CN218918862U

CN218918862U - Solid state relay

Info

Publication number: CN218918862U
Application number: CN202223285931.XU
Authority: CN
Inventors: 黄贤权; 李兴德; 王友荣; 王爱
Original assignee: Shenle Co ltd
Current assignee: Shenle Co ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-04-25
Anticipated expiration: 2032-12-07

Abstract

The utility model relates to a solid-state relay, which comprises a base, a heat-radiating substrate, a circuit board with an electronic element, a power device, an input terminal, an output terminal and an upper cover, wherein a through groove is formed between the side edge of one side of the circuit board, which is close to the output terminal, and the inner wall of the base; the output terminal is provided with an output conductive connecting piece, and the output conductive connecting piece is provided with a first connecting part fixed on the base and a second connecting part used for connecting with the power device; the power device comprises a conductive bridge arm, wherein the conductive bridge arm is provided with a mounting plate fixed on the heat dissipation substrate and a third connecting part positioned at one side of the mounting plate and used for being connected with the output terminal; the second connecting part is positioned at one side of the third connecting part, electric connection is formed by welding the second connecting part and the third connecting part, and a connecting structure formed by the welded second connecting part and the third connecting part passes through the through groove. The utility model directly performs welding connection between the output terminal and the power device, avoids a circuit board, does not pass load current through the circuit board, has low temperature rise of the circuit board, and prolongs the service life of the electronic element.

Description

Solid state relay

Technical Field

The present utility model relates to a solid state relay.

Background

Solid state relays are contactless switching devices with relay characteristics that replace conventional electrical contacts with semiconductor devices as switching means. Solid state relays typically include a housing, a heat dissipating substrate, a circuit board with electronic components, a power device (e.g., a TRIAC)), two input terminals, and two output terminals. The heat dissipation substrate is in contact with the power device so as to conduct heat generated by the power device to the outside of the housing. The solid state relay can drive a high current load at the output with a small control signal at the input. At present, a common binding post of a solid-state relay sets up the terminal at the both ends of casing, and the fixed connection mode between the pin of silicon controlled rectifier and the terminal is that need buckle the laminating with the pin of silicon controlled rectifier on the circuit board after, reuse soldering tin with pin and terminal welding together, and this kind of fixed connection mode's defect lies in: the load current forms a current loop through the circuit board, and the temperature rise of the circuit board is higher, so that the service life of the electronic element is influenced.

Disclosure of Invention

The utility model aims to overcome the defects and shortcomings of the prior art and provides a solid-state relay.

The technical scheme adopted by the utility model is as follows: the solid-state relay comprises a base, a heat dissipation substrate, a circuit board with electronic elements, a power device, an input terminal, an output terminal and an upper cover, wherein the heat dissipation substrate is fixed at the bottom of the base, the power device is fixed on the heat dissipation substrate, the circuit board is arranged in the base and above the power device, the input terminal and the output terminal are arranged at the upper end of the base and are respectively electrically connected with the circuit board and the power device, the power device is electrically connected with the circuit board,

a through groove is formed between the side edge of one side of the circuit board, which is close to the output terminal, and the inner wall of the base;

the output terminal is provided with an output conductive connecting piece, and the output conductive connecting piece is provided with a first connecting part fixed on the base and a second connecting part used for connecting with the power device;

the power device comprises a conductive bridge arm, wherein the conductive bridge arm is provided with a mounting plate fixed on the heat dissipation substrate and a third connecting part positioned at one side of the mounting plate and used for being connected with the output terminal;

the second connecting part is positioned at one side of the third connecting part, electric connection is formed by welding the second connecting part and the third connecting part, and a connecting structure formed by the welded second connecting part and the third connecting part passes through the through groove.

The third connecting portion is perpendicular to the second connecting portion, the second connecting portion is perpendicular to the first connecting portion, and the second connecting portion is located on one side of the third connecting portion and forms a welding cavity between the third connecting portion and the first connecting portion.

The second connecting portion extends upwards relative to the first connecting portion, and the third connecting portion is located at one side, away from the first connecting portion, of the second connecting portion.

And a convex tooth line is arranged on one side of the second connecting part, which is close to the third connecting part.

The mounting plate is upwards extended to form a first pin, and the circuit board is correspondingly provided with a slot for the first pin to pass through.

The power device comprises two conductive bridge arms arranged at a certain interval, two silicon controlled chips respectively fixed on the two conductive bridge arms, and two bridges respectively used for connecting one silicon controlled chip and the other conductive bridge arm, wherein the gates of the two silicon controlled chips are connected with the circuit board through leads.

And through holes are respectively formed at two ends of the bridge frame.

The heat dissipation substrate is an aluminum substrate and comprises an aluminum plate, an insulating layer arranged on the outer layer of the aluminum plate and a copper foil layer fixed on the insulating layer, and the power device is fixed on the copper foil layer.

The base is hinged with a protective cover at the position corresponding to the input terminal and the output terminal.

The circuit board top is equipped with the work pilot lamp, be equipped with on the upper cover with work pilot lamp complex leaded light post.

The beneficial effects of the utility model are as follows: compared with the mode that the output terminal and the pins of the power device are welded on the circuit board in the prior art, the utility model directly performs welding connection between the output terminal and the power device, avoids the circuit board, does not pass through the circuit board by load current, has low temperature rise, and prolongs the service life of electronic elements.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are required in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that it is within the scope of the utility model to one skilled in the art to obtain other drawings from these drawings without inventive faculty.

FIG. 1 is an exploded view of one embodiment of the present utility model;

FIG. 2 is a schematic view of an embodiment of the present utility model with the upper cover and the protective cover hidden;

FIG. 3 is a schematic diagram of a connection structure of an output conductive connection member and a power device according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a conductive bridge arm according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of an output conductive connector according to an embodiment of the present utility model;

FIG. 6 is a schematic diagram of a circuit board according to an embodiment of the present utility model;

FIG. 7 is a schematic diagram of a bridge according to an embodiment of the present utility model;

FIG. 8 is a schematic diagram of a heat dissipating substrate according to an embodiment of the present utility model;

in the figure, 1, a base; 2, a heat dissipation substrate; 201, aluminum plate; 202, a copper foil layer; 3, a circuit board; 301, a slot; 4, a power device; 401, conductive bridge arms; 4011, a mounting plate; 4012, a third connection; 4013, a first pin; 402, a silicon controlled chip; 403, bridge frame; 4031, vias; 5, an input terminal; 501, inputting a conductive connecting piece; 502, a first stud; 6, outputting a terminal; 601, outputting a conductive connecting piece; 6011, first connecting portion; 6012, second connecting part; 6013, tooth pattern; 602, a second stud; 7, an upper cover; 8, protecting the cover; 9, working indicator lamps; 10, a light guide column.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present utility model more apparent.

It should be noted that, in the embodiments of the present utility model, all the expressions "first" and "second" are used to distinguish two entities with the same name but different entities or different parameters, and it is noted that the "first" and "second" are only used for convenience of expression, and should not be construed as limiting the embodiments of the present utility model, and the following embodiments are not described one by one.

The terms of direction and position in the present utility model, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "top", "bottom", "side", etc., refer only to the direction or position of the drawing. Accordingly, directional and positional terms are used to illustrate and understand the utility model and are not intended to limit the scope of the utility model.

As shown in fig. 1, the solid-state relay comprises a base 1, a heat dissipation substrate 2, a circuit board 3 with electronic components, a power device 4, an input terminal 5, an output terminal 6, an upper cover 7 and a protective cover 8. The heat dissipation substrate 2 is fixed at the bottom of the base 1, the power device 4 is fixed on the heat dissipation substrate 2, the circuit board 3 is arranged in the base 1 and is located above the power device 4, the upper cover 7 is fixed above the base 1 to seal the inner cavity of the base 1, the input terminal 5 and the output terminal 6 are arranged at the upper end of the base 1 and are respectively electrically connected with the circuit board 3 and the power device 4, and the power device 4 is electrically connected with the circuit board 3.

The power device 4 is a thyristor assembly, and specifically includes two conductive bridge arms 401 disposed at a certain interval, two thyristor chips 402 respectively fixed on the two conductive bridge arms 401, and two bridges 403 respectively used for connecting one thyristor chip 402 and the other conductive bridge arm 401, where gates of the two thyristor chips 402 are connected with the circuit board 3 through leads.

The input terminal 5 is composed of an input conductive connecting piece 501 and a first stud 502, the output terminal 6 is composed of an output conductive connecting piece 601 and a second stud 602, and the input terminal 5 and the output terminal 6 are respectively located at two sides of the circuit board 3.

As shown in fig. 2, a through slot is formed between the side edge of the circuit board 3, which is close to the output terminal 6, and the inner wall of the base 1; as shown in fig. 3 to 5, the output conductive connector 601 has a first connecting portion 6011 fixed to the base 1 and a second connecting portion 6012 for connecting with the power device 4; the conductive arm 401 has a mounting board 4011 fixed to the heat dissipation substrate 2 and a third connection portion 4012 located on the mounting board 4011 side for connection to the output terminal 6;

the second connecting portion 6012 is located at one side of the third connecting portion 4012 and is welded to form an electrical connection therebetween, and a connection structure formed by the welded second connecting portion 6012 and the third connecting portion 4012 passes through the through groove.

The conductive bridge arm 401 of the power device 4 and the output conductive connecting piece 601 of the output terminal 6 are directly welded, the welding position avoids the circuit board 3, load current does not pass through the circuit board, the temperature rise of the circuit board is low, and the service life of electronic elements is prolonged.

Further, as shown in fig. 4, the third connecting portion 4012 is perpendicular to the second connecting portion 6012, as shown in fig. 5, the second connecting portion 6012 is perpendicular to the first connecting portion 6011, and the second connecting portion 6012 is located at one side of the third connecting portion 4012 and forms a welding cavity therebetween. So arranged, the second connecting portion 6012 and the third connecting portion 4012 are conveniently welded by spot welding. Spot welding is a high-speed and economical connection method, and during welding, the surface of a welding piece is cleaned, and then welded plates are lapped and assembled, pressed between two columnar copper electrodes, and pressed by applying pressure P, as shown in figure 2. When a sufficiently large current is passed, a large amount of resistive heat is generated at the contact of the plates, rapidly heating the metal in the central hottest region to a highly plastic or molten state, forming a lenticular liquid pool. Continuing to maintain the pressure P, turning off the current, and forming a welding spot after the metal cools.

Further, the second connecting portion 6012 extends upward relative to the first connecting portion 6011, and the third connecting portion 4012 is located at a side of the second connecting portion 6012 away from the first connecting portion 6011. In this way, during assembly, the conductive bridge arm 401 may be fixed on the heat dissipation substrate 2 and the output conductive connecting piece 601 may be assembled on the base 1, and then welded by spot welding, as shown in fig. 2, with sufficient operation space for performing spot welding operation, otherwise, the conductive bridge arm 401 needs to be welded with the output conductive connecting piece 601, and then assembled, so that the production cost may be obviously increased.

Further, as shown in fig. 5, a tooth pattern 6013 is disposed on a side of the second connecting portion 6012 near the third connecting portion 4012. The number of welding points can be increased by the arrangement of the convex tooth lines 6013, and the welding strength is improved.

As shown in fig. 4, the mounting board 4011 extends upward to form a first pin 4013, and as shown in fig. 6, the circuit board 3 is correspondingly provided with a slot 301 through which the first pin 4013 passes. The first pins 4013 and the third connection portion 4012 are located on the same side of the mounting board 4011 and are spaced apart from each other by a certain distance, so that the first pins 4013 and the circuit board 3 are not soldered to the third connection portion 4012.

As shown in fig. 7, through holes 4031 are respectively formed at two ends of the bridge 403. The through holes 4031 are used for adding solder paste, so that the solder paste quantity is ensured, and the welding is firmer.

The heat dissipation substrate 2 is an aluminum substrate and comprises an aluminum plate 201, an insulating layer arranged on the outer layer of the aluminum plate 201, and a copper foil layer 202 fixed on the insulating layer, and the power device 4 is fixed on the copper foil layer 202. The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a common single panel is composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer, wherein the surface of a power device is attached to the circuit layer, heat generated during the operation of the device is rapidly conducted to the metal base layer through the insulating layer, and then the heat is transferred out through the metal base layer, so that the heat dissipation of the device is realized. The aluminum substrate can reduce the thermal resistance to the minimum, so that the aluminum substrate has excellent heat conduction performance; its mechanical properties are very good compared with thick film ceramic circuits.

The protective cover 8 is located at a position on the base 1 corresponding to the position where the input terminal 5 and the output terminal 6 are installed and is hinged with the base 1, and is opened when wiring is needed, and closed when wiring is not needed to play a protective role.

The circuit board 3 top is equipped with work pilot lamp 9, be equipped with on the upper cover 7 with work pilot lamp 9 complex leaded light post 10.

The production process of this embodiment is different from that of the solid state relay currently on the market, and the specific process is as follows:

(1) Fixing the solder paste on the heat dissipation substrate 2 through a positioning clamp;

(2) Placing two conductive bridge arms 401 on the heat dissipation substrate 2, and soldering paste on the conductive bridge arms 401; placing a silicon controlled chip 402, placing a bridge 403, and soldering paste on the bridge 403; soldering is completed through constant-temperature heating;

(3) A mounting base 1;

(4) Installing an output conductive connecting member 601, and performing spot welding operation on the second connecting portion 6012 and the third connecting portion 4012 to weld the two into a whole;

(5) Injecting silica gel, injecting a layer of epoxy resin after curing, and curing;

(6) Mounting a circuit board 3;

(7) Mounting an input conductive connection 501;

(8) The input conductive connector 501 and the circuit board 3 are connected by soldering so that the input conductive connector and the circuit board 3 can be connected in a conductive manner, and the first pin 4013 and the circuit board 3 are connected in a conductive manner by soldering;

(9) Installing an upper cover 7;

(10) Mounting a first stud 502 and a second stud 602;

(11) Installing a guide pipe column 10;

(12) Installing a protective cover 8;

(13) And (5) packaging.

The main difference between the production process of this embodiment and the production process of the solid state relay in the current market is that: in this embodiment, the output conductive connecting member 601 and the conductive bridge arm 401 are welded first, then the circuit board 3 is mounted, so that the load circuit does not pass through the circuit board 3, and in the prior art, the power device 4, the circuit board 3 and the output conductive connecting member 601 are sequentially mounted, and then electrical connection is formed by soldering.

The foregoing disclosure is illustrative of the present utility model and is not to be construed as limiting the scope of the utility model, which is defined by the appended claims.

Claims

1. The utility model provides a solid-state relay, includes base (1), radiating substrate (2), has circuit board (3) of electronic component, power device (4), input terminal (5) and output terminal (6), upper cover (7), radiating substrate (2) are fixed in base (1) bottom, power device (4) are fixed on radiating substrate (2), circuit board (3) set up in base (1) and are located power device (4) top, input terminal (5) and output terminal (6) set up in base (1) upper end and are connected with circuit board (3) and power device (4) electricity respectively, power device (4) are connected with circuit board (3) electricity, its characterized in that:

a through groove is formed between the side edge of one side of the circuit board (3) close to the output terminal (6) and the inner wall of the base (1);

the output terminal (6) has an output conductive connection member (601), the output conductive connection member (601) having a first connection portion (6011) fixed to the base (1) and a second connection portion (6012) for connection with the power device (4);

the power device (4) comprises a conductive bridge arm (401), wherein the conductive bridge arm (401) is provided with a mounting plate (4011) fixed on the heat dissipation substrate (2) and a third connecting part (4012) positioned at one side of the mounting plate (4011) and used for being connected with the output terminal (6);

the second connecting part (6012) is positioned at one side of the third connecting part (4012) and is welded between the third connecting part and the third connecting part to form electric connection, and a connecting structure formed by the welded second connecting part (6012) and the third connecting part (4012) penetrates through the through groove.

2. The solid state relay of claim 1, wherein: the third connecting portion (4012) is perpendicular to the second connecting portion (6012), the second connecting portion (6012) is perpendicular to the first connecting portion (6011), and the second connecting portion (6012) is located on one side of the third connecting portion (4012) and forms a welding cavity between the third connecting portion and the second connecting portion.

3. The solid state relay of claim 2, wherein: the second connecting portion (6012) extends upwards relative to the first connecting portion (6011), and the third connecting portion (4012) is located on one side, away from the first connecting portion (6011), of the second connecting portion (6012).

4. A solid state relay according to claim 3, wherein: and a convex tooth line (6013) is arranged on one side of the second connecting part (6012) close to the third connecting part (4012).

5. The solid state relay of claim 1, wherein: the mounting plate (4011) extends upwards to form a first pin (4013), and the circuit board (3) is correspondingly provided with a slot (301) through which the first pin (4013) passes.

6. The solid state relay of claim 1, wherein: the power device (4) comprises two conductive bridge arms (401) which are arranged at a certain interval, two silicon controlled chips (402) which are respectively fixed on the two conductive bridge arms (401), and two bridge frames (403) which are respectively used for connecting one silicon controlled chip (402) and the other conductive bridge arm (401), wherein the gates of the two silicon controlled chips (402) are connected with the circuit board (3) through leads.

7. The solid state relay of claim 6, wherein: through holes (4031) are respectively formed in two ends of the bridge (403).

8. The solid state relay of claim 1, wherein: the heat dissipation substrate (2) is an aluminum substrate and comprises an aluminum plate (201), an insulating layer arranged on the outer layer of the aluminum plate (201) and a copper foil layer (202) fixed on the insulating layer, and the power device (4) is fixed on the copper foil layer (202).

9. The solid state relay of claim 1, wherein: the base (1) is hinged with a protective cover (8) at a position corresponding to the input terminal (5) and the output terminal (6).

10. The solid state relay of claim 1, wherein: the circuit board (3) top is equipped with work pilot lamp (9), be equipped with on upper cover (7) with work pilot lamp (9) complex leaded light post (10).