TWI439200B - Method of desoldering an electrical component and thermally conductive module - Google Patents
Method of desoldering an electrical component and thermally conductive module Download PDFInfo
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Description
本發明是有關於一種電子元件解焊方法以及用以輔助該解焊方法的導熱模組，特別是指一種利用導熱材料輔助進行加熱的解焊方法以及該導熱材料形成的導熱件。The invention relates to a soldering method for electronic components and a heat conducting module for assisting the soldering method, in particular to a soldering method for assisting heating by using a heat conductive material and a heat conducting member formed by the heat conducting material.
在較大型的電子裝置中(例如工業電腦、伺服器等等)，為確保其可靠度與使用壽命，並且避免使用中的任何當機與故障，其電路板尺寸與厚度通常較大而厚，銅箔層數也通常較多，而這樣的電路板在組裝過程較容易遭遇到困難的一個環節是在於為重工的需要而進行解焊時。In larger electronic devices (such as industrial computers, servers, etc.), the board size and thickness are usually large and thick to ensure reliability and longevity, and to avoid any downtime and failure in use. The number of copper foil layers is also usually large, and one of the difficulties that such a circuit board is more difficult to encounter during assembly is that it is desoldered for heavy work.
在進行解焊時，通常是將電路板放在盛裝有錫液的錫爐上，利用高溫的錫液使已經凝固附著在電路板的錫料再度熔化，以便於將電子元件由電路板分離。In the case of desoldering, the circuit board is usually placed on a tin furnace containing tin liquid, and the tin material which has solidified and adhered to the circuit board is re-melted by the high-temperature tin liquid to facilitate separation of the electronic components from the circuit board.
然而，當欲進行解焊的電路板厚度越厚且銅箔層數越多時，由於一部分的熱能會被各銅箔層散掉，因此，較難以讓焊料到達解焊溫度而熔化至可將電子元件與電路板分離的程度，而若為了讓焊料到達解焊溫度而拉長電路板放置在錫爐上的時間，則容易發生電路板上焊接處的銅箔電路也會被熔解而形成斷路，甚至使整片電路板報廢的問題，因而降低電路板重工的良率與品質。However, when the thickness of the board to be desoldered is thicker and the number of copper foil layers is larger, since a part of the thermal energy is scattered by the respective copper foil layers, it is more difficult to allow the solder to reach the desoldering temperature and melt to The degree to which the electronic component is separated from the circuit board. If the time for the soldering to extend the circuit board on the soldering furnace is to allow the solder to reach the soldering temperature, the copper foil circuit at the soldering portion on the circuit board is likely to be melted to form an open circuit. Even the problem of scrapping the entire board, thus reducing the yield and quality of the board rework.
因此，本發明之目的，即在提供一種可使電路板上的焊料較容易到達解焊溫度而可提高解焊良率與品質的電子元件解焊方法，且該方法亦可被使用於電子元件的焊接而提高焊接品質。Accordingly, it is an object of the present invention to provide an electronic component desoldering method which can improve soldering yield and quality by allowing solder on a circuit board to easily reach the soldering temperature, and the method can also be applied to electronic components. Welding improves welding quality.
本發明的另一個目的，在於提供一種用以輔助前述解焊方法與焊接方法進行的導熱模組。Another object of the present invention is to provide a heat conducting module for assisting the aforementioned soldering method and soldering method.
本發明電子元件解焊方法包含以下步驟：步驟A：放置一導熱件於一電子元件並且與該電子元件的複數接腳接觸。The electronic component desoldering method of the present invention comprises the following steps: Step A: placing a heat conducting member on an electronic component and contacting a plurality of pins of the electronic component.
步驟B：對導熱件加熱，使熱能經導熱件傳導至接腳。Step B: heating the heat conductive member to conduct heat energy to the pins via the heat conductive member.
步驟C：由電路板底面對接腳加熱。Step C: The substrate is heated by the bottom surface of the board.
其中，該電子元件為插槽連接器，且該導熱件縱向斷面大致呈T型而能伸入該電子元件的插槽內。Wherein, the electronic component is a socket connector, and the heat conducting member has a substantially T-shaped longitudinal section and can protrude into the slot of the electronic component.
前述電子元件解焊方法也可以應用在對電子元件焊接，其包含以下步驟：步驟A：放置一導熱件於一電子元件並且與該電子元件的複數接腳接觸。The foregoing electronic component soldering method can also be applied to soldering electronic components, which comprises the following steps: Step A: placing a heat conducting component on an electronic component and contacting a plurality of pins of the electronic component.
步驟B：對導熱件加熱，使熱能經導熱件傳導至接腳。Step B: heating the heat conductive member to conduct heat energy to the pins via the heat conductive member.
步驟C：將電路板放置於一盛裝有錫液的容器上，使接腳與錫液接觸。Step C: Place the circuit board on a container filled with tin liquid so that the pins are in contact with the tin liquid.
本發明導熱模組用以將一熱源提供的熱能傳導至一電子元件的複數接腳，且該電子元件形成有一插槽，該等接腳伸入該插槽內，該導熱模組包含一導熱件，該導熱件包括一插板部與一頂板部。該插板部呈直立方向延伸而可供伸入該電子元件的插槽並且與該等接腳接觸，該頂板部呈橫向延伸連接該插板部而可供外露於該插槽，接收該熱源提供的熱能。The heat conduction module of the present invention is configured to conduct thermal energy provided by a heat source to a plurality of pins of an electronic component, and the electronic component forms a slot into which the pins extend. The heat conduction module includes a heat conduction. The heat conducting member comprises a plug portion and a top portion. The insertion plate portion extends in an upright direction to extend into the slot of the electronic component and is in contact with the pins, and the top plate portion extends laterally to connect the insertion plate portion for being exposed to the slot to receive the heat source The heat provided.
本發明之功效在於，利用導熱件與電子元件的接腳接觸，並且藉由對導熱件加熱，使熱能可傳導至電子元件的接腳，除了可解決以往由於電路板厚度太厚或銅箔層數太多導致解焊不易的問題之外，將其應用於焊接時，也可增加焊料的附著量而提高焊接的品質。The utility model has the advantages that the heat conducting member is in contact with the pin of the electronic component, and by heating the heat conducting member, the heat energy can be transmitted to the pin of the electronic component, except that the thickness of the circuit board is too thick or the copper foil layer can be solved. In addition to the problem that too many leads to unsealable welding, when applied to welding, the amount of solder adhered can also be increased to improve the quality of soldering.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之三個較佳實施例的詳細說明中，將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of FIG.
在本發明被詳細描述之前，要注意的是，在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.
在介紹本發明電子元件解焊方法的較佳實施例之前，須先行說明的是，參閱圖1，以下所指的電子元件2為一插槽連接器(例如卡緣連接器)，該電子元件2包括一絕緣本體20以及複數根設置在絕緣本體20的接腳22，絕緣本體20大致呈長條狀並且形成有一沿絕緣本體20的長度方向(垂直圖面的方向)延伸的插槽21，該等接腳22沿絕緣本體20的長度方向排列設置並且均伸入插槽21內，且接腳22的底端往下外露出絕緣本體20底部並且穿伸通過一電路板3的穿孔31而藉由焊料4(如焊錫)附著在電路板3底面而焊接固定。Before describing the preferred embodiment of the electronic component soldering method of the present invention, it should be noted that, referring to FIG. 1, the electronic component 2 referred to below is a socket connector (for example, a card edge connector), and the electronic component 2 includes an insulative housing 20 and a plurality of pins 22 disposed on the insulative housing 20, the insulative housing 20 is substantially elongated and formed with a slot 21 extending along the longitudinal direction of the insulative housing 20 (in the direction of the vertical plane). The pins 22 are arranged along the length direction of the insulative housing 20 and extend into the slot 21, and the bottom end of the pin 22 extends outwardly to expose the bottom of the insulative housing 20 and extend through the through hole 31 of a circuit board 3. Soldering is fixed by solder 4 (such as solder) attached to the bottom surface of the circuit board 3.
此外，參閱圖2，該電子元件解焊方法是配合一導熱模組100進行，該導熱模組100包含一導熱件1與一隔熱墊7。導熱件1包含一插板部11、一頂板部12。插板部11呈直立方向延伸的板片並且具有一頂緣110、一底緣111以及相反的一第一表面112與一第二表面113，頂板部12為呈橫向水平延伸的板片連接在插板部11頂緣110，使得頂板部12與插板部11相連接的結構縱向斷面呈T形，且頂板部12具有一頂面121。較佳者，導熱件1的材質可以為銅或其他導熱性較佳的材質，且導熱件1的結構可為一體成型。In addition, referring to FIG. 2 , the electronic component de-soldering method is performed in conjunction with a thermal conductive module 100 . The thermal conductive module 100 includes a heat conducting component 1 and a thermal pad 7 . The heat conducting member 1 includes a plug portion 11 and a top plate portion 12. The inserting portion 11 has a plate extending in an upright direction and has a top edge 110, a bottom edge 111 and an opposite first surface 112 and a second surface 113. The top plate portion 12 is connected to the horizontally horizontally extending plate. The top edge 110 of the insertion plate portion 11 is such that the longitudinal section of the structure in which the top plate portion 12 and the insertion plate portion 11 are connected is T-shaped, and the top plate portion 12 has a top surface 121. Preferably, the material of the heat conducting member 1 may be copper or other material having better thermal conductivity, and the structure of the heat conducting member 1 may be integrally formed.
隔熱片7則可為環形片狀的隔熱材質。The heat insulating sheet 7 can be an annular sheet-shaped heat insulating material.
參閱圖3，本發明電子元件解焊方法的較佳實施例包含以下步驟：步驟61：放置導熱件於電子元件並且與電子元件的接腳接觸。配合參閱圖2、圖4，在本實施例中，是將導熱件1以其插板部11伸入電子元件2的插槽21內，使插板部11兩側的第一表面112與第二表面113分別與插槽21內的各接腳22接觸，而頂板部12則外露於插槽21上方，且較佳者，插板部11的底緣111也可以形成有導角，以便於較容易伸入電子元件2的插槽21內。Referring to FIG. 3, a preferred embodiment of the method of soldering an electronic component of the present invention comprises the following steps: Step 61: placing a heat conducting member on the electronic component and contacting the pin of the electronic component. Referring to FIG. 2 and FIG. 4, in the embodiment, the heat conducting member 1 is inserted into the slot 21 of the electronic component 2 with the inserting portion 11 so that the first surface 112 and the first side of the inserting portion 11 are The two surfaces 113 are respectively in contact with the pins 22 in the slot 21, and the top plate portion 12 is exposed above the slot 21, and preferably, the bottom edge 111 of the card portion 11 can also be formed with a lead angle for facilitating It is easier to protrude into the slot 21 of the electronic component 2.
步驟62：設置隔熱墊於導熱件與絕緣本體之間。配合參閱圖2、圖4，此一步驟可在步驟61之前進行，亦即，先將隔熱墊7套設在導熱件1位於頂板部12底面，或放置於電子元件2的絕緣本體20上並且位於插槽21的外圍，使得當導熱件1被放置在電子元件2上時，隔熱墊7位於頂板部12底面與電子元件2的絕緣本體20之間，或者，隔熱墊7也可以是在導熱件1被製造成型之後即預先固定在導熱件1的頂板部12底面。Step 62: Disposing a heat insulating pad between the heat conducting member and the insulating body. Referring to FIG. 2 and FIG. 4, this step can be performed before step 61, that is, the heat insulating pad 7 is first placed on the bottom surface of the top plate portion 12 or placed on the insulating body 20 of the electronic component 2. And located at the periphery of the slot 21, such that when the heat conducting member 1 is placed on the electronic component 2, the heat insulating pad 7 is located between the bottom surface of the top plate portion 12 and the insulating body 20 of the electronic component 2, or the heat insulating pad 7 can also After the heat conductive member 1 is manufactured, it is fixed to the bottom surface of the top plate portion 12 of the heat conductive member 1 in advance.
步驟63：對導熱件加熱，使熱能經導熱件傳導至接腳。配合參閱圖5，在本實施例中，是使用一熱風槍51配合一熱風罩52設置在頂板部12頂面121而對導熱件1的頂板部12加熱，並且藉由插板部11的第一表面112及第二表面113與接腳22接觸而使熱能可經由插板部11傳導至接腳22，進而傳導至附著於電路板3底面並且連接接腳22與電路板3的焊料4處。Step 63: Heating the heat conductive member to conduct heat energy to the pin via the heat conductive member. Referring to FIG. 5, in the present embodiment, a hot air gun 51 is used to fit the top surface 121 of the top plate portion 12 with a hot air hood 52 to heat the top plate portion 12 of the heat conductive member 1, and the first portion of the heat transfer member 11 is used. A surface 112 and a second surface 113 are in contact with the pin 22 so that thermal energy can be conducted to the pin 22 via the card portion 11, and thereby to the solder 4 attached to the bottom surface of the circuit board 3 and connecting the pin 22 to the circuit board 3. .
步驟64：由電路板底面對接腳加熱。配合參閱圖5，此一步驟可在步驟63之前進行或一併進行，在本實施例中，是將電路板3連同焊接於其上的電子元件1放置於一盛裝有錫液的錫爐8上，使電子元件的接腳22甚至連同附著於電路板3底面的焊料4與高溫的錫液接觸，藉以熔化焊料4。Step 64: heating the bottom surface of the circuit board by the pins. Referring to FIG. 5, this step can be performed before or after step 63. In this embodiment, the circuit board 3 and the electronic component 1 soldered thereon are placed in a tin furnace 8 containing tin liquid. On the other hand, the pins 22 of the electronic component are brought into contact with the high-temperature tin liquid even with the solder 4 attached to the bottom surface of the circuit board 3, whereby the solder 4 is melted.
當附著於電路板3底面的焊料4被加熱到達解焊溫度而熔化之後，便可將電子元件2往上與電路板3分離，完成解焊作業。When the solder 4 attached to the bottom surface of the circuit board 3 is heated to reach the desoldering temperature and melted, the electronic component 2 can be separated from the circuit board 3 to complete the desoldering operation.
補充說明的是，在進行步驟63與步驟64之前，也可以先對電路板3預熱以縮短需要加熱的時間。It should be noted that before performing step 63 and step 64, the circuit board 3 may also be preheated to shorten the time required for heating.
此外，前述步驟63中，藉由熱風槍51配合熱風罩52，是可控制頂板部12的受熱區域，但對導熱件1加熱也可以單獨使用熱風槍直接對導熱件1的頂板部12加熱，或者，熱風槍52也可以替換成其他電熱式加熱器或溫控式加熱器等。Further, in the above step 63, the heat hood 52 is coupled to the hot hood 52 to control the heat receiving area of the top plate portion 12. However, the heat transfer member 1 may be heated by the heat gun directly, and the top plate portion 12 of the heat conductive member 1 may be directly heated. Alternatively, the heat gun 52 may be replaced with other electrothermal heaters or temperature-controlled heaters and the like.
而設置隔熱墊7的作用則在於可避免導熱件1在被加熱的過程中，高溫的頂板部12會燒傷電子元件2的絕緣本體20，當然，隔熱墊7也可以是呈複數條狀分別設置在頂板部12的底面兩側。The function of the heat insulating pad 7 is to prevent the high temperature top plate portion 12 from damaging the insulating body 20 of the electronic component 2 during the heating process. Of course, the heat insulating pad 7 may also be in a plurality of strips. They are respectively disposed on both sides of the bottom surface of the top plate portion 12.
由上述內容可知，本發明除了將電路板3放置在錫爐8上而利用高溫的錫液加熱焊料4以外，更藉由被加熱的導熱件1對接腳22的導熱而增加解焊的加熱路徑，使附著於電路板3底面的焊料4較容易到達解焊溫度而熔化，以利於後續的重工作業，除此之外，藉由上下兩個熱源51、8同時對電子元件2的接腳22與焊料4加熱，也可避免電路板3需要耗費較長時間與熱源接觸而導致電路燒毀。As apparent from the above, the present invention increases the heat-dissipating heating path by the heat conduction of the heated heat-conducting member 1 to the butt-hole 22, except that the circuit board 3 is placed on the tin furnace 8 and the solder 4 is heated by the high-temperature tin liquid. Therefore, the solder 4 attached to the bottom surface of the circuit board 3 is more easily melted to reach the desolding temperature to facilitate subsequent heavy work, and in addition, the pins 22 of the electronic component 2 are simultaneously simultaneously by the upper and lower heat sources 51, 8. Heating with the solder 4 also prevents the circuit board 3 from taking a long time to come into contact with the heat source to cause the circuit to burn out.
參閱圖6，前述的電子元件焊接方法也可以應用在對電子元件2的焊接作業上，其做法步驟大致與前述解焊方法的步驟相同，不同的地方是在於，電子元件2的接腳22僅是穿伸在電路板3的穿孔31內而尚未有焊料附著，且在對應前述步驟64的做法中，是直接將電路板3放置於盛裝有錫液的錫爐8上，使電子元件2接腳22凸出電路板3底面的部分浸泡在錫液內而可讓錫液附著於接腳22及電路板3底面，且值得注意的是，藉由被加熱的導熱件1將熱能傳導至接腳22，可使接腳22保持於一定的高溫，使附著於電路板3穿孔31內的錫液不至於太快凝固，進而，便能讓較多的錫液填充附著於穿孔31內而增加上錫率，並且縮短上錫時間，達到較佳的焊接品質。Referring to FIG. 6, the foregoing electronic component soldering method can also be applied to the soldering operation of the electronic component 2, and the method of the method is substantially the same as the step of the soldering method described above, except that the pin 22 of the electronic component 2 is only It is inserted into the through hole 31 of the circuit board 3 without solder adhesion, and in the corresponding step 64, the circuit board 3 is directly placed on the tin furnace 8 containing the tin liquid, so that the electronic component 2 is connected. The portion of the foot 22 protruding from the bottom surface of the circuit board 3 is immersed in the tin liquid to allow the tin liquid to adhere to the bottom surface of the pin 22 and the circuit board 3, and it is noted that the heat conduction is conducted by the heated heat conducting member 1. The foot 22 can maintain the pin 22 at a certain high temperature, so that the tin liquid adhered to the through hole 31 of the circuit board 3 does not solidify too quickly, and thus, more tin liquid filling can be adhered to the through hole 31 to increase The tin ratio is increased, and the tinning time is shortened to achieve better soldering quality.
參閱圖7、圖8，為導熱件1’的另一種變化態樣，其中，導熱件1’的插板部11’更具有二由第一表面112凹陷形成的第三表面114與一由第二表面113凹陷形成的第四表面115，第三表面114較第一表面112鄰近第二表面113，第四表面115較第二表面113鄰近第一表面112，換句話說，插板部11’在其長度方向上部分位置的厚度較薄而部分位置的厚度較厚。Referring to FIG. 7 and FIG. 8 , another variation of the heat conducting member 1 ′, wherein the inserting portion 11 ′ of the heat conducting member 1 ′ further has two third surfaces 114 formed by the first surface 112 recessed and The second surface 113 is recessed to form a fourth surface 115. The third surface 114 is adjacent to the second surface 113 than the first surface 112. The fourth surface 115 is adjacent to the first surface 112 than the second surface 113. In other words, the insertion portion 11' The thickness of the partial position in the longitudinal direction is thin and the thickness of the partial position is thick.
當插板部11’伸入插槽21時，第三表面114與第四表面115的區域由於凹陷的關係而不會與對應的接腳22接觸，藉此可控制導熱件1’的插板部11’只與部分接腳22接觸，換言之，導熱件1’這樣的結構設計其作用在於針對特定幾個位置的接腳22比較容易出現瑕疵或無法進行重工或拆解，故藉由在導熱件1’的第一表面112與第二表面113局部的特定位置凹陷，便能控制只讓導熱件1’的部分表面與接腳22接觸。When the insertion plate portion 11' protrudes into the slot 21, the regions of the third surface 114 and the fourth surface 115 are not in contact with the corresponding pins 22 due to the concave relationship, whereby the insertion plate of the heat conductive member 1' can be controlled. The portion 11' is only in contact with the partial pins 22, in other words, the structural design of the heat-conducting member 1' is such that the pins 22 for a certain number of positions are relatively easy to be defective or cannot be reworked or disassembled, so that heat conduction is performed. The first surface 112 of the piece 1' and the specific position of the second surface 113 are partially recessed, so that only a part of the surface of the heat conducting member 1' can be controlled to be in contact with the pin 22.
參閱圖9，為導熱件1”的再一種變化態樣，由於當電子元件2’為例如DIMM卡規格的插槽連接器時，其插槽21’是包括分隔的一第一槽段211與一第二槽段212，因此，配合這種規格的插槽連接器，導熱件1”的插板部11”係包括沿頂板部12長度方向相間隔的一第一板片116與一第二板片117，導熱件1”是藉其插板部11”的第一板片116與第二板片117分別伸入第一槽段211與一第二槽段212內。Referring to FIG. 9, a further variation of the heat conducting member 1", since the electronic component 2' is a slot connector such as a DIMM card type, the slot 21' is a first slot segment 211 including a partition. a second slot 212, therefore, in conjunction with the slot connector of this size, the insert portion 11" of the heat conductive member 1" includes a first plate 116 and a second spaced along the length of the top plate portion 12. The plate 117, the heat conducting member 1" extends from the first plate 116 and the second plate 117 of the inserting plate portion 11" into the first groove segment 211 and the second groove segment 212, respectively.
而在導熱件1”為圖9的態樣的情況下，其第一板片116與第二板片117也可以有類似於圖7的局部凹陷的結構設計，以達到如圖7的導熱件1’的效果。In the case where the heat conducting member 1" is in the aspect of FIG. 9, the first plate 116 and the second plate 117 may have a structural design similar to that of FIG. 7 to achieve the heat conducting member of FIG. 1' effect.
參閱圖10、圖11，為導熱件1’’’的又一種變化態樣，且導熱模組更包含複數分隔片14，其中，導熱件1’’’的頂板部12頂面121凹陷形成有一沿插板部11的長度方向延伸的凹槽13，且凹槽13是往下凹陷至插板部11內而界定出二相間隔的凹槽內壁131，每一個凹槽內壁131形成有複數上下延伸的定位槽132，在本實施例中，每一個定位槽132是凹槽內壁131凸出形成有二相間隔的凸條133界定出，且該等凹槽內壁131的定位槽132在頂板部12的寬度方向上相對齊。Referring to FIG. 10 and FIG. 11 , another variation of the heat conducting member 1 ′′′, and the heat conducting module further includes a plurality of separators 14 , wherein the top surface 121 of the top plate portion 12 of the heat conducting member 1 ′′′ is recessed and formed. a groove 13 extending along the length direction of the inserting portion 11, and the groove 13 is recessed downward into the inserting portion 11 to define two spaced-apart groove inner walls 131, each of which is formed with an inner wall 131 A plurality of positioning grooves 132 extending upward and downward. In the embodiment, each of the positioning grooves 132 is defined by a rib 133 protruding from the inner wall 131 of the groove and having two spaced intervals, and the positioning groove of the inner wall 131 of the groove 132 are aligned in the width direction of the top plate portion 12.
該等分隔片14用以分別插設於每一對相對齊的定位槽132之間而伸入凹槽13內，將凹槽13區隔為複數槽段130。The spacers 14 are respectively inserted between the pair of aligned positioning slots 132 and extend into the recesses 13 to partition the recesses 13 into a plurality of slots 130.
這種導熱件1’’’與分隔片14的結構設計係更有利於不須針對電子元件的所有接腳加熱的情況，其在對導熱件1’’’加熱時，只需要針對其中部分槽段130的區域進行加熱，使熱能傳導至對應該等槽段130位置的接腳，且由於分隔片14是可分離的，因此，也能機動性地調整需要分隔出的槽斷130區域的大小。The structural design of the heat-conducting member 1"" and the separator 14 is more advantageous in that it does not need to be heated for all the pins of the electronic component, and when heating the heat-conducting member 1"", only a part of the groove is required. The area of section 130 is heated to conduct thermal energy to the pins corresponding to the position of the slot section 130, and since the divider 14 is separable, the size of the slotted area 130 that needs to be separated can also be flexibly adjusted. .
在導熱件1’’’為圖10的態樣的情況下，其插板部11也可以有類似於圖7的局部凹陷的結構設計，以達到如圖7的導熱件1’的效果，或者，在導熱件1”為圖9的態樣的情況下，也可以同時有如圖10的凹槽13與分隔片14的設計，以達到如圖10的導熱件1’’’的效果。In the case where the heat conducting member 1 ′′′ is in the aspect of FIG. 10 , the inserting portion 11 thereof may have a structural design similar to that of FIG. 7 to achieve the effect of the heat conducting member 1 ′ of FIG. 7 , or In the case where the heat conducting member 1" is in the form of FIG. 9, it is also possible to have the design of the groove 13 and the separator 14 as shown in FIG. 10 to achieve the effect of the heat conducting member 1"' of FIG.
綜上所述，本發明由於是利用導熱件1、1’、1”、1’’’與電子元件2的接腳22接觸，並且對導熱件1、1’、1”、1’’’加熱，使熱能可傳導至電子元件2的接腳22，除了解決以往由於電路板3厚度太厚或銅箔層數太多導致解焊不易的問題之外，將其應用於焊接時，也可增加焊料4的附著量而提高焊接的品質，因此，確實能達成本發明的目的。In summary, the present invention utilizes the heat conducting members 1, 1 ', 1", 1"' to contact the pins 22 of the electronic component 2, and the heat conducting members 1, 1', 1", 1"' Heating, so that thermal energy can be conducted to the pin 22 of the electronic component 2, except that in the past, when the thickness of the circuit board 3 is too thick or the number of copper foil layers is too large, the problem of desoldering is not easy, and when it is applied to soldering, Since the amount of adhesion of the solder 4 is increased to improve the quality of the solder, the object of the present invention can be achieved.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
1、1’、1”、1’’’．．．導熱件1, 1', 1", 1'''... heat-conducting parts
11、11’、11”．．．插板部11, 11', 11"... insert board
110．．．頂緣110. . . Top edge
111．．．底緣111. . . Bottom edge
112．．．第一表面112. . . First surface
113．．．第二表面113. . . Second surface
114．．．第三表面114. . . Third surface
115．．．第四表面115. . . Fourth surface
116．．．第一板片116. . . First plate
117．．．第二板片117. . . Second plate
12．．．頂板部12. . . Roof section
121．．．頂面121. . . Top surface
13．．．凹槽13. . . Groove
130．．．槽段130. . . Slot section
131．．．凹槽內壁131. . . Groove inner wall
132．．．定位槽132. . . Positioning slot
133．．．凸條133. . . Rib
14．．．分隔片14. . . Separator
2、2’．．．電子元件2, 2’. . . Electronic component
20．．．絕緣本體20. . . Insulating body
21．．．插槽twenty one. . . Slot
22．．．接腳twenty two. . . Pin
3．．．電路板3. . . Circuit board
31．．．穿孔31. . . perforation
4．．．焊料4. . . solder
51．．．熱風槍51. . . Hot air gun
52．．．熱風罩52. . . Hot hood
61-64．．．步驟61-64. . . step
7．．．隔熱墊7. . . Insulation pads
8．．．錫爐8. . . Tin stove
圖1是本發明電子元件解焊方法的一個較佳實施例中，電路板與焊固在電路板上的電子元件的剖視圖；1 is a cross-sectional view showing a circuit board and electronic components soldered on the circuit board in a preferred embodiment of the soldering method for electronic components of the present invention;
圖2是本發明導熱模組的一個較佳實施例的立體圖；2 is a perspective view of a preferred embodiment of the heat conducting module of the present invention;
圖3是該電子元件解焊方法的較佳實施例的步驟流程圖；3 is a flow chart showing the steps of a preferred embodiment of the electronic component soldering method;
圖4是該電子元件解焊方法的較佳實施例中，將導熱件放置在電子元件的步驟示意圖；4 is a schematic view showing a step of placing a heat conductive member on an electronic component in a preferred embodiment of the electronic component soldering method;
圖5是該電子元件解焊方法的較佳實施例中，對導熱件以及電路板底面加熱的步驟示意圖；5 is a schematic view showing a step of heating a heat conductive member and a bottom surface of the circuit board in a preferred embodiment of the electronic component soldering method;
圖6是該電子元件解焊方法應用在電子元件焊接的一個步驟示意圖；6 is a schematic view showing a step of applying the soldering method of the electronic component to soldering of the electronic component;
圖7是該導熱件另一種變化態樣的立體圖；Figure 7 is a perspective view of another variation of the heat conducting member;
圖8是圖7態樣的導熱件伸入電子元件的插槽的示意圖；Figure 8 is a schematic view of the heat conducting member of Figure 7 extending into the slot of the electronic component;
圖9是該導熱件再一種變化態樣的立體圖；Figure 9 is a perspective view of still another variation of the heat conducting member;
圖10是該導熱件又一種變化態樣的立體圖，且該導熱模組更包括複數分隔片；以及10 is a perspective view of still another variation of the heat conducting member, and the heat conducting module further includes a plurality of separators;
圖11是圖10的態樣中，該等分隔片插設於該導熱件內的俯視圖。Figure 11 is a plan view of the separator of Figure 10 inserted into the heat conducting member.
1．．．導熱件1. . . Heat conductive member
11．．．插板部11. . . Board section
112．．．第一表面112. . . First surface
113．．．第二表面113. . . Second surface
12．．．頂板部12. . . Roof section
121．．．頂面121. . . Top surface
22．．．接腳twenty two. . . Pin
3．．．電路板3. . . Circuit board
4．．．焊料4. . . solder
51．．．熱風槍51. . . Hot air gun
52．．．熱風罩52. . . Hot hood
7．．．隔熱墊7. . . Insulation pads
8．．．錫爐8. . . Tin stove
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99118711A TWI439200B (en) | 2010-06-09 | 2010-06-09 | Method of desoldering an electrical component and thermally conductive module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99118711A TWI439200B (en) | 2010-06-09 | 2010-06-09 | Method of desoldering an electrical component and thermally conductive module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201146118A TW201146118A (en) | 2011-12-16 |
| TWI439200B true TWI439200B (en) | 2014-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99118711A TWI439200B (en) | 2010-06-09 | 2010-06-09 | Method of desoldering an electrical component and thermally conductive module |
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| Country | Link |
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| TW (1) | TWI439200B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI747767B (en) * | 2021-03-15 | 2021-11-21 | 駿曦股份有限公司 | Automatic welding system and heating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112752416B (en) * | 2019-10-30 | 2022-04-29 | 技嘉科技股份有限公司 | Clamping tool for clamping edge slot connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI747767B (en) * | 2021-03-15 | 2021-11-21 | 駿曦股份有限公司 | Automatic welding system and heating device |
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| TW201146118A (en) | 2011-12-16 |
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