CN217879307U

CN217879307U - Fixing device with protection function for testing semiconductor chip

Info

Publication number: CN217879307U
Application number: CN202221572471.6U
Authority: CN
Inventors: 梅鹏; 万里春; 黎城镇
Original assignee: Henan Chenxin Technology Co ltd
Current assignee: Henan Chenxin Technology Co ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2022-11-22
Anticipated expiration: 2032-06-22

Abstract

The utility model discloses a fixing device is used in semiconductor chip test with safeguard function, comprises a workbench, the top of workstation is provided with prevents pressing from both sides and hinders the structure, prevent pressing from both sides and hinder the structure and include the side splint, the side splint are installed in one side on the workstation top, the inside of side splint one side is provided with the activity groove, and the internally mounted in activity groove has the rubber strip, be provided with anti-skidding sand grip on the lateral wall of rubber strip, buffer spring is installed to the opposite side of rubber strip. The utility model discloses a be provided with side splint, movable groove, rubber strip, anti-skidding sand grip and buffer spring, realized the protection to semiconductor chip, the rubber strip adopts the rubber material to make, has good compliance, when carrying out the centre gripping to semiconductor chip, the rubber strip can compress buffer spring, utilizes the toughness of rubber strip and buffer spring's elastic absorption clamping-force, the prevention centre gripping dynamics is too big, causes damaged phenomenon to semiconductor chip to make fixing device have safeguard function.

Description

Fixing device with protection function for testing semiconductor chip

Technical Field

The utility model relates to a fixing device technical field is used in semiconductor chip test specifically is a fixing device is used in semiconductor chip test with safeguard function.

Background

The semiconductor chip is etched on the semiconductor chip, the wiring, the semiconductor device that can realize certain function of making, along with the high-speed development of society, the technological level is constantly improved, under the addition of internet technology, intelligent product has obtained the brisk development, and semiconductor chip is the intelligent main components and parts of electronic product, in semiconductor chip production process, need carry out the sampling test to the semiconductor chip, test semiconductor chip's each item performance, whether detect semiconductor chip and accord with production standard, when semiconductor chip tests, can use fixing device to fix semiconductor chip, but fixing device is used in current semiconductor chip test has many problems or defects:

traditional fixing device is used in semiconductor chip test can lead to the breakage of semiconductor chip edge when the fixed dynamics is too big in the in-service use, influences semiconductor chip's normal use, makes semiconductor chip test fixing device's protective effect not good.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fixing device is used in semiconductor chip test with safeguard function to provide the not good problem of fixing device protecting effect for semiconductor chip test in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a fixing device is used in semiconductor chip test with safeguard function, includes the workstation, the top of workstation is provided with prevents pressing from both sides and hinders the structure, prevent pressing from both sides and hinder the structure and include the side splint, the side splint is installed in one side on workstation top, the inside of side splint one side is provided with the movable groove, and the internally mounted in movable groove has the rubber strip, be provided with anti-skidding sand grip on the lateral wall of rubber strip, buffer spring is installed to the opposite side of rubber strip, and buffer spring sets up in the inside in movable groove, the support frame is installed on the top of workstation, and installs air pump and electric telescopic handle on the top of support frame, vacuum chuck is installed to electric telescopic handle's bottom.

Preferably, the cross section of the rubber strip is T-shaped, and the anti-skid convex strips are uniformly distributed on the rubber strip.

Preferably, the buffer springs are provided with a plurality of buffer springs, and the buffer springs are arranged and distributed on one side of the rubber strip at equal intervals.

Preferably, the middle section position department of support frame is provided with bearing structure, bearing structure includes logical groove, it sets up in the inside of support frame to lead to the groove, U type slide rail is all installed to the both sides that lead to the groove, and installs the support plate between the U type slide rail, and the one end of support plate installs the arm-tie.

Preferably, the two sides of the support plate are clamped in grooves in the U-shaped slide rails, a sliding structure is formed between the support plate and the U-shaped slide rails, and the support plate and the electric telescopic rod are perpendicular to each other.

Preferably, one side on workstation top is provided with the adjustment structure, the adjustment structure includes solid fixed splint, gu fixed splint swing joint is on the top of workstation, gu fixed splint's one side is installed connecting sleeve, and connecting sleeve's inside swing joint in threaded rod, the crank is installed to one side of threaded rod, gu fixed splint's bottom is provided with the direction spout.

Preferably, the bottom of solid fixed splint is provided with the slider with direction spout looks adaptation, connecting sleeve's mouth of pipe department is provided with the internal thread, form threaded connection between connecting sleeve and the threaded rod, the support is all installed in the outside of connecting sleeve and threaded rod.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) The semiconductor chip fixing device is provided with the side clamping plates, the movable grooves, the rubber strips, the anti-skidding raised lines and the buffer springs, the semiconductor chip is protected, the rubber strips are made of rubber materials and have good flexibility, when the semiconductor chip is clamped, the rubber strips can compress the buffer springs, the toughness of the rubber strips and the elasticity of the buffer springs are utilized to absorb clamping force, the phenomenon that the semiconductor chip is damaged due to overlarge clamping force is prevented, and therefore the fixing device has a protection function;

(2) The semiconductor chip is stored by the aid of the through grooves, the U-shaped slide rails, the support plate and the pull plate, two sides of the support plate are clamped in the grooves in the U-shaped slide rails, the support plate and the U-shaped slide rails form a sliding structure, the support plate can be pulled and pulled between the U-shaped slide rails, the U-shaped slide rails can store the chip to be tested, the support plate and the electric telescopic rod are perpendicular to each other, the support plate is convenient to move, the semiconductor chip is moved to the position under the vacuum chuck, and therefore the practicability of the fixing device is improved;

(3) Through being provided with solid fixed splint, adapter sleeve, the threaded rod, crank and direction spout, it is fixed to have realized carrying out the centre gripping to unidimensional semiconductor chip, the rotation of crank can drive the threaded rod and rotate, and through threaded connection of threaded rod and adapter sleeve, whole length between adjustment adapter sleeve and the threaded rod, control solid fixed splint carry out the translation along the direction of direction spout, form the clamping state with the side splint, it is fixed to carry out the centre gripping to the semiconductor chip, thereby fixing device's flexibility has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a front view of the anti-pinch structure of the present invention;

fig. 4 is a schematic view of the top-view cross-sectional structure of the adjusting structure of the present invention.

The reference numbers in the figures illustrate:

1. a work table; 2. a pinch-proof structure; 201. a side clamping plate; 202. a movable groove; 203. a rubber strip; 204. anti-skid convex strips; 205. a buffer spring; 3. a support frame; 4. a load bearing structure; 401. a through groove; 402. a U-shaped slide rail; 403. a carrier plate; 404. pulling a plate; 5. an air pump; 6. an electric telescopic rod; 7. a vacuum chuck; 8. adjusting the structure; 801. fixing the clamping plate; 802. a connecting sleeve; 803. a threaded rod; 804. a crank; 805. a guide chute.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides an embodiment of: a fixing device with a protection function for a semiconductor chip test comprises a workbench 1, wherein an anti-pinch structure 2 is arranged at the top end of the workbench 1, the anti-pinch structure 2 comprises a side clamping plate 201, the side clamping plate 201 is installed at one side of the top end of the workbench 1, a movable groove 202 is formed in the inner portion of one side of the side clamping plate 201, a rubber strip 203 is installed in the movable groove 202, anti-slip convex strips 204 are arranged on the outer side wall of the rubber strip 203, buffer springs 205 are installed on the other side of the rubber strip 203, the buffer springs 205 are arranged in the movable groove 202, the cross section of the rubber strip 203 is in a T shape, the anti-slip convex strips 204 are uniformly distributed on the rubber strip 203, the number of the buffer springs 205 is multiple, and the buffer springs 205 are arranged and distributed at equal intervals on one side of the rubber strip 203;

specifically, as shown in the figure, when the semiconductor chip clamping device is used, the rubber strip 203 is made of rubber materials and has good flexibility, when the semiconductor chip is clamped, the rubber strip 203 can compress the buffer spring 205, and the toughness of the rubber strip 203 and the elasticity of the buffer spring 205 are utilized to absorb the clamping force, so that the phenomenon that the semiconductor chip is damaged due to overlarge clamping force is prevented;

a support frame 3 is installed at the top end of the workbench 1, an air pump 5 and an electric telescopic rod 6 are installed at the top end of the support frame 3, a vacuum chuck 7 is installed at the bottom end of the electric telescopic rod 6, a bearing structure 4 is arranged at the middle section position of the support frame 3, the bearing structure 4 comprises a through groove 401, the through groove 401 is arranged inside the support frame 3, U-shaped slide rails 402 are installed on two sides of the through groove 401, a support plate 403 is installed between the U-shaped slide rails 402, a pull plate 404 is installed at one end of the support plate 403, two sides of the support plate 403 are clamped in grooves inside the U-shaped slide rails 402, a sliding structure is formed between the support plate 403 and the U-shaped slide rails 402, and the support plate 403 and the electric telescopic rod 6 are perpendicular to each other;

specifically, as shown in the figure, when in use, two sides of the carrier plate 403 are clamped in the grooves inside the U-shaped slide rail 402, and a sliding structure is formed between the carrier plate 403 and the U-shaped slide rail 402, the carrier plate 403 can be pulled and pulled between the U-shaped slide rails 402, the U-shaped slide rail 402 can store the chips to be tested, and the carrier plate 403 and the electric telescopic rod 6 are perpendicular to each other, so that the carrier plate 403 can be moved conveniently, and the semiconductor chips can be moved to a position right below the vacuum chuck 7;

an adjusting structure 8 is arranged on one side of the top end of the workbench 1, the adjusting structure 8 comprises a fixed clamping plate 801, the fixed clamping plate 801 is movably connected to the top end of the workbench 1, a connecting sleeve 802 is installed on one side of the fixed clamping plate 801, the inside of the connecting sleeve 802 is movably connected to a threaded rod 803, a crank 804 is installed on one side of the threaded rod 803, a guide sliding groove 805 is formed in the bottom end of the fixed clamping plate 801, a sliding block matched with the guide sliding groove 805 is arranged at the bottom end of the fixed clamping plate 801, an internal thread is arranged at a pipe orifice of the connecting sleeve 802, a threaded connection is formed between the connecting sleeve 802 and the threaded rod 803, and supports are installed on the outer sides of the connecting sleeve 802 and the threaded rod 803;

specifically, as shown in the figure, during the use, through the rotation of crank 804, can drive threaded rod 803 and rotate to through the threaded connection of threaded rod 803 and connecting sleeve 802, adjust the whole length between connecting sleeve 802 and the threaded rod 803, control solid fixed splint 801 and carry out the translation along the direction of direction spout 805, form the centre gripping state with side splint 201, in order to realize carrying out the centre gripping to semiconductor chip and fix.

The working principle is as follows: when in use, the fixture for testing semiconductor chips is externally connected to a power supply, and first, the fixture for testing semiconductor chips is taken out and placed in a target area, the carrier plate 403 is taken out from between the U-shaped slide rails 402, the semiconductor chips to be tested are taken out, the chips are placed on the carrier plate 403, the carrier plate 403 is inserted between the U-shaped slide rails 402, and according to the use requirement, the carrier plate 403 is pulled, the chip to be tested is controlled to be positioned under the vacuum chuck 7, the control switch is controlled accordingly, the air pump 5 and the electric telescopic rod 6 are controlled to operate, the air pump 5 is connected with the vacuum chuck 7 through the hose, the vacuum chuck 7 is controlled to generate suction, and the chip below is absorbed, at the moment, the pulling plate 404 is pushed forwards, the carrier plate 403 is controlled to retract to the inside of the through groove 401, the blocking of the vacuum chuck 7 is released, and controls the electric telescopic rod 6 to extend downwards, stably places the chip above the worktable 1, controls the control switch, controls the air pump 5 to stop operating, releases the adsorption of the vacuum chuck 7 to the chip, controls the electric telescopic rod 6 to reset, then the crank 804 is grabbed and rotated, the fixed clamp plate 801 is controlled to move towards one side of the side clamp plate 201 through the threaded connection of the threaded rod 803 and the connecting sleeve 802, the chip is clamped and fixed, at this time, the rubber strip 203 will be pressed by the clamping, the rubber strip 203 will retract into the movable groove 202, and presses the buffer spring 205, by the flexibility of the rubber strip 203 and the elasticity of the buffer spring 205, the clamping force is buffered, the damage to the chip caused by overlarge clamping force is avoided, and after the fixation is finished, the chip can be tested, and finally the fixing device for testing the semiconductor chip is used.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a fixing device is used in test of semiconductor chip with safeguard function, includes workstation (1), its characterized in that: the top of workstation (1) is provided with prevents pressing from both sides and hinders structure (2), prevent pressing from both sides and hinder structure (2) including side splint (201), one side on workstation (1) top is installed in side splint (201), the inside of side splint (201) one side is provided with movable groove (202), and the internally mounted of movable groove (202) has rubber strip (203), be provided with anti-skidding sand grip (204) on the lateral wall of rubber strip (203), buffer spring (205) are installed to the opposite side of rubber strip (203), and buffer spring (205) set up in the inside of movable groove (202), support frame (3) are installed on the top of workstation (1), and air pump (5) and electric telescopic handle (6) are installed on the top of support frame (3), vacuum chuck (7) are installed to the bottom of electric telescopic handle (6).

2. The fixing device with protection function for testing semiconductor chip as claimed in claim 1, wherein: the cross section of the rubber strip (203) is T-shaped, and the anti-skid convex strips (204) are uniformly distributed on the rubber strip (203).

3. The fixing device with protection function for testing semiconductor chip as claimed in claim 1, wherein: the buffer springs (205) are provided with a plurality of buffer springs (205), and the buffer springs (205) are arranged and distributed at equal intervals on one side of the rubber strip (203).

4. The fixing device with protection function for testing semiconductor chip as claimed in claim 1, wherein: the middle section position department of support frame (3) is provided with bearing structure (4), bearing structure (4) are including leading to groove (401), it sets up in the inside of support frame (3) to lead to groove (401), U type slide rail (402) are all installed to the both sides that lead to groove (401), and install between U type slide rail (402) support plate (403), and the one end of support plate (403) installs arm-tie (404).

5. The mounting apparatus for testing semiconductor chips with protection function as claimed in claim 4, wherein: the two sides of the carrier plate (403) are clamped in grooves in the U-shaped slide rail (402), a sliding structure is formed between the carrier plate (403) and the U-shaped slide rail (402), and the carrier plate (403) and the electric telescopic rod (6) are perpendicular to each other.

6. The fixing device with protection function for testing semiconductor chip as claimed in claim 1, wherein: one side on workstation (1) top is provided with adjustment structure (8), adjustment structure (8) are including solid fixed splint (801), gu fixed splint (801) swing joint is on the top of workstation (1), connecting sleeve (802) are installed to one side of solid fixed splint (801), and the inside swing joint of connecting sleeve (802) in threaded rod (803), crank (804) are installed to one side of threaded rod (803), the bottom of solid fixed splint (801) is provided with direction spout (805).

7. The mounting apparatus for testing semiconductor chips with protection function as claimed in claim 6, wherein: the bottom of solid fixed splint (801) is provided with the slider with direction spout (805) looks adaptation, the mouth of pipe department of connecting sleeve (802) is provided with the internal thread, form threaded connection between connecting sleeve (802) and threaded rod (803), the support is all installed in the outside of connecting sleeve (802) and threaded rod (803).