CN218649121U - Single wide PCIE collection processing module structure with heat dispersion - Google Patents

Abstract

The utility model discloses a single wide PCIE collection and processing modular structure with heat dispersion belongs to single wide PCIE collection and processing modular structure technical field, including the PCIE integrated circuit board, the top of PCIE integrated circuit board is equipped with the fin subassembly to one side below department that is located the fin subassembly is equipped with the square notch, and this square notch is embedded to have embedded radiator fan, the bottom portion department of PCIE integrated circuit board installs L type connecting piece subassembly through the screw rod, the side bottom department of PCIE integrated circuit board is equipped with the integrated module casing, and is located the inside of integrated module casing and embeds there is the integrated module, adopts embedded radiator fan, and the direction piece that the integrated module casing was laminated completely on the fin subassembly and was passed through the fin subassembly simultaneously is towards PCIE panel direction, makes its integrated module casing be located the inboard and the outside of fin subassembly, belongs to two-sided heat conduction heat dissipation, realizes the function that high-efficient heat dissipation and occupation space is little.

Description

Single wide PCIE collection processing module structure with heat dispersion

Technical Field

The utility model relates to a single wide PCIE collection and processing modular structure especially relates to a single wide PCIE collection and processing modular structure with heat dispersion, belongs to single wide PCIE collection and processing modular structure technical field.

Background

Current PCIE gathers processing module structure, most of them adopt the structural design of monoblock heat dissipation cavity, many layouts on the upper part of module, the high-power fan of embedded, power supply on the outer fishplate bar of fan, such heat dissipation measure, the cold efficiency of leading on the board is not high, though through big fan heat dissipation, can solve the heat dissipation problem, but must the power supply of external power supply, and the fan size is great, general height is higher, standard "single wide" height has been surpassed, can influence the standard integrated circuit board installation of neighbouring PCIE trench, the condition that occupies two PCIE trenches even, it is "two wide" PCIE height to have become promptly.

The heat dissipation structure of the general PCIE acquisition and processing module can generally satisfy a commercial-grade heat dissipation condition, that is, the working temperature is at 25 degrees indoors, the normal operation and heat dissipation of the processing module, but under other high-temperature working conditions, such as 70 degrees in a cabin, the requirement cannot be satisfied, and especially the requirement of general military products cannot be satisfied, for example, the environmental adaptability requirement and the test method of the general technical requirement of the technical reconnaissance equipment in the GJB 1621.7A-2006, so a single-wide PCIE acquisition and processing module architecture with high heat dissipation performance needs to be developed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a single wide PCIE collection and processing modular structure with heat dispersion adopts embedded radiator fan, and the while collection moulding piece casing is laminated completely on the fin subassembly and through the direction piece of fin subassembly towards PCIE panel direction, makes its collection moulding piece casing be located the inboard and the outside of fin subassembly, belongs to two-sided heat conduction heat dissipation, realizes the function that high-efficient heat dissipation and occupation space are little.

The purpose of the utility model can be achieved by adopting the following technical scheme:

the utility model provides a single wide PCIE acquisition and processing modular structure with heat dispersion, includes the PCIE integrated circuit board, the top of PCIE integrated circuit board is equipped with the fin subassembly to one side below department that is located the fin subassembly is equipped with square notch, and this square notch is embedded to have embedded radiator fan, the L type connection piece subassembly is installed through the screw rod in the bottom department of PCIE integrated circuit board, the side bottom department of PCIE integrated circuit board is equipped with the integrated module casing, and is located that the inside of integrated module casing embeds there is integrated module.

Preferably, the heat dissipation component comprises a heat dissipation PCIE board card and heat dissipation fins, the heat dissipation PCIE board card is installed at the top of the PCIE board card, the heat dissipation fins are arranged on the top of the heat dissipation PCIE board card at equal intervals, and the heat dissipation fins and the heat dissipation PCIE board card are integrally formed.

Preferably, the L-shaped connecting piece assembly comprises an L-shaped side connecting plate, an end notch, a clamping groove and a bottom fixing strip, the bottom fixing strip is installed at the bottom end of the PCIE board card through a screw, the L-shaped side connecting plate is integrally formed at the top of one side of the bottom fixing strip, the clamping groove is formed in the middle of the end of the L-shaped side connecting plate, and the end notch is formed in the bending position of the L-shaped side connecting plate.

Preferably, an interface is arranged on one side of the PCIE board card far away from the integrated module housing.

Preferably, the four corners of the top of the PCIE board card are provided with fixing holes.

Preferably, an outer screw rod piece penetrates through one side of the L-shaped side connecting plate, and a connecting piece is connected to one side, close to the connector, of the outer screw rod piece.

Preferably, the end part of one side of the PCIE board card is provided with an indicator light, and the indicator light penetrates through the end slot.

The utility model has the advantages of:

the utility model provides a pair of single wide PCIE collection and processing modular structure with heat dispersion adopts embedded radiator fan, and the while integrated module casing laminates completely on fin subassembly and through the direction piece of fin subassembly towards PCIE panel direction, makes its integrated module casing be located the inboard and the outside of fin subassembly, belongs to two-sided heat conduction heat dissipation, realizes the function that high-efficient heat dissipation and occupation space are little.

Drawings

Fig. 1 is a schematic overall three-dimensional structure diagram of an apparatus according to a preferred embodiment of a single-width PCIE acquisition and processing module structure with heat dissipation performance according to the present invention;

fig. 2 is a schematic expanded three-dimensional structure diagram of a device integral integrated module casing according to a preferred embodiment of the single-width PCIE acquisition and processing module structure with heat dissipation performance of the present invention;

fig. 3 is a schematic view of the overall three-dimensional structure of a device for mounting a PCIE board according to an embodiment of the single-width PCIE acquisition and processing module structure with heat dissipation performance of the present invention;

fig. 4 is a top view of a PCIE board mounting according to a preferred embodiment of a single-width PCIE acquisition and processing module structure with heat dissipation capability according to the present invention;

fig. 5 is a bottom view of the installation PCIE board card according to an embodiment of the present invention, which is a single wide PCIE acquisition and processing module structure with heat dissipation performance.

In the figure: the integrated module comprises 1-PCIE board card, 2-L-shaped side connecting plates, 3-integrated module shells, 4-bottom fixing strips, 5-radiating fins, 6-embedded radiating fans, 7-interfaces, 8-fixing holes, 9-end notches, 10-clamping grooves, 11-indicating lamps, 12-connecting plates, 13-outer spiral rod pieces and 14-radiating PCIE board cards.

Detailed Description

In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention is further described in detail below with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1 to fig. 5, the single-width PCIE acquisition and processing module structure with heat dissipation performance provided in this embodiment includes a PCIE board 1, a heat sink assembly is disposed at the top of the PCIE board 1, a square notch is disposed below one side of the heat sink assembly, an embedded heat dissipation fan 6 is embedded in the square notch, an L-shaped connection board assembly is mounted at the bottom of the PCIE board 1 through a screw, an integrated module housing 3 is disposed at the bottom of the side of the PCIE board 1, and an integrated module is disposed inside the integrated module housing 3.

Adopt embedded radiator fan 6, integrated module casing 3 laminates on the fin subassembly completely simultaneously and through the direction piece of fin subassembly towards PCIE panel direction, makes its integrated module casing 3 be located the inboard and the outside of fin subassembly, belongs to two-sided heat conduction heat dissipation, realizes high-efficient heat dissipation and little function of occupation space.

In this embodiment, the heat sink assembly includes a heat dissipation PCIE board 14 and heat dissipation fins 5, the heat dissipation PCIE board 14 is installed on the top of the PCIE board 1, the heat dissipation fins 5 are disposed on the top of the heat dissipation PCIE board 14 at equal intervals, and the heat dissipation fins 5 and the heat dissipation PCIE board 14 are integrally formed.

The design of the heat dissipation PCIE board card 14 and the heat dissipation fins 5 is adopted, and the heat dissipation fins 5 are matched with the embedded heat dissipation fan 6 towards the direction of the PCIE panel, so that the heat dissipation efficiency is improved.

In this embodiment, the L-shaped connecting piece assembly includes an L-shaped side connecting plate 2, an end notch 9, a clamping groove 10 and a bottom fixing strip 4, the bottom fixing strip 4 is installed at the bottom end of the pcie board 1 through a screw, the L-shaped side connecting plate 2 is integrally formed at the top of one side of the bottom fixing strip 4, the clamping groove 10 is formed in the middle of the end of the L-shaped side connecting plate 2, and the end notch 9 is formed at the bending position of the L-shaped side connecting plate 2.

The L-shaped side connecting plate 2, the end notch 9, the clamping groove 10 and the bottom fixing strip 4 are designed to be conveniently fixed and connected.

In this embodiment, an interface 7 is disposed on a side of the PCIE board 1 away from the integrated module housing 3.

In this embodiment, the four corners of the top of the PCIE board 1 are provided with fixing holes 8.

In this embodiment, an outer screw rod 13 is provided through one side of the L-shaped side connection plate 2, and a connection plate 12 is connected to one side of the outer screw rod 13 near the joint 7.

In this embodiment, an indicator light 11 is disposed at an end of one side of the PCIE board 1, and the indicator light 11 penetrates the end slot 9.

Above, only the further embodiments of the present invention are shown, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can replace or change the technical solution and the concept of the present invention within the protection scope of the present invention.

Claims (7)

1. The utility model provides a single wide PCIE collection processing module structure with heat dispersion which characterized in that: including PCIE integrated circuit board (1), the top of PCIE integrated circuit board (1) is equipped with the fin subassembly to one side below department that is located the fin subassembly is equipped with square notch, and this square notch is embedded to have embedded radiator fan (6), the bottom portion department of PCIE integrated circuit board (1) installs L type connecting piece subassembly through the screw rod, the side bottom department of PCIE integrated circuit board (1) is equipped with integrated module casing (3), and is located the inside built-in integrated module that has of integrated module casing (3).

2. The single-width PCIE acquisition and processing module structure with heat dissipation performance of claim 1, wherein: the radiating fin component comprises a radiating PCIE board card (14) and radiating fins (5), the radiating PCIE board card (14) is installed at the top of the PCIE board card (1), the radiating fins (5) are arranged on the top of the radiating PCIE board card (14) at equal intervals, and the radiating fins (5) and the radiating PCIE board card (14) are integrally formed.

3. The single-width PCIE acquisition and processing module structure with heat dissipation performance according to claim 2, wherein: l type connection piece subassembly includes L type side connecting plate (2), end notch (9), draw-in groove (10) and end fixed strip (4), the bottom portion department of PCIE integrated circuit board (1) is installed end fixed strip (4) through the screw rod, just one side top integrated into one piece of end fixed strip (4) has L type side connecting plate (2), draw-in groove (10) have been seted up at the end middle part of L type side connecting plate (2), and have seted up end notch (9) in the department of bending of L type side connecting plate (2).

4. The single-width PCIE acquisition and processing module structure with heat dissipation performance of claim 3, wherein: and an interface (7) is arranged on one side, far away from the integrated module shell (3), of the PCIE board card (1).

5. The single-width PCIE acquisition and processing module structure with heat dissipation performance of claim 4, wherein: and fixing holes (8) are formed in four corners of the top of the PCIE board card (1).

6. The single-width PCIE acquisition and processing module structure with heat dissipation capability of claim 5, wherein: one side of the L-shaped side connecting plate (2) is provided with an outer screw rod piece (13) in a penetrating mode, and one side, close to the connector (7), of the outer screw rod piece (13) is connected with a connecting piece (12).

7. The single-width PCIE acquisition and processing module structure with heat dissipation performance of claim 5, wherein: one side tip of PCIE integrated circuit board (1) is equipped with pilot lamp (11), and pilot lamp (11) run through end notch (9).

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