153 communicates with an inlet of the second cooling flow passage 143. The second cooling means includes a second heat exchanger 156 provided in the second container 153, and the second heat exchanger 156 is used for cooling the cooling medium in the second container 153.
Thereby, the cooling medium in the first container 152 can be pumped into the second container 153 by the circulation pump, and then heat exchange is performed with the cooling medium through the second heat exchanger 156 in the second container 153 to further lower the temperature of the cooling medium in the second container 153, and then the cooling medium in the second container 153 is introduced into the second cooling flow path 143 of the condenser 140, thereby realizing that the temperature of the cooling medium introduced into the first cooling flow path 131 is higher than the temperature of the cooling medium introduced into the second cooling flow path 143.
As shown in fig. 1, the inlet of the first container 152 communicates with the outlet of the first cooling flow path 131 and the outlet of the second cooling flow path 143, thereby achieving the recycling of the cooling medium.
In some embodiments, as shown in fig. 1, the mounting base 130 and the condenser 140 are sequentially distributed along the inlet-to-outlet direction of the cooling air duct 111. It can be understood that, since the mounting base 130 needs to cool the device 200 to be cooled, the temperatures of the mounting base 130 and the device 200 to be cooled are higher, the temperature of the air in the cooling air duct 111 passing through the mounting base 130 and the device 200 to be cooled is higher, and when the air with higher temperature passes through the condenser 140 with lower temperature, the water vapor in the air can be quickly condensed to form condensed water.
Specifically, the fan 120 is provided at the inlet of the cooling air duct 111. The cooling air duct 111 extends in the up-down direction. The fan 120 is located above the mount 130, and the condenser 140 is located below the mount 130. Therefore, the fans 120, the mounting seats 130 and the condensers 140 are sequentially distributed along the direction from the inlet to the outlet of the cooling air duct 111, the air outlet of the fans 120 is downward, the air blown by the fans 120 passes through the mounting seats 130 firstly and then passes through the condensers 140, and the problem that the to-be-cooled device 200 is damaged due to the condensed water generated by the condensers 140 dropping onto the to-be-cooled device 200 on the mounting seats 130 can be avoided.
In other embodiments, the condenser 140 and the mounting base 130 may be sequentially distributed along the inlet-to-outlet direction of the cooling air duct 111. Therefore, the air in the cooling air duct 111 can first pass through the condenser 140 to condense the water vapor in the air into condensed water so as to dry the air, and then the dried air flows through the mounting seat 130 and the device 200 to be cooled, so that the device 200 to be cooled is prevented from being damaged due to the condensed water formed by the water vapor in the air at the mounting seat 130.
Specifically, the fan 120 is provided at the inlet of the cooling air duct 111. The fan 120 is located above the condenser 140, and the mount 130 is located below the condenser 140. Therefore, the fans 120, the condenser 140 and the mounting base 130 are sequentially distributed along the inlet-to-outlet direction of the cooling air duct 111, the air outlet of the fans 120 is downward, and the air blown by the fans 120 passes through the condenser 140 downward and then passes through the mounting base 130.
In other embodiments, the cooling air duct 111 may be disposed laterally. The mounting base 130 and the condenser 140 may be sequentially distributed along the direction from the inlet to the outlet of the cooling air duct 111, or the condenser 140 and the mounting base 130 may be sequentially distributed along the direction from the inlet to the outlet of the cooling air duct 111.
As shown in fig. 1, the housing 110 further includes a return air duct 112, and an inlet of the return air duct 112 communicates with an outlet of the cooling air duct 111, and an outlet of the return air duct 112 communicates with an inlet of the cooling air duct 111 to form a closed space. By placing the mount 130 and the condenser 140 in the closed space of the housing 110, the condenser 140 can continuously condense the water vapor in the closed space, and the water vapor outside the housing 110 is prevented from entering the closed space, so that the closed space in the housing 110 can achieve high dryness.
In some embodiments, the return air duct 112 is disposed circumferentially of the cooling air duct 111 to increase the cross-sectional area of the return air duct 112 and increase the amount of air flow in the return air duct 112.
In some embodiments, the cooling system 100 further includes a water tray (not shown) positioned below the condenser 140 for receiving condensed water generated by the surface of the condenser 140. The water receiving tray is communicated to the outside of the shell 110 through a pipeline, so that condensed water received by the water receiving tray is discharged to the outside of the shell 110.
In some embodiments, the piping communicating with the inlet or outlet of the first cooling flow passage 131 of the mounting base 130 is wrapped with heat insulating cotton (not shown in the drawing), and/or the piping communicating with the inlet or outlet of the second cooling flow passage 143 of the condenser 140 is wrapped with heat insulating cotton (not shown in the drawing). Thereby, it is possible to prevent condensed water from being generated on the surface of the pipe communicating with the inlet or outlet of the first cooling flow passage 131 of the mount 130 and/or the pipe communicating with the inlet or outlet of the second cooling flow passage 143 of the condenser 140.
The embodiment of the application also provides a laser, which comprises a cooling system, and the specific structure of the cooling system refers to the embodiment, and because the laser adopts all the technical schemes of all the embodiments, the laser at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
The laser comprises a pumping source and a cooling system, wherein the cooling system is the cooling system in any one of the embodiments, the pumping source is a device to be cooled, and the pumping source is arranged on a mounting seat of the cooling system.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The cooling system and the laser provided by the embodiment of the application are described in detail, and specific examples are applied to illustrate the principle and the implementation of the application, and the description of the above embodiments is only used for helping to understand the technical scheme and the core idea of the application; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
Claims (10)
1. A cooling system, the cooling system comprising:
a housing including a cooling air duct;
the fan is connected with the shell and is used for providing air flow into the cooling air duct so that the air flow in the cooling air duct flows from the inlet to the outlet of the cooling air duct;
the mounting seat is connected with the shell and positioned in the cooling air duct, and a first cooling flow passage is arranged in the mounting seat;
the condenser is connected with the shell and positioned in the cooling air duct, and a second cooling flow passage is arranged in the condenser;
and the outlet of the cooling assembly is communicated with the inlets of the first cooling flow channel and the second cooling flow channel, and the cooling assembly is used for providing cooling medium for the first cooling flow channel and the second cooling flow channel, and the temperature of the cooling medium entering the first cooling flow channel is higher than that of the cooling medium entering the second cooling flow channel.
2. The cooling system of claim 1, wherein the cooling assembly includes a cooling medium supply member, a first cooling member, and a second cooling member, an outlet of the cooling medium supply member being in communication with an inlet of the first cooling flow channel and an inlet of the second cooling flow channel to provide the cooling medium to the first cooling flow channel and the second cooling flow channel;
the first cooling part is used for cooling the cooling medium in the cooling medium supply part, and the second cooling part is used for cooling the cooling medium between the cooling medium supply part and the inlet of the second cooling flow channel, so that the temperature of the cooling medium entering the first cooling flow channel is higher than the temperature of the cooling medium entering the second cooling flow channel.
3. The cooling system according to claim 2, wherein the cooling medium supply means includes a first container, a second container, and a circulation pump provided in the first container, the first container and the second container being for accommodating the cooling medium, an outlet of the circulation pump being in communication with inlets of the first cooling flow passage and the second container, an outlet of the second container being in communication with an inlet of the second cooling flow passage;
the first cooling component comprises a first heat exchanger arranged in the first container, and the first heat exchanger is used for cooling a cooling medium in the first container; the second cooling component comprises a second heat exchanger arranged in the second container, and the second heat exchanger is used for cooling the cooling medium in the second container.
4. The cooling system of claim 3, wherein the inlet of the first container communicates with the outlet of the first cooling flow passage and the outlet of the second cooling flow passage.
5. The cooling system according to any one of claims 1 to 4, wherein the mount and the condenser are distributed in order along a direction from an inlet to an outlet of the cooling air duct; or,
the condenser and the mounting seat are distributed in sequence along the direction from the inlet to the outlet of the cooling air duct.
6. The cooling system of claim 5, wherein the housing further comprises a return air duct, an inlet of the return air duct communicating with an outlet of the cooling air duct, and an outlet of the return air duct communicating with an inlet of the cooling air duct to form an enclosed space.
7. The cooling system of claim 6, wherein the fan is disposed at an inlet of the cooling duct; the cooling air duct extends along the up-down direction, the fan is positioned above the mounting seat, and the condenser is positioned below the mounting seat; alternatively, the fan is located above the condenser, and the mount is located below the condenser.
8. The cooling system of claim 6, wherein the return air duct is disposed circumferentially of the cooling air duct.
9. The cooling system of claim 5, wherein the cooling air duct extends laterally.
10. A laser, the laser comprising:
a pump source;
a cooling system as claimed in any one of claims 1 to 9, the pump source being mounted to a mounting of the cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311274322.0A CN117239517A (en) | 2023-09-27 | 2023-09-27 | Cooling system and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311274322.0A CN117239517A (en) | 2023-09-27 | 2023-09-27 | Cooling system and laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117239517A true CN117239517A (en) | 2023-12-15 |
Family
ID=89085900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311274322.0A Pending CN117239517A (en) | 2023-09-27 | 2023-09-27 | Cooling system and laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117239517A (en) |
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2023
- 2023-09-27 CN CN202311274322.0A patent/CN117239517A/en active Pending
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