CN215575494U

CN215575494U - Semiconductor testing device

Info

Publication number: CN215575494U
Application number: CN202122113318.9U
Authority: CN
Inventors: 周军; 马磊
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-09-02
Filing date: 2021-09-02
Publication date: 2022-01-18
Anticipated expiration: 2031-09-02

Abstract

The utility model discloses a semiconductor testing device, comprising: the frame can be placed on the table top, so that the probe is placed in the frame; the clamping plate is arranged in the frame and can clamp the semiconductor in the frame; the transmission part is arranged between the clamping plates and the frame, the clamping plates which are opposite to each other move oppositely or back to back simultaneously through the transmission part, the clamping plates can slide on the transmission part along the inner wall of the frame, the clamping plates on two sides can be pushed to move relatively through the transmission part, and various quadrangles are formed among the clamping plates.

Description

Semiconductor testing device

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor testing device.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like.

When testing a semiconductor, the semiconductor is usually required to be placed in a frame to be fixed, so that the semiconductor is relatively fixed, then a probe of a testing instrument is used for stably testing the semiconductor, the semiconductor is taken out from the frame after the test is finished, however, special frames are usually required to be produced for different types of semiconductors, the production cost is increased, the testing frame is continuously replaced, the testing speed is reduced, the operation of an operator is troublesome, and therefore, the semiconductor testing device is provided.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a semiconductor testing apparatus to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: a semiconductor test apparatus, comprising:

the frame can be placed on the table top, so that the probe is placed in the frame;

the clamping plate is arranged in the frame and can clamp the semiconductor in the frame;

the driving medium sets up between splint and frame, makes to be located relative splint simultaneously and moves in opposite directions or back to back of the body through the driving medium, splint can slide along the inner wall of frame on the driving medium, but the splint relative movement of both sides is promoted through the driving medium for form multiple quadrangle between a plurality of splint, and then make and to hold multiple type semiconductor between the splint.

Preferably, the driving medium includes that two are connected two screws that are the symmetric distribution splint respectively, every the both sides screw thread opposite direction of screw rod, pedestal connection is passed through on the frame at the both ends of screw rod, the outside of screw rod is equipped with can be in the gliding slider of frame, the tip and the splint of slider are connected, through rotating the screw rod for the slider of both sides is simultaneously in opposite directions or the motion of carrying on the back mutually, and then makes splint with the semiconductor centre gripping or loosen.

Preferably, a sliding groove is formed in one side of the clamping plate, and the end part of the sliding block can slide relatively in the sliding groove.

Preferably, the sliding block comprises a connecting part which can slide relative to the frame, a pressing part which can slide on the connecting part is arranged on one side of the connecting part, and a first spring which can push the clamping plate to stretch is arranged between the pressing part and the connecting part.

Preferably, the top of extrusion portion is equipped with a plurality of draw-in grooves, be equipped with one in the frame and insert in the draw-in groove and promote the extrusion portion to the briquetting of a position department motion of spring, adjacent two connect through the connecting plate between the briquetting, through pressing the connecting plate makes the briquetting moves the extrusion portion of both sides to the frame outside simultaneously, and then makes the semiconductor can put into or take out at splint spare.

Preferably, a second spring is arranged between the connecting plate and the frame, and after the pressing block is pressed downwards through the second spring, the pressing block is drawn out from the clamping groove, so that the sliding block can continuously slide in the frame.

The utility model has at least the following beneficial effects:

the connecting piece is used for clamping or loosening the semiconductor by pushing the clamping plates, the clamping plates on two sides work independently, the non-rectangular semiconductor can be clamped, compared with the prior art, special frames are generally required to be produced for different types of semiconductors, the production cost is increased, the testing frames are continuously replaced, the testing speed is reduced, and the operation of an operator is troublesome.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial cross-sectional view of the present invention;

fig. 3 is an enlarged view of the area a in fig. 2.

In the figure: 1-a frame; 2-clamping plate; 3-a transmission part; 31-a screw; 4-a slide block; 41-a connecting part; 42-an extrusion part; 43-spring one; 5-a chute; 6-briquetting; 7-a connecting plate; 8-spring two; 9-card slot.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a semiconductor test apparatus, comprising:

the frame 1 can be placed on the table board, so that the probe is placed in the frame 1, and the frame 1 is convenient for the semiconductor to be stably tested;

the clamping plate 2 is arranged in the frame 1 and can clamp the semiconductor in the frame 1, and the clamping plate 2 can fix the semiconductor in the frame 1, so that the semiconductor test is more convenient;

driving medium 3, the setting is between splint 2 and frame 1, makes to be located relative splint 2 simultaneously and in opposite directions or back-to-back motion through driving medium 3, splint 2 can slide along frame 1's inner wall on driving medium 3, but splint 2 relative movement of both sides is promoted through driving medium 3 for form multiple quadrangle between a plurality of splint 2, and then make but centre gripping multiple type semiconductor between splint 2, promote the splint 2 synchronous motion that is relative distribution through driving medium 3, and then guarantee that the semiconductor is comparatively stable position in frame 1 by the centre gripping, splint 2 of both sides remove respectively, and then make things convenient for the centre gripping of multiple shape semiconductor.

The transmission part 3 comprises two screw rods 31 respectively connected with two clamp plates 2 which are symmetrically distributed, the two screw rods 31 are distributed in a vertically staggered manner, the thread directions of two sides of each screw rod 31 are opposite, two ends of each screw rod 31 are connected to the frame 1 through bases, the bases are fixedly connected with the frame 1 and rotatably connected with the screw rods 31, slide blocks 4 capable of sliding in the frame 1 are arranged on the outer sides of the screw rods 31, the slide blocks 4 are slidably connected with the frame 1, the slide blocks 4 are in threaded connection with the screw rods 31, the end parts of the slide blocks 4 are connected with the clamp plates 2, the slide blocks 4 on two sides move oppositely or oppositely and oppositely at the same time by rotating the screw rods 31, so that the clamp plates 2 clamp or release the semiconductor, the shape of the semiconductor needs to be clamped, the two screw rods 31 are respectively rotated, the two screw rods 31 respectively push the slide blocks 4 on two sides to slide, and the slide blocks 4 push the clamp plates 2 to clamp the semiconductor, thereby facilitating testing of the semiconductor.

The spout 5 has been seted up to one side of splint 2, the tip of slider 4 can be in spout 5 relative slip, and when the semiconductor of different length of centre gripping, splint 2 can pass through spout 5 at the tip of slider 4 and slide to adjust splint 2 to different positions, and then be applicable to the test to multiple semiconductor.

Slider 4 include with frame 1 slidable connecting portion 41 relatively, one side of connecting portion 41 is equipped with the extrusion portion 42 that can slide on connecting portion 41, extrusion portion 42 in connecting portion 41 sliding connection, be equipped with the flexible spring 43 that can promote splint 2 between extrusion portion 42 and the connecting portion 41, the both ends of spring 43 respectively with extrusion portion 42 and connecting portion 41 fixed connection, when slider 4 promotes splint 2 centre gripping semiconductor, extrusion portion 42 slides relative connecting portion 41 to spring 43 compresses, provides the extrusion force that has certain elasticity to the semiconductor, thereby avoids rotatory screw rod 31 excessively to cause the damage to the thread of screw rod 31 or the side of semiconductor, and then conveniently the centre gripping to the semiconductor.

The top of the extrusion part 42 is provided with a plurality of clamping grooves 9, a pressing block 6 which can be inserted into the clamping grooves 9 and can push the extrusion part 42 to move to a spring I43 position is arranged in the frame 1, the pressing block 6 is connected with the frame 1 in a sliding manner, two adjacent pressing blocks 6 are connected through a connecting plate 7, the connecting plate 7 is fixedly connected with the pressing block 6, the pressing block 6 can move the extrusion parts 42 at two sides to the outer side of the frame 1 simultaneously by pressing the connecting plate 7, so that the semiconductor can be put in or taken out from the clamping plates 2, when the semiconductor is required to be taken out after one semiconductor is tested, only the connecting plate 7 is pressed, the pressing block 6 is extruded by the connecting plate 7, the pressing block 6 acts on the side surface of the inclined clamping groove 9, the extrusion part 42 can be pushed to move backwards, so that part of the clamping plates 2 is loosened, the spring I43 is compressed, and after a new semiconductor is put between the clamping plates 2, the pressed connecting plate 7 is sent, the first spring 43 is ejected out, the clamping plate 2 clamps the semiconductor, the step that the screw 31 is rotated again by a worker is reduced, the testing time is saved, and the use of the worker is facilitated.

Be equipped with spring two 8 between connecting plate 7 and the frame 1, after 6 pushes down at briquetting through spring two 8, take briquetting 6 out from draw-in groove 9, and then make slider 4 can continue to slide in frame 1, fixed connection between spring two 8 and connecting plate 7 and the frame 1 makes things convenient for the resetting of connecting plate 7 after pressing more through spring two 8, and then makes things convenient for staff's operation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor test apparatus, characterized in that: the method comprises the following steps:

the frame (1) can be placed on the table top, so that the probe is placed in the frame (1);

the clamping plate (2) is arranged in the frame (1) and can clamp the semiconductor in the frame (1);

the transmission part (3) is arranged between the clamping plates (2) and the frame (1), the clamping plates (2) which are opposite to each other move in opposite directions or back to back simultaneously through the transmission part (3), the clamping plates (2) can slide on the transmission part (3) along the inner wall of the frame (1), and the clamping plates (2) which are arranged on two sides can move relatively through the transmission part (3), so that a plurality of quadrangles are formed between the clamping plates (2).

2. A semiconductor test apparatus as claimed in claim 1, characterized in that: the transmission part (3) includes that two are connected screw rod (31) that symmetric distribution splint (2) respectively, every the both sides screw thread opposite direction of screw rod (31), the both ends of screw rod (31) are passed through pedestal connection on frame (1), the outside of screw rod (31) is equipped with can be in frame (1) gliding slider (4), the tip and the splint (2) of slider (4) are connected, through rotating screw rod (31) for the slider (4) of both sides is simultaneously in opposite directions or the motion of carrying on the back mutually, and then makes splint (2) with the semiconductor centre gripping or loosen.

3. A semiconductor test apparatus according to claim 2, wherein: one side of the clamping plate (2) is provided with a sliding groove (5), and the end part of the sliding block (4) can relatively slide in the sliding groove (5).

4. A semiconductor test apparatus according to claim 3, wherein: the sliding block (4) comprises a connecting portion (41) which can slide relative to the frame (1), a pressing portion (42) which can slide on the connecting portion (41) is arranged on one side of the connecting portion (41), and a first spring (43) which can push the clamping plate (2) to stretch is arranged between the pressing portion (42) and the connecting portion (41).

5. A semiconductor test apparatus as claimed in claim 4, characterized in that: the top of extrusion portion (42) is equipped with a plurality of draw-in grooves (9), be equipped with one in frame (1) and insert in draw-in groove (9) and promote extrusion portion (42) to briquetting (6) that spring (43) position department moved, adjacent two connect through connecting plate (7) between briquetting (6), through pressing connecting plate (7), make briquetting (6) move extrusion portion (42) of both sides to the frame (1) outside simultaneously, and then make the semiconductor can put into or take out at splint (2) piece.

6. A semiconductor test apparatus as claimed in claim 5, wherein: a second spring (8) is arranged between the connecting plate (7) and the frame (1), and after the pressing block (6) is pressed down through the second spring (8), the pressing block (6) is drawn out from the clamping groove (9), so that the sliding block (4) can continuously slide in the frame (1).