CN115312908A

CN115312908A - Heat radiation structure, power supply unit and electric automobile

Info

Publication number: CN115312908A
Application number: CN202210947332.5A
Authority: CN
Inventors: 张细平; 刘玉伟; 孙永宝; 陶安发
Original assignee: Suzhou Huichuan United Power System Co Ltd
Current assignee: Suzhou Huichuan United Power System Co Ltd
Priority date: 2022-08-09
Filing date: 2022-08-09
Publication date: 2022-11-08

Abstract

The invention discloses a heat dissipation structure, power supply equipment and an electric automobile. The heat dissipation structure comprises a shell and a liquid through pipe, wherein the shell is provided with a heat dissipation cavity, and a heating element can be arranged inside and outside the heat dissipation cavity so as to improve the utilization rate of a heat dissipation space; the casing includes two at least radiating parts and at least one connecting portion, establish a plurality of runners in the radiating part, two at least liquid pipes communicate inlet and the liquid outlet at each runner both ends respectively, the one end that leads to the liquid pipe lets in the coolant liquid of lower temperature, in order to dispel the heat through a plurality of runners of a plurality of inlet flows through, the higher temperature coolant liquid after the heat dissipation is through one side liquid pipe discharge of intercommunication liquid outlet, the casing strengthens support strength through the runner wall of every two adjacent runners, the setting of runner can reduce casing weight simultaneously, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

Description

Heat radiation structure, power supply unit and electric automobile

Technical Field

The invention relates to the technical field of liquid cooling heat dissipation, in particular to a heat dissipation structure, power supply equipment and an electric automobile.

Background

The liquid cooling heat dissipation device adopted by the conventional vehicle-mounted charger is generally formed by die-casting or metal plate, and the wall thickness of the formed water channel of the die-casting heat dissipation water channel is thick due to process limitation, so that the liquid cooling heat dissipation device is heavy, has high thermal resistance and has poor heat dissipation effect; the wall thickness of the heat dissipation water channel formed by the metal plates is thin, but the pressure resistance of the water channel is low, and the water channel wall is easy to deform.

Disclosure of Invention

The invention mainly aims to provide a heat dissipation structure, which aims to solve the technical problems of heavy weight or insufficient compressive strength of the existing liquid cooling heat dissipation device and improve the applicability of the heat dissipation structure.

In order to achieve the above object, the heat dissipation structure of the present invention comprises:

the shell is provided with a heat dissipation cavity and comprises at least one connecting part and at least two heat dissipation parts, every two adjacent heat dissipation parts are connected through one connecting part, the heat dissipation parts are provided with a plurality of flow channels arranged at intervals, the flow channels are arranged around the heat dissipation cavity, the inner wall of the heat dissipation cavity and/or the outer wall of the heat dissipation cavity are used for mounting a heating element, and two ends of each flow channel are respectively provided with a liquid inlet and a liquid outlet; and

at least two lead to the liquid pipe, at least two lead to the liquid pipe and connect the casing, wherein, at least one lead to the liquid pipe intercommunication the inlet, at least one lead to the liquid pipe intercommunication the liquid outlet.

In one embodiment, the housing comprises:

the liquid cooling piece is provided with at least one connecting part and at least two radiating parts, and the connecting parts and the radiating parts are arranged in a staggered manner along the extending direction of the accommodating groove; and

the two clapboards are connected with the two sides of the liquid cooling piece and form the heat dissipation cavity with an opening at one side by enclosing with the containing groove.

In one embodiment, the accommodating groove is a U-shaped groove;

or, the both ends of liquid cooling spare are equipped with the extension, two the extension is dorsad respectively the opening extends the setting, the inlet with the liquid outlet runs through the extension, the periphery wall of extension is used for installing heating element.

In one embodiment, the thickness of the heat dissipation part is larger than that of the connecting part;

and/or the clapboard is an aluminum substrate;

and/or the liquid cooling piece is a temperature-equalizing plate;

and/or the liquid cooling piece is of an extrusion molding structure;

and/or at least one clapboard is welded with the liquid cooling piece;

and/or at least one baffle plate is detachably connected with the liquid cooling piece.

In an embodiment, each partition board is provided with a first mounting portion, the first mounting portions are arranged at the opening, the two first mounting portions extend towards two sides away from the opening respectively, the first mounting portions are detachably connected with a first circuit board or an external part, and the first circuit board or the external part covers the opening.

In an embodiment, one side of the heat dissipation portion, which faces away from the opening, is used for mounting at least one heating element, and a heat conductive adhesive layer is arranged between the heating element and the heat dissipation portion.

In an embodiment, a second mounting portion is further disposed on a side edge of each partition board away from the opening, the second mounting portion is used for mounting a second circuit board, and the second circuit board is provided with the heating element.

In one embodiment, the connecting part is provided with a through hole communicated with the containing groove;

and/or at least one side of the liquid cooling piece, which is adjacent to the partition plate, is provided with a guide connection part, and the guide connection part is provided with a plurality of through holes so that pins of the heating element accommodated in the heat dissipation cavity can penetrate through the through holes.

In one embodiment, the heat dissipation structure comprises a plurality of the shells and a plurality of the liquid passing pipes, and the flow passages of two adjacent shells are arranged in series through the liquid passing pipes;

and/or the flow channels of at least two heat dissipation parts are arranged in parallel through the liquid through pipes.

The present invention also proposes a power supply device, comprising: at least one heat source and a heat dissipation structure as described in any of the above embodiments;

at least one of the heat sources is in thermally conductive connection with an inner surface and/or an outer surface of a heat dissipation chamber of the heat dissipation structure.

The present invention also provides an electric vehicle, comprising:

a vehicle body;

the power battery is arranged in the vehicle body; and

the power supply device according to the above embodiment is disposed in the vehicle body, and is electrically connected to the power battery to provide a charging power supply for the power battery.

According to the technical scheme, the shell with the flow channel is adopted to form the heat dissipation cavity, and the heating elements can be arranged inside and outside the heat dissipation cavity, so that the technical problems of large weight or insufficient compressive strength of the existing liquid cooling heat dissipation device are solved.

The heat dissipation structure comprises a shell and a liquid through pipe, wherein the shell is provided with a heat dissipation cavity, and a heating element can be arranged inside and outside the heat dissipation cavity so as to improve the utilization rate of a heat dissipation space; at least two radiating parts are established at the casing interval, two adjacent radiating parts are connected through connecting portion, the radiating part is equipped with a plurality of runners, the both sides of casing are connected to the liquid pipe that leads to, and communicate the inlet and the liquid outlet at each runner both ends respectively, the one end of liquid pipe lets in cooler temperature coolant liquid, in order to dispel the heat through a plurality of runners of flow through a plurality of inlets, higher temperature coolant liquid after the heat dissipation is discharged through one side liquid pipe of intercommunication liquid outlet, the casing is through the runner wall strengthening support intensity of every double-phase adjacent runner, the setting of runner can reduce casing weight simultaneously, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight. In addition, the arrangement of the heating elements is facilitated by the arrangement of the plurality of heat dissipation parts, so that the arrangement of the heating elements is more flexible, and the applicability of the heat dissipation structure is improved.

Drawings

In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of a liquid cooling element according to an embodiment of the heat dissipation structure of the present application;

fig. 2 is a schematic partial structural view of a housing according to an embodiment of the heat dissipation structure of the present application;

FIG. 3 is a schematic view of an assembled structure of an embodiment of the housing of FIG. 2;

FIG. 4 is a schematic view of an assembly structure of another embodiment of the housing of FIG. 2;

FIG. 5 is a schematic view of a liquid flow direction structure according to an embodiment of the heat dissipation structure of the present application;

FIG. 6 is an exploded view of the heat dissipation structure of the present application;

FIG. 7 is a schematic view of a heat dissipation structure of the present application in combination with the liquid flow direction of the embodiment of FIG. 6;

FIG. 8 is a schematic structural diagram of a liquid cooling element according to another embodiment of the heat dissipation structure of the present application;

fig. 9 is a schematic partial structural view of a housing according to another embodiment of the heat dissipation structure of the present application;

FIG. 10 is a schematic view of an assembled configuration of an embodiment of the housing of FIG. 9;

FIG. 11 is a schematic view of an assembly structure of another embodiment of the housing of FIG. 9;

fig. 12 is a schematic view illustrating a liquid flow direction structure according to another embodiment of the heat dissipation structure of the present application;

FIG. 13 is an exploded view of another embodiment of the heat dissipation structure of the present application;

fig. 14 is a schematic view illustrating a flow direction of a liquid according to an embodiment of the heat dissipation structure of the present application in combination with fig. 13.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 to 14, a heat dissipation structure 100 is provided.

In the embodiment of the present invention, the heat dissipation structure 100 includes a housing 10 and at least two liquid passing tubes 90, and the housing 10 has a heat dissipation chamber 10A. As shown in fig. 1 and 8, the housing 10 includes at least one connecting portion 32 and at least two heat dissipating portions 31, two adjacent heat dissipating portions 31 are connected by the connecting portion 32, the heat dissipating portion 31 is provided with a plurality of flow channels 31A arranged at intervals, the plurality of flow channels 31A are arranged around the heat dissipating cavity 10A, an inner wall of the heat dissipating cavity 10A and/or an outer wall of the heat dissipating cavity 10A are used for mounting the heating element 70, and two ends of each flow channel 31A are respectively provided with a liquid inlet 311A and a liquid outlet 312A; referring to fig. 5 and 12, at least two liquid passing pipes 90 are connected to the housing 10, wherein at least one liquid passing pipe 90 is connected to the liquid inlet 311A, and at least one liquid passing pipe 90 is connected to the liquid outlet 312A.

Referring to fig. 2 to 4 and 9 to 11, in the technical solution of the present invention, a heat dissipation chamber 10A is formed by using a housing 10 having a flow channel 31A, and a heating element 70 can be installed inside and outside the heat dissipation chamber 10A, so as to solve the technical problem of heavy weight or insufficient compressive strength of the conventional liquid cooling heat dissipation device.

The heat dissipation structure 100 includes a housing 10 and a liquid pipe 90, the housing 10 has a heat dissipation chamber 10A, both of which can be installed with a heating element 70, to improve the heat dissipation space utilization; at least two heat dissipation parts 31 are arranged at intervals on the shell 10, two adjacent heat dissipation parts 31 are connected through a connecting part 32, the heat dissipation parts 31 are provided with a plurality of flow channels 31A, a liquid through pipe 90 is connected with two sides of the shell 10 and is respectively communicated with a liquid inlet 311A and a liquid outlet 312A at two ends of each flow channel 31A, a lower-temperature cooling liquid is introduced into one end of the liquid through pipe 90 so as to dissipate heat through the plurality of flow channels 31A through the plurality of liquid inlets 311A, the cooled higher-temperature cooling liquid is discharged through the liquid through pipe 90 at one side communicated with the liquid outlet 312A, the shell 10 strengthens the supporting strength through the walls of the flow channels 31A of every two adjacent flow channels 31A, meanwhile, the weight of the shell 10 can be reduced through the arrangement of the flow channels 31A, the effective contact area of the heat dissipation can be increased, the heat dissipation efficiency is improved, and the technical problem that the weight of the existing liquid cooling heat dissipation device is large or the compression strength is not enough is solved.

In addition, the arrangement of the at least two heat dissipation portions 31 facilitates the arrangement of the heat generating elements 70, so that the arrangement of the heat generating elements 70 is more flexible, the applicability of the heat dissipation structure 100 is improved, and the material utilization rate is improved.

It can be understood that the heat generating element 70 includes a first heat generating source and a second heat generating source, the first heat generating source is a PCB board, and includes a circuit board 71 and a magnetic core component 72, the magnetic core component 72 is a transformer, and may also be a high heat generating element 70 such as a capacitor or a power board, wherein the core packages of the transformer and the capacitor may be accommodated in the heat dissipation cavity 10A and electrically connected to the circuit board 71 through pins, the circuit board 71 may be one or two, that is, the first circuit board 71 and the second circuit board 71, the first circuit board 71 and/or the second circuit board 71 are disposed on one side or both sides of the heat dissipation cavity 10A, and may also be disposed on an adjacent side or an opposite side; the second heat source can be arranged on the outer wall of the heat dissipation cavity 10A, and comprises a heat source arranged on the outer side wall and/or the outer bottom wall, and the second heat source can be a patch MOS73, a plug-in MOS and the like.

When the plurality of heat dissipation parts 31 can be arranged in a split manner, the heat dissipation parts can be flexibly spliced according to the needs of the heating element 70 so as to adapt to the size and the number of the heating element 70; when the case 10 is of an integral structure, the heat generating element 70 may be flexibly disposed to the plurality of heat dissipating parts 31.

It can be understood that when the installation condition allows, the second heat generating source can be arranged on the outer wall of the liquid through pipe 90, so as to facilitate heat dissipation.

In an embodiment, the housing 10 includes a liquid cooling member 30 and two partition plates 50, a surface of the liquid cooling member 30 is recessed to form a receiving cavity 30A, the liquid inlet 311A and the liquid outlet 312A are disposed around a notch of the receiving cavity 30A, the liquid cooling member 30 includes at least one connecting portion 32 and at least two heat dissipating portions 31, the connecting portion 32 and the heat dissipating portions 31 are disposed along an extending direction of the receiving cavity 30A in a staggered manner, and the two partition plates 50 are connected to two sides of the liquid cooling member 30 and enclose the receiving cavity 30A to form a heat dissipating cavity 10A having a side opening 10B.

In this embodiment, the plate of the liquid cooling member 30 includes at least one connecting portion 32 and at least two heat dissipating portions 31, a plurality of flow channels 31A are disposed inside each heat dissipating portion 31, two ends of each flow channel 31A penetrate through two side ends of the plate to form a liquid inlet 311A and a liquid outlet 312A, the liquid inlet 311A and the liquid outlet 312A are disposed at two end portions of the wall of the accommodating groove 30A, one section of the liquid inlet pipe is correspondingly communicated with the liquid inlet 311A to input the cooling liquid with a lower temperature, and the other section of the liquid inlet pipe is correspondingly communicated with the liquid outlet 312A to discharge the cooling liquid with a higher temperature after heat absorption. The cooling liquid of lower temperature flows in flow path 31A to discharge from the liquid outlet 312A that is located inlet 311A offside, make the cooling liquid encircle the panel extending direction of whole liquid cooling member 30, greatly increased heat dissipation area of contact promotes the radiating efficiency.

Optionally, the partition 50 is an aluminum substrate, which has characteristics of low cost, light weight, and good heat conduction effect, and reduces manufacturing cost and weight of the heat dissipation structure 100. The partition plate 50 can be connected to the two sides of the liquid cooling member 30 along the extending direction of the container 30A by gluing or welding, etc. to block the openings 10B at the two sides of the container 30A, so as to form the heat dissipation chamber 10A with one side opening 10B.

It is understood that the heat generating element 70 disposed inside the heat dissipating chamber 10A and/or outside the heat dissipating chamber 10A can be directly attached to the liquid cooling member 30; the heat generating element 70 accommodated in the heat dissipation chamber 10A can not directly contact the liquid cooling member 30 due to the structure or the space, and the heat dissipation chamber 10A is filled with glue to relatively fix the relative position of the heat generating element 70 and increase the heat conduction efficiency.

In one embodiment, referring to fig. 1, the receiving groove 30A is a U-shaped groove.

In this embodiment, two sides of the liquid cooling member 30 are bent to form a U-shaped groove, and the two partition plates 50 are respectively disposed on two side edges of the U-shaped groove to form the heat dissipation chamber 10A by enclosing with the liquid cooling member 30.

It can be understood that the heat dissipation portion 31 and the connecting portion 32 are also U-shaped, and each flow channel 31A in the heat dissipation portion 31 is also U-shaped, so that the heat dissipation cavity 10A is formed, and at the same time, the resistance in the flow channel 31A is reduced, and the heat dissipation efficiency is improved. The heating element 70 may be disposed in a U-shaped groove surrounded by the liquid cooling member 30, or may be disposed on an outer wall of the U-shaped groove.

In other embodiments, referring to fig. 8, the two ends of the liquid cooling member 30 are provided with extension portions 34, the two extension portions 34 are respectively extended away from the opening 10B, the liquid inlet 311A and the liquid outlet 312A penetrate the extension portions 34, and the peripheral wall of the extension portion 34 is used for mounting the heating element 70.

In this embodiment, the two side edges of the liquid cooling element 30, which are parallel to the flow channel 31A, are respectively provided with the extension portions 34, and the two extension portions 34 are both disposed opposite to the opening 10B side of the heat dissipation cavity 10A, so that the liquid cooling element 30 is disposed in a pi shape, wherein the liquid inlet 311A and the liquid outlet 312A of the flow channel 31A penetrate through the extension portions 34 and are disposed facing the surface of the liquid through tube 90, and the extension portions 34, which are not in contact with the outer surface of the liquid through tube 90, may further include a plug-in MOS, so as to increase heat dissipation elements, improve the utilization rate of the lower temperature coolant for dissipating heat at low temperature difference, and reduce energy loss.

Referring to fig. 2 and 9, in an embodiment, the thickness of the heat dissipation part 31 is greater than that of the connection part 32.

In this embodiment, when a part of the liquid cooling member 30 is cut at a cross section perpendicular to the extending direction of the flow channels 31A, it can be seen that the cross sections of the flow channels 31A of the heat dissipation portion 31 are arranged in a square or circular shape, and the heat dissipation portion 31 needs to have a certain thickness to ensure smooth flow of the water path. Generally, the connecting portion 32 is a plate-shaped solid, and the thickness of the connecting portion 32 is smaller than that of the heat dissipating portion 31 because there is no need to provide the flow channel 31A on the premise of ensuring the stability of the housing 10. The heat dissipation part 31 and the connecting part 32 are convenient to distinguish, the heating element 70 is prevented from being attached to wrong positions, materials are saved to a certain extent, and punching is convenient to fix the circuit board 71.

Optionally, the partition 50 is an aluminum substrate, which has characteristics of low cost, light weight, and good heat conduction effect, and reduces manufacturing cost and weight of the heat dissipation structure 100.

Optionally, the liquid cooling element 30 is a temperature equalizing plate, the temperature equalizing plate is provided with a harmonica tube type heat dissipation part 31, the plurality of flow channels 31A penetrate through the extension area of the temperature equalizing plate, the heat dissipation uniformity can be improved, the local overheating condition in the heat dissipation process is avoided, the effective heat dissipation efficiency is improved, and the heat dissipation reliability of the heat dissipation structure 100 is high.

Further, in one embodiment, the liquid cooling member 30 is an extruded structure. It can be understood that parameter design can be conveniently carried out on the forming equipment to adjust the quantity, proportion, size and other parameters of the heat dissipation part 31 and the connecting part 32, so that the consistency of all parts of the liquid cooling plate is ensured, and a good heat dissipation effect is obtained.

The plurality of flow passages 31A in the extrusion-molded harmonica-shaped heat dissipation portion 31 increase the convection exchange area, and improve the heat dissipation effect. The retaining wall between each adjacent flow channel 31A supports the upper and lower surfaces of the plate, so that the pressure resistance of the liquid cooling member 30 is enhanced, the flow channels 31A are prevented from deforming under the condition of high pressure, and the liquid cooling member is high in stability and high in reliability.

Optionally, at least one partition 50 is welded to the fluid cooling member 30; and/or at least one partition plate 50 is detachably connected to the liquid-cooled member 30.

In some embodiments, the arrangement of the partition 50 and the liquid cooling member 30 includes the following cases:

firstly, two partition boards 50 can be directly welded with the liquid cooling piece 30 to form a heat dissipation cavity 10A structure with an opening 10B on one side in a surrounding manner, so that the installation steps are reduced, and the heating element 70 is accommodated through the opening 10B;

second, two partition plates 50 can be detachably connected to the liquid cooling member 30, so as to adjust the spatial layout of the heat dissipation chamber 10A and improve the space utilization. If the heat dissipation structure is used in a specific use scene and does not need to be frequently disassembled, the two partition plates 50 and the liquid cooling element 30 can be pre-assembled in advance, and the heat dissipation structure 100 does not need to be disassembled into parts even if the heat dissipation structure is disassembled, so that the assembly, maintenance or replacement efficiency is improved;

thirdly, a baffle 50 and the welding of liquid cooling piece 30, another baffle 50 can be dismantled with liquid cooling piece 30 and be connected, when still being provided with a plurality of baffles in heat dissipation chamber 10A, baffle and liquid cooling piece 30 are can dismantle the connection to in adjustment installation space, promotion space utilization, can also promote simultaneously and dismantle the speed, be convenient for demolish the encapsulating, so that heat radiation structure 100's reuse.

It is understood that the aspects of the above embodiments can be freely combined without conflicting with the technical idea of the present application, and the combined aspects are also within the scope of the present application.

For example, in an embodiment, the partition plate 50 is an aluminum substrate, the liquid cooling member 30 is an extruded temperature-equalizing plate, and the two partition plates 50 are directly welded to the liquid cooling member 30 to form the heat dissipation chamber 10A.

Other aspects of the combination scheme are not described in detail herein.

Referring to fig. 2 and 9, in an embodiment, each partition 50 is provided with a first mounting portion 51, the first mounting portions 51 are provided at the opening 10B, two first mounting portions 51 are respectively provided to extend toward two sides away from the opening 10B, the first mounting portions 51 are detachably connected to a first circuit board 71 or an external component, and the first circuit board 71 or the external component covers the opening 10B.

The first mounting portion 51 is provided with a mounting hole 51A for connecting the first circuit board 71 or an external component.

Optionally, first circuit board 71 is located the opening 10B side of heat dissipation chamber 10A, and carry out the dismouting assembly through first installation department 51 on the baffle 50 of both sides, first installation department 51 extends to opening 10B dorsad, be convenient for the installation and do not hinder the space that sets up of components and parts on first circuit board 71, reduce the risk of colliding with, damaging components and parts on first circuit board 71, make first circuit board 71 can hold high heat generation nature's heating element 70 in heat dissipation chamber 10A, with dispel the heat fast, avoid damaging other electronic components on first circuit board 71 or its board.

Alternatively, the first mounting portion 51 is used to connect to an external component, specifically, the external component may be an inner wall surface of a mounting cavity of the casing, and the heating element 70 may be attached to an outer wall surface of the heat dissipation portion 31.

Referring to fig. 3 and 10, in one embodiment, the side of the heat dissipation portion 31 facing away from the opening 10B is used for mounting at least one heating element 70, and a heat conductive adhesive layer is disposed between the heating element 70 and the heat dissipation portion 31. In this embodiment, the heating element 70 is a patch MOS73 or the like, the plurality of heating elements 70 are arranged in an array on the heat dissipation portion 31, and a heat conductive adhesive layer is provided between the wall surfaces of the heating element 70 and the heat dissipation portion 31 to fix the heating element 70, so that heat transfer is more uniform and heat dissipation efficiency is improved.

Further, in an embodiment, a second mounting portion 52 is further disposed on a side of each partition 50 away from the opening 10B, the second mounting portion 52 is used for mounting a second circuit board 71, and a heating element 70 is disposed on the second circuit board 71.

In this embodiment, the heat generating element 70 is disposed on the surface of the second circuit board 71 facing the housing 10, and when the second circuit board 71 is disposed on the side of the heat dissipation cavity 10A away from the opening 10B, two second mounting portions 52 are correspondingly disposed on each partition 50, so as to increase the assembly space utilization rate and the heat dissipation contact area of the liquid cooling element 30 and the heat generating element 70, reduce the heat dissipation loss of the cooling liquid, and improve the heat dissipation efficiency.

Referring to fig. 3, 4, 10 and 11, further, in some embodiments, the connection portion 32 is provided with a through hole 33A communicating with the accommodating groove 30A, and/or at least one side of the liquid cooling element 30 adjacent to the partition plate 50 is provided with a connection portion 33, and the connection portion 33 is provided with a plurality of through holes 33A, so that the pins of the heat generating element 70 accommodated in the heat dissipation chamber 10A can pass through the through holes.

That is, the liquid cooling member 30 may be provided with the through hole 33A at the connecting portion 32 alone, may be provided with the connecting portion 33 alone, and may be provided with the through hole 33A at the connecting portion 33, and of course, the liquid cooling member 30 may be provided with both the connecting portion 32 and the connecting portion 33 and may be provided with the through hole 33A at both.

Optionally, the through hole 33A is used to avoid the pin of the heat generating element 70. In an embodiment, a second circuit board 71 is disposed on a side of the housing 10 away from the opening 10B, and a power device such as a transformer is disposed in the heat dissipation cavity 10A, and pins thereof can be connected to the second circuit board 71 through the connection portion 32 and/or the through hole 33A of the connection portion 33.

Alternatively, the through hole 33A is used to fix the heating element 70. In another embodiment, the second circuit board 71 is disposed on a side of the housing 10 away from the opening 10B, and the second circuit board 71 can be fixed on the housing 10 by fixing members such as bolts disposed in the through holes 33A, so that the two are tightly attached to each other, thereby improving the heat dissipation efficiency.

Further, in the embodiment, the housing 10 is provided with the conductive portion 33, the second circuit board 71 is fixed together by the through holes of the conductive portion 33 and the connecting portion 32, and a heat conductive adhesive layer is disposed between the circuit board 71 and the housing 10 to prevent the heat conductive adhesive layer from arching, so that the two are attached more tightly.

Of course, the through hole 33A can also be used to fix the heating element 70 in the heat dissipation chamber 10A, and is not described in detail here.

Referring to fig. 5 and 12, in an embodiment, the liquid passing tube 90 includes at least a first liquid passing tube 91 for liquid inlet and a second liquid passing tube 92 for liquid discharge.

In this embodiment, the heat dissipation structure 100 includes a housing 10, a liquid inlet 91A is disposed at one end of the first liquid flowing pipe 91 far away from the liquid cooling member 30, a first passage and a first liquid passing hole 911 are disposed inside the first liquid flowing pipe 91, the first liquid passing hole 911 is disposed corresponding to the liquid inlet 311A of the flow path, two ends of the first passage are respectively communicated with the liquid inlet 91A and the first liquid passing hole 911 to form a liquid inlet channel, and the liquid inlet channel is communicated with the liquid inlets 311A through the first liquid passing hole 911; one end that liquid cold spare 30 was kept away from to the liquid section is equipped with leakage fluid dram 92A, goes out that liquid section inside is equipped with the second and passes liquid hole 921 with the second, and the second is passed the liquid hole 921 and is corresponded the liquid outlet 312A setting of flow path, and the both ends of second route communicate leakage fluid dram 92A and second respectively and pass liquid hole 921 to form the flowing back passageway, the flowing back passageway passes through the second and passes a plurality of liquid outlets 312A of liquid hole 921 intercommunication. The arrangement of the first liquid passing pipe 91 and the second liquid passing pipe 92 enables the cooling liquid to flow in and flow out smoothly, and the flowing smoothness of the cooling liquid is improved.

It can be understood that the first liquid passing hole 911 may be one or a small number of strip-shaped holes capable of being simultaneously communicated with the plurality of liquid inlet ports 311A, so as to ensure the structural strength of the first liquid passing pipe 91 and improve the pressure resistance of the first liquid passing pipe 91; or the first liquid passing hole 911 may be a plurality of through holes corresponding to the liquid inlet 311A in number one-to-one, so as to definitely plan and shunt the flowing process of the cooling liquid, that is, the plurality of through holes are connected in series with the liquid inlet channel of the first liquid passing pipe 91, so that the cooling liquid flows orderly and radiates accurately.

It is understood that the second liquid passing hole 921 may be arranged in the same manner.

Alternatively, the heat dissipation structure 100 may include a first liquid passing tube 91 and a second liquid passing tube 92, the heat dissipation portions 31 are connected in parallel, the first liquid passing tube 91 is provided with a plurality of first liquid passing holes 911 corresponding to liquid inlets 311A of the heat dissipation portions 31, the second liquid passing tube 92 is provided with a plurality of second liquid passing holes 921 corresponding to liquid outlets 312A of the heat dissipation portions 31, and the cooling liquid enters the flow channels 31A of the heat dissipation portions 31 from the liquid inlet 91A through the liquid inlet channels and the first liquid passing holes 911 and is discharged to the liquid outlet 92A through the second liquid passing holes 921 and the liquid outlet channels.

It is understood that the inlet 311A and the outlet 312A of the flow channel 31A are both two ports communicating with the space in the flow channel 31A, that is, for one of the ports, the port into which the cooling liquid flows is the inlet 311A, and the port out of which the cooling liquid flows is the outlet 312A, and the names are not only used to limit the port position and the flow direction, but also to limit the practical application.

Of course, the plurality of heat dissipating portions 31 may be connected in series by another third liquid passing tube 93, and the third liquid passing tube 93 may have a plurality of liquid passing holes.

Referring to fig. 6, 7, 13 and 14, it can be understood that in an embodiment, the heat dissipation structure 100 includes a plurality of housings 10 and a plurality of liquid passing pipes 90, and according to the above embodiment, the flow passages 31A of the plurality of housings 10 may be arranged in parallel, i.e., the cooling liquid flows from the first liquid passing pipe 91 to the second liquid passing pipe 92 through the plurality of housings 10.

In other embodiments, the heat dissipation structure 100 includes a plurality of housings 10 and a plurality of liquid passing pipes 90, and the flow channels 31A of two adjacent housings 10 are serially connected through the liquid passing pipes 90.

Alternatively, taking three housings 10 as an example, the heat dissipation structure 100 includes a first liquid passing tube 91, a second liquid passing tube 92 and two third liquid passing tubes 93, the flow channels 31A of at least two heat dissipation portions 31 of each housing 10 are arranged in parallel, the three housings 10 are arranged along the extending direction of the accommodating groove 30A, the first liquid passing tube 91 is connected to one side of the heat dissipation portion 31 of one housing 10, the second liquid passing tube 92 is connected to one side of the heat dissipation portion 31 of the other housing 10, and the two third liquid passing tubes 93 are connected to the remaining heat dissipation portions 31 of the three housings 10. Therefore, the cooling liquid can flow smoothly, and the heat dissipation efficiency is ensured.

Of course, the heat dissipation structure 100 may be provided with more third liquid passing tubes 93 so that the flow passages 31A of at least two heat dissipation portions 31 of each housing 10 are provided in series, or the flow passages 31A of some of the heat dissipation portions 31 may be provided in series and the flow passages 31A of the heat dissipation portions 31 may be provided in parallel. The flexible arrangement improves the applicability of the heat dissipation structure 100 and improves the heat dissipation efficiency.

Alternatively, the external liquid inlet 91A and the external liquid outlet 92A may be provided on both sides. The first liquid passing tube 91 and the second liquid passing tube 92 can be respectively positioned at two sides of the liquid cooling member 30 with the flow channel 31A adjacent to the liquid inlet 311A and the liquid outlet 312A;

when the liquid inlet 91A and the liquid outlet 92A facing the outside are not suitable for the working condition of bilateral arrangement, the first liquid passing pipe 91 or the second liquid passing pipe 92 can be bent and extended, so that at least part of the first liquid passing pipe 91 and the second liquid passing pipe 92 are arranged on the same side and the same side, and the requirements of unilateral liquid inlet and liquid discharge are met.

Wherein, furtherly, the liquid pipe 90 both ends that are located the homonymy can fix a connection, reinforcing structural stability.

The present invention also provides a power supply apparatus, which includes at least one heat source and the heat dissipation structure 100 according to any of the above embodiments; at least one heat source is in thermally conductive communication with the inner and/or outer surfaces of heat dissipation chamber 10A of heat dissipation structure 100. Since the power supply device adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.

The power supply equipment can be a vehicle-mounted charger or a DCDC power supply module and the like.

The invention also provides an electric automobile which comprises an automobile body, a power battery and the power supply equipment; the specific structure of the power supply device refers to the above embodiments, and since the electric vehicle adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here. The power supply equipment is arranged in the vehicle body and is electrically connected with the power battery to provide a charging power supply for the power battery.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, which are directly or indirectly applied to the present invention, are included in the scope of the present invention.

Claims

1. A heat dissipation structure, comprising:

2. The heat dissipation structure of claim 1, wherein the housing comprises:

the two clapboards are connected with the two sides of the liquid cooling piece and are enclosed with the accommodating groove to form the heat dissipation cavity with an opening at one side.

3. The heat dissipating structure of claim 2, wherein said receiving groove is a U-shaped groove;

4. The heat dissipation structure according to claim 2, wherein a thickness of the heat dissipation portion is larger than a thickness of the connection portion;

and/or the clapboard is an aluminum substrate;

and/or the liquid cooling piece is a temperature equalizing plate;

and/or the liquid cooling piece is of an extrusion molding structure;

and/or at least one clapboard is welded with the liquid cooling piece;

5. The heat dissipating structure of claim 2, wherein each of said partitions has a first mounting portion, said first mounting portions are disposed at said opening, two of said first mounting portions extend toward two sides away from said opening, said first mounting portions are detachably connected to a first circuit board or an external component, and said first circuit board or said external component covers said opening.

6. The heat dissipating structure of claim 5, wherein the side of the heat dissipating portion facing away from the opening is used for mounting at least one of the heat generating elements, and a heat conductive adhesive layer is disposed between the heat generating element and the heat dissipating portion.

7. The heat dissipating structure of claim 6, wherein a second mounting portion is further disposed on a side of each of the partitions away from the opening, the second mounting portion is used for mounting a second circuit board, and the second circuit board is provided with the heat generating element.

8. The heat dissipating structure of claim 7, wherein said connecting portion has a through hole communicating with said receiving groove;

9. The heat dissipation structure according to any one of claims 1 to 8, wherein the heat dissipation structure comprises a plurality of the housings and a plurality of the liquid passing pipes through which the flow passages of two adjacent housings are arranged in series;

10. A power supply device characterized by comprising: at least one heat source and the heat dissipating structure of any one of claims 1 to 9;

11. An electric vehicle, characterized in that the electric vehicle comprises:

a vehicle body;

the power battery is arranged in the vehicle body; and

the power supply device according to claim 10, wherein the power supply device is provided in the vehicle body and electrically connected to the power battery to supply a charging power to the power battery.