CN218506784U

CN218506784U - Logistics turnover assembly line for chip mounter workshop

Info

Publication number: CN218506784U
Application number: CN202222229697.2U
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Zhejiang Yongyuan Technology Co ltd
Current assignee: Zhejiang Yongyuan Technology Co ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2023-02-21
Anticipated expiration: 2032-08-24

Abstract

The utility model provides a chip mounter workshop commodity circulation turnover assembly line relates to commodity circulation turnover technical field, include: the chip mounter, the reflow soldering machine and the conveying device; the chip mounters are arranged on one side of the conveying device; the reflow welding machine is arranged at the tail end of the conveying device, and a reflow track is arranged between the reflow welding machine and the conveying device; the conveying device comprises a guide rail and a first conveying belt arranged on the guide rail, and the first conveying belt is connected with the chip mounter and the backflow rail; and the conveying devices are arranged between the first conveying belt and the chip mounter and between the first conveying belt and the backflow track, and each conveying device comprises an electric clamping jaw for grabbing the PCB and a driving mechanism for moving the PCB. The utility model discloses can realize a backflow welder of a plurality of chip mounters sharing to reduce the cost of labor, and the electric quantity consumption has played energy saving and emission reduction's effect.

Description

Logistics turnover assembly line for chip mounter workshop

Technical Field

The utility model relates to a commodity circulation turnover technical field especially relates to chip mounter workshop commodity circulation turnover assembly line.

Background

In the production process of a Printed Circuit Board (PCB), the PCB is required to be mounted and then placed in a reflow soldering machine for soldering. At present, the transfer of the PCB between a chip mounter and a reflow soldering machine is generally finished manually, the labor cost consumed in the whole process is high, and the production efficiency of the machine is restricted. In some production lines, in order to reduce labor cost and improve production efficiency, a reflow soldering machine is configured on each chip mounter production line. The reflow soldering machine is an electric heating device, and the power consumption is large, so that the production cost and the energy consumption are overhigh.

SUMMERY OF THE UTILITY MODEL

For prior art's problem among the solution background art, the utility model provides a chip mounter workshop commodity circulation turnover assembly line, include: chip mounter, reflow soldering machine and conveyer.

The chip mounter has a plurality ofly, all sets up in one side of conveyer.

The reflow soldering machine is arranged at the tail end of the conveying device, and a reflow track is arranged between an inlet of the reflow soldering machine and the conveying device.

The conveying device comprises a guide rail and a first conveying belt arranged on the guide rail, and the first conveying belt is connected with a discharge port of the chip mounter and a feeding end of the backflow track.

And conveying devices are arranged between the first conveying belt and the chip mounter and between the first conveying belt and the backflow track, and each conveying device comprises an electric clamping jaw 41 for grabbing the PCB and a driving mechanism for moving the PCB.

The utility model discloses a conveyer and handling device realize the automatic transport of PCB board between chip mounter and backflow welding machine, reduce the cost of labor, improve production efficiency. And a plurality of chip mounters share one reflow soldering machine, so that the power consumption is reduced, and the production cost is reduced. The utility model discloses simple structure can play energy saving and emission reduction's effect.

Drawings

Fig. 1 is a schematic structural view of a chip mounter workshop logistics turnover assembly line in embodiment 1 of the present invention;

fig. 2 is a schematic structural view of a conveying device in embodiment 2 of the present invention;

fig. 3 is a schematic structural view of a conveying device according to embodiment 3 of the present invention;

fig. 4 is a schematic structural view of a feeding device for a tool plate in embodiment 3 of the present invention;

fig. 5 is the utility model discloses chip mounter workshop commodity circulation turnover assembly line structure sketch map in embodiment 4.

Wherein, 1: a chip mounter; 2: a reflow soldering machine; 3: a conveying device; 4: a carrying device; 5: a PCB board; 6: a return track; 7: a jig plate; 8: a plate loading device; 9: a lower plate device; 31: a guide rail; 32: a first conveyor belt; 33: a limiting plate; 34: an electric cylinder; 41: an electric jaw; 42: a first positioning member; 61: a second positioning member; 71: a smelting tool plate bin; 72: a jig plate feeding device; 73: a suction cup mechanism; 91: a lower plate rail.

Detailed Description

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators in the embodiments of the present invention (such as upper, lower, left, right, front, and rear … …) are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is also changed accordingly, and the connection may be a direct connection or an indirect connection.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Example 1

As shown in fig. 1, a schematic structural diagram of a chip mounter workshop logistics turnover assembly line is provided, in this embodiment, the chip mounter workshop logistics turnover assembly line includes: the chip mounter comprises a chip mounter 1, a reflow soldering machine 2 and a conveying device 3. The chip mounter 1 has a plurality of, all sets up the one side at conveyer 3. The conveying device 3 is used for collecting the PCB 5 output by the chip mounter 1 and transferring the PCB 5 to the reflow soldering machine 2, so that the PCB 5 can be automatically conveyed between the chip mounter 1 and the reflow soldering machine 2.

The reflow soldering machine 2 is arranged at the tail end of the conveying device 3, and a reflow track 6 is arranged between the inlet of the reflow soldering machine 2 and the conveying device 3. The reflow rail 6 is used to transport the PCB boards 5 collected by the conveyor 3 to the reflow soldering machine 2.

The conveying device 3 includes a guide rail 31 and a first conveyor belt 32 disposed on the guide rail 31, and the first conveyor belt 32 connects the discharge port of the chip mounter 1 and the feeding end of the reflow track 6. The conveying device 3 can stably convey the PCB 5 at a long distance through the guide rail 31 and the first conveying belt 32, and the requirement of a large chip mounter workshop is met.

The conveying devices 4 are arranged between the first conveyor belt 32 and the chip mounter 1 and between the first conveyor belt 32 and the backflow track 6, and the conveying devices 4 comprise electric clamping jaws 41 for grabbing the PCB 5 and driving mechanisms for moving the PCB 5.

The conveying device 4 is disposed between the first conveyor belt 32 and the chip mounter 1, and can convey the PCB 5 output from the chip mounter 1 onto the first conveyor belt 32. After the first conveyor belt 32 conveys the PCB 5 to a position close to the reflow track 6, the carrying device 4 arranged between the first conveyor belt 32 and the reflow track 6 carries the PCB 5 from the first conveyor belt 32 to the reflow track 6, so that the plurality of chip mounters 1 share one reflow soldering machine 2.

The automatic carrying of the PCB 5 between the chip mounter 1 and the reflow soldering machine 2 is realized through the conveying device 3 and the carrying device in the embodiment, the labor cost is reduced, and the production efficiency is improved. And a plurality of chip mounters 1 share one reflow soldering machine 2, so that the power consumption is reduced, and the production cost is reduced. The embodiment has a simple structure and can play a role in energy conservation and emission reduction.

Example 2

This embodiment is a further improvement of embodiment 1, and compared with embodiment 1, the conveying device 3 in this embodiment includes two parallel guide rails 31, two first conveying belts 32 are respectively disposed on the two guide rails 31, and the conveying device 3 is equipped with a width adjusting device for adjusting the distance between the two guide rails 31. Fig. 2 is a schematic structural diagram of the conveying device in this embodiment.

In use, the two side edges of the PCB panel 5 rest on the two first conveyor belts 32, respectively, and the side edges contact the first conveyor belts 32 and move along the guide rail 31 with the first conveyor belts 32. The guide rail 31 and the first conveyor belt 32 support the PCB 5, and prevent the electronic components on the PCB 5 from being touched. The width adjusting device can adjust the distance between the two guide rails 31, so that the PCB 5 with different sizes can be adapted, and the universality of the equipment is improved.

The width adjusting device comprises an electric cylinder 34, one guide rail 31 is fixedly connected with a moving mechanism of the electric cylinder 34, and the other guide rail 31 is fixed in position. The guide rail 31 and the electric cylinder 34 can be fixed on the frame, the distance between the two guide rails 31 can be accurately adjusted through the electric cylinder 34, and the situation that the PCB 5 cannot be supported due to the overlarge distance between the guide rails 31 is prevented.

A limiting plate 33 parallel to the conveying surface of the first conveyor belt 32 is mounted above the first conveyor belt 32, and the limiting plate 33 is fixedly connected with the guide rail 31 and used for clamping the PCB 5 together with the first conveyor belt 32.

In this embodiment, the first conveyor belt 32 holds and moves the side edge of the PCB 5, and when the first conveyor belt 32 is narrow, the PCB 5 is likely to fall off. As shown in fig. 2, the stopper plate 33 is mounted on the guide rail 31, and clamps the PCB 5 with the first conveyor belt 32, and can abut against the PCB 5 when the PCB 5 is offset, thereby restricting the PCB 5 from moving only in the direction of the guide rail 31.

In the embodiment, the distance between the two guide rails 31 is adjusted by the width adjusting device, so that the PCB 5 with different sizes can be adapted, and the universality of the equipment is improved.

Example 3

This embodiment is a further improvement of embodiment 2, and as shown in fig. 3, is a schematic structural diagram of a robot in this embodiment, compared with the embodiment of embodiment 2 in which the transfer device 3 is further provided with a first positioning member 42 for positioning the PCB 5, the electric clamping jaw 41 grabs or releases the PCB 5 on the first positioning member 42; the first positioning member 42 includes a support plate for supporting the PCB board 5, and a lifting cylinder for driving the support plate to move up and down perpendicular to the conveying surface of the first conveyor belt 32, and a moving end of the lifting cylinder is connected to the support plate.

As shown in fig. 3, the carrying device 4 carries the PCB board 5 from the transfer device 3 onto the reflow track 6. The first positioning member 42 is provided between the two guide rails 31 to be movable up and down. The electric clamping jaw 41 is used for clamping two sides of the PCB 5 to prevent touching electronic components on the PCB 5, and when the electric clamping jaw 41 grabs or releases the PCB 5, the first positioning member 42 jacks up the PCB 5 to be carried, so that the PCB 5 is separated from the first conveyor belt 32.

The first positioning element 42 further comprises a position sensor, the handling device 4 is a robot arm and is mounted above the conveyor 3 by a bracket, and the position sensor is electrically connected with the handling device 4. Carry PCB board 5 through the robotic arm, can adapt to various different situations, improve the stability of transporting. The position sensor senses whether the PCB 5 exists on the first positioning piece 42 or not, and transmits a signal to the mechanical arm, and the mechanical arm carries out carrying action according to the signal.

The backflow rail 6 is provided with a plurality of conveying belts which are arranged between the feeding end of the backflow welder 2 and the conveying device 3 side by side, and the second conveying belts are arranged on the backflow rail 6. The reflow rail 6 may be a plurality of rails arranged in parallel, and the space of the reflow soldering machine 2 can be fully utilized.

The second conveyor belt is provided with a second positioning piece 61 capable of lifting, the second positioning piece 61 comprises a positioning claw for lifting the smelting tool plate 7, the smelting tool plate 7 is used for bearing the PCB 5 in the reflow soldering machine 2, and heat dissipation holes are formed in the smelting tool plate 7.

The temperature in the reflow soldering machine 2 is high, the PCB board 5 needs to be placed on the jig board 7 on the reflow rail 6, and then the PCB board 5 and the jig board 7 are transported together to the reflow soldering machine 2 through the reflow rail 6 for soldering. The heat dissipation holes arranged on the jig plate 7 can enable the PCB 5 to be heated uniformly, and welding quality is improved.

Wherein, second setting element 61 fixes a position the position of smelting tool board 7 on the second conveyer belt, when backward flow track 6 has a plurality ofly, all can set up a second setting element 61 on every backward flow track 6, increases PCB board 5 and smelting tool board 7 that get into among the reflow soldering machine 2 simultaneously, improves reflow soldering machine 2's work efficiency.

As shown in fig. 4, for the schematic structural diagram of the jig plate feeding device, one side of the backflow rail 6 is provided with a jig plate bin 71 for storing the jig plate 7, a jig plate feeding device 72 is arranged above the jig plate bin 71, the jig plate feeding device 72 includes a moving mechanism crossing over the plurality of backflow rail 6, and a suction cup mechanism 73 for adsorbing the jig plate 7 is installed on the moving mechanism.

Preferably, the jig plate feeding device 72 is a three-axis motion assembly, and the moving mechanism of the jig plate feeding device 72 can move along the direction perpendicular to the conveying direction of the reflow rails 6, so as to place the jig plates 7 on the respective reflow rails 6, thereby improving the throughput of the reflow soldering machine 2.

This embodiment passes through smelting tool board loading attachment 72 and backward flow track 6, accomplishes the confluence of PCB board 5 from each chip mounter 1 to conveyer 3 to on shifting PCB board 5 to smelting tool board 7, get into reflow soldering machine 2 through backward flow track 6. The labor cost can be saved, the production efficiency is improved, and the quality of the welding machine is improved.

Example 4

The present embodiment is a further improvement on embodiment 3, and as shown in fig. 5, is a schematic structural diagram of a chip mounter workshop logistics turnover assembly line in the present embodiment, the chip mounter workshop logistics turnover assembly line provided in the present embodiment further includes an upper plate device 8 and a lower plate device 9, the upper plate device 8 is disposed at the tail end of the conveying device 3, and a discharge port of the upper plate device 8 is disposed in a moving range of the conveying device 4 between the first conveyor belt 32 and the return track 6; the lower plate device 9 and the conveying device 3 are connected by a lower plate rail 91, and the feeding end of the lower plate rail 91 is disposed in the moving range of the conveying device 4 between the first conveyor belt 32 and the chip mounter 1.

The lower board device 9 is connected to the conveying device 3 through a lower board rail 91, and the lower board rail 91 and a chip mounter 1 share one conveying device 4. In use, the carrying device 4 can carry the PCB 5 on the discharging end of the chip mounter 1 or the conveying device 3 onto the lower board rail 91, and then enter the lower board device 9 through the lower board rail 91. The excessive number of the PCB boards 5 on the conveyor 3 can be prevented when the production efficiency of the chip mounter 1 is too high.

The upper plate device 8 is arranged at the tail end of the conveying device 3, when the number of the PCB boards 5 on the conveying device 3 is small, the conveying device 3 is fed through the upper plate device 8, and the working efficiency of the reflow soldering machine 2 is improved.

This embodiment is passed through upper plate device 8 and lower plate device 9, and when chip mounter 1 was inequality with 2 efficiency of backward flow welding machine, adjust the chip mounter workshop commodity circulation turnover assembly line that this embodiment provided, stabilize the speed that PCB board 5 got into backward flow welding machine 2, improve backward flow welding machine 2's work efficiency.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims

1. Chip mounter workshop commodity circulation turnover assembly line, its characterized in that includes: the chip mounter comprises a chip mounter (1), a reflow soldering machine (2) and a conveying device (3);

a plurality of chip mounters (1) are arranged on one side of the conveying device (3);

the reflow soldering machine (2) is arranged at the tail end of the conveying device (3), and a reflow track (6) is arranged between the inlet of the reflow soldering machine (2) and the conveying device (3);

the conveying device (3) comprises a guide rail (31) and a first conveying belt (32) arranged on the guide rail (31), and the first conveying belt (32) is connected with a discharge hole of the chip mounter (1) and a feeding end of the backflow rail (6);

the chip mounter is characterized in that a carrying device (4) is arranged between the first conveying belt (32) and the chip mounter (1) and between the first conveying belt (32) and the backflow track (6), and the carrying device (4) comprises an electric clamping jaw (41) for grabbing a PCB (printed circuit board) 5 and a driving mechanism for moving the PCB (printed circuit board) 5.

2. The chip mounter workshop logistics turnover assembly line of claim 1, wherein the conveyor (3) comprises two parallel guide rails (31), one first conveyor belt (32) is arranged on each of the two guide rails (31), and the conveyor (3) is provided with a width adjusting device for adjusting the distance between the two guide rails (31).

3. The chip mounter workshop logistics turnover assembly line of claim 2, wherein the width adjusting device comprises an electric cylinder (34), one of the guide rails (31) is fixedly connected with a moving mechanism of the electric cylinder (34), and the other guide rail (31) is fixed in position.

4. The chip mounter workshop logistics turnover assembly line of claim 2, wherein a limiting plate (33) parallel to a conveying surface of the first conveyor belt (32) is mounted above the first conveyor belt (32), and the limiting plate (33) is fixedly connected with the guide rail (31) and used for clamping the PCB (5) together with the first conveyor belt (32).

5. The chip mounter workshop logistics turnover flow line of claim 1, wherein the conveyor (3) is further provided with a first positioning member (42) for positioning the PCB board (5), and the electric holding jaw (41) grips or releases the PCB board (5) on the first positioning member (42); the first positioning piece (42) comprises a supporting plate for bearing the PCB (5) and a lifting cylinder for driving the supporting plate to move up and down perpendicular to the conveying surface of the first conveying belt (32), and the moving end of the lifting cylinder is connected with the supporting plate.

6. The pick & place machine shop logistics turnaround line of claim 5, wherein the first positioning member (42) further comprises a position sensor, the handling device (4) is a robotic arm mounted by a bracket above the conveyor device (3), and the position sensor is electrically connected to the handling device (4).

7. The chip mounter workshop logistics turnover assembly line of claim 1, wherein the reflow rail (6) is provided in plurality and arranged side by side between a feeding end of the reflow soldering machine (2) and the conveying device (3), and a second conveying belt is arranged on the reflow rail (6).

8. The logistics turnover assembly line of a chip mounter workshop as claimed in claim 7, wherein a second positioning member (61) capable of being lifted and lowered is arranged on the second conveyor belt, the second positioning member (61) comprises a positioning claw for lifting a jig plate (7), the jig plate (7) is used for bearing the PCB (5) in the reflow soldering machine (2), and heat dissipation holes are formed in the jig plate (7).

9. The chip mounter workshop logistics turnover assembly line of claim 8, wherein one side of the backflow track (6) is provided with a storage jig plate bin (71) of the jig plate (7), a jig plate feeding device (72) is arranged above the jig plate bin (71), the jig plate feeding device (72) comprises a plurality of crossing moving mechanisms of the backflow track (6), and the moving mechanisms are provided with sucking disc mechanisms (73) for adsorbing the jig plate (7).

10. The chip mounter workshop logistics turnover assembly line of claim 1, comprising an upper plate device (8) and a lower plate device (9), wherein the upper plate device (8) is arranged at the end of the conveying device (3), and the discharge port of the upper plate device (8) is arranged in the moving range of the carrying device (4) between the first conveyor belt (32) and the return track (6); the lower board device (9) is connected with the conveying device (3) through a lower board rail (91), and the feeding end of the lower board rail (91) is arranged in the moving range of the conveying device (4) between the first conveying belt (32) and the chip mounter (1).