CN218469883U

CN218469883U - Packaging structure of silicon-based sensor

Info

Publication number: CN218469883U
Application number: CN202222349702.3U
Authority: CN
Inventors: 谭蛟腾; 姚家红; 李如意
Original assignee: Anhui Xin'he Defense Equipment Technology Co ltd
Current assignee: Anhui Xin'he Defense Equipment Technology Co ltd
Priority date: 2022-09-02
Filing date: 2022-09-02
Publication date: 2023-02-10
Anticipated expiration: 2032-09-02

Abstract

The utility model discloses a packaging structure of silica-based sensor, including the base plate, go up the casing, silica-based sensor and metal connecting piece down, the base plate is established between last casing and lower casing, and the base plate has the part that extends casing and casing down, and silica-based sensor is installed on the base plate and is located between base plate and the last casing, and metal connecting piece installs the part that extends casing and casing down at the base plate, and metal connecting piece passes through the base plate and is connected with silica-based sensor, still includes the sealing ring, wherein: the inner wall of the metal connecting piece and the outer wall of the upper shell are provided with an installation distance; the sealing ring is sleeved outside the upper shell and used for sealing the upper surface of the substrate located in the installation distance. Through the setting of metal connecting piece and then reduce the temperature drift phenomenon of sensor, through the setting of sealing ring, and then the protection is extended go up the casing with base plate between the casing down avoids being located the circuit corrosion or damage on the outer base plate of casing and lower casing of extending simultaneously.

Description

Packaging structure of silicon-based sensor

Technical Field

The utility model relates to a sensor production manufacturing equipment technical field especially relates to a packaging structure of silica-based sensor.

Background

The silicon-based sensor is a high-precision detection device, can sense measured information, can convert the sensed information into an electric signal or other required information output according to a certain rule, and meets the requirements of information transmission, processing, storage, display, recording, control and the like. Packaging is critical to the reliability of the sensor. Therefore, the design of the package must take into account reliability requirements, especially for custom packaging for specific applications.

For some pressure sensors, such as a pressure sensor on a breathing machine, which needs a high humidity environment and a long-time temperature measurement, in the current sensor design, the sensor chip is mainly packaged and directly fixed on a plastic package shell, and because the temperature coefficient difference between the shell and the silicon material of the sensor is large, the sensor is greatly influenced by the temperature, and a relatively serious temperature drift can occur.

The authorization notice number is: CN112665775B, entitled "a novel differential pressure sensor and its packaging method", has an extended portion on the substrate opposite to the housing, and the substrate extending out of the housing is provided with a metal tube leg to reduce the temperature drift, which is a technical problem of this patent, because the metal tube leg is electrically connected to the circuit on the substrate through a copper sheet, the circuit or copper sheet on the substrate outside the housing is not exposed by the metal tube, and the circuit on the substrate is connected to the sensor inside the housing, resulting in the circuit between the housing and the metal tube being exposed, even if the glue injection curing process is performed, the circuit is also easily worn and the circuit on the substrate outside the housing and not covered by the metal tube is exposed.

SUMMERY OF THE UTILITY MODEL

For the technical problem who exists among the solution background art, the utility model provides a packaging structure of silica-based sensor.

The utility model provides a packaging structure of silica-based sensor, include the base plate, go up casing, lower casing, silica-based sensor and metal connecting piece, the base plate is established go up the casing with down between the casing, the base plate has and extends go up the casing with the part of casing down, silica-based sensor is installed on the base plate and be located the base plate with go up between the casing, metal connecting piece installs the base plate extends go up the casing with the part of casing down, just metal connecting piece passes through the base plate with silica-based sensor connects, still includes the sealing ring, wherein:

the inner wall of the metal connecting piece and the outer wall of the upper shell are provided with an installation distance, and it needs to be noted that the inner wall of the metal connecting piece refers to the surface of the metal connecting piece opposite to the upper shell;

the sealing ring is sleeved outside the upper shell and used for sealing the upper surface of the substrate located in the installation distance.

As a further preferable technical solution of the present invention, the outer sidewall of the lower case and the outer sidewall of the upper case are in the same plane.

As a further preferred technical solution of the present invention, the depth of the sealing ring is greater than the thickness of the metal connecting member.

As a further preferable technical solution of the present invention, the metal connecting piece and the opposite surface of the upper case are inclined planes which are gradually close to the upper case from top to bottom.

As a further preferable technical solution of the present invention, the seal ring has an inner ring portion and an outer ring portion, the inner ring portion is located the upper housing and between the metal connecting pieces, the outer ring portion is located outside the inner ring portion, and the outer ring portion is connected to the metal connecting pieces.

As a further preferred technical scheme of the utility model, the inside wall of inner circle part with the outside of going up the casing is connected, the outer lane part have with the part that metal connecting piece connects, the outer lane part with the bottom surface of inner circle part all with the base plate is contradicted.

As a further preferred technical scheme of the utility model, the outer lane part have the joint lug, open the upper surface of metal connecting piece has the draw-in groove, the joint lug with the draw-in groove matches.

As a further preferred technical solution of the present invention, the sealing ring is made of an elastic material.

The utility model discloses in, the packaging structure of silica-based sensor that provides sets up and then reduces the temperature drift phenomenon of sensor through metal connecting piece, simultaneously through the setting of sealing ring, and then the protection is extended go up the casing with base plate between the casing down avoids being located the circuit corrosion or damage on extending the outer base plate of casing and inferior valve simultaneously.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a front view of the present invention;

fig. 2 is a sectional view of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar designations denote like or similar elements or elements having like or similar functionality throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

It will be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in an orientation or positional relationship indicated in the drawings for convenience and simplicity of description only, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1-2 a packaging structure of silicon-based sensor, including base plate 1, go up casing 2, casing 3 down, silicon-based sensor 4 and metal connecting piece 5, base plate 1 is established between last casing 2 and casing 3 down, base plate 1 has the part that extends last casing 2 and casing 3 down, silicon-based sensor 4 installs on base plate 1 and lies in between base plate 1 and last casing 2 through welding mode, metal connecting piece 5 installs the part that extends last casing 2 and casing 3 down at base plate 1, and metal connecting piece 5 is connected with silicon-based sensor 4 through base plate 1, it is concrete, be equipped with the circuit on the base plate 1, take metal connecting piece 5 to be connected with silicon-based sensor 4 through the circuit on the base plate 1, it has first inlet port 20 to open on last casing 2, it has second inlet port 30 to open on casing 3 down, first inlet port 20 is relative and the intercommunication with second inlet port 30, first inlet port 20 is relative with silicon-based sensor 4, be equipped with waterproof ventilative mould 8 in the last casing 2, waterproof ventilative mould 8 is relative with first inlet port 20, still include sealing ring 6, wherein:

the metal connecting piece 5 can be any rod-shaped or sheet-shaped or tubular structure with conductive performance, in this embodiment, the metal rod is used, and the inner wall of the metal connecting piece 5 has an installation distance with the outer wall of the upper shell 2;

the sealing ring 6 is made for elastic material, and in this embodiment the sealing ring 6 is made for rubber, and 6 covers of sealing ring are established outside last casing 2 and are used for sealing the upper surface that is located the base plate 1 of installation distance, and the sealing ring 6 is cyclic annular cover in the part that base plate 1 is located last casing 2 and lower casing 3, avoids base plate 1 to damage and then causes the damage to the circuit on the base plate 1.

In some embodiments, it is preferable that the outer side wall of the lower case 3 and the outer side wall of the upper case 2 are in the same plane, thereby reducing the volume and facilitating the support of the substrate 1.

In some embodiments, it is preferable that the depth of the sealing ring 6 is greater than the thickness of the metal connecting member 5, and the sealing ring 6 not only serves to protect the substrate 1 but also fixes the metal connecting member 5.

In some embodiments, it is preferable that a surface of the metal connecting member 5 opposite to the upper casing 2 is an inclined surface which is inclined gradually from top to bottom toward a direction close to the upper casing 2, so as to increase a contact area between the metal connecting member 5 and the sealing ring 6, and a distance between the inclined surface and the upper casing is gradually reduced from top to bottom, thereby facilitating fixing of the sealing ring 6.

In some embodiments, it is preferable that the seal ring 6 has an inner ring portion 60 and an outer ring portion 61, the inner ring portion 60 is located between the upper housing 2 and the metal connector 5, the outer ring portion 61 is located outside the inner ring portion 60, and the outer ring portion 61 is connected to the metal connector 5, and the seal ring 6 increases a protection area of the substrate 1 while having a fixing effect on the metal connector 5.

In some embodiments, it is preferable that the inner side wall of the inner ring portion 60 is connected to the outer side of the upper case 2, in order to increase the fixing of the seal ring 6, the inner wall of the inner ring portion 60 and the outer wall of the upper case 2 may be bonded, the outer ring portion 61 has a portion connected to the metal connector 5, and the bottom surfaces of the outer ring portion 61 and the inner ring portion 60 are both abutted against the substrate 1.

In some embodiments, it is preferable that the outer ring part 61 has a clamping protrusion 7, the upper surface of the metal connecting member 5 is provided with a clamping groove 50, and the clamping protrusion 7 is matched with the clamping groove 50, so as to increase the stability of the connection between the outer ring part 61 and the metal connecting member 5.

The technical features indicated in the above embodiments may be combined in any two or more ways to form a new embodiment, so as to achieve better technical effects.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a packaging structure of silicon-based sensor, includes base plate (1), goes up casing (2), lower casing (3), silicon-based sensor (4) and metal connecting piece (5), establish base plate (1) go up casing (2) with between lower casing (3), base plate (1) has and extends go up casing (2) with the part of casing (3) down, install silicon-based sensor (4) on base plate (1) and be located base plate (1) with go up between casing (2), metal connecting piece (5) are installed base plate (1) extends go up casing (2) with the part of casing (3) down, just metal connecting piece (5) pass through base plate (1) with silicon-based sensor (4) are connected, its characterized in that still includes sealing ring (6), wherein:

the inner wall of the metal connecting piece (5) has an installation distance with the outer wall of the upper shell (2);

and the sealing ring (6) is sleeved outside the upper shell (2) and is used for sealing the upper surface of the substrate (1) positioned in the installation distance.

2. The packaging structure of a silicon-based sensor according to claim 1, characterized in that the outer sidewall of the lower housing (3) and the outer sidewall of the upper housing (2) are in the same plane.

3. The packaging structure of a silicon-based sensor according to claim 1, characterized in that the depth of the sealing ring (6) is greater than the thickness of the metal connector (5).

4. The packaging structure of the silicon-based sensor according to claim 3, wherein a surface of the metal connecting piece (5) opposite to the upper shell (2) is an inclined surface which is gradually inclined from top to bottom in a direction approaching the upper shell (2).

5. The packaging structure of a silicon-based sensor according to claim 3, characterized in that the sealing ring (6) has an inner ring portion (60) and an outer ring portion (61), the inner ring portion (60) is located between the upper housing (2) and the metal connector (5), the outer ring portion (61) is located outside the inner ring portion (60), and the outer ring portion (61) is connected with the metal connector (5).

6. The packaging structure of a silicon-based sensor according to claim 5, wherein the inner side wall of the inner ring part (60) is connected with the outer side of the upper shell (2), the outer ring part (61) has a portion connected with the metal connector (5), and the bottom surfaces of the outer ring part (61) and the inner ring part (60) are both abutted against the substrate (1).

7. The packaging structure of the silicon-based sensor, according to claim 5, characterized in that the outer ring portion (61) is provided with a clamping projection (7), the upper surface of the metal connector (5) is provided with a clamping groove (50), and the clamping projection (7) is matched with the clamping groove (50).

8. The packaging structure of a silicon-based sensor according to claim 1, wherein the sealing ring (6) is made of an elastic material.