CN218735285U

CN218735285U - IC preheats tool and preheating device

Info

Publication number: CN218735285U
Application number: CN202222344719.XU
Authority: CN
Inventors: 邱长波; 桑建; 陈永铭
Original assignee: Guangzhou Hongli Display Electronics Co ltd
Current assignee: Guangzhou Hongli Display Electronics Co ltd
Priority date: 2022-09-02
Filing date: 2022-09-02
Publication date: 2023-03-24
Anticipated expiration: 2032-09-02

Abstract

The utility model relates to the technical field of electronic product processing, in particular to an IC preheating jig and a preheating device, wherein the IC preheating jig comprises a heat conduction block, the heat conduction block comprises a heated surface and a working surface arranged opposite to the heated surface, and the section size of the heat conduction block is gradually decreased along the direction from the heated surface to the working surface; the preheating device comprises a preheating jig and a heating device, the heating device heats the heating surface, and the problem of poor tin melting effect of the integrated circuit when the integrated circuit is welded on the substrate is solved.

Description

IC preheats tool and preheating device

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electronic product processing technology field especially relates to a IC preheats tool and preheating device.

[ background of the invention ]

An IC, i.e., an integrated circuit, is a microelectronic device or component, in which elements such as semiconductors, resistors, and capacitors, which are necessary for forming a circuit having a certain function, and connecting wires therebetween are all integrated on a small silicon wafer, and then fixed to a substrate by soldering.

However, in the prior art, during soldering, since preheating is not performed, the integrated circuit or the heat absorbing material at the bottom of the substrate absorbs heat during the reflow process of the molten tin, so that the lamp surface area of the substrate is unevenly heated, and the tin melting effect is affected.

[ Utility model ] content

The poor problem of tin effect is melted when solving among the prior art integrated circuit welding on the base plate, the utility model provides a IC preheats tool and preheating device.

The utility model provides a solution to the technical problem to provide an IC preheats tool, including the heat conduction piece, the heat conduction piece includes the heating surface and the working face that sets up opposite with the heating surface, the heat conduction piece section size is followed the heating surface and is decreased progressively towards the working face direction; the working surface is provided with a preheating groove for heating the IC.

Preferably, the heated surface is parallel to the working surface.

Preferably, the center point of the preheating groove is overlapped with the center point of the heat conducting block.

Preferably, the perpendicular distance between the heated surface and the working surface is not less than 2cm.

Preferably, the depth of the preheating groove is 1cm-2cm.

Preferably, heat insulation blocks are arranged at two ends in the preheating groove.

Preferably, the upper surface of the heat insulation block is flush with the working surface.

Preferably, the thermal conductivity of the heat conducting blocks and the thermal insulation blocks is more than 100W/MK.

Preferably, the device comprises a preheating jig and a heating device, wherein the heating device heats the heated surface.

Preferably, the heating device is any one or more of a red-infrared heating device, a laser heating device and a directional microwave heating device.

Compared with the prior art, the utility model discloses a IC preheats tool and preheating device has following advantage:

1. the utility model discloses a IC preheats tool includes the heat conduction piece, and the heat conduction piece is including receiving the hot side and with the working face that receives the hot side and set up relatively, offers the preheating groove that is used for carrying out the heating to IC on the working face, preheats through the preheating groove that sets up on the heat conduction piece earlier before welding IC to the base plate, avoids base plate bottom integrated circuit or heat absorption material to cause base plate lamp face region to be heated unevenly melting tin reflux in-process heat absorption, and the influence melts the tin effect.

2. The utility model discloses a heat conduction piece section size is steadilyd decrease towards the working face direction along being heated, makes the heat can follow to be heated and transmit and concentrate to preheating the inslot towards the working face, has shortened preheating time.

3. The utility model discloses a receive the hot side parallel with the working face, make the heat can follow and receive the hot side to the working face diffusion uniformly to can prevent to damage other parts on the base plate.

4. The utility model discloses a preheat groove central point and heat conduction piece central point and overlap the setting, make and preheat inslot wall heat distribution evenly, strengthened preheating effect.

5. The utility model discloses a receive the perpendicular distance of hot side and working face and be not less than 2cm, avoid other components and parts to contact the heating device to the hot side heating of heat conduction piece on the base plate, cause the damage to other components and parts on the base plate.

6. The utility model discloses a preheat the groove degree of depth and be 1cm-2cm, can make the heat transmit to preheating the inslot fast, make integrated circuit fully preheat simultaneously.

7. The utility model discloses a preheat the groove both ends and be provided with the heat insulating block, set up the heat insulating block and can reduce thermal loss, shorten preheating time.

8. The utility model discloses a thermoblock upper surface and thermoblock top surface parallel and level reduce the calorific loss who preheats the inslot, have shortened preheating time, still prevent other parts on the thermoblock damage base plate simultaneously.

9. The utility model discloses a thermal conductivity coefficient of heat conduction piece higher, be favorable to passing the heat that receives the hot side fast preheating groove in, make the heat pile up fast, shortened preheating time.

10. The utility model discloses well preheating device is including heating device and preheating tool, carries out directional heating to the heating surface of heat conduction piece through heating device, and the heat passes through the heat conduction piece and transmits to preheating inslot, preheats IC before welding IC to the base plate, avoids influencing the tin effect of melting.

[ description of the drawings ]

Fig. 1 is a first schematic view of a heat-conducting block according to a first embodiment of the present invention.

Fig. 2 is a second schematic view of the heat-conducting block according to the first embodiment of the present invention.

Fig. 3 is a third schematic view of the heat-conducting block according to the first embodiment of the present invention.

Fig. 4 is a fourth schematic view of the heat-conducting block according to the first embodiment of the present invention.

Fig. 5 is a front view of a heat-conducting block according to a first embodiment of the present invention.

Fig. 6 is a first schematic view of a preheating jig according to a first embodiment of the present invention.

Fig. 7 is a second schematic view of the preheating jig according to the first embodiment of the present invention.

Fig. 8 is a schematic view of a preheating device according to a second embodiment of the present invention.

Description of the figures:

1. preheating the jig; 2. a preheating device;

11. a working surface; 12. a heated surface; 13. a preheating tank; 14. a heat insulation block; 15. a heat conducting block; 21. a heating device.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1 to 4, a first embodiment of the present invention provides an IC preheating fixture 1, including a heat conducting block 15, the heat conducting block 15 includes a heating surface 12 and a working surface 11 disposed opposite to the heating surface, a cross-sectional dimension of the heat conducting block 15 decreases progressively along the heating surface 12 toward the working surface 11, that is, an area of the working surface 11 is smaller than an area of the heating surface 12, and a preheating groove 13 for accommodating an IC and heating the IC is disposed on the working surface 11. The preheating groove 13 formed in the working surface 11 of the heat-conducting block 15 allows the IC to be preheated by the preheating groove 13 before the IC is soldered to the substrate.

It can be understood that, as the size of the cross section of the heat conducting block 15 decreases progressively along the direction from the heated surface 12 to the working surface 11, the heat received by the heated surface 12 is transferred towards the working surface 11, and meanwhile, the heat can be concentrated in the preheating groove 13 formed in the working surface 11, so that the heating efficiency can be improved, and the preheating time can be shortened.

Optionally, the preheating groove 13 is a through groove or a key groove;

it can be understood that the through groove, i.e. the two ends of the preheating groove 13, are open ends, which facilitates the opening of the preheating groove 13 on the heat conducting block 15 in the processing process; the groove wall of the key groove surrounds the IC, so that heat loss is less in the heating process, and the preheating effect is enhanced.

Furthermore, the size of the preheating groove 13 is customized according to the sizes of different ICs, and the requirement that the size of the preheating groove 13 is slightly larger than that of the ICs is met, so that on one hand, the situation that the ICs contact the inner peripheral wall of the preheating groove 13 during preheating and damage the ICs is caused can be avoided, on the other hand, the reduction of the temperature of the preheating groove 13 can be slowed down, and the preheating time is shortened;

it should be noted that, in the present embodiment, the heat receiving surface 12 defined for the heat conducting block 15 is a surface of the heat conducting block 15 receiving heat, the working surface 11 is a surface of the heat conducting block 15 terminating heat transfer, and the working surface 11 and the heat receiving surface 12 are arranged opposite to each other, the heat conducting block 15 is heated by the heating device 21, the heat is transferred to the working surface 11 direction through the heat conducting block 15, the preheating groove 13 is formed in the working surface 11, the heat is finally collected to the inner wall of the preheating groove 13, so that the IC is conveniently placed in the preheating groove 13 for preheating, and therefore, the backflow of molten tin caused by uneven heating is avoided.

The specific shape of the heat conduction block 15 is not limited, and may include, but is not limited to, a truncated cone shape, a truncated pyramid shape, and the like, as long as the sectional dimension of the heat conduction block 15 decreases from the heat receiving surface 12 to the working surface 11.

Further, the heated surface 12 is parallel to the working surface 11, so that heat can be uniformly transferred from the heated surface 12 to the working surface 11, temperature imbalance of different positions of the preheating groove 13 is avoided, the IC can be fully preheated, and meanwhile, the substrate can be prevented from being damaged by the working surface 11.

It should be noted that, as a preferred embodiment, in order to better ensure that the IC is uniformly heated during the preheating process, the slopes of the inclined planes connecting the heating surface 12 and the working surface 11 should be equal, that is, before the heat conduction block 15 is not provided with the preheating groove 13, the cross section of the heat conduction block 15 along the direction perpendicular to the heating surface 12 is substantially isosceles trapezoid, so that the temperatures of the inner walls of the preheating grooves 13 are all equal, thereby ensuring that the IC is uniformly heated.

Further, the central point of the preheating groove 13 and the central point of the heat conducting block 15 are overlapped, it should be noted that the overlapped arrangement here means that the geometric central point of the preheating groove 13 and the geometric central point of the heat conducting block 15 are on the same straight line perpendicular to the heated surface 12, or it can be understood that, along the projection direction of the straight line perpendicular to the heated surface 12, the geometric central point of the preheating groove 13 and the geometric central point of the heat conducting block 15 are overlapped, and by such a design, the heat can be uniformly diffused into the preheating groove 13, and the IC is prevented from being heated unevenly during preheating.

Further, referring to fig. 5, the vertical distance B between the heated surface 12 and the working surface 11 is not less than 2cm, considering that most ICs are smaller components, the smaller the distance between the working surface 11 and the heated surface 12 during the preheating process, the faster the heat transfer speed from the heated surface 12 to the working surface 11, but in order to avoid that the device for heating the heated surface 12 directly contacts the substrate or other components on the substrate, the safe distance between the heated surface 12 and the working surface 11 needs to be not less than 2cm.

Further, the depth A of the preheating groove 13 is 1cm-2cm, heat is rapidly accumulated on the inner wall of the preheating groove 13 in actual work, meanwhile, the depth A of the preheating groove 13 needs to be larger than the thickness of the IC, the IC to be preheated can be completely placed into the preheating groove 13 for sufficient preheating, and damage to the IC caused by the inner wall of the preheating groove 13 is avoided.

The depth a of the preheating bath 13 is always required to be smaller than the vertical distance B between the heat receiving surface 12 and the working surface 11.

Further, referring to fig. 6 to 7, two ends of the preheating groove 13 are provided with heat insulation blocks 14, the heat insulation blocks 14 and the heat conduction blocks 15 may be detachably connected, or may be integrally formed with the heat conduction blocks 15, that is, after the preheating groove 13 is formed, the heat insulation blocks 14 close the opening end of the preheating groove 13 in a clamping manner, or the heat conduction blocks 15 are manufactured, and at the same time, the size of the preheating groove 13 is obtained according to the size of the IC, and the size is integrally formed through a mold; the heat insulation blocks 14 can well prevent heat from losing from the openings at the two ends of the preheating groove 13, so that the temperature in the preheating groove 13 is ensured to be stable and constant, and the preheating effect is enhanced; it should be noted that, the heat insulation block 14 is not arranged to interfere with the IC, that is, after the heat insulation block 14 is arranged in the preheating groove 13, the space for preheating the IC is still slightly larger than the size of the IC, so as to ensure that the IC is not damaged in the preheating process.

Further, the upper surface of the heat insulation block 14 is flush with the working surface 11, the heat insulation block 14 is completely placed in the preheating groove 13, and the upper surface of the heat insulation block 14 higher than the working surface 11 can damage the substrate or the parts on the substrate in the preheating process; the reason why the heat insulation blocks 14 are flush with the working surface 11 is mainly to prevent heat loss, so that the temperature in the preheating tank 13 is always kept in a constant range, and the preheating time is reduced.

Further, the thermal conductivity of the heat conducting block 15 and the heat insulating block 14 is greater than 100W/MK, wherein, in order to avoid the influence caused by the difference of the thermal expansion coefficients of the heat insulating block 14 and the heat conducting block 15 during the preheating process, preferably, the heat insulating block 14 and the heat conducting block 15 of the embodiment are made of the same material, which can be heat conducting insulating elastic rubber, graphene, heat conducting silicone grease, and the like, and both have the characteristics of high thermal conductivity and excellent physical properties; preferably, the graphene is used as the heat conduction material in the embodiment, and compared with other materials, the graphene has excellent physical properties such as high heat conduction coefficient and high temperature resistance, and stable chemical properties, and can well perform a heat conduction function.

Referring to fig. 3, fig. 4 and fig. 8, a second embodiment of the present invention provides a preheating device 2, the preheating device 2 includes a heating device 21 and a preheating fixture 1, the heating device 21 is disposed on one side of the heated surface 12 of the heat conducting block 15 for heating the heated surface 12, heat is transferred to the preheating tank 13 through the heat conducting block 15 to preheat the IC, it should be noted that, in order to prevent the heating device 21 from damaging the substrate and other components on the substrate during the heating process, the heating device 21 only heats the heated surface 12 of the heat conducting block 15.

Further, the heating device 21 may be an infrared heating device 21, a laser heating device 21 or a directional microwave heating device 21, and it should be noted that infrared heating, directional microwave heating and laser heating are all prior art, and all have the advantages of fast heating speed and high efficiency, and ensure that in the preheating process, the temperature can be raised quickly, the preheating time is shortened, and the preheating effect is enhanced.

Further, the working principle of the embodiment is briefly described as follows: before welding the IC to the substrate, the preheating device 2 provided by the utility model preheats the IC, the specific steps are that the heat conducting blocks 15 with different sizes are selected according to the specific size of the IC, and the heat conducting blocks 15 can be made of graphene materials, so that the heating efficiency is improved; a preheating groove 13 corresponding to the size of an IC is formed in a working surface 11 of a heat conduction block 15, the size of the preheating groove 13 needs to be slightly larger than that of the IC, the IC is conveniently placed in and taken out in the preheating process, a heated surface 12 of the heat conduction block 15 is fixedly arranged on a heating device 21, the heating device 21 is turned on, the heated surface 12 of the heat conduction block 15 is directionally heated, the section size of the heat conduction block 15 is gradually reduced from the heated surface 12 to the working surface 11, heat is collected in the preheating groove 13 in the upward transfer process, the IC needing to be preheated is placed in the preheating groove 13 for preheating, meanwhile, in order to ensure the preheating temperature, a thermocouple can be used for measuring the temperature of the heat conduction block 15 and the preheating groove 13 in the preheating process, the thermocouple is the prior art, the thermocouple has the advantages of simplicity in use, large temperature measurement range and high use precision, an operator can conveniently control the preheating temperature and the preheating time in time, the IC is taken out and welded to a substrate after the preheating is finished, and the phenomenon that the heat absorption of the IC at the bottom of the substrate or heat absorption material in the reflow process to cause the substrate to cause the unbalanced heating area of a substrate lamp surface is avoided, so that the tin melting effect is affected.

9. The utility model discloses a heat conduction block's thermal conductivity coefficient is higher, is favorable to reaching the heat that receives the hot side fast and preheats the inslot, makes the heat pile up fast, has shortened preheating time.

10. The utility model discloses well preheating device is including heating device and heat conduction piece, carries out directional heating to the face that receives of heat conduction piece through heating device, and the heat passes through the heat conduction piece and transmits to preheating inslot, preheats IC before welding IC to the base plate, avoids influencing the tin effect of melting.

The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the present invention, and any modification, equivalent replacement and improvement made within the principle of the present invention should be included in the scope of the present invention.

Claims

1. An IC preheating jig is characterized by comprising a heat conduction block, wherein the heat conduction block comprises a heating surface and a working surface opposite to the heating surface, and the size of the section of the heat conduction block is gradually reduced along the direction from the heating surface to the working surface; the working surface is provided with a preheating groove for heating the IC.

2. The IC preheating jig of claim 1, wherein the heated surface is parallel to the working surface.

3. The IC preheating jig of claim 1, wherein a center point of the preheating groove is overlapped with a center point of the heat conducting block.

4. The IC preheating jig of claim 2, wherein a vertical distance between the heated surface and the working surface is not less than 2cm.

5. The IC preheating jig of claim 4, wherein the preheating groove has a depth of 1cm-2cm.

6. The IC preheating jig of claim 1, wherein heat insulation blocks are disposed at both ends of the preheating groove.

7. The IC preheating jig of claim 6, wherein the upper surface of the heat insulation block is flush with the working surface.

8. The IC preheating jig of claim 6, wherein the thermal conductivity of the heat conducting block and the thermal insulation block is greater than 100W/MK.

9. A preheating device, comprising the preheating jig according to any one of claims 1 to 8 and a heating device, wherein the heating device heats the heated surface.

10. The preheating device according to claim 9, wherein the heating device is any one or more of a red-infrared heating device, a laser heating device and a directional microwave heating device.