CN218277285U

CN218277285U - Integrated circuit board with heat radiation structure

Info

Publication number: CN218277285U
Application number: CN202222439662.1U
Authority: CN
Inventors: 陈生古
Original assignee: Shenzhen Weidianbao Electronics Co ltd
Current assignee: Shenzhen Weidianbao Electronics Co ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2023-01-10
Anticipated expiration: 2032-09-15

Abstract

The utility model discloses an integrated circuit board with heat radiation structure, including circuit layer, heat-conducting component and radiator unit, circuit layer lower extreme is provided with insulating substrate, and both ends are connected with the viscose layer about the insulating substrate for guide heat the heat-conducting component is connected in insulating substrate upper surface, and the heat-conducting component includes conducting block and insulating piece, the laminating of conducting block upper end has the insulating piece, is used for the forced air cooling heat dissipation the radiator unit connects in circuit layer upper end, and radiator unit is including filling up foot, shell body and heat dissipation fan, fill up the foot upper end and install the shell body. This integrated circuit board with heat radiation structure is provided with the heat conduction piece, and insulating substrate upper surface has been seted up a plurality of notches and has been used for accepting to place the heat conduction piece and install, and then carries out the heat conduction gathering to whole integrated circuit board through the effect of the heat conduction piece of even setting to the heat dissipation fan through upper end parallel arrangement carries out the forced air cooling and concentrates the heat dissipation, improves the radiating effect of whole integrated circuit board.

Description

Integrated circuit board with heat radiation structure

Technical Field

The utility model relates to an integrated circuit board technical field specifically is an integrated circuit board with heat radiation structure.

Background

An integrated circuit board is also called an integrated circuit board and is a carrier for carrying an integrated circuit. But often the integrated circuit board is also brought on. The integrated circuit board is mainly made of silica gel, so the integrated circuit board is generally green.

Utility model discloses an integrated circuit board with shock attenuation heat dissipation function as application number CN202121197535.4 includes: the damping structures are arranged on the bottom plate and the side plates, so that when the circuit board is vibrated, the influence of vibration on the circuit board is effectively absorbed and relieved by the expansion of the V-shaped frame and the extension spring, and meanwhile, the damping structures are arranged on the four surfaces of the end part of the fixing plate, so that the circuit board can be protected in all directions; the radiating grooves are formed in the bottom plate, so that effective radiating processing can be carried out on the circuit board, dust can be effectively prevented from entering the radiating grooves, the radiating fans are arranged on the side plates, the radiating fans can effectively carry out radiating processing on the circuit board in working engineering, damage to the circuit board caused by heat is reduced, and the service life of the circuit board is prolonged.

The integrated circuit board similar to the above application has the following disadvantages at present:

in the heat dissipation treatment process, the heat dissipation effect is poor only by matching the heat dissipation grooves with the heat dissipation fans, and only the specific areas where the heat dissipation fans are installed can be subjected to heat dissipation.

In view of the above, the present invention provides an integrated circuit board with a heat dissipation structure, which is improved in view of the existing structure and defects, so as to achieve the purpose of having more practical value.

Disclosure of Invention

An object of the utility model is to provide an integrated circuit board with heat radiation structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integrated circuit board with heat radiation structure, includes circuit layer, thermal conductivity subassembly and radiator unit, circuit layer lower extreme is provided with insulating substrate, and both ends are connected with the viscose layer about the insulating substrate for guide heat thermal conductivity subassembly connects in insulating substrate upper surface, and thermal conductivity subassembly includes heat conduction piece and insulating piece, the laminating of heat conduction piece upper end has the insulating piece, is used for the forced air cooling heat dissipation radiator unit connects in circuit layer upper end, and radiator unit is including filling up foot, shell body and heat dissipation fan, fill up the foot upper end and install the shell body, and the inside rotation of shell body is connected with the heat dissipation fan.

Furthermore, the heat conduction blocks are uniformly distributed on the upper surface of the insulating base material, and the heat conduction blocks and the insulating base material are in a fully-surrounding structure through the insulating sheets.

Furthermore, the circuit layer is connected with the insulating base material in a bonding mode through the adhesive layer, and the size of the opening structure of the insulating base material is matched with that of the outer opening structure of the heat conducting block.

Furthermore, the heat dissipation assembly further comprises a cover frame and a partition, the cover frame is connected to the upper end inside the outer shell, and the partition is arranged inside the cover frame.

Furthermore, the cover frame is connected with the outer shell in a clamping mode, and the partition blades are distributed with the cover frame in an equidistant mode.

Furthermore, the welding medium layer is welded on the upper surface of the circuit layer, the bottom end of the insulating base material is connected with the bottom substrate, and the bottom end of the bottom substrate is provided with an anti-static assembly used for removing static electricity.

Furthermore, the anti-static component comprises an inner groove, a guide block and an insulating pad, the guide block is arranged in the inner groove, and the insulating pad is arranged on the inner wall of the inner groove.

The utility model provides an integrated circuit board with heat radiation structure possesses following beneficial effect:

the heat-conducting fins are arranged in the vacant areas of the whole dust-collecting circuit board, so that the heat dissipation effect of the surface of the whole circuit board is realized, the heat dissipation fan is continuously cooled in a specific area, the heat of the specific area is uneven with that of other areas of the circuit board, and the heat-conducting fins are neutralized to achieve the effect of uniform heat dissipation.

1. The utility model discloses be provided with the heat conduction piece, a plurality of notches are seted up to insulating substrate upper surface and are used for accepting and place the heat conduction piece and install, and then carry out the heat conduction gathering to whole integrated circuit board through the effect of the heat conduction piece of even setting, and carry out forced air cooling through upper end parallel arrangement's heat dissipation fan and concentrate the heat dissipation, improve the radiating effect of whole integrated circuit board, and place the installation back at heat conduction piece and insulating substrate, it is sealed further to carry out the block through the upper end insulating piece, and seal the cover through the viscose layer, guarantee the stability of heat conduction piece installation.

2. The utility model discloses be provided with the lid frame, the inside upper end block of shell body is connected with a structure size identical lid frame, and its inside equidistance is provided with polylith slope form and separates the leaf for inside getting into the shell body such as separation upper end dust fall, the block is installed in the lid frame of the inside upper end of shell body dismouting of being convenient for simultaneously, and then realizes breaking away from to the lid frame, is convenient for to the clearance of radiating piece, maintain, avoids the dust to amass stifled, improves whole radiating effect.

3. The utility model discloses be provided with the metal guide block, the metal guide block through the inside setting of bottom substrate bottom inner groovy is derived whole collection dirt circuit board static on surface, avoids static to cause the short circuit and influence normal use to integrated circuit board.

Drawings

Fig. 1 is a schematic overall side view of an integrated circuit board with a heat dissipation structure according to the present invention;

fig. 2 is a schematic view of a top view structure of an insulating substrate and a heat-conducting block of an integrated circuit board with a heat-dissipating structure according to the present invention;

fig. 3 is a schematic diagram of a three-dimensional structure of a circuit layer and a guide block of an integrated circuit board with a heat dissipation structure according to the present invention;

fig. 4 is a schematic view of the overlooking structure of the housing and the cover frame of the integrated circuit board with the heat dissipation structure of the present invention.

In the figure: 1. a circuit layer; 2. welding a medium layer; 3. an adhesive layer; 4. an insulating base material; 5. a base substrate; 6. a heat conducting component; 601. a heat conducting block; 602. an insulating sheet; 7. a heat dissipating component; 701. a foot pad; 702. an outer housing; 703. a heat dissipation fan; 704. a cover frame; 705. separating leaves; 8. an anti-static component; 801. an inner groove; 802. a guide block; 803. an insulating pad.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 and fig. 2, an integrated circuit board with a heat dissipation structure comprises a circuit layer 1, a heat conduction assembly 6 and a heat dissipation assembly 7, wherein an insulating substrate 4 is arranged at the lower end of the circuit layer 1, and adhesive layers 3 are connected to the upper end and the lower end of the insulating substrate 4, the heat conduction assembly 6 for guiding heat is connected to the upper surface of the insulating substrate 4, and the heat conduction assembly 6 comprises a heat conduction block 601 and an insulating sheet 602, an insulating sheet 602 is attached to the upper end of the heat conduction block 601, the heat conduction block 601 is uniformly distributed on the upper surface of the insulating substrate 4, and the heat conduction block 601 completely surrounds the insulating substrate 4 through the insulating sheet 602, the circuit layer 1 is adhesively connected with the insulating substrate 4 through the adhesive layer 3, and the opening structure size of the insulating substrate 4 is matched with the outer opening structure size of the heat conduction block 601, a plurality of notches are formed in the upper surface of the insulating substrate 4 for accommodating and placing the heat conduction block 601 for installation, and then the whole integrated circuit board is subjected to heat conduction and concentrated heat dissipation through the heat dissipation fan 703 arranged in parallel at the upper end, thereby ensuring the stability of the heat conduction block 601 through the sealing and the adhesive layer 602. The air-cooling heat dissipation assembly 7 is connected to the upper end of the circuit layer 1, the heat dissipation assembly 7 comprises a pad 701, an outer shell 702 and a heat dissipation fan 703, the outer shell 702 is mounted at the upper end of the pad 701, and the heat dissipation fan 703 is rotatably connected inside the outer shell 702.

As shown in fig. 1 and fig. 4, the heat dissipation assembly 7 further includes a cover frame 704 and partition leaves 705, the upper end inside the outer housing 702 is connected with the cover frame 704, the partition leaves 705 are arranged inside the cover frame 704, the cover frame 704 is connected with the outer housing 702 in a snap-fit manner, the partition leaves 705 are distributed with respect to the cover frame 704 at equal intervals, the cover frame 704 with the same structure size is connected with the upper end inside the outer housing 702 in a snap-fit manner, a plurality of inclined partition leaves 705 are arranged inside the outer housing 702 at equal intervals for preventing upper end dust from entering the outer housing 702, and the cover frame 704 is mounted on the upper end inside the outer housing 702 in a snap-fit manner for easy dismounting and mounting, so as to realize the separation of the cover frame 704, facilitate the cleaning and maintenance of the heat dissipation member, avoid dust accumulation and blocking, and improve the overall heat dissipation effect.

As shown in fig. 1 and 3, a welding medium layer 2 is welded on the upper surface of the circuit layer 1, a bottom substrate 5 is connected to the bottom end of the insulating substrate 4, and an anti-static component 8 for removing static electricity is arranged at the bottom end of the bottom substrate 5. Prevent that static subassembly 8 includes inner groovy 801, guide block 802 and insulating pad 803, and inner groovy 801 internally mounted has guide block 802, and inner groovy 801 inner wall is provided with insulating pad 803, derives the static on whole collection dirt circuit board surface through the inside metal guide block 802 that sets up of inner groovy 801 in bottom of bottom base plate 5, avoids static to cause the short circuit and influence normal use to integrated circuit board.

In summary, as shown in fig. 1-4, when the integrated circuit board with a heat dissipation structure is used, the heat dissipation fan 703 inside the outer housing 702 is first activated to operate, so that the heat dissipation fan 703 performs air-cooling heat dissipation treatment on the surface of the circuit layer 1 parallel to the bottom end of the heat dissipation fan 703, the upper surface of the insulating substrate 4 inside the integrated circuit board is provided with a plurality of notches for receiving and placing the heat conduction blocks 601 for installation, and further performs heat conduction and aggregation on the entire integrated circuit board through the action of the uniformly arranged heat conduction blocks 601, and when the heat dissipation fan 703 performs a heat dissipation action, it is used for neutralizing heat, and further realizes uniform heat dissipation of the entire circuit board, and after the heat conduction blocks 601 and the insulating substrate 4 are placed and installed, the heat conduction block 602 is further used for clamping and sealing, and seal up through viscose layer 3 and cover, guarantee the stability of heat conduction piece 601 installation, the inside upper end block of corresponding shell body 702 is connected with a cover frame 704 that the structure size is identical, its inside equidistance is provided with polylith slope form and separates the leaf 705, it is inside to get into shell body 702 for separation upper end dust fall etc. simultaneously, the block is installed in the inside cover frame 704 of upper end of shell body 702 and is convenient for the dismouting, and then realize breaking away from to cover frame 704, be convenient for to the clearance of radiating piece, the maintenance, avoid the dust to amass stifled, improve whole radiating effect, and lead out the static on whole dust collection circuit board surface through the inside metal guide block 802 that sets up of bottom inner grove 801 of bottom base plate 5, avoid static to cause the short circuit to integrated circuit board and influence normal use.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. The utility model provides an integrated circuit board with heat radiation structure, includes circuit layer (1), heat-conducting component (6) and radiator unit (7), its characterized in that: line layer (1) lower extreme is provided with insulating substrate (4), and both ends are connected with viscose layer (3) about insulating substrate (4), are used for guiding thermal heat thermal-conductive subassembly (6) are connected in insulating substrate (4) upper surface, and thermal-conductive subassembly (6) are including heat conduction piece (601) and insulating piece (602), the laminating has insulating piece (602) on heat conduction piece (601), is used for the forced air cooling heat dissipation heat radiation subassembly (7) are connected in line layer (1) upper end, and heat radiation subassembly (7) are including filling up foot (701), shell body (702) and heat dissipation fan (703), fill up foot (701) upper end and install shell body (702), and shell body (702) inside rotation is connected with heat dissipation fan (703).

2. The integrated circuit board with the heat dissipation structure as claimed in claim 1, wherein the heat conduction blocks (601) are uniformly distributed on the upper surface of the insulating substrate (4), and the heat conduction blocks (601) and the insulating substrate (4) are in a full surrounding structure through the insulating sheet (602).

3. The integrated circuit board with the heat dissipation structure according to claim 1, wherein the circuit layer (1) is adhesively connected to the insulating substrate (4) through the adhesive layer (3), and the size of the opening structure of the insulating substrate (4) is identical to the size of the outer opening structure of the heat conduction block (601).

4. The integrated circuit board with the heat dissipation structure according to claim 1, wherein the heat dissipation assembly (7) further comprises a cover frame (704) and a partition (705), the cover frame (704) is connected to the upper end of the inside of the outer casing (702), and the partition (705) is arranged inside the cover frame (704).

5. The integrated circuit board with the heat dissipation structure as recited in claim 4, wherein the cover frame (704) is connected with the outer housing (702) in a snap-fit manner, and the partition leaves (705) are equidistantly distributed about the cover frame (704).

6. The integrated circuit board with the heat dissipation structure as recited in claim 1, wherein a soldering medium layer (2) is soldered on the upper surface of the circuit layer (1), a bottom end of the insulating substrate (4) is connected with a bottom substrate (5), and the bottom end of the bottom substrate (5) is provided with an antistatic component (8) for removing static electricity.

7. The integrated circuit board with the heat dissipation structure as recited in claim 6, wherein the anti-static component (8) comprises an inner groove (801), a guide block (802) and an insulating pad (803), the guide block (802) is mounted inside the inner groove (801), and the insulating pad (803) is arranged on the inner wall of the inner groove (801).