CN218194514U

CN218194514U - Chip loading device for CMP wafer polishing machine

Info

Publication number: CN218194514U
Application number: CN202221530473.9U
Authority: CN
Inventors: 李国强
Original assignee: Guangzhou Everbright Technology Co ltd
Current assignee: Guangzhou Everbright Technology Co ltd
Priority date: 2022-06-16
Filing date: 2022-06-16
Publication date: 2023-01-03
Anticipated expiration: 2032-06-16

Abstract

The utility model discloses a wafer loading device for a CMP wafer polishing machine, which comprises a main driving mechanism and a wafer loading head arranged on the main driving mechanism; the general driving mechanism is used for driving the wafer slide glass head to move between the loading station and the lower part of a polishing head in the CMP wafer polishing machine; wafer carrier head includes slide glass base, lifter plate and lift actuating mechanism, the slide glass base with total actuating mechanism connects, be equipped with the carrier plate portion that is used for bearing the wafer on the slide glass base, the lifter plate is located carrier plate portion receives the lift actuating mechanism drive and can be relative carrier plate portion reciprocates, the lifter plate is used for the lifting to be located wafer in the carrier plate portion is in order to transfer the polishing head in CMP wafer polishing machine with the wafer on. The wafer loading efficiency can be improved, and meanwhile, the loading positions of the wafers on the polishing head can be ensured to be uniform, so that the polishing precision of the wafers can be improved.

Description

Chip loading device for CMP wafer polishing machine

Technical Field

The utility model relates to a wafer polishing technical field especially relates to a CMP wafer polishing machine is with last piece device.

Background

CPM, i.e., chemical mechanical polishing, is a critical process for achieving wafer surface planarization in the fabrication of integrated circuits. Different from the traditional pure mechanical or pure chemical polishing method, the CMP process realizes the removal of micron/nanometer-scale different materials on the surface of the wafer by combining the surface chemical action and the mechanical grinding technology, thereby achieving the nanometer-scale planarization of the surface of the wafer and leading the next photoetching process to be carried out.

At present, a CMP wafer polishing machine is used for polishing a wafer, however, the CMP wafer polishing machine in the market needs to manually load a wafer, that is, the wafer is loaded onto a polishing head through manual operation, whether the loading position is at the center is determined, and finally, a suction cup on the polishing head adsorbs the wafer.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a wafer loading device for CMP wafer polishing machine, it can improve wafer loading efficiency, and the loading position of wafer on the polishing head can also be ensured simultaneously to be unified to can improve the polishing precision of wafer.

The purpose of the utility model is realized by adopting the following technical scheme:

the wafer loading device for the CMP wafer polishing machine comprises a main driving mechanism and a wafer carrying head arranged on the main driving mechanism;

the general driving mechanism is used for driving the wafer carrying head to move between the loading station and the lower part of a polishing head in the CMP wafer polishing machine;

wafer year piece head includes slide glass base, lifter plate and lift actuating mechanism, the slide glass base with total actuating mechanism connects, be equipped with the year piece portion that is used for bearing the wafer on the slide glass base, the lifter plate is located year piece portion receives lift actuating mechanism drive and can be relative year piece portion reciprocates, the lifter plate is used for the lifting to be located carry wafer on the piece portion in order to transfer the polishing head in the CMP wafer burnishing machine with the wafer on.

Furthermore, a blocking portion located at the outer edge of the top of the carrying piece portion is further arranged on the carrying piece base and used for blocking the wafer from deviating from the carrying piece portion.

Further, the stop part is around the stop ring that the center of year piece portion set up, encloses the constant head tank with the wafer adaptation between the inner wall of stop ring and the top surface of year piece portion.

Furthermore, a flexible pad is arranged on the inner wall of the blocking ring.

Further, the blocking portion comprises a plurality of blocking columns, and the blocking columns are sequentially arranged at the outer edge of the top of the carrying piece portion and arranged around the center of the carrying piece portion.

Furthermore, the carrier plate part is a carrier plate ring, and the lifting plate is arranged in a center hole of the carrier plate ring.

Furthermore, a plurality of through holes penetrating through the upper end and the lower end of the carrying piece part are formed in the carrying piece part, the number of the lifting plates is the same as that of the through holes, and the lifting plates are correspondingly arranged in the through holes one by one.

Further, the lifting driving mechanism is an air bag lifting driver.

Furthermore, a flexible buffer structure is arranged between the lifting plate and the lifting driving mechanism.

Further, the top surfaces of the carrying piece part and the lifting plate are both provided with flexible cushions.

Further, the general driving mechanism is a manipulator.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a CMP wafer burnishing machine is with last piece device, during the use, the accessible is total actuating mechanism drive wafer slide head and is removed to the material loading station, the artifical wafer that will be located the material loading station of accessible is placed in carrying the piece portion, then remove the burnishing head below in the CMP wafer burnishing machine through total actuating mechanism drive wafer slide head, after that through lift actuating mechanism drive lifter plate lifting and will be located the wafer of carrying the piece portion and transfer to the burnishing head of CMP wafer burnishing machine on, thereby supply the burnishing head can adsorb the wafer, accomplish the loading of wafer, the automation that this structure can realize the wafer is gone up the piece, wafer is gone up piece efficiently, and can ensure that the loading position of each wafer on the burnishing head all is the same, wafer loading positioning accuracy is high, thereby can improve the polishing precision of wafer.

Drawings

FIG. 1 is a schematic view of a loading device for a CMP wafer polishing machine according to the present invention;

FIG. 2 is a schematic structural diagram of a wafer carrier head in a loading device for a CMP wafer polisher according to the present invention.

In the figure: 10. a main drive mechanism; 20. a wafer carrier head; 21. a slide base; 211. a carrier sheet section; 212. a blocking portion; 22. a lifting plate.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

Referring to fig. 1, a wafer loading apparatus for a CMP wafer polishing machine according to a preferred embodiment of the present invention is shown, including a main driving mechanism 10 and a wafer loading head 20 disposed on the main driving mechanism 10; the general driving mechanism 10 is used for driving the wafer carrying head 20 to move between the loading station and a polishing head in the CMP wafer polishing machine; the wafer carrier head 20 comprises a carrier base 21, a lifting plate 22 and a lifting driving mechanism (not shown in the figure), the carrier base 21 is connected with the general driving mechanism 10, a carrier piece portion 211 for carrying a wafer is arranged on the carrier base 21, the lifting plate 22 is arranged on the carrier piece portion 211 and can move up and down relative to the carrier piece portion 211 under the driving of the lifting driving mechanism, and the lifting plate 22 is used for lifting the wafer on the carrier piece portion 211 so as to transfer the wafer to a polishing head in a CMP wafer polishing machine.

The utility model discloses a CMP wafer burnishing machine is with last piece device, during the use, the accessible is total actuating mechanism 10 drive wafer year piece head 20 and is removed to the material loading station, the artifical wafer that will be located the material loading station of accessible is placed in year piece portion 211 then, then it removes the polishing head below in the CMP wafer burnishing machine to carry piece head 20 through total actuating mechanism 10 drive wafer, after that through the lift of lift actuating mechanism drive lifter plate 22 lifting and will be located the wafer of carrying piece portion 211 and transfer to the polishing head of CMP wafer burnishing machine on, thereby supply the polishing head to adsorb the wafer, accomplish the loading of wafer, the automatic piece of going up of wafer can be realized to this structure, the wafer is gone up piece efficiently, and can ensure that the loading position of each polishing head on wafer all is the same, the wafer loads positioning accuracy height, thereby can improve the polishing precision of wafer.

Referring to fig. 1 and 2, the slide base 21 is further provided with a blocking portion 212 located at the top outer edge of the carrier plate portion 211, and the blocking portion 212 is used for blocking the wafer from deviating from the carrier plate portion 211, so that the wafer can be reliably and accurately placed on the carrier plate portion 211 in the wafer transfer process, the lifting plate 22 can reliably lift the wafer, the wafers can be accurately transferred to the designated loading position of the polishing head one by one, and the wafer loading positioning accuracy is higher.

In this embodiment, the blocking portion 212 is a blocking ring disposed around the center of the carrier portion 211, a positioning groove adapted to the wafer is defined between the inner wall of the blocking ring and the top surface of the carrier portion 211, and the positioning groove is used to reliably position the wafer, so that the wafer is reliably placed on the carrier portion 211, the wafer is prevented from shifting during the transfer process, and the wafer loading and positioning accuracy is higher.

In this embodiment, a flexible pad (not shown) is disposed on an inner wall of the stop ring to prevent hard contact between an outer edge of the wafer and the inner wall of the stop ring when the wafer is lifted, so as to protect the outer edge of the wafer.

In other embodiments, the blocking portion 212 may include a plurality of blocking pillars sequentially disposed at the top outer edge of the carrier sheet portion 211 and around the center of the carrier sheet portion 211, and the plurality of blocking pillars may also be used to block the wafer on the carrier sheet portion 211, so as to prevent the wafer from deviating from the carrier sheet portion 211.

In this embodiment, the carrier piece portion 211 is a carrier ring, and the lifting plate 22 is disposed in a center hole of the carrier ring, so that the wafer can be stably lifted only by disposing one lifting plate 22, and the wafer lifting device is simple and practical in structure and low in cost.

In other embodiments, the specific structure of carrier portion 211 is as follows: the carrying piece part 211 is provided with a plurality of through holes penetrating through the upper end and the lower end of the carrying piece part, the number of the lifting plates 22 is the same as that of the through holes, and the lifting plates 22 are correspondingly arranged in the through holes one by one.

Specifically, in the present embodiment, the overall driving mechanism 10 is a robot, and may be a six-degree-of-freedom robot, so that the movement is more flexible.

In other embodiments, the overall driving mechanism 10 may include a rotary cylinder, a traverse driving module disposed on the rotary cylinder, and a lift driving module disposed on the traverse driving module, wherein the wafer carrier head 20 is disposed on the lift driving module, and the wafer carrier head 20 is driven to move between the loading station and the lower side of the polishing head by the cooperation of the rotary cylinder, the traverse driving module, and the lift driving module.

In this embodiment, the lifting driving mechanism is an air bag lifting driver, and the air bag lifting driver has certain flexibility, so that when the lifting plate 22 lifts the wafer to a position where the wafer is supported by the polishing head, the wafer can be buffered, and the lifting plate 22 and the polishing head are prevented from being directly and rigidly contacted to cause damage to the wafer and the polishing head.

Specifically, the airbag lifting driver specifically comprises an air pump and an airbag communicated with the air pump, the airbag is connected with the lifting plate 22, the airbag is inflated by supplying air to the airbag through the air pump so as to drive the lifting plate 22 to move upwards relative to the carrying piece part 211, and the lifting plate 22 can move downwards relative to the carrying piece part 211 by deflating the airbag.

In other embodiments, the lifting driving mechanism may be any one of an electric push rod, an air cylinder, a hydraulic cylinder, and the like, and on the basis of the structure, a flexible buffer structure is disposed between the lifting plate 22 and the lifting driving mechanism, and the flexible buffer structure is used to buffer the lifting plate 22, so as to prevent the damage to the lifting plate 22 and the polishing head due to direct hard contact therebetween.

In particular, the flexible buffer structure may be in particular a rubber pad or a flexible bellows.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

The wafer loading device for the CMP wafer polishing machine is characterized by comprising a main driving mechanism and a wafer loading head arranged on the main driving mechanism;

the general driving mechanism is used for driving the wafer slide glass head to move between the loading station and the lower part of a polishing head in the CMP wafer polishing machine;

wafer year piece head includes slide glass base, lifter plate and lift actuating mechanism, the slide glass base with total actuating mechanism connects, be equipped with the year piece portion that is used for bearing the wafer on the slide glass base, the lifter plate is located year piece portion receives lift actuating mechanism drive and can be relative year piece portion reciprocates, the lifter plate is used for the lifting to be located carry wafer on the piece portion in order to transfer the polishing head in the CMP wafer burnishing machine with the wafer on.
2. The loading device for a CMP wafer polisher according to claim 1 further comprising a stop on the carrier plate at the top outer edge of the carrier plate for stopping the wafer from deflecting away from the carrier plate.
3. The wafer loading apparatus for a CMP wafer polisher according to claim 2 wherein the stop is a stop ring disposed around the center of the carrier plate, and a positioning groove adapted to the wafer is defined between the inner wall of the stop ring and the top surface of the carrier plate.
4. The apparatus of claim 3, wherein a flexible pad is disposed on an inner wall of the barrier ring.
5. The wafer loading apparatus for a CMP wafer polishing machine according to claim 2, wherein the blocking portion includes a plurality of blocking posts, and the plurality of blocking posts are sequentially disposed at a top outer edge of the carrier sheet portion and around a center of the carrier sheet portion.
6. The wafer loading device for a CMP wafer polisher according to claim 1 wherein the carrier is a carrier ring and the lift plate is disposed in a central aperture of the carrier ring.
7. The wafer loading device for a CMP wafer polishing machine according to claim 1, wherein the carrier plate portion is provided with a plurality of through holes penetrating upper and lower ends thereof, the number of the elevating plates is the same as the number of the through holes, and each of the elevating plates is provided in each of the through holes in a one-to-one correspondence.
8. The wafer loading apparatus for a CMP wafer polisher according to claim 1 wherein the lift drive mechanism is a bladder lift drive.
9. The wafer loading apparatus for CMP wafer polisher according to claim 1 with a flexible buffer structure between the lift plate and the lift drive mechanism.
10. The wafer loading apparatus for a CMP wafer polisher according to claim 1 wherein the general drive mechanism is a robot.