CN218866041U - Support plate assembly and test equipment - Google Patents
Support plate assembly and test equipment Download PDFInfo
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- CN218866041U CN218866041U CN202223077678.9U CN202223077678U CN218866041U CN 218866041 U CN218866041 U CN 218866041U CN 202223077678 U CN202223077678 U CN 202223077678U CN 218866041 U CN218866041 U CN 218866041U
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Abstract
The utility model provides a carrier plate assembly, which comprises a carrier plate, a first testing pin mold assembly and a second testing pin mold assembly; the first testing pin die assembly comprises a product positioning block, a side pin die module and a moving platform, wherein the product positioning block is arranged on the carrier plate and used for fixing the ZIF connector, the side pin die module is horizontally arranged on the side surface of the carrier plate, and the moving platform is arranged on the carrier plate and used for driving the side pin die module to translate; the second test pin die assembly comprises a pin die set and a plurality of vertical probes, wherein the pin die set is vertically arranged. The utility model provides a support plate subassembly sets up first test needle membrane module and second test needle membrane module simultaneously on the support plate, can prick the needle test to the ZIF connector, can also carry out the OS test to the B2B connector for same support plate subassembly can carry out two kinds of test operation simultaneously in the testing process, thereby has promoted the efficiency of software testing to flexible circuit board and has shortened test time. The utility model also provides a test equipment.
Description
Technical Field
The utility model belongs to the technical field of the automatic test equipment technique of flexible circuit board and specifically relates to a support plate subassembly and test equipment are related to.
Background
With the continuous development of science and technology, flexible circuit boards are adopted as core components in more and more electronic devices. After the flexible circuit board is processed, various tests are required to be performed on the flexible circuit board to ensure the quality of the processed product and whether each connector on the flexible circuit board works normally. The existing flexible circuit board is generally provided with a B2B connector or a Z if connector on the board body. The connectors are located at different positions of the flexible circuit board, so that the circuit board needs to be sent to different testing devices respectively in order to test different connectors on the flexible circuit board, so as to test different connectors on the flexible circuit board, thereby resulting in long testing time of the flexible circuit board in a testing link, low testing efficiency and easy unnecessary damage to the flexible circuit board in a testing process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve current test equipment and only can test a connector on the flexible circuit board to lead to the flexible circuit board to accomplish all tests and need through a plurality of test equipment and the shortcoming that test time is long, efficiency of software testing is low that arouses, provide a support plate subassembly.
The utility model provides a technical scheme that its technical problem adopted is: a carrier plate assembly bears a flexible circuit board to be tested, a ZIF connector and a B2B connector are arranged on the flexible circuit board, and the carrier plate assembly comprises a carrier plate, a first testing pin die assembly and a second testing pin die assembly, wherein the first testing pin die assembly is arranged on the carrier plate and used for testing the ZIF connector of the flexible circuit board, and the second testing pin die assembly is arranged on the carrier plate and used for testing the B2B connector of the flexible circuit board; the first test pin die assembly comprises a product positioning block arranged on the carrier plate and used for fixing the Z IF connector, a side pin die module horizontally arranged on the side surface of the carrier plate and a moving platform arranged on the carrier plate and used for driving the side pin die module to translate; the second testing needle die assembly comprises a needle die set and a plurality of vertical probes, the needle die set is fixed on the carrier plate and vertically arranged, the vertical probes penetrate through the needle die set, the needle die set comprises a first needle die used for placing the B2B connector and a cover plate hinged to the first needle die and used for pressing the B2B connector onto the first needle die.
In one embodiment, the side needle module comprises a first side needle module, a second side needle module, a third side needle module, a fourth side needle module, a fifth side needle module and a plurality of horizontal probes, wherein the first side needle module, the second side needle module, the third side needle module, the fourth side needle module and the fifth side needle module are horizontally arranged, the horizontal probes penetrate through the first side needle module and the fifth side needle module, and the horizontal probes extend out of the side surface of the first side needle module and abut against a Z if connector on the product positioning block.
In one embodiment, a first side needle die in the side needle die sets is movably connected with a second side needle die through an elastic guide column, the second side needle die is fixedly connected with a third side needle die through a horizontal support column, and a fourth side needle die and a fifth side needle die are fixedly connected with the third side needle die through a locking piece.
In one embodiment, the second side needle die and the third side needle die in the side needle die set are movably connected with the moving platform.
In one embodiment, the moving platform comprises a horizontal mounting plate fixed on the support plate, a linear guide rail fixed on the horizontal mounting plate, and a driving part fixed below the horizontal mounting plate, wherein a mounting bracket fixedly connected with the side position needle module is arranged on the linear guide rail, and the driving part is fixedly connected with the mounting bracket through a transmission part.
In one embodiment, the needle template set further comprises a second needle template, a third needle template, a fourth needle template and a fifth needle template which are vertically arranged at the bottom of the first needle template, and the vertical probe extends out of the top of the first needle template and then abuts against the B2B connector on the first needle template.
In one embodiment, a positioning groove for placing the B2B connector and an installation groove for connecting the cover plate are formed in the top surface of the first pin die, and a rotating shaft hinged to the cover plate is arranged in the installation groove.
In one embodiment, the cover plate comprises a base plate, a metal pressing block arranged at one end of the base plate, and a connecting block arranged at the other end of the base plate, the metal pressing block can extend into the positioning groove of the first needle die, a magnet for adsorbing the metal pressing block is further arranged in the positioning groove of the first needle die, and the connecting block is embedded into the mounting groove of the first needle die and is hinged to the first needle die through the rotating shaft.
In one embodiment, the first needle mold is movably connected with the second needle mold, the second needle mold is fixedly connected with the third needle mold through a vertical supporting column, and the fourth needle mold and the fifth needle mold are both fixedly connected with the third needle mold.
The utility model provides a pair of support plate subassembly's beneficial effect lies in: set up first test pin mould subassembly and second test pin mould subassembly simultaneously on the support plate, first test pin mould subassembly can carry out the acupuncture test to the Z IF connector on the flexible circuit board, second test pin mould subassembly can carry out the OS test to the B2B connector on the flexible circuit board, make same support plate subassembly can carry out two kinds of test operation of OS test and acupuncture test simultaneously at a test procedure, thereby promoted the efficiency of software testing to the flexible circuit board and shortened test time.
The utility model also provides a test equipment, including the frame, set up in foretell support plate subassembly in the frame and set up in be located in the frame the sky board subassembly of support plate subassembly top.
The utility model provides a test equipment's beneficial effect lies in: it has adopted foretell support plate subassembly for test equipment can accomplish two kinds of tests to the flexible circuit board in same test procedure, thereby has also promoted efficiency of software testing when having promoted test equipment's test function, makes the utility model provides a test equipment is not only can carry out the test of the B2B connector of flexible circuit board, can also be used for the test of the Z IF connector of flexible circuit board.
Drawings
Fig. 1 is a schematic perspective view of a carrier plate assembly provided in the present invention;
fig. 2 is a schematic perspective exploded view of a carrier plate assembly according to the present invention;
fig. 3 is a schematic perspective view of a lateral pin mold module in a first testing pin mold assembly of a carrier plate assembly according to the present invention;
fig. 4 is a schematic perspective view of a mobile platform in a first testing pin mold assembly of a carrier plate assembly according to the present invention;
fig. 5 is a schematic perspective exploded view of a second testing pin mold assembly in a carrier plate assembly according to the present invention;
fig. 6 is a schematic perspective view of a testing apparatus provided by the present invention.
Description of the reference numerals:
100-carrier plate assembly, 10-carrier plate, 200-test equipment, 210-rack and 220-ceiling assembly;
20-a first testing pin mold component and 21-a product positioning block;
22-side position needle die set, 221-first side position needle die, 222-second side position needle die, 223-third side position needle die, 224-fourth side position needle die and 225-fifth side position needle die;
226-horizontal probe, 227-elastic guide column, 228-horizontal support column;
23-moving platform, 231-horizontal mounting plate, 232-linear guide rail, 233-driving piece, 234-mounting bracket and 235-driving piece;
30-a second test pin die assembly, 31-a pin die plate set, 32-a vertical probe;
311-first needle mould, 3111-locating slot, 3112-mounting slot, 3113-rotating shaft, 3114-magnet;
312-second needle die, 313-third needle die, 314-fourth needle die, 315-fifth needle die, 316-vertical support column;
317-cover plate, 3171-base plate, 3172-metal briquetting and 3173-connecting block;
90-flexible circuit board, 91-Z IF connector and 92-B2B connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring to fig. 1-5, a carrier plate assembly 100 is provided. The utility model provides a support plate subassembly 100 sets up in the survey of flexible circuit board establishes equipment 200, and this support plate subassembly 100 mutually supports with the sky board subassembly 210 that is arranged in test equipment 200 to the realization is to the test operation of placing flexible circuit board 90 on support plate subassembly 100. The utility model provides a support plate subassembly 100 can be simultaneously to having set up a plurality of connectors on the flexible circuit board 90 and test to accomplish a plurality of tests in test process, can promote product test's efficiency, reduce the time of the required process of test and test.
As shown in fig. 1, a schematic perspective view of a carrier board assembly 100 according to the present invention is provided. The utility model provides a support plate subassembly 100 includes support plate 10, sets up the first test needle module subassembly 20 that tests to the Z IF connector 91 of flexible circuit board 90 on support plate 10 and sets up the second test needle module subassembly 30 that tests to the B2B connector 92 of flexible circuit board 90 on support plate 10. The carrier board 10 disposed on the carrier board assembly 100 is used for carrying the flexible circuit board 90 to be tested, and fixedly connecting the first testing pin mold assembly 20 and the second testing pin mold assembly 30. As shown in fig. 2, an exploded view of the carrier plate assembly 100 provided by the present invention is shown. The utility model provides a both sides of the flexible substrate of the flexible circuit board 90 of placing on the support plate subassembly 100 are provided with Z IF connector 91 and B2B connector 92 respectively. In order to realize the test of the Z if connector 91, the first test pin mold assembly 20 is disposed on the side surface of the carrier board 10 for performing a pin insertion test on the Z if connector 91. The B2B connector 92 on the other side of the flexible substrate is located on the bottom surface of the flexible substrate, and in order to implement the test on the B2B connector 92, a second test pin mold assembly 30 is vertically arranged on the carrier board 10 for performing an OS test on the B2B connector 92.
As shown in fig. 2, the utility model provides a first test needle module assembly 20 in carrier plate assembly 100 is including setting up the product locating piece 21 that is used for fixed Z if connector 91 on carrier plate 10, the side that is located carrier plate 10 is side position needle module 22 that the level set up and sets up the moving platform 23 that drives side position needle module 22 translation on carrier plate 10. The product positioning block 21 is fixed on the carrier 10, and is used for fixing the Z if connector 91 at one end of the flexible circuit board 90 to be tested. Then, during testing, the lateral needle module 22 is moved to the product positioning block 21 by the moving platform 23, and the lateral needle module 22 is butted with the Z if connector 91 for testing. After the examination of awaiting measuring is accomplished, through moving platform 23 with side position needle die set 22 and the separation of product locating piece 21, with side position needle die set 22 and the separation of ZI F connector 91 to avoid side position needle die set 22 and other parts on the test equipment 200 to produce and interfere.
As shown in fig. 3, a schematic perspective view of a lateral pin mold module 22 in a first testing pin mold module 20 of a carrier board assembly 100 according to the present invention is shown. The side needle module 22 includes a first side needle module 221, a second side needle module 222, a third side needle module 223, a fourth side needle module 224, a fifth side needle module 225, and a plurality of horizontal probes 226 penetrating the first side needle module 221 to the fifth side needle module 225. The lateral needle module 22 in the first testing needle module assembly 20 is entirely distributed horizontally, i.e. the first lateral needle module 221 to the fifth lateral needle module 225 are arranged from left to right. The first side needle module 221 is located at a side surface close to the product positioning block 21, and the fifth side needle module 225 is located at an end far from the product positioning block 21. The first side pin mold 221 to the fifth side pin mold 225 are fixed as a whole and located on the side of the carrier 10. A plurality of horizontal probes 226 are arranged in the side needle die set 22, and the number of the horizontal probes 226 is equal to the structural oil pipe of the ZI F connector 91 arranged on the product positioning block 21. The horizontal probes 226 are also distributed horizontally and extend through the entire first side pin die 221 to the fifth side pin die 225. One side of the first side needle die 221, which is close to the product positioning block 21, is provided with a butt joint port through which the horizontal probes 226 can extend, and during testing, the horizontal probes 226 extend from the butt joint port on the side of the first side needle die 221 and then abut against the ZI F connector 91 on the product positioning block 21. The needle insertion test of the ZI F connector 91 is realized through the abutting of the horizontal probe 226 on the side needle module 22 and the ZI F connector 91.
In this embodiment, as shown in fig. 3, the first side needle module 221 of the side needle module 22 is movably connected to the second side needle module 222 through the elastic guide column 227, so that the first side needle module 221 has a certain elastic gap in the horizontal direction, and when the first side needle module 221 abuts against the side surface of the ZI F connector 91, the second side needle module 222 can drive the plurality of horizontal probes 226 to continuously move to the ZI F connector 91, so that the plurality of horizontal probes 226 extend out from the side surface of the first side needle module 221.
The second side needle module 222 of the side needle module 22 is fixedly connected with the third side needle module 223 through a horizontal support column 228, and the fourth side needle module 224 and the fifth side needle module 225 are fixedly connected with the third side needle module 223 through a locking member. The second side pin mold 222 and the third side pin mold 223 are spaced apart from each other by a large distance and are fixed to each other by a horizontal support member 228. The fourth side pin mold 224 and the fifth side pin mold 225 are fixed to the side surface of the third side pin mold 223 by means of screws, bolts, or the like.
As shown in fig. 1 and fig. 2, in the first testing pin mold assembly 20 provided by the present invention, the second side pin mold 222 and the third side pin mold 223 in the side pin mold 22 are movably connected to the moving platform 23. The second side needle module 222 and the third side needle module 223 are connected to the movable platform 23 through movable copper sleeves, so that a certain movable gap is formed between the side needle module 22 and the movable platform 23 in the horizontal moving direction.
As shown in fig. 4, it is a schematic perspective view of the moving platform 23 in the first testing pin mold assembly 20 according to the present invention. The moving platform 23 of the first testing pin mold assembly 20 includes a horizontal mounting plate 231 fixed on the carrier plate 10, a linear guide rail 232 fixed on the horizontal mounting plate 231, and a driving member 233 fixed below the horizontal mounting plate 231. The two side surfaces of the horizontal mounting plate 231 are mounted on the carrier plate 10, the linear guide rail 232 and the driving member 233 are respectively located on the top surface and the bottom surface of the horizontal mounting plate 231, and the side needle module 22 located above the horizontal mounting plate 231 is driven by the driving member 233 to horizontally move along the setting direction of the linear guide rail 232. As shown in fig. 4, the linear guide 232 is provided with a mounting bracket 234 fixedly connected to the side position pin die set 22, the bottom of the mounting bracket 234 is fixedly connected to the driving member 233, and the top thereof is movably connected to the second side position pin die 222 and the third side position pin die 223 of the side position pin die set 22. The driving member 233 is fixedly connected to the mounting bracket 234 via a transmission member 235. The driving member 235 extends from the lower portion to the upper portion through the horizontal mounting plate 231 and is fixedly connected to the mounting bracket 234. In this embodiment, the driving member 233 disposed below the horizontal mounting plate 231 is a driving cylinder, and a driving rod of the driving cylinder is movably connected to the transmission member 235, so that the transmission member 235 drives the mounting bracket 234 disposed above the transmission member to move horizontally along the linear guide 232.
Fig. 5 is an exploded view of the second testing pin mold assembly 30 in the carrier board assembly 100 according to the present invention. The utility model provides a needle template group 31 and a plurality of that are vertical setting wear to locate the vertical probe 32 of needle template group 31 on being fixed in support plate 10 are tested to second test needle template subassembly 30, and this needle template group 31 distributes from top to bottom in proper order, and vertical probe 32 runs through whole needle template group 31. The utility model provides a quantity of the vertical probe 32 that sets up in the second test needle module assembly 30 is relevant with the structure of the B2B connector 92 on the flexible circuit board 90. The number of test points that the B2B connector 92 needs to test determines the number and location of the vertical probes 32 in the second test pin die assembly 30.
The needle module group 31 in the second testing needle module 30 includes a first needle module 311 for placing the B2B connector 92 and a cover plate 317 hinged on the first needle module 311 for pressing the B2B connector 92 onto the first needle module 311. When the cover plate 317 disposed above the first pin die 311 is in an initial state, the cover plate 317 is disposed perpendicular to the first pin die 311, so that the B2B connector 92 of the flexible circuit board 90 to be tested can be placed on the top surface of the first pin die 311. After the B2B connector 92 is placed in the first pin mold 311, the cover plate 317 is rotated to cover the first pin mold 311, so that the B2B connector 92 is pressed against the first pin mold 311 by the cover plate 317, thereby facilitating the subsequent testing operation.
As shown in fig. 2, the needle mold set 31 of the second testing needle mold assembly 30 of the present invention further includes a second needle mold 312, a third needle mold 313, a fourth needle mold 314, and a fifth needle mold 315 vertically arranged at the bottom of the first needle mold 311. The first pin dies 311 to the fifth pin dies 315 in the pin die set 31 are sequentially distributed from top to bottom. As shown in fig. 5, the vertical probe 32 in the second testing pin mold assembly 30 extends from the top of the first pin mold 311 and then abuts against the B2B connector 92 on the first pin mold 311. When the B2B connector 92 on the first needle die 311 abuts against the vertical probe 32, the OS test for the B2B connector 92 is achieved by the second test needle die assembly 30.
In this embodiment, the first needle mold 311 and the second needle mold 312 in the needle mold group 31 are movably connected, and the first needle mold 311 and the second needle mold 312 are connected through a movable copper sleeve, so that a movable gap in the vertical direction between the first needle mold 311 and the second needle mold 312 is realized. The second needle mold 312 is fixedly connected with the third needle mold 313 through a vertical support column 316, and the fourth needle mold 314 and the fifth needle mold 315 are fixedly connected with the third needle mold 313.
As shown in fig. 4, a positioning groove 3111 for placing the B2B connector 92 and a mounting groove 3112 for connecting the cover plate 317 are provided on the top surface of the first pin mold 311 of the pin mold block set 31. The positioning groove 3111 on the first pin mold 311 is used to define the relative position of the B2B connector 92 of the flexible circuit board 90 in the horizontal direction on the first pin mold 311. The hinged cover 317 of the first pin die 311 is used to define the relative position of the B2B connector 92 on the first pin die 311 in the vertical direction. The mounting groove 3112 on the side of the first needle mold 311 is used for connecting the cover plate 317, and the cover plate 317 can rotate relative to the first needle mold 311. A rotating shaft 3113 hinged to the cover plate 317 is disposed in the mounting groove 3112. The shaft 3113 is disposed in the mounting groove 3112 of the first needle mold 311 through the cover plate 317, and is fixed in the mounting groove 3112 by two screws.
In this embodiment, the cover 317 of the pin template set 31 includes a base 3171, a metal compact 3172 disposed at one end of the base 3171, and a connection block 3173 disposed at the other end of the base 3171. The metal pressing block 3172 and the connecting block 3173 are both located at the bottom of the base plate 3171, wherein the metal pressing block 3172 of the cover plate 317 can extend into the positioning groove 3111 of the first needle die 311, a magnet 3114 for adsorbing the metal pressing block 3172 is further arranged in the positioning groove 3111 of the first needle die 311, when the cover plate 317 is pressed downwards into the positioning groove 3111 of the first needle die 311, the magnet 3114 located in the first needle die 311 can adsorb the metal pressing block 3172 of the cover plate 317, and the first needle die 311 and the cover plate 317 are relatively fixedly connected. The connecting block 3173 of the cover plate 317 is embedded into the mounting groove 3112 of the first needle mold 311 and hinged with the first needle mold 311 through the rotating shaft 3113, so that the cover plate 317 can be opened and closed relative to the first needle mold 311.
The utility model provides a support plate subassembly 100, set up first test needle module subassembly 20 and second test needle module subassembly 30 simultaneously on support plate 10, first test needle module subassembly 20 can prick the needle test to ZIF connector 91 on the flexible circuit board 90, second test needle module subassembly 30 can carry out the OS test to B2B connector 92 on the flexible circuit board 90, make same support plate subassembly 100 can carry out two kinds of test operation of OS test and prick the needle test simultaneously in test process, thereby promoted the efficiency of software testing to flexible circuit board 90 and shortened test time.
As shown in fig. 6, the three-dimensional structure of the testing apparatus 200 provided by the present invention is schematically illustrated. The utility model also provides a test equipment 200, including frame 210, set up foretell support plate subassembly 100 in frame 210 and set up the sky board subassembly 220 that is located support plate subassembly 100 top in frame 210. During testing, the top plate assembly 220 moves downward onto the carrier board assembly 100, and after the top plate assembly 220 abuts against the carrier board assembly 100, various testing functions on the carrier board assembly 100 are realized. After the test is completed, the top board assembly 220 is separated from the carrier board assembly 100, so that the flexible circuit board 90 can be conveniently taken out of the carrier board assembly 100.
The utility model provides a test equipment 200 has adopted foretell support plate subassembly 100 for test equipment 200 can accomplish two kinds of tests to flexible circuit board 90 in same test procedure, thereby has also promoted efficiency of software testing when having promoted test equipment 200's test function, makes the utility model provides a test equipment 200 is not only can carry out the test of flexible circuit board 90's B2B connector 92, can also be used for the test of flexible circuit board 90's Z IF connector 91.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A carrier plate assembly bears a flexible circuit board to be tested, and a ZIF connector and a B2B connector are arranged on the flexible circuit board, and the carrier plate assembly is characterized by comprising a carrier plate, a first testing pin mold assembly and a second testing pin mold assembly, wherein the first testing pin mold assembly is arranged on the carrier plate and used for testing the ZIF connector of the flexible circuit board, and the second testing pin mold assembly is arranged on the carrier plate and used for testing the B2B connector of the flexible circuit board;
the first testing pin die assembly comprises a product positioning block, a side pin die module and a moving platform, wherein the product positioning block is arranged on the carrier plate and used for fixing the ZIF connector, the side pin die module is horizontally arranged on the side surface of the carrier plate, and the moving platform is arranged on the carrier plate and used for driving the side pin die module to translate;
the second testing needle die assembly comprises a needle die set and a plurality of vertical probes, the needle die set is fixed on the carrier plate and vertically arranged, the vertical probes penetrate through the needle die set, the needle die set comprises a first needle die used for placing the B2B connector and a cover plate hinged to the first needle die and used for pressing the B2B connector onto the first needle die.
2. The carrier assembly of claim 1, wherein the side needle module comprises a first side needle module, a second side needle module, a third side needle module, a fourth side needle module, a fifth side needle module arranged horizontally, and a plurality of horizontal probes penetrating from the first side needle module to the fifth side needle module, wherein the horizontal probes extend from the side of the first side needle module and abut against the ZIF connectors on the product positioning block.
3. A carrier assembly as recited in claim 2 wherein a first side pin die of said side pin die sets is movably connected to a second side pin die by means of flexible guide posts, said second side pin die is fixedly connected to said third side pin die by means of horizontal support posts, and said fourth side pin die and said fifth side pin die are fixedly connected to said third side pin die by means of retaining members.
4. The carrier assembly of claim 2, wherein a second side pin die and a third side pin die of the side pin die set are movably connected to the movable platform.
5. The carrier board assembly as claimed in claim 1, wherein the moving platform includes a horizontal mounting plate fixed on the carrier board, a linear guide fixed on the horizontal mounting plate, and a driving member fixed under the horizontal mounting plate, the linear guide is provided with a mounting bracket fixedly connected to the side pin die set, and the driving member is fixedly connected to the mounting bracket through a transmission member.
6. The carrier board assembly of claim 1, wherein the pin die set further comprises a second pin die, a third pin die, a fourth pin die and a fifth pin die vertically arranged at the bottom of the first pin die, and the vertical probes extend from the top of the first pin die and then abut against the B2B connectors on the first pin die.
7. The carrier board assembly of claim 6, wherein the first pin mold has a positioning groove for placing the B2B connector and a mounting groove for connecting the cover plate, and a rotating shaft hinged to the cover plate is disposed in the mounting groove.
8. The carrier assembly of claim 7, wherein the cover plate comprises a base plate, a metal pressing block disposed at one end of the base plate, and a connecting block disposed at the other end of the base plate, the metal pressing block can extend into the positioning groove of the first pin mold, a magnet for attracting the metal pressing block is further disposed in the positioning groove of the first pin mold, and the connecting block is embedded in the mounting groove of the first pin mold and is hinged to the first pin mold through the rotating shaft.
9. The carrier assembly of claim 6, wherein the first pin die is movably connected to the second pin die, the second pin die is fixedly connected to the third pin die by vertical support posts, and the fourth pin die and the fifth pin die are both fixedly connected to the third pin die.
10. A test apparatus comprising a rack, the loadboard assembly of any of claims 1-9 disposed within the rack, and a ceiling assembly disposed within the rack above the loadboard assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223077678.9U CN218866041U (en) | 2022-11-18 | 2022-11-18 | Support plate assembly and test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223077678.9U CN218866041U (en) | 2022-11-18 | 2022-11-18 | Support plate assembly and test equipment |
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| Publication Number | Publication Date |
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| CN218866041U true CN218866041U (en) | 2023-04-14 |
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| CN202223077678.9U Active CN218866041U (en) | 2022-11-18 | 2022-11-18 | Support plate assembly and test equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115754676A (en) * | 2022-11-18 | 2023-03-07 | 燕麦(杭州)智能制造有限公司 | Test equipment and test method for electrical property test of flexible circuit board |
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2022
- 2022-11-18 CN CN202223077678.9U patent/CN218866041U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115754676A (en) * | 2022-11-18 | 2023-03-07 | 燕麦(杭州)智能制造有限公司 | Test equipment and test method for electrical property test of flexible circuit board |
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