CN218125237U - Heat radiation structure and electric automobile - Google Patents

Abstract

The utility model discloses a heat radiation structure and electric automobile. The heat dissipation structure comprises a shell, a liquid inlet mechanism and a liquid outlet mechanism, wherein the shell is provided with a heat dissipation cavity, the inside and the outside of the heat dissipation cavity can be provided with heating elements, so that the utilization rate of a heat dissipation space is improved; establish a plurality of runners in the casing, the both sides of liquid cooling return circuit tubular construction connection casing, and communicate the inlet and the liquid outlet at each runner both ends respectively, the one end of liquid cooling return circuit tubular construction lets in the coolant liquid of lower temperature, in order to dispel the heat through a plurality of runners of a plurality of inlets flow through, the higher temperature coolant liquid after the heat dissipation is discharged through the one side liquid cooling return circuit tubular construction of intercommunication liquid outlet, the casing strengthens the support intensity through the runner wall of every two adjacent runners, the setting of runner can reduce casing weight simultaneously, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

Description

Heat radiation structure and electric automobile

Technical Field

The utility model relates to a liquid cooling heat dissipation technical field, in particular to heat radiation structure and electric automobile.

Background

The liquid cooling heat dissipation device adopted by the conventional vehicle-mounted charger is generally formed by die-casting or metal plate, and the wall thickness of the formed water channel of the die-casting heat dissipation water channel is thick due to process limitation, so that the liquid cooling heat dissipation device is heavy, has high thermal resistance and has poor heat dissipation effect; the wall thickness of the heat dissipation water channel formed by the metal plates is thin, but the pressure resistance of the water channel is low, and the water channel wall is easy to deform.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat radiation structure and electric automobile, aim at solving the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

In order to achieve the above object, the utility model provides a heat radiation structure, heat radiation structure is located in the vehicle-mounted charging machine, including at least one heat dissipation module, heat dissipation module includes:

the heat dissipation device comprises a shell, a heat dissipation cavity and a heat dissipation cover, wherein the shell is provided with a heat dissipation cavity, a plurality of flow channels which are arranged at intervals are arranged in at least one side wall of the shell, the flow channels are arranged around the heat dissipation cavity, the inner wall of the heat dissipation cavity and/or the outer wall of the heat dissipation cavity are used for being connected with a heating element, and a liquid inlet and a liquid outlet are respectively arranged at two ends of each flow channel; and

the liquid inlet mechanism is communicated with liquid inlets of the flow channels; and

and the liquid outlet mechanism is communicated with the liquid outlets of the plurality of flow channels.

Optionally, the housing comprises:

the liquid cooling piece is provided with a plurality of flow channels which are arranged at intervals, one surface of the liquid cooling piece is concavely provided with a containing groove, and the liquid inlet and the liquid outlet are arranged around the notch of the containing groove; and

the two partition plates are connected with two sides of the liquid cooling piece and form the heat dissipation cavity with one side opened in a surrounding mode with the containing groove, and an installation portion is arranged on each partition plate to be connected with an external piece.

Optionally, two the installation department is respectively towards deviating from the open-ended both sides extend the setting, the opening part is used for installing first circuit board, the installation department with first circuit board can dismantle the connection, first circuit board lid closes the opening.

Optionally, a side of the heat dissipation cavity facing away from the opening is used for mounting at least one heat generating element;

or, the surface of one side of the heat dissipation cavity, which is back to the opening, is used for installing a second circuit board, at least one side of the liquid cooling piece, which is adjacent to the partition plate, is provided with a guide connection part, and the guide connection part is provided with a plurality of through holes so that the pins of the heating element accommodated in the heat dissipation cavity can penetrate through the through holes.

Optionally, the accommodating groove is a U-shaped groove;

or, the both ends of liquid cooling spare are equipped with the extension, two the extension is dorsad respectively the opening extends the setting, the inlet with the liquid outlet runs through the extension, the periphery wall of extension is used for installing heating element.

Optionally, the partition plate is an aluminum substrate;

and/or the liquid cooling piece is a temperature equalizing plate;

and/or the liquid cooling piece is of an extrusion molding structure;

and/or at least one clapboard is welded with the liquid cooling piece;

and/or at least one partition plate is detachably connected with the liquid cooling piece.

Optionally, the housing further includes at least one baffle, at least one baffle is disposed in the heat dissipation cavity to divide the heat dissipation cavity into at least a first cavity and a second cavity, and the first cavity and the second cavity are respectively used for accommodating the heating element.

Optionally, the heat dissipation structure includes a plurality of heat dissipation modules, and the liquid inlet mechanism and the liquid outlet mechanism of the plurality of heat dissipation modules are connected in series to form a liquid cooling loop.

The utility model discloses still provide electric automobile, electric automobile includes:

the electric vehicle comprises a vehicle body, wherein an electric power storage structure is arranged in the vehicle body; and

as described above, the heat dissipation structure is disposed in the vehicle body and electrically connected to the power storage structure.

The utility model discloses technical scheme is formed with the heat dissipation chamber through the casing that adopts to have the runner, and heating element can all be installed to the inside and outside of heat dissipation chamber to solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight. The heat dissipation structure comprises a shell, a liquid inlet mechanism and a liquid outlet mechanism, wherein the shell is provided with a heat dissipation cavity, the inside and the outside of the heat dissipation cavity can be provided with heating elements, so that the utilization rate of a heat dissipation space is improved; establish a plurality of runners in the casing, inlet mechanism communicates the inlet of a plurality of runners, go out the liquid outlet of a plurality of runners of liquid mechanism intercommunication, let in lower cold coolant liquid through inlet mechanism, lower cold coolant liquid dispels the heat through a plurality of runners of a plurality of inlets flow through, higher warm coolant liquid after the heat dissipation is discharged through going out liquid mechanism after passing through the liquid outlet, the casing is through the runner wall enhancement support intensity between every two adjacent runners, the setting of runner can reduce casing weight simultaneously, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is an exploded schematic view of an embodiment of the heat dissipation structure of the present invention;

fig. 2 is a schematic view illustrating a structure of a housing according to an embodiment of the heat dissipation structure of the present invention;

fig. 3 is a schematic structural view of a liquid cooling element according to an embodiment of the heat dissipation structure of the present invention;

fig. 4 is a schematic view of a housing structure of another embodiment of the heat dissipation structure of the present invention;

fig. 5 is a schematic view of a housing structure according to another embodiment of the heat dissipation structure of the present invention;

fig. 6 is a schematic view illustrating a structure of a flow direction of liquid in a casing according to another embodiment of the heat dissipation structure of the present invention;

fig. 7 is a schematic view of a liquid cooling element according to another embodiment of the heat dissipation structure of the present invention;

fig. 8 is a schematic view of the heat dissipation structure of the present invention combined with the housing structure of fig. 7;

fig. 9 is an assembly exploded view of the heat dissipation structure of the present invention in combination with the another embodiment of fig. 7;

fig. 10 is a schematic view of the heat dissipation structure of the present invention combined with the assembly structure of the heat dissipation structure of fig. 7;

fig. 11 is a schematic view of an assembly and disassembly structure of the heat dissipation structure of the present invention combined with the housing and the heating element of fig. 7 according to an embodiment;

fig. 12 is a schematic view of an assembly structure of the heat dissipation structure of the present invention in combination with the embodiment of fig. 7;

fig. 13 is a schematic structural view of a liquid cooling element according to yet another embodiment of the heat dissipation structure of the present invention;

fig. 14 is a schematic view of the heat dissipation structure of the present invention combined with the housing structure of fig. 13;

fig. 15 is a schematic structural view of a liquid cooling element according to another embodiment of the heat dissipation structure of the present invention;

fig. 16 is a schematic view of the heat dissipation structure of the present invention combined with the housing structure of fig. 15;

fig. 17 is a schematic view of the heat dissipation structure of the present invention combined with the assembly structure of the heat dissipation structure of fig. 15;

fig. 18 is a schematic view of the heat dissipation structure of the present invention combined with the assembly and disassembly structure of the housing and the heating element shown in fig. 17;

fig. 19 is a schematic structural view of a liquid cooling element according to still another embodiment of the heat dissipation structure of the present invention;

fig. 20 is a schematic view of the heat dissipation structure of the present invention combined with the assembly structure of the heat dissipation structure of fig. 19;

fig. 21 is a schematic view of the heat dissipation structure of the present invention combined with the heat dissipation structure and the assembly structure of the heating element shown in fig. 19;

fig. 22 is a schematic view of the heat dissipation structure of the present invention combined with the assembly structure of another heat dissipation structure and the heat generating element shown in fig. 19.

The reference numbers illustrate:

reference numerals

Name(s)

Reference numerals

Name (R)

Reference numerals

Name (R)

100

Heat radiation structure

30

Liquid cooling piece

50

Partition board

10

Shell body

30A

Flow passage

51

Mounting part

10A

Heat dissipation cavity

301A

Liquid inlet

51A

Mounting hole

10B

Opening of the container

302A

Liquid outlet

90

Liquid cooling loop pipe structure

80

Baffle plate

30B

Containing groove

91

Liquid inlet pipe

70

Heating element

31

Main body

911

A first liquid inlet passage

71

Circuit board

32

Guide connection part

912

Second liquid inlet passage

72

Magnetic core component

32A

Perforation

92

Drain pipe

73

Paster MOS

33

Extension part

921

First liquid outlet passage

74

Plug-in MOS

90A

Liquid inlet interface

922

Second liquid outlet passage

90B

Liquid drainage interface

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indications in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "secured" are to be construed broadly, and thus, for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the expression "and/or" as used throughout is meant to encompass three juxtaposed aspects, exemplified by "A and/or B", including either the A aspect, or the B aspect, or aspects in which both A and B are satisfied. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a heat radiation structure 100.

Referring to fig. 1 to 22, fig. 1 to 4 are schematic views of a heat dissipation structure 100 employing one kind of liquid cooling member 30, fig. 7 to 10 are schematic views of a heat dissipation structure 100 employing another kind of liquid cooling member 30, fig. 13 to 14 are schematic views of a heat dissipation structure 100 employing yet another kind of liquid cooling member 30, and fig. 15 to 18 are schematic views of a heat dissipation structure 100 employing yet another kind of liquid cooling member 30;

fig. 5 and 6 are schematic diagrams of the heat dissipation structure 100 with a plurality of heat dissipation chambers 10A and the flow direction of the liquid in the four liquid cooling members 30; fig. 19 to 22 are schematic views of a heat dissipation structure 100 using still another liquid cooling member 30.

In the embodiment of the present invention, the heat dissipation structure 100 is located in the vehicle-mounted charger, and includes at least one heat dissipation module, where the heat dissipation module includes a housing 10, a liquid inlet mechanism, and a liquid outlet mechanism, and the housing 10 has a heat dissipation cavity 10A; as shown in fig. 1 to 4, a plurality of flow channels 30A are disposed in the housing 10 at intervals, the plurality of flow channels 30A are disposed around the heat dissipation cavity 10A, an inner wall of the heat dissipation cavity 10A and/or an outer wall of the heat dissipation cavity 10A are used for connecting the heating element 70, and a liquid inlet 301A and a liquid outlet 302A are respectively disposed at two ends of each flow channel 30A; the liquid inlet mechanism is communicated with liquid inlets 301A of the plurality of flow channels 30A; the liquid outlet mechanism is communicated with liquid outlets 302A of the plurality of flow channels.

The utility model discloses technical scheme is formed with heat dissipation chamber 10A through the casing 10 that adopts to have runner 30A, and heat dissipation chamber 10A's inside and outside all can install heating element 70 to solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight. The heat dissipation structure 100 comprises a shell 10, a liquid inlet mechanism and a liquid outlet mechanism, wherein the shell 10 is provided with a heat dissipation cavity 10A, the inside and the outside of which can be provided with a heating element 70, so as to improve the utilization rate of a heat dissipation space; a plurality of flow channels 30A are arranged in the housing 10, the liquid inlet mechanism is communicated with liquid inlets 301A of the flow channels 30A, and the liquid outlet mechanism is communicated with liquid outlets 302A of the flow channels, so as to communicate the flow channels 30A for heat dissipation. Wherein, heat radiation structure 100 lets in lower cryogenic coolant liquid through feed liquor mechanism, lower cryogenic coolant liquid dispels the heat through a plurality of runners 30A of flowing through of a plurality of inlet 301A, higher temperature coolant liquid after the heat dissipation is discharged through liquid outlet 302A back through liquid outlet mechanism, casing 10 strengthens the support intensity through the runner wall between every two adjacent runners 30A, simultaneously runner 30A's setting can reduce casing 10 weight, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

It can be understood that the heat generating element 70 includes a first heat generating source and a second heat generating source, the first heat generating source is a PCB board, and includes a circuit board 71 and a magnetic core element 72, the magnetic core element 72 is a transformer, and may also be a high heat generating element 70 such as a capacitor or a power board, wherein the core packages of the transformer and the capacitor may be accommodated in the heat dissipation cavity 10A and electrically connected to the circuit board 71 through pins, the circuit board 71 may be one or two, that is, the first circuit board 71 and the second circuit board 71, the first circuit board 71 and/or the second circuit board 71 are disposed on one side or both sides of the heat dissipation cavity 10A, and may also be disposed on an adjacent side or an opposite side, such as a PCB board; the second heat source may be disposed on an outer wall of the heat dissipation chamber 10A, including being disposed on the outer sidewall and/or the outer bottom wall, and the second heat source may be a patch MOS73, a plug MOS74, or the like.

It can be understood that when the installation condition allows, the second heat source can be arranged on the outer wall of the liquid inlet mechanism and/or the liquid outlet mechanism, as shown in fig. 1, so as to facilitate heat dissipation.

Optionally, the housing 10 includes a liquid cooling member 30 and two partition plates 50, the liquid cooling member 30 has a plurality of flow passages 30A arranged at intervals, a surface of the liquid cooling member 30 is recessed to form a receiving groove 30B, and the liquid inlet 301A and the liquid outlet 302A are arranged around a notch of the receiving groove 30B; two partition boards 50 are connected with two sides of the liquid cooling member 30 and form a heat dissipation chamber 10A with one side opening 10B by enclosing with the containing groove 30B, and each partition board 50 is provided with a mounting part 51 for connecting with an external member.

In this embodiment, a plurality of flow channels 30A are disposed in the plate of the liquid cooling member 30 at intervals, two ends of the flow channels 30A penetrate through two side ends of the plate to form a liquid inlet 301A and a liquid outlet 302A, the liquid inlet 301A and the liquid outlet 302A are distributed at two wall ends of the accommodating groove 30B, one section of the liquid inlet pipe is correspondingly communicated with the liquid inlet 301A to input the cooling liquid with a lower temperature, and the other section of the liquid inlet pipe is correspondingly communicated with the liquid outlet 302A to discharge the cooling liquid with a higher temperature after absorbing heat. The cooling liquid with lower temperature flows in the flow channel 30A and is discharged from the liquid outlet 302A located at the opposite side of the liquid inlet 301A, so that the cooling liquid surrounds the plate extending direction of the whole liquid cooling piece 30, the heat dissipation contact area is greatly increased, and the heat dissipation efficiency is improved.

In another embodiment, at least one side of each partition 50 is provided with a mounting portion 51, the mounting portion 51 is provided with a mounting hole 51A for connecting with an external component, when the two opposite sides of the heat dissipation cavity 10A are both provided with the heat generating elements 70, two mounting portions 51 are respectively provided on the heat generating elements 70 on the two corresponding sides of each partition 50, so that the assembly space utilization rate and the heat dissipation contact area of the liquid cooling element 30 and the heat generating elements 70 are increased, the heat dissipation loss of the cooling liquid is reduced, and the heat dissipation efficiency is improved.

It is understood that the heat generating element 70 disposed inside the heat dissipating chamber 10A and/or outside the heat dissipating chamber 10A can directly contact the liquid cooling member 30; the heat generating element 70 accommodated in the heat dissipation chamber 10A can not directly contact the liquid cooling member 30 due to the structure or the space, and the heat dissipation chamber 10A is filled with glue to relatively fix the relative position of the heat generating element 70 and increase the heat conduction efficiency.

Optionally, the partition 50 is an aluminum substrate, which has the characteristics of low cost, light weight and good heat conduction effect, and reduces the manufacturing cost and weight of the heat dissipation structure 100.

Optionally, the heat dissipation structure 100 includes a plurality of heat dissipation modules, and the liquid inlet mechanism and the liquid outlet mechanism of the plurality of heat dissipation modules are connected in series to form a liquid cooling loop.

In this embodiment, the liquid inlet mechanism and the liquid outlet mechanism of the present invention are the liquid cooling loop pipe structure 90 of the heat dissipation structure 100, the liquid inlet mechanism is set as a liquid inlet pipe 91, the liquid outlet mechanism is set as a liquid outlet pipe 92, the liquid inlet pipe 91 is disposed on one side of the housing 10 adjacent to the liquid inlet 301A, the liquid inlet pipe 91 is provided with a liquid inlet channel, and the liquid inlet channel is communicated with the liquid inlet 301A; the drain tube 92 is disposed on a side of the housing 10 adjacent to the liquid outlet 302A, and the drain tube 92 is provided with a drain passage communicating with the liquid outlet 302A. A liquid inlet is formed in one end, away from the liquid cooling piece 30, of the liquid inlet pipe 91, a first passage and a first liquid passing hole are formed in the liquid inlet pipe 91, the first liquid passing hole is arranged corresponding to the liquid inlet 301A of the flow path, two ends of the first passage are respectively communicated with the liquid inlet and the first liquid passing hole to form a liquid inlet channel, and the liquid inlet channel is communicated with the liquid inlets 301A through the first liquid passing holes; one end of the liquid discharge pipe 92, which is far away from the liquid cooling part 30, is provided with a liquid outlet 302A, a second passage and a second liquid passing hole are arranged inside the liquid discharge pipe 92, the second liquid passing hole corresponds to the liquid outlet 302A of the flow path, two ends of the second passage are respectively communicated with the liquid outlet 302A and the second liquid passing hole to form a liquid discharge channel, and the liquid discharge channel is communicated with the plurality of liquid outlets 302A through the second liquid passing hole. The arrangement of the liquid inlet pipe 91 and the liquid outlet pipe 92 enables the cooling liquid to flow in and out smoothly, and the smoothness of the flowing of the cooling liquid is improved.

When the heat dissipation structure 100 includes a heat dissipation module, the liquid inlet mechanism and the liquid outlet mechanism may be a liquid inlet pipe 91 and a liquid outlet pipe 92 that are separately disposed on two sides of the housing 10 and are independently disposed, as shown in fig. 1-2, 9 and 17, the liquid inlet pipe 91 is connected to the liquid inlet 301A, the liquid outlet pipe 92 is connected to the liquid outlet 302A, the heat dissipation structure 100 conveys the cooling liquid with a lower temperature through the liquid inlet pipe 91 to enter the liquid inlet 301A, and flows through the flow channel 30A until reaching the liquid outlet 302A at an end of the flow channel 30A away from the liquid inlet 301A, and discharges the cooling liquid with a higher temperature that absorbs the heat of the heating element 70 through the liquid outlet 302A, thereby improving the heat dissipation efficiency and the flow order of the cooling liquid.

When the heat dissipation structure 100 includes a plurality of heat dissipation modules, the plurality of housings 10 form a plurality of heat dissipation cavities 10A, in order to improve the distribution convenience of the liquid cooling loop structure 90, a plurality of first liquid passing holes may be disposed on the liquid inlet pipe 91 of the liquid inlet mechanism, a plurality of second liquid passing holes may be disposed on the liquid outlet pipe 92 of the liquid outlet mechanism, and at least one of the first liquid passing holes and/or at least one of the second liquid passing holes is disposed corresponding to one of the housings 10. Referring to fig. 11, two first liquid passing holes or two second liquid passing holes are correspondingly disposed on the liquid inlet 301A or the liquid outlet 302A of the housing 10, respectively, and the pipe wall portion between the two first liquid passing holes or the two second liquid passing holes increases the structural strength of the liquid inlet pipe 91 or the liquid outlet pipe 92, thereby enhancing the flow order and smoothness of the cooling liquid and increasing the heat exchange efficiency of the cooling liquid.

Furthermore, the first liquid passing holes can be set to be one or a small number of strip-shaped holes which can be simultaneously communicated with the liquid inlet ports 301A, so that the structural strength of the liquid inlet pipe 91 is ensured to be set, and the pressure resistance of the liquid inlet pipe 91 is improved; or the first liquid passing holes may be a plurality of through holes corresponding to the liquid inlet 301A in number one to one, so as to definitely plan and shunt the flowing process of the cooling liquid, which may be understood as a liquid inlet channel of the liquid inlet pipe 91 connected with the plurality of through holes in series, so that the cooling liquid flows orderly and dissipates heat accurately.

It will be appreciated that the second liquid passing holes may be arranged similarly.

It is understood that the liquid inlet 301A and the liquid outlet 302A of the flow channel 30A are both two ports communicating with the space in the flow channel 30A, that is, for one of the ports, the port into which the cooling liquid flows is the liquid inlet 301A, and the port out of which the cooling liquid flows is the liquid outlet 302A, and the names are not only used for limiting the port position and the liquid flow direction, but also for practical applications.

It should be noted that, when the external liquid inlet 90A and the external liquid outlet 90B are facing the working condition that they can be disposed on two sides, the housing 10 forms a heat dissipation cavity 10A, the liquid inlet tube 91 and the liquid outlet tube 92 are respectively independent pipes and are respectively located on two sides of the liquid cooling element 30 with the flow channel 30A, which are adjacent to the liquid inlet 301A and the liquid outlet 302A, and the low-temperature cooling liquid enters the flow channel 30A from one side of the liquid inlet tube 91 and flows out of the heat dissipation structure 100 from one side of the liquid outlet tube 92.

When the external liquid inlet and outlet port 90B is not suitable for the bilateral working condition, the liquid inlet pipe 91 and the liquid outlet pipe 92 may be set to be connected to the same side, as shown in fig. 5 and 6, that is, at least a portion of the liquid inlet pipe 91 and the liquid outlet pipe 92 are set to be on the same side and the same side, so as to meet the requirements of liquid inlet and outlet on the single side.

Further, the liquid inlet channel of the liquid inlet pipe 91 may be independently set and disconnected with the liquid discharge channel of the liquid discharge pipe 92, and the staggered connection may also be realized according to the number of the heat dissipation cavities 10A, taking the three heat dissipation cavities 10A as an example, that is, the liquid cooling loops corresponding to the three heat dissipation cavities are connected in series, and the specific expression is as follows: the cooling liquid with lower temperature enters from the liquid inlet port 90A and is discharged from the liquid discharge port 90B after sequentially passing through the first liquid inlet passage 911, the flow channel 30A of the first cavity, the first liquid outlet passage 921, the flow channel 30A of the second cavity, the second liquid inlet passage 912, the flow channel 30A of the third cavity and the second liquid outlet passage 922;

the first liquid inlet passage 911 is communicated with the liquid inlet port 90A, and the first liquid inlet passage 911 and the second liquid inlet passage 912 are arranged on the liquid inlet pipe 91 and are isolated and not communicated with each other; the first liquid outlet passage 921 and the second liquid outlet passage 922 are arranged on the liquid discharge pipe 92, and are isolated and not communicated, and the second liquid outlet passage 922 is communicated with the liquid discharge interface 90B.

Optionally, liquid cooling piece 30 is the temperature-uniforming plate, and the temperature-uniforming plate sets up to the harmonica tubular, and the temperature-uniforming plate itself is equipped with a plurality of runners 30A, and a plurality of runners 30A link up the extended area of temperature-uniforming plate, can promote radiating homogeneity, avoid the local overheated condition to appear among the heat dissipation process, improve effective radiating efficiency, this heat radiation structure 100's heat dissipation reliability is high.

Optionally, the liquid cooling member 30 is an extrusion-molded structure, and the plurality of flow channels 30A in the extrusion-molded harmonica-shaped uniform temperature plate increase the convection exchange area, thereby improving the heat dissipation effect. The retaining wall between each flow channel 30A of each adjacent chain plays a supporting role on the upper surface and the lower surface of the plate, so that the pressure resistance of the temperature equalizing plate is enhanced, the flow channels 30A are prevented from deforming under the condition of high pressure, and the temperature equalizing plate is high in stability and strong in reliability.

Optionally, at least one partition 50 is welded to the fluid cooling member 30; and/or at least one partition 50 is removably connected to the fluid-cooled element 30.

In this embodiment, the arrangement of the partition plate 50 and the liquid cooling member 30 includes the following situations:

firstly, two partition boards 50 can be directly welded with the liquid cooling piece 30 to form a heat dissipation cavity 10A structure with an opening 10B on one side in a surrounding manner, so that the installation steps are reduced, and the heating element 70 is accommodated through the opening 10B;

second, two partition plates 50 can be detachably connected to the liquid cooling member 30, so as to adjust the spatial layout of the heat dissipation chamber 10A and improve the space utilization. If the heat dissipation structure is used in a specific use scene and does not need to be frequently disassembled, the two partition plates 50 and the liquid cooling element 30 can be pre-assembled in advance, and the heat dissipation structure 100 does not need to be disassembled into parts even if the heat dissipation structure is disassembled, so that the assembly, maintenance or replacement efficiency is improved;

thirdly, a baffle 50 and the welding of liquid cooling piece 30, another baffle 50 can be dismantled with liquid cooling piece 30 and be connected, when still being provided with a plurality of baffles 80 in heat dissipation chamber 10A, baffle 80 and liquid cooling piece 30 are can dismantle the connection to in adjustment installation space, promotion space utilization, can also promote simultaneously and dismantle speed, be convenient for demolish the encapsulating, so that heat radiation structure 100's reuse.

Optionally, the two mounting portions 51 extend towards two sides away from the opening 10B, the opening 10B is used for mounting the first circuit board 71, the mounting portions 51 are detachably connected with the first circuit board 71, and the first circuit board 71 covers the opening 10B.

In this embodiment, first circuit board 71 locates heat dissipation chamber 10A's opening 10B side, and carry out the dismouting assembly through installation department 51 on the both sides baffle 80, installation department 51 extends to opening 10B dorsad, be convenient for the installation and do not hinder the space that sets up of components and parts on first circuit board 71, reduce the risk of the components and parts colliding with on first circuit board 71, damage, make first circuit board 71 can hold high heat generation nature's heating element 70 in heat dissipation chamber 10A, with dispel the heat fast, avoid damaging first circuit board 71 or other electronic components on its board.

Optionally, the receiving groove 30B is a U-shaped groove.

In this embodiment, the liquid cooling member 30 is a temperature-uniforming plate, the temperature-uniforming plate is bent to form a U-shaped groove, and the two partition plates 50 are respectively disposed on two side edges of the U-shaped groove to form the heat dissipation chamber 10A by enclosing with the temperature-uniforming plate.

Optionally, the two ends of the liquid cooling member 30 are provided with extending portions 33, the two extending portions 33 extend away from the opening 10B, the liquid inlet 301A and the liquid outlet 302A penetrate through the extending portions 33, and the outer peripheral wall of the extending portions 33 is used for mounting the heating element 70.

In another embodiment, the two side edges of the liquid cooling element 30, which are parallel to the flow channel 30A, are respectively provided with an extension portion 33, and both the two extension portions 33 are disposed opposite to the opening 10B side of the heat dissipation cavity 10A, so that the liquid cooling element 30 is disposed in a pi shape, wherein the liquid inlet 301A and the liquid outlet 302A of the flow channel 30A penetrate through the extension portions 33 and are disposed facing the surface of the liquid cooling loop pipe structure 90, and the extension portions 33, which are not in contact with the outer surface of the liquid cooling loop pipe structure 90, can further be provided with a plug-in MOS74, thereby increasing the heat dissipation element, improving the utilization rate of the lower temperature difference of the lower temperature cooling liquid for heat dissipation, and reducing the energy loss.

Referring to fig. 10, 12 and 17 in combination, optionally, the side of the heat dissipation chamber 10A facing away from the opening 10B is used for mounting at least one heat generating element 70.

In this embodiment, one side of the heat dissipation cavity 10A away from the opening 10B is used for installing at least one patch MOS73, so as to save an installation space, and the heat dissipation structure 100 can dissipate heat from a first heat source in the heat dissipation cavity 10A, and also can dissipate heat from a second heat source outside the heat dissipation cavity 10A.

Referring to fig. 7 to 10 and 15 to 18, optionally, a surface of the heat dissipation chamber 10A opposite to the opening 10B is used for mounting a second circuit board 71, at least one side of the liquid cooling element 30 adjacent to the partition plate 50 is provided with a lead portion 32, and the lead portion 32 is provided with a plurality of through holes 32A, so that pins of a part of the heat generating element 70 accommodated in the heat dissipation chamber 10A can pass through the through holes.

In this embodiment, circuit boards 71 are disposed on the sides of the heat dissipation chamber 10A and the heat dissipation chamber 10A facing away from the opening 10B, the heat generating element 70 disposed on the side of the heat dissipation chamber 10A facing away from the opening 10B is set as a second circuit board 71, and the partition board 50 is also provided with a mounting portion 51 corresponding to the second circuit board 71, wherein the mounting portion 51 is used for being detachably assembled with the second circuit board 71. A plurality of through holes 32A are formed in the extending portion 33 of the liquid cooling element 30, and at least two groups of first heat sources are accommodated in the heat dissipation cavity 10A, taking two groups as an example, pins of one group of first heat sources extend toward the first circuit board 71 to be electrically welded with the first circuit board 71; the other group of first heat sources and the last group of first heat sources are mutually static and arranged at intervals through glue filling, pins of the reorganized first heat sources penetrate through the through holes 32A in the extension portion 33 and are electrically welded with the second power piece arranged on the back side of the opening 10B, and therefore heat dissipation efficiency and installation space utilization rate are improved.

Referring to fig. 19 to fig. 22, optionally, the casing 10 further includes at least one baffle 80, and the at least one baffle 80 is disposed in the heat dissipation chamber 10A to divide the heat dissipation chamber 10A into at least a first chamber and a second chamber, where the first chamber and the second chamber are respectively used for accommodating the heat generating element 70.

In this embodiment, both the baffle 80 and the partition 50 can be made of aluminum substrates, the baffle 80 divides the heat dissipation chamber 10A into a plurality of small chambers, such as a first chamber, a second chamber, a third chamber, and the like, and the small chambers are used for installing a plurality of heating elements 70 arranged in a centralized manner, so as to improve the heat dissipation efficiency.

Further, when the heat dissipation requirements of more intensively-arranged heat-dissipation elements 70 to be dissipated are met, a plurality of temperature equalizing plates can be used for connection, and the baffle plates 50 of the plurality of baffle plates 80 divide the connected large heat dissipation cavity 10A into a plurality of small heat dissipation cavities 10A for subpackaging the heat-dissipation elements 70, and meanwhile, the baffle plates 80 and/or the baffle plates 50 can also shield mutual interference among the heat-dissipation elements 70.

The utility model also provides an electric automobile, which comprises an automobile body and the heat dissipation structure; the specific structure of the heat dissipation structure refers to the above embodiments, and since the electric vehicle adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here. The vehicle-mounted charger is arranged in the vehicle body, the heat dissipation structure is arranged on the vehicle-mounted charger, the electric power storage structure is further arranged in the vehicle body, the vehicle-mounted charger is electrically connected with the electric power storage structure, the heat dissipation efficiency of the vehicle-mounted charger is improved through the arrangement of the heat dissipation structure, and the charging safety guarantee of the electric vehicle is improved.

The above is only the preferred embodiment of the present invention, and the patent scope of the present invention is not limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims (9)

1. The utility model provides a heat radiation structure, is applied to on-vehicle machine that charges, its characterized in that, heat radiation structure is located in the on-vehicle machine that charges, including at least one heat dissipation module, heat dissipation module includes:

the heat dissipation device comprises a shell, a heat dissipation cavity and a heat dissipation cover, wherein the shell is provided with a heat dissipation cavity, a plurality of flow channels which are arranged at intervals are arranged in at least one side wall of the shell, the flow channels are arranged around the heat dissipation cavity, the inner wall of the heat dissipation cavity and/or the outer wall of the heat dissipation cavity are/is used for being connected with a heating element, and a liquid inlet and a liquid outlet are respectively arranged at two ends of each flow channel;

the liquid inlet mechanism is communicated with liquid inlets of the flow channels; and

and the liquid outlet mechanism is communicated with the liquid outlets of the flow channels.

2. The heat dissipation structure of claim 1, wherein the housing comprises:

the liquid cooling piece is provided with a plurality of flow channels which are arranged at intervals, one surface of the liquid cooling piece is concavely provided with a containing groove, and the liquid inlet and the liquid outlet are arranged around the notch of the containing groove; and

the two partition plates are connected with two sides of the liquid cooling piece and form the heat dissipation cavity with one side opened in a surrounding mode with the containing groove, and an installation portion is arranged on each partition plate to be connected with an external piece.

3. The heat dissipation structure of claim 2, wherein the two mounting portions extend toward two sides away from the opening, the opening is used for mounting a first circuit board, the mounting portions are detachably connected with the first circuit board, and the first circuit board covers the opening.

4. The heat dissipating structure of claim 3, wherein a side of said heat dissipating cavity facing away from said opening is adapted to receive at least one of said heat generating components;

or, the surface of one side of the heat dissipation cavity, which is back to the opening, is used for installing a second circuit board, at least one side of the liquid cooling piece, which is adjacent to the partition plate, is provided with a guide connection part, and the guide connection part is provided with a plurality of through holes so that the pins of the heating element accommodated in the heat dissipation cavity can penetrate through the through holes.

5. The heat dissipating structure of claim 2, wherein said receiving groove is a U-shaped groove;

or, the both ends of liquid cooling spare are equipped with the extension, two the extension is dorsad respectively the opening extends the setting, the inlet with the liquid outlet runs through the extension, the periphery wall of extension is used for installing heating element.

6. The heat dissipating structure of claim 2, wherein the spacer is an aluminum substrate;

and/or the liquid cooling piece is a temperature-equalizing plate;

and/or the liquid cooling piece is of an extrusion molding structure;

and/or at least one partition plate is welded with the liquid cooling piece;

and/or at least one baffle plate is detachably connected with the liquid cooling piece.

7. The heat dissipation structure of claim 1, wherein the housing further comprises at least one baffle disposed in the heat dissipation chamber to divide the heat dissipation chamber into at least a first chamber and a second chamber, the first chamber and the second chamber being respectively configured to receive the heat generating component.

8. The heat dissipating structure of claim 1, wherein the heat dissipating structure comprises a plurality of heat dissipating modules, and the liquid inlet mechanism and the liquid outlet mechanism of the plurality of heat dissipating modules are connected in series to form a liquid cooling loop.

9. An electric vehicle, characterized in that the electric vehicle comprises:

the electric vehicle comprises a vehicle body, wherein an electric power storage structure is arranged in the vehicle body; and

the heat dissipation structure according to any one of claims 1 to 8, which is provided in the vehicle body and electrically connected to the electricity storage structure.

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