CN218587504U - Controller for electric booster bicycle - Google Patents

Abstract

The utility model provides an electric power bicycle controller, it is including the casing that has the casing cavity, set up the circuit board in the casing cavity and set up in the casing cavity and be located the circuit board below and lean on the radiating piece of contact, wherein the radiating piece is the metal sheet, its with the chip corresponds the setting at the installation region of circuit board. The utility model has the advantages that: the metal substrate attribute of the heat dissipation piece and the area where the chip is located are welded and connected to conduct rapid heat dissipation, the size, the structure and the manufacturing process of the controller are optimized, and the controller is particularly suitable for a high-power controller.

Description

Controller for electric booster bicycle

Technical Field

The utility model relates to an electric power assisted bicycle field especially relates to an electric power assisted bicycle controller.

Background

In the prior art, a direct-insertion field effect transistor (MOS) used by a controller of a common electric power-assisted bicycle has a large volume, occupies a large space on a circuit board, and causes the whole volume of the controller to be increased. In addition, the common direct-insertion field effect transistor needs manual welding, the manual welding has high failure rate, continuous repair is needed, and the labor cost and the time cost are increased invisibly. In addition, the existing direct-insertion field effect transistor has the defects of large volume, small power, complex assembly process and low production efficiency, and can not meet the existing market demand.

The controller of the electric power-assisted bicycle can also use a patch type field effect transistor, in particular to a high-power controller (a motor capable of controlling high power, such as a motor of 500 watts or more), and the high-power field effect transistor packaged by TOLL (a surface mounting type package) has higher requirements on heat dissipation performance and structure. In the prior art, chinese patent No. 202122712235.1 also discloses a controller heat dissipation structure, but it is only suitable for a chip fet of a low-power controller to dissipate heat.

Therefore, it is desirable to provide an electric bicycle controller and a heat sink thereof, which can make a high-power controller achieve a better heat dissipation effect, so that the overall size is smaller, and the performance, structure, process and the like are optimized.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electric power bicycle controller can realize that the produced thermal fast of paster field effect transistor dispels the heat among the high power controller, optimizes controller volume, structure, manufacturing process.

To achieve the purpose of the present invention, the present invention provides the following first technical solution: an electric power-assisted bicycle controller comprises a shell with a shell cavity, a circuit board arranged in the shell cavity and provided with at least one chip, and a heat dissipation piece arranged in the shell cavity, positioned below the circuit board and corresponding to the chip, wherein the heat dissipation piece is a metal plate and is arranged in a region where a chip main body of the chip is located and in a region where chip pins of the chip are located, and the metal plate corresponds to the chip main body.

On the basis of the technical scheme, the method further comprises the following subsidiary technical scheme:

preferably, the heat dissipation device further comprises a heat dissipation boss which is arranged in the shell cavity, supports the heat dissipation piece and is integrally formed with the shell.

Preferably, the heat sink includes a first bonding pad and a second bonding pad spaced apart from the first bonding pad, and the first bonding pad corresponds to a first portion of the chip, and the second bonding pad corresponds to a second portion of the chip, and the chip mounting region of the circuit board includes a first mounting region corresponding to the first bonding pad and having a heat conductive material, and a second mounting region corresponding to the second bonding pad and having a heat conductive material.

Preferably, a layer of insulating material is provided on one side of the heat sink, wherein the first and second bonding pads are provided on the layer of insulating material.

Preferably, the wiring board further includes another chip disposed at an interval, and the heat spreader further includes a third bonding pad located on one side of the second bonding pad and corresponding to a first portion of the another chip, and a fourth bonding pad located on the other side of the third bonding pad and corresponding to a second portion of the another chip, wherein the fourth bonding pad and the third bonding pad are both disposed on the insulating material layer.

Preferably, the chip mounting region of the wiring board further includes a third mounting region provided with a heat conductive material corresponding to the third land, and a fourth mounting region provided with a heat conductive material corresponding to the fourth land.

Preferably, the heat dissipation structure further comprises a plurality of leads connected with the circuit board in a welding mode, the heat dissipation piece further comprises a through hole located between the second welding area and the fourth welding area, the heat dissipation boss is provided with a groove corresponding to the through hole, and the welding connection point of the leads and the circuit board is located in the through hole and partially located in the groove.

Preferably, the circuit board further comprises a plurality of through holes located in the first mounting area and the fourth mounting area, and heat conduction materials are arranged between the adjacent through holes and inside the through holes.

Preferably, the chip is a chip on chip field effect transistor chip and includes a chip main body and chip pins, wherein the first bonding region corresponds to the chip main body and part of the chip pins of the first chip, the third bonding region corresponds to the chip main body and part of the chip pins of the second chip, the second bonding region corresponds to the remaining chip pins of the first chip, and the fourth bonding region corresponds to the remaining chip pins of the second chip.

Preferably, the circuit board further includes a connection region disposed on a side opposite to the first mounting region, the second mounting region, the third mounting region, or the fourth mounting region and provided with a heat conductive material, and the connection region is connected to the first land, the second land, the third land, or the fourth land and includes a first connection region disposed corresponding to the first mounting region, a second connection region disposed corresponding to the second mounting region, a third connection region disposed corresponding to the third mounting region, and a fourth connection region disposed corresponding to the fourth mounting region.

Preferably, the circuit board has a three-phase bridge arm driving circuit, and the one chip is a chip of an upper half bridge arm of one path of the three-phase bridge arm driving circuit, and the other chip is a chip of a lower half bridge arm of one path of the three-phase bridge arm driving circuit.

The utility model provides a following second technical scheme: a heat sink for dissipating heat from at least one pair of chips on a circuit board provided with a first mounting area mounting a first portion of a first chip and having a thermally conductive material, a second mounting area mounting a second portion of the first chip and having a thermally conductive material, a third mounting area mounting a first portion of a second chip and having a thermally conductive material, and a fourth mounting area mounting a second portion of the second chip and having a thermally conductive material, includes a first land solder-bonded to at least a portion of the thermally conductive material in the first mounting area, a second land solder-bonded to at least a portion of the thermally conductive material in the second mounting area, a third land solder-bonded to at least a portion of the thermally conductive material in the third mounting area, and a fourth land solder-bonded to at least a portion of the thermally conductive material in the fourth mounting area.

On the basis of the second technical scheme, the method further comprises the following subsidiary technical scheme:

preferably, an insulating material layer is further disposed on one side of the heat sink, wherein the first bonding region, the second bonding region, the third bonding region, and the fourth bonding region are disposed on the insulating material layer, the chip is a surface mount field effect chip and includes a chip main body and chip pins, the first bonding region corresponds to the chip main body and part of the chip pins of the first chip, the fourth bonding region corresponds to the chip main body and part of the chip pins of the second chip, the second bonding region corresponds to the remaining chip pins of the first chip, and the third bonding region corresponds to the remaining chip pins of the second chip.

The utility model provides a following third technical scheme: a heat dissipation piece is used for dissipating heat of at least one pair of chips on a circuit board, the circuit board is provided with a chip main body region of a first chip, a chip pin region of the first chip, a chip main body region of a second chip and a chip pin region of the second chip, the heat dissipation piece is a metal plate, and the heat dissipation piece is arranged in a manner of corresponding to the chip main body region of the first chip, the chip pin region of the first chip, the chip main body region of the second chip and the chip pin region of the second chip.

Compared with the prior art, the utility model discloses there is following positive effect: the metal substrate attribute of the radiating piece and the area where the chip is located are welded and connected to conduct rapid radiating, then the radiating piece is in close fit with the radiating boss of the shell to conduct further radiating, radiating effect is optimized, size, structure and manufacturing process of the controller are optimized, and the controller is particularly suitable for a high-power controller.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic perspective exploded view of a first embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a first embodiment of the present invention;

fig. 3 is a partial view of a circuit board according to a first embodiment of the present invention;

fig. 4 is a partial view of a mounting region of a circuit board according to a first embodiment of the present invention;

fig. 5 is a partial view of a connection region of a circuit board according to a first embodiment of the present invention;

fig. 6 is a front view of a second embodiment of the present invention.

Detailed Description

In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience in describing the present invention and simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as the case may be, by those of ordinary skill in the art.

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Example (b): as shown in fig. 1-5, the present invention discloses a first embodiment of an electric bicycle controller, which comprises: the circuit board comprises a shell 100 with a shell cavity 120, a circuit board 200 which is arranged in the shell cavity 120 and is provided with a chip 220, a heat dissipation piece 300 which is arranged in the shell cavity 120 and is positioned below the circuit board 200 and is in abutting contact with the circuit board 200, and a plurality of leads 400 of which the tail ends are connected with the circuit board 200 in a welding mode. The chip 220 is a chip-on-chip field effect chip and includes a chip body and chip pins.

The casing 100 is made of metal, preferably aluminum, and is a hollow rectangular body with an opening at one end and surrounding the casing cavity 120, and includes a heat dissipation boss 140 disposed in the casing cavity 120 and supporting the heat dissipation member 300, and a groove 142 disposed on the heat dissipation boss 140 and below the heat dissipation member 300. The protruding height of the heat dissipation boss 140 is greater than 1mm and smaller than 15mm for good heat dissipation, and the heat dissipation boss 140 and the housing 100 are integrally injection-molded. The open end of the housing 100 is closed by a cover plate (not shown) to protect the internal circuit board 200.

In another embodiment, a side wall of the housing is further provided with a groove so that the wire can be led out of the housing through the groove.

As shown in fig. 3 and fig. 2, the circuit board 200 may have a four-layer circuit board structure and includes at least a pair of chips 220 disposed at two sides of the through hole 310, a main body mounting area 240 at one end and receiving the main body of the chip, a plurality of through holes 242 disposed in the main body mounting area 240, a plurality of first pin holes 244 disposed at one side of the main body mounting area 240 and corresponding to some chip pins, and a plurality of second pin holes 245 disposed at the other side of the main body mounting area 240 and corresponding to the remaining chip pins. The corresponding area of the main body mounting area 240 and the first pin hole 244 of the first chip is a first mounting area 250, the corresponding area of the second pin hole 245 of the first chip is a second mounting area 252, the corresponding area of the main body mounting area 240 and the first pin hole 244 of the second chip is a third mounting area 254, the corresponding area of the second pin hole 245 of the second chip is a fourth mounting area 256, because a plurality of through holes 242 are arranged in the main body mounting area 240, and the first and second pin holes 244, 245 are arranged on two sides of the main body mounting area, heat conduction materials (such as copper, tin and the like) are arranged in the main body mounting area 240, and the heat conduction materials (such as copper, tin and the like) are filled in the through holes 242 and the pin holes; the diameter of the through holes 242 or pin holes is in the range of 0.1-0.4 mm. In this embodiment, the number of the first pin holes 244 is smaller than the number of the second pin holes 245. The circuit board 200 and the heat sink 300 are connected by soldering, and the heat sink 300 is preferably a heat conductive aluminum substrate. To ensure reliable soldering, the wiring board 200 is provided at the non-mounting end with a connection area in which a thermally conductive material (e.g., copper, tin, etc.) is disposed and which includes a first connection area 260 disposed in correspondence with the first mounting area 250, a second connection area 262 disposed in correspondence with the second mounting area 252, a third connection area 264 disposed in correspondence with the third mounting area 254, and a fourth connection area 266 disposed in correspondence with the fourth mounting area 256. That is, the mounting area and the connection area are areas at the upper and lower ends of the wiring board 200. The heat generated by the chip body is quickly and effectively conducted to the heat sink 300 through the copper-clad structure of the through hole 242, and the heat dissipation principle of the chip pins is similar. In this embodiment, the lower end of the heat sink 300 is tightly fitted to the heat sink boss 140, and the heat sink boss 140 is used for fast heat dissipation. The circuit board 200 has a three-phase bridge arm driving circuit, and the chips 220 are an upper half-bridge arm chip and a lower half-bridge arm chip of the three-phase bridge arm driving circuit. The field effect chips in this embodiment are main components of a three-phase bridge arm driving circuit, wherein an upper half bridge arm is connected to a battery voltage, and a lower half bridge arm is grounded, and in this embodiment, at least 6 field effect chips need to be provided, wherein 3 upper half bridge arm chips and 3 lower half bridge arm chips. When the field effect transistor chip is conducted, a large amount of heat can be generated, and the heat needs to be quickly dissipated. The patch type MOS tube has small volume, reduces the occupied area of the circuit board, and is directly welded on the circuit board. The circuit board 200 is fixed to the heat dissipating boss 140 by screws. In this embodiment, the through holes 310 are mainly disposed for matching with the solder points of the three-phase wires 400 on the circuit board, and when there is no corresponding relationship between the solder points of the three-phase wires 400 on the circuit board and the heat dissipation member, the heat dissipation member 300 does not need to be disposed with the through holes 310.

As shown in fig. 6, heat spreader 300 is made of a metal plate, preferably an aluminum substrate, and includes a through hole 310, a first land 320 located on one side of through hole 310, a second land 330 located between through hole 310 and first land 320, a third land 340 located on the other side of through hole 310, and a fourth land 350 located between through hole 310 and third land 340. The first bonding area 320 corresponds to the first bonding area 260, the second bonding area 330 corresponds to the second bonding area 262, the third bonding area 340 corresponds to the third bonding area 264, and the fourth bonding area 350 corresponds to the fourth bonding area 266. For realizing the purpose of the present invention, the first welding area 320 and the fourth welding area 350 can also be plural, and the present embodiment can perform area combination because the polarity of the first pin hole 244 is the same, for example, the first pin hole is a positive electrode or a negative electrode. First, second, third, and fourth lands 320, 330, 340, and 350 are located at the upper end of heat sink 300. In the heat sink 300 of the present embodiment, the first bonding pad 320 corresponds to the chip main bodies and the first pin holes 244 of the 3 upper half bridge arm chips, the second bonding pad 330 corresponds to the second pin holes 245 of the 3 upper half bridge arm chips, the third bonding pad 340 corresponds to the chip main bodies and the first pin holes 244 of the 3 lower half bridge arm chips, and the fourth bonding pad 350 corresponds to the second pin holes 245 of the 3 lower half bridge arm chips. The first pin of the upper half bridge arm chip is a positive electrode, and the second pin of the lower half bridge arm chip is grounded.

The lead 400 is a three-phase lead of the motor, wherein the soldering connection point 410 of the lead 400 and the circuit board 200 is located in the through hole 310 and partially located in the groove 142. The solder joints 410 are often implemented in a ball shape according to the patch process.

The first bonding pad 320, the second bonding pad 330, the third bonding pad 340, and the fourth bonding pad 350 are all tin pads, i.e. a layer of tin covering the upper surface of the aluminum substrate, and the through hole 310 is used for accommodating a solder ball of the conductive wire 400 soldered on the circuit board 200. When the circuit board 200 is mounted in the housing cavity 120, the solder balls soldered on the circuit board 200 by the wires 400 pass through the through holes 310 of the aluminum substrate and are received in the grooves 142 of the heat dissipation bosses 140 for heat dissipation. The plurality of solder pads correspond to the field effect chip body and the chip pins on one side thereof in the connection area where the wiring board 200 is located. The heat sink 300 is correspondingly matched with the circuit board 200, and then heated by a heating device to melt and cool the soldering plate, so that the heat sink 300 is fixed with the circuit board 200. The connection area where the circuit board 200 is mated with the solder pad of the heat sink 300 is also covered with a heat-dissipating tin layer. The first bonding pad 320, the second bonding pad 330, the third bonding pad 340, and the fourth bonding pad 350 are not only used for soldering with the connection region of the circuit board 200, but also used for transferring heat from the main body mounting region 240, the first and second pin holes 244, 245 to the first connection region 260, the second connection region 262, the third connection region 264, and the fourth connection region 266 through the heat conductive material located in the through holes or the pin holes, transferring the heat to the solder pads of the aluminum substrate, and finally dissipating the heat through the heat dissipating boss 140.

As shown in fig. 6, the present invention further discloses a second embodiment of a heat dissipation device for dissipating heat of at least a pair of chips 220 on a circuit board 200, wherein the circuit board 200 is connected to a terminal of a wire 400 by soldering, and comprises a through hole 310 for receiving a soldering terminal of the wire 400, a first bonding pad 320 located at one side of the through hole 310 and corresponding to the first chip, and a third bonding pad 340 located at the other side of the through hole 310 and corresponding to the second chip. Heat spreader 300 also includes a second bonding pad 330 between via 310 and first bonding pad 320, and a fourth bonding pad 350 between via and third bonding pad 340, where first bonding pad 320 corresponds to a first portion of the first chip, second bonding pad 330 corresponds to a second portion of the first chip, third bonding pad 340 corresponds to a first portion of the second chip, and fourth bonding pad 350 corresponds to a second portion of the second chip. The first, second, third, and fourth welding regions 320, 330, 340, and 350 are all on the same plane. The first portion of the chip 220 is preferably the chip body and a portion of the chip pins, and the second portion of the chip 220 is preferably the remaining portion of the chip pins. In this embodiment, the through holes 310 are mainly disposed for matching with the solder points of the three-phase wires 400 on the circuit board, and when there is no correspondence between the solder points of the three-phase wires 400 on the circuit board and the heat sink, the heat sink does not need to be disposed with the through holes 310.

In another embodiment, the heat spreader is further provided with an insulating layer (e.g., a coating of insulating varnish) on a side or surface thereof, and the plurality of lands (which may be a layer of tin pads) are provided on the insulating layer.

The utility model has the advantages that: the circuit board is characterized in that a plurality of through holes and heat conduction materials are arranged in a main body mounting area of the circuit board, and the through holes are filled with the heat conduction materials (such as copper, tin and the like); and the opposite side area of the main body mounting area is also provided with a heat conduction material, the circuit board is connected with the heat conduction heat dissipation part through tin soldering, and heat generated by the chip is quickly and effectively conducted to the aluminum substrate through a copper-clad structure of the through hole. And the heat dissipation piece is in close fit with the heat dissipation boss of the shell to further dissipate heat, so that the heat dissipation effect is optimized, the size, the structure and the manufacturing process of the controller are optimized, and the controller is particularly suitable for a high-power controller.

The above is only the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and all such modifications and improvements are intended to be covered by the protection scope of the present invention.

Claims (10)

1. The electric power-assisted bicycle controller is characterized by comprising a shell (100) with a shell cavity (120), a circuit board (200) which is arranged in the shell cavity (120) and is provided with at least one chip (220), and a heat dissipation member (300) which is arranged in the shell cavity (120), is positioned below the circuit board (200) and corresponds to the chip (220), wherein the heat dissipation member (300) is a metal plate and corresponds to the chip in a mounting area of the circuit board (200).

2. The electric bicycle controller according to claim 1, further comprising a heat dissipating boss (140) provided in the housing cavity (120) and supporting the heat dissipating member (300) and integrally formed with the housing (100).

3. The electric power bicycle controller of claim 2, wherein: the heat sink (300) includes a first bonding pad (320) and a second bonding pad (330) spaced apart from the first bonding pad (320), the first bonding pad (320) corresponding to a first portion of the chip (220), and the second bonding pad (330) corresponding to a second portion of the chip (220), and the chip mounting region of the circuit board (200) includes a first mounting region (250) corresponding to the first bonding pad (320) and having a heat conductive material, and a second mounting region (252) corresponding to the second bonding pad (330) and having a heat conductive material.

4. The electric power bicycle controller of claim 3, wherein: a layer of insulating material is disposed on a side of the heat spreader, wherein the first bonding pad (320) and the second bonding pad (330) are disposed on the layer of insulating material.

5. The electric power bicycle controller of claim 4, wherein: the wiring board (200) further includes another chip (220) disposed at an interval, the heat sink (300) further includes a third bonding pad (340) located at one side of the second bonding pad (330) and corresponding to a first portion of the another chip (220), and a fourth bonding pad (350) located at the other side of the third bonding pad (340) and corresponding to a second portion of the another chip (220), wherein the third bonding pad (340) and the fourth bonding pad (350) are both disposed on the insulating material layer.

6. The electric bicycle controller of claim 5, wherein: the chip mounting area of the wiring board (200) further includes a third mounting area (254) provided with a heat conductive material corresponding to the third land (340), and a fourth mounting area (256) provided with a heat conductive material corresponding to the fourth land (350).

7. An electrically assisted bicycle controller according to claim 5, characterized by further comprising a plurality of wires (400) soldered to the circuit board (200), the heat sink (300) further comprising a through hole (310) between the second (330) and third (340) soldering regions, the heat dissipating boss (140) being provided with a recess (142) corresponding to the through hole (310), wherein the soldered connection point (410) of the wire (400) to the circuit board (200) is located in the through hole (310) and partially within the recess (142).

8. The electric bicycle controller of claim 5, wherein: the circuit board (200) further comprises a plurality of through holes (242) located in the first mounting area and the fourth mounting area, and heat conduction materials are arranged between the adjacent through holes and inside the through holes (242).

9. The electric bicycle controller of claim 5, wherein: the chip (220) is a chip-on-chip field effect chip and comprises a chip main body and chip pins, wherein the first welding area (320) corresponds to the chip main body and part of the chip pins of the first chip, the third welding area (340) corresponds to the chip main body and part of the chip pins of the second chip, the second welding area (330) corresponds to the rest of the chip pins of the first chip, and the fourth welding area (350) corresponds to the rest of the chip pins of the second chip.

10. The electric bicycle controller of claim 6, wherein: the circuit board (200) further comprises a connecting area which is opposite to the first mounting area or the second mounting area or the third mounting area or the fourth mounting area and is provided with a heat conducting material, and the connecting area is connected with the first welding area (320) or the second welding area (330) or the third welding area (340) or the fourth welding area (350) and comprises a first connecting area (260) which is arranged corresponding to the first mounting area (250), a second connecting area (262) which is arranged corresponding to the second mounting area (252), a third connecting area (264) which is arranged corresponding to the third mounting area (254) and a fourth connecting area (266) which is arranged corresponding to the fourth mounting area (256).

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