CN218287228U - Controllable adhesion micro-transfer seal based on shape memory polymer - Google Patents
Controllable adhesion micro-transfer seal based on shape memory polymer Download PDFInfo
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- CN218287228U CN218287228U CN202222746983.6U CN202222746983U CN218287228U CN 218287228 U CN218287228 U CN 218287228U CN 202222746983 U CN202222746983 U CN 202222746983U CN 218287228 U CN218287228 U CN 218287228U
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Abstract
A controllable adhesion micro-transfer seal based on a shape memory polymer belongs to the technical field of micro-transfer. The shape memory polymer-based controllable adhesion micro-transfer stamp comprises a rigid backing and a shape memory polymer block arranged on one side of the rigid backing, wherein a micro-structure bulge is arranged on the lower surface of the shape memory polymer block and is a pointed cone-circular table combined array formed by pointed cone micro-structure bulges and circular table micro-structure bulges, and the pointed cone micro-structure bulges are higher than the circular table micro-structure bulges. The controllable adhesion micro-transfer printing stamp based on the shape memory polymer improves the controllability of a micro-transfer printing process through the micron-sized pointed cone-circular truncated cone combined array, improves the controllable variation range of the adhesion force of micro-transfer printing, reduces the strict requirements on micro-transfer printing equipment and environment, reduces the production difficulty and improves the production efficiency.
Description
Technical Field
The utility model relates to a little rendition technical field, in particular to controllable adhesion little rendition seal based on shape memory polymer.
Background
With the rapid development of high-precision electronic technology, the demand for flexible electronics is greatly increased, so that the related manufacturing technology is widely concerned. Professor John Rogers, champagne division, university of illinois, usa, first proposed micro-transfer technology which essentially used an elastomeric stamp to peel a micro/nano-element from a donor substrate, which was then printed onto a target substrate, to achieve integration of flexible electronics. The key to the micro-transfer technology is the variation in the adhesion at the stamp interface between the pick-up stage, which requires a stamp with sufficient adhesion to peel the microelectronic device from the donor substrate, and the print stage, which requires a stamp with sufficiently low adhesion to successfully print the device onto the target substrate.
In order to improve the micro-transfer efficiency and the safety of equipment, students propose to improve the microstructure on the surface of the seal, and utilize finite element software to numerically analyze the influence of the array structure of the transfer material, the pillar size of the seal with a columnar structure and the viscoelasticity effect of the seal on the transfer process. Most of the surfaces of micro transfer printing seals commonly used in the industry at the present stage are pointed cone microstructure protrusions which are uniformly distributed, although enough adhesion force is guaranteed to a certain extent, the large vertical load of equipment cannot be overcome, if the speed is improperly controlled, the seal is easy to extrude a substrate material, the equipment is damaged, potential safety hazards are caused, and the production difficulty is large and the efficiency is low. In terms of materials, the Shape Memory Polymer (SMP) triggered by heat is popular with scholars in the same field, when the SMP is used as a micro-transfer stamp material and reaches a certain critical temperature, the SMP is converted into a rubber state with low modulus, so that the temperature is reduced, the SMP can be converted into a glass state with high modulus, and the production process is highly controllable.
In summary, with the further increase of the demand of flexible electronic devices and the continuously improved theoretical research foundation, the integrated manufacturing of flexible electronics is demanding a more efficient, more accurate and higher success rate device.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem such as the protruding structural constraint of micro-structure that leads to of prior art exists because the micro-transfer printing equipment required precision is high, the production degree of difficulty is big and the rendition is inefficient, the utility model provides a controllable adhesion micro-transfer printing seal based on shape memory polymer has improved the controllability of micro-transfer printing process through micron order awl-round platform combination array, has improved the controllable range of change of adhesion of micro-transfer printing, reduces the harsh requirement to micro-transfer printing equipment and environment, reduces the production degree of difficulty, improves production efficiency.
In order to realize the purpose, the technical scheme of the utility model is that:
a controllable adhesion micro-transfer printing stamp based on shape memory polymer comprises a rigid backing and a shape memory polymer block arranged on one side of the rigid backing;
the lower surface of the shape memory polymer block is provided with a microstructure boss, and the microstructure boss is a pointed cone-circular truncated cone combined array consisting of pointed cone microstructure bosses and circular truncated cone microstructure bosses;
the pointed cone microstructure bulge is higher than the circular truncated cone microstructure bulge.
Furthermore, the pointed cone-round table combined array is a square array formed by uniformly arranging a plurality of pointed cone microstructure bulges and a plurality of round table microstructure bulges at intervals.
Further, the interval is 50-100 μm.
Furthermore, the area of the side, away from the shape memory polymer block, of the boss of the circular truncated cone microstructure is smaller than the area of the side, close to the shape memory polymer block, of the boss of the circular truncated cone microstructure.
Further, the pointed cone-circular truncated cone combined array is a micron-sized pointed cone-circular truncated cone combined array.
Furthermore, the pointed cone microstructure bulges and the plurality of round platform microstructure bulges are both made of shape memory polymers.
Further, the bulk shape memory polymer is secured to the rigid backing.
The utility model has the advantages that:
(1) The utility model discloses a little rendition seal structure includes rigid backing and shape memory polymer block, there is the micro-structure bellying shape memory polymer block lower surface, the micro-structure bellying is by Shape Memory Polymer (SMP) material preparation, the micro-structure bellying is awl-round platform combination array, in using, through deploying energy generation facility and applying external load, make seal surface micro-structure bellying take place memory deformation, send the change of interface adhesion size around the deformation, be applied to little rendition in-process with this characteristic, rendition process controllability has been strengthened through little rendition seal structure, the quality of little rendition and efficiency have been improved, and the commonality is good, be applicable to the microelectronic device who has various characteristics, good reproducibility, low use cost.
(2) The utility model discloses a point awl-round platform combination array warp around the back and the change of microelectronic device area of contact is showing, and adhesion force variation range is big, accords with the deformation efficiency demand of SMP seal simultaneously, has improved the speed and the quality of little rendition.
(3) The utility model discloses a pointed cone-round platform combination array structure has improved the adhesion force variation range of little rendition, and the production process is safe controllable, because the existence of pointed cone-round platform combination array structure, in the perpendicular motion of seal, along with the emergence of pointed cone and round platform micro-structure deformation, the pointed cone top is flattened gradually, the increase of the tangent plane area of round platform makes the perpendicular motion of seal obstructed, the deformation later stage provides great extrusion resistance, the direct collision of seal and basement when having avoided printing, it is more reliable. Due to the large contact interface area between the pointed cone-circular truncated cone combined array structure and the microelectronic device, the interface adhesion force is greatly increased, the probability that the adhesion force between the device and the source substrate is larger than that between the device and the seal during stripping is reduced, the occurrence probability of transfer printing process failure is reduced, the micro transfer printing efficiency and safety are improved, and more possibilities are provided for the flexible electronic industry.
Additional features and advantages of the invention will be set forth in part in the detailed description which follows.
Drawings
FIG. 1 is a schematic structural diagram of a shape memory polymer-based controllable adhesion micro-transfer stamp according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a shape memory polymer based controllably adhesive micro-transfer stamp according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating the principle and application flow of a shape memory polymer-based controllably adhesive micro-transfer stamp according to an embodiment of the present invention.
Reference numerals in the drawings of the specification include:
1-rigid backing, 2-shape memory polymer block, 3-pointed cone microstructure protrusion, 4-round table microstructure protrusion, 5-longitudinal electric control slide rail, 6-horizontal electric control slide rail, 7-fixed table, 8-controllable adhesion micro transfer printing stamp based on shape memory polymer, 9-target substrate and 10-source substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, or may be connected between two elements through an intermediate medium, or may be directly connected or indirectly connected, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
In order to solve the problems in the prior art, as shown in fig. 1, the utility model provides a controllable adhesion micro-transfer stamp 8 based on shape memory polymer, which comprises a rigid backing 1 and a shape memory polymer block 2 arranged on one side of the rigid backing 1;
the lower surface of the shape memory polymer block 2 is provided with a microstructure boss, and the microstructure boss is a pointed cone-circular table combined array consisting of pointed cone microstructure bosses 3 and circular table microstructure bosses 4;
the pointed cone microstructure bulge 3 is higher than the round table microstructure bulge 4.
In the embodiment, the shape memory polymer block 2 is a thermosetting epoxy-based shape memory polymer, the lower surface of the block is a contact surface with a microelectronic device, when the block is used, the microstructure protruding parts on the shape memory polymer block 2 are in contact with the microelectronic device to be transferred, the adhesion force of the stamp is controlled through the contact area of the surface microstructure protruding parts and the microelectronic device, the size of energy acting on the shape memory polymer stamp can be adjusted through an energy generation device control system according to the material, the volume and the structure of the microelectronic device and the requirements on micro-transfer precision and efficiency, so that the mode and the adhesion force of the stamp are controlled, for example, heat energy is applied to the stamp through devices such as laser, ultrasonic waves and focused ultrasonic devices, the stamp is deformed, and the adhesion force requirements required by the grabbing and printing operations of the microelectronic device are met. The rigid back lining 1 is a non-core part of the stamp, has small change of neutral property in the transfer printing process, and can be fixedly connected with an external lifting mechanism.
The pointed cone-round table combined array is a square array formed by uniformly arranging a plurality of pointed cone microstructure bulges 3 and a plurality of round table microstructure bulges 4 at intervals of 50-100 mu m.
The area of one side of the circular truncated cone microstructure bulge 4, which is far away from the shape memory polymer block 2, is smaller than the area of one side of the circular truncated cone microstructure bulge, which is close to the shape memory polymer block 2, namely the cross section of the circular truncated cone microstructure bulge 4 along the axial direction is of a structure with a narrow top and a wide bottom.
The pointed cone-circular truncated cone combined array is a micron-sized pointed cone-circular truncated cone combined array.
The pointed cone microstructure bulges 3 and the plurality of circular truncated cone microstructure bulges 4 are both made of shape memory polymer, and specifically, the pointed cone-circular truncated cone combined array is formed by the action of a reusable silicon die on the surface of the shape memory polymer.
The shape memory polymer block 2 is fixed to a rigid backing 1.
As shown in fig. 2, in the practical use of the shape memory polymer-based controllable adhesion micro-transfer stamp 8 of the present embodiment, the rigid backing 1 is mounted on the fixing table 7, and the fixing table 7 moves up and down along the longitudinal electrically controlled slide rail 5, so as to realize the up-and-down movement of the shape memory polymer-based controllable adhesion micro-transfer stamp 8; the longitudinal electric control slide rail 5 moves left and right along the horizontal electric control slide rail 6, so that the controllable adhesion micro-transfer printing stamp 8 based on the shape memory polymer moves left and right. The microelectronic device is placed on a source substrate 10, and the fixing table 7, the longitudinal electric control slide rail 5 and the horizontal electric control slide rail 6 drive the controllable adhesion micro-transfer printing stamp 8 based on the shape memory polymer to move, and the controllable adhesion micro-transfer printing stamp 8 based on the shape memory polymer adsorbs and releases the microelectronic device, so that the microelectronic device on the source substrate 10 is moved to a target substrate 9.
The utility model relates to a theory of operation of controllable adhesion micro-transfer seal 8 based on shape memory polymer:
the utility model discloses a micro-transfer seal comprises a rigid backing 1 and shape memory polymer block 2, and 2 surfaces of shape memory polymer block are equipped with the micro-structure arch of a certain amount. The transfer process is completed based on the shape memory effect of the SMP material, the SMP material can change the shape under the stimulation of external light, heat, electricity, chemical reaction and the like, and the SMP material is combined with the surface microstructure to realize controllable adhesion. Taking the grasping process of temperature control SMP stamp deformation as an example, when the energy generator inputs heat energy to the SMP stamp, the shape memory polymer will react to the heat energy, and when the temperature reaches the critical temperature T trans When the seal is converted into a low-modulus rubber state, a certain positive load is applied to the seal, the microstructure convex part on the surface of the seal is extruded to collapse, the geometric attribute of the microstructure convex part is changed, and the adhesive force at the interface is increased along with the gradual increase of the contact area between the surface of the seal and the microelectronic device; then stopping the input of the energy generating device, when the temperature is reduced to the critical temperature T trans The method comprises the following steps that crystal grains in the shape memory polymer are rearranged, the seal is converted into a high-modulus glass state, namely, a shape memory process is completed, at the moment, the seal and the microelectronic device keep ideal surface contact, the interface adhesion force is far greater than the adhesive force of an original substrate to the microelectronic device, the device is reliably grabbed, an operator can integrate the material, the volume and the structure of the microelectronic device and the requirements on micro-transfer printing precision and efficiency, and the energy applied to the SMP seal is adjusted through an energy generation device control system, so that the size of the energy is adjusted through an energy generation device control system, and the shape memory process is completedThe mode and the adhesive force of the stamp are controlled, and the whole transfer printing process is highly controllable. The SMP material can overcome slow rebound effect errors caused by a traditional PDMS stamp, can accurately control the deformation degree of the stamp by using visual and controllable external energy sources such as light, heat and the like, overcomes errors caused by mechanical stretching and abrasion to a device, further applies the SMP stamp to micro-transfer printing of a complex structure, improves the working efficiency and the product quality, and effectively reduces the cost.
The utility model discloses the design of micro-transfer seal geometric attributes is accomplished based on pointed cone-round platform combination array structure, and this structure has also guaranteed that the range of variation of adhesive force is big and controllable when improve equipment safety in utilization. And pointed cone-circular truncated cone combined arrays are uniformly distributed on the surface of the shape memory polymer block 2, wherein the top point of the pointed cone is higher than the upper surface of the circular truncated cone. When a traditional stamp with a pillar-shaped convex structure is in pressing contact with a target substrate 9, the vertical load can be effectively reduced, the direct contact of the stamp with the substrate is avoided, and the service life of the system is prolonged, but due to the limitation of the thickness of a pillar body, the power and the speed required by a machine are both in deterministic requirements during pressing, negative influences are caused on the cost and the efficiency of micro-transfer printing to a certain extent, the geometric attributes of the micro-transfer printing are not obviously changed in the whole transfer printing process, and the change range of the adhesive force is extremely limited; due to the geometrical characteristics of the pointed cone convex structure, the pointed cone convex structure is in point contact with a device in an initial state, the contact area is extremely small, after deformation occurs under the combined action of energy and external load, the contact mode is changed into surface contact, the front and back adhesion force change is obvious, but the pointed cone convex structure is small in size, sensitive to extrusion reaction and incapable of playing a good interface protection role. The utility model discloses the integrated configuration that the pointed cone-round platform were arranged when inheriting the good elastic deformation efficiency of circular cone, has also inherited the bellied security of round platform. Taking a transfer printing grabbing stage as an example, after an energy generating device is deployed, a lifting device controls a stamp to descend, a pointed cone microstructure bulge 3 is firstly contacted with the surface of a microelectronic device and is extruded by a forward load, the vertex of the pointed cone microstructure bulge collapses, point contact is converted into surface contact with the area gradually increasing, the microelectronic device is contacted with the upper surface of a circular table along with continuous reduction of the height of the stamp, the total contact area is sharply increased, meanwhile, a circular table microstructure bulge 4 is extruded and generates resistance under the combined action of the pointed cone microstructure bulge 3 which collapses, the geometric properties of the narrow upper part and the wide lower part enable the stamp to be more close to a substrate, the resistance applied to the stamp is larger, collision of the stamp and a main substrate is effectively prevented, when the lifting distance set by a system is reached, the stamp stops descending, the energy generating device is stopped to reduce the temperature to be below a critical temperature to complete shape memory of the state, the contact mode and the contact area of the stamp surface and the microelectronic device before and after extrusion are obviously changed, the interface adhesion force is also obviously changed, and the printing quality is ensured.
The utility model discloses a micro-transfer seal can strengthen the controllability of micro-transfer process, utilize the deformation of SMP seal to reply characteristic and the influence of surperficial micro-structure geometric attributes to interface adhesion, the realization is to snatching and printing of small electronic device, design the protruding geometric attributes of seal of adaptation promptly, realize changing the micro-structure shape through temperature control shape memory polymer mode, the control snatchs and prints stage seal micro-structure functional surface and microelectronic device's area of contact, further control seal interface adhesion size, compare traditional method, the adhesion of seal is more controllable.
During the in-service use, the utility model discloses accessible energy generation device snatchs and the separation operation, and energy conversion form accessible designs the analysis of practical application direction, and the range of application is wide, can include partial clean energy's utilization simultaneously.
The application process of the controllable adhesion micro-transfer stamp 8 based on the shape memory polymer comprises the following steps:
(1) Taking a thermally triggered shape memory polymer as an example, under the condition of room temperature, the seal usually presents a high-modulus glass state, the activity of a polymer molecular chain of the seal is low, and the shape of the seal is fixed;
(2) When the temperature is heated to the critical temperature T trans When the seal is in the above state, the polymer molecular chain starts to move, the seal is in a low-modulus rubber state, the seal in the state can generate elastic deformation under the action of external force, the directional arrangement form is reduced, and the distance between the pointed cone microstructure bulge 3 and the rigid backing is reduced1, the vertical height is reduced, i.e. the phenomenon of "heat shrinkage" occurs, thereby completing the grasping operation.
(3) Under the continuous application of external force, positive pressure is applied to the boss 4 of the circular truncated cone microstructure on the rigid backing 1, the phenomenon of thermal contraction also occurs, the macroscopic scale is shortened, the contact area between the microelectronic device and the seal is increased, and the interface adhesion force between the shape memory polymer and the microelectronic device is enhanced;
(4) In order to avoid the damage of the device caused by the collision of the rigid backing 1 and the source substrate 10 under the application of external force, the thickness of the lower part of the circular truncated cone microstructure bulge 4 enables microscopic molecular chains to gather, so that certain resistance can be provided for the falling of the stamp, and the use safety is ensured.
(5) After the energy generation device is switched off, the ambient temperature is gradually reduced to the critical temperature T trans Hereinafter, the reversible phase transition region in the SMP is reoriented along the gravity direction, and finally, crystallization is performed, and the pointed cone microstructure protrusions 3 and the truncated cone microstructure protrusions 4 grow vertically in a macroscopic angle until the initial state is recovered, which is the phenomenon of "cold elongation".
Furthermore, it should be noted that: transition temperature T trans The method needs to be determined according to the geometric structure parameters, the process, the surface quality and the like of the SMP stamp.
As shown in fig. 3, the printing step of a shape memory polymer-based controlled adhesion micro-transfer stamp 8 (SMP stamp for short) of this embodiment includes:
as shown in (a), after setting the parameters of the energy generating device, the SMP stamp is placed right above the source substrate 10, and the microelectronic devices are arranged on the surface of the source substrate 10 to prepare for the transfer printing operation.
As shown in (b), taking the thermally triggered SMP material as an example, the environmental temperature reaches the critical temperature T under the external stimulus of the energy generating device trans Meanwhile, a positive pressure in the vertical direction is applied to the stamp, so that the stamp is attached to the microelectronic device to be transferred.
Turning off the energy generating device and returning the ambient temperature to the critical temperature T as shown in (c) trans In contrast, SMP materials undergo a "cold shrink" phenomenon in thatThe elastic deformation generated by the attachment in the last step is fixed, the utility model discloses sharp awl-round platform combination array geometry seal can produce great interface adhesion, grabs the microelectronic device firmly on the SMP surface.
As shown in (d), the SMP stamp is lifted, and the microelectronic device waiting for transfer is lifted together with the SMP material by the interfacial adhesion force.
As shown in (e), the SMP stamp is moved over the target substrate 9, ready for printing.
As shown in (f), the stamp is moved down to a proper height to start the printing operation.
As shown in (g), the energy generating device is operated again to heat the ambient temperature to T trans On the upper portion, polymer molecular chains are loosened, the seal is changed into a low-modulus rubber state and is easy to deform, the grabbing force on the microelectronic device is reduced, and the microelectronic device is gradually printed on the surface of the target substrate 9.
As shown in fig. h, the stamp is lifted up again to prepare for the next printing operation.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A controllable adhesion micro-transfer printing stamp based on shape memory polymer is characterized by comprising a rigid back lining and a shape memory polymer block arranged on one side of the rigid back lining;
the lower surface of the shape memory polymer block is provided with a microstructure boss, and the microstructure boss is a pointed cone-circular truncated cone combined array consisting of pointed cone microstructure bosses and circular truncated cone microstructure bosses;
the pointed cone microstructure bulge is higher than the circular truncated cone microstructure bulge.
2. The shape memory polymer-based controlled adhesion micro transfer stamp of claim 1, wherein the pointed cone-truncated cone combined array is a square array formed by a plurality of pointed cone micro-structural protrusions and a plurality of truncated cone micro-structural protrusions which are uniformly arranged at intervals.
3. The shape memory polymer-based controlled adhesion micro transfer stamp of claim 2, wherein the spacing is 50-100 μm.
4. The shape memory polymer-based controlled adhesion micro transfer stamp of claim 1, wherein the area of the side of the truncated microstructure protrusions away from the shape memory polymer block is smaller than the area of the side of the truncated microstructure protrusions close to the shape memory polymer block.
5. The shape memory polymer-based controlled adhesion micro transfer stamp of claim 1, wherein the pointed cone-circular truncated cone combined array is a micron-sized pointed cone-circular truncated cone combined array.
6. The shape memory polymer-based controlled adhesion micro transfer stamp of claim 1, wherein the pointed microstructure protrusions and the plurality of truncated microstructure protrusions are made of a shape memory polymer.
7. The shape memory polymer-based controlled adhesion micro-transfer stamp of claim 1, wherein the shape memory polymer mass is fixed to the rigid backing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222746983.6U CN218287228U (en) | 2022-10-19 | 2022-10-19 | Controllable adhesion micro-transfer seal based on shape memory polymer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222746983.6U CN218287228U (en) | 2022-10-19 | 2022-10-19 | Controllable adhesion micro-transfer seal based on shape memory polymer |
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| CN218287228U true CN218287228U (en) | 2023-01-13 |
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| CN202222746983.6U Active CN218287228U (en) | 2022-10-19 | 2022-10-19 | Controllable adhesion micro-transfer seal based on shape memory polymer |
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