CN217860464U

CN217860464U - A polisher for wafer ring processing usefulness

Info

Publication number: CN217860464U
Application number: CN202222426927.4U
Authority: CN
Inventors: 于长峰
Original assignee: Dongguan Nenghong Plastic Products Co ltd
Current assignee: Dongguan Nenghong Plastic Products Co ltd
Priority date: 2022-09-14
Filing date: 2022-09-14
Publication date: 2022-11-22
Anticipated expiration: 2032-09-14

Abstract

The utility model discloses a polisher for wafer ring processing usefulness, including the connecting seat, one side fixedly connected with support frame at connecting seat top, the top of connecting seat is provided with the workstation, fixedly connected with stabilizer blade between connecting seat and the workstation, the bottom of workstation is provided with the casing. This a polisher for wafer ring processing usefulness is through being provided with the connecting axle, driving motor, the apparatus further comprises a rotating shaft, drive gear and driven gear, start driving motor, driving motor drives drive gear through the pivot and rotates, because drive gear and driven gear mutually support and spliced pole fixed connection are on the top of connecting axle, so drive gear rotates the spliced pole that can drive connecting axle and connecting axle top and rotates, thereby can make the outside wafer ring of backup pad rotate, make the wafer ring rotate then can conveniently make the mill polish the wafer ring, the solution is inconvenient to make the spliced pole rotate, the lower problem of work efficiency of polishing.

Description

A polisher for wafer ring processing usefulness

Technical Field

The utility model relates to a wafer ring processing technology field specifically is a polisher that is used for wafer ring processing to use.

Background

When the wafer ring is produced, the wafer ring needs to be processed, and a grinding machine needs to be used when the wafer ring is processed, the grinding machine can not only enable the surface of the wafer ring to be smoother, but also can change the thickness of the wafer ring, and when the grinding machine for processing the wafer ring is used for grinding the wafer ring, the connecting column is inconvenient to rotate, so that the grinding work efficiency is low; the position of the polishing disc is inconvenient to adjust, and the flexibility is poor; the wafer rings of different sizes are not convenient to polish, and the limitation is large. An improvement is now made to a grinder for wafer ring machining in view of the above-identified problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a polisher for wafer ring processing usefulness to propose inconvenient messenger's spliced pole rotation in solving above-mentioned background, the lower problem of work efficiency of polishing.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a polisher for processing of wafer ring, includes the connecting seat, one side fixedly connected with support frame at connecting seat top, the top of connecting seat is provided with the workstation, fixedly connected with stabilizer blade between connecting seat and the workstation, the bottom of workstation is provided with the casing, the inside top of support frame is provided with the protecting crust, driving motor is installed to the opposite side of the inside bottom of casing, driving motor's output fixedly connected with pivot, one side fixedly connected with drive gear of pivot, the inside swing joint of casing has the connecting axle, the outside fixedly connected with driven gear of connecting axle, the top fixedly connected with spliced pole of connecting axle.

Preferably, a tooth block is arranged outside the driven gear, a tooth block with the same size as the driven gear is arranged outside the driving gear, and the driving gear and the driven gear are matched with each other.

Preferably, a servo motor is installed on the other side of the protective shell, a threaded rod is fixedly connected to the output end of the servo motor, a limiting slide rod is arranged at the top end of the threaded rod, threaded sleeves are arranged outside the limiting slide rod and the threaded rod, and a hydraulic oil cylinder is installed at the bottom end of the threaded sleeve.

Preferably, the bottom end of the hydraulic oil cylinder is provided with a polishing disc.

Preferably, the outside of threaded rod is provided with the external screw thread, the inside bottom of thread bush is provided with the internal thread with external screw thread matched with, the inside top of thread bush sets up the outside at spacing slide bar.

Preferably, the both sides of spliced pole are provided with the backup pad, the spacing spring of both ends fixedly connected with between backup pad and the spliced pole, the both sides fixedly connected with reset spring of spliced pole, the inside one side of reset spring is provided with spacing loop bar, the inside opposite side of reset spring is provided with spacing sleeve.

Preferably, the limiting sleeve is sleeved on one side of the outer part of the limiting sleeve rod.

Preferably, the limiting springs are arranged at two ends of the return spring.

Compared with the prior art, the beneficial effects of the utility model are that: the polishing machine for processing the wafer rings not only realizes the convenience for rotating the connecting column and adjusting the position of the polishing disc, but also realizes the convenience for polishing the wafer rings with different sizes;

(1) The wafer ring rotating device is provided with the connecting shaft, the driving motor, the rotating shaft, the driving gear and the driven gear, the driving motor is started, the driving motor drives the driving gear to rotate through the rotating shaft, and the driving gear and the driven gear are matched with each other and the connecting column is fixedly connected to the top end of the connecting shaft, so that the driving gear can drive the connecting shaft and the connecting column at the top end of the connecting shaft to rotate, a wafer ring outside the supporting plate can rotate, and the wafer ring can be conveniently polished by the polishing disc when rotating;

(2) The wafer ring polishing machine is provided with the hydraulic oil cylinder, the limiting slide rod, the servo motor, the protective shell, the threaded rod and the threaded sleeve, the servo motor is started when the position of the polishing disc needs to be adjusted, the servo motor drives the threaded rod to rotate, the threaded rod and the threaded sleeve are matched with each other, and the hydraulic oil cylinder is installed at the bottom end of the threaded sleeve, so that the threaded sleeve can move left and right through rotation of the threaded rod, the position of the polishing disc can be adjusted through left and right movement of the threaded sleeve, and the polishing disc can conveniently polish different positions of a wafer ring through adjustment of the position of the polishing disc;

(3) Through being provided with the spliced pole, the backup pad, spacing sleeve, spacing spring, spacing loop bar and reset spring, press the backup pad, backup pad extrusion spacing spring and reset spring, thereby can make the distance between the backup pad shorten, later overlap the wafer ring in the outside of backup pad, loosen the backup pad after overlapping, spacing spring and reset spring can make the backup pad support spacing to the wafer ring through the elasticity of self, thereby can fix the wafer ring, the convenience is polished the wafer ring.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the top-view cross-sectional structure of the connecting column of the present invention;

FIG. 3 is a side view of the driving gear of the present invention;

fig. 4 is an enlarged partial cross-sectional view of the point a in fig. 1 according to the present invention.

In the figure: 1. a connecting seat; 2. a support frame; 3. a support leg; 4. a work table; 5. grinding disc; 6. a hydraulic cylinder; 7. a limiting slide bar; 8. a servo motor; 9. a protective shell; 10. connecting columns; 11. a support plate; 12. a connecting shaft; 13. a drive motor; 14. a housing; 15. a rotating shaft; 16. a drive gear; 17. a driven gear; 18. a limiting sleeve; 19. a limiting spring; 20. a limiting sleeve rod; 21. a return spring; 22. a threaded rod; 23. and (4) a threaded sleeve.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Example 1: referring to fig. 1-4, a grinding machine for processing a wafer ring comprises a connecting seat 1, a supporting frame 2 is fixedly connected to one side of the top of the connecting seat 1, a workbench 4 is arranged at the top end of the connecting seat 1, supporting legs 3 are fixedly connected between the connecting seat 1 and the workbench 4, a shell 14 is arranged at the bottom end of the workbench 4, a protective shell 9 is arranged at the top end of the inside of the supporting frame 2, a driving motor 13 is installed at the other side of the bottom end of the inside of the shell 14, a rotating shaft 15 is fixedly connected to the output end of the driving motor 13, a driving gear 16 is fixedly connected to one side of the rotating shaft 15, a connecting shaft 12 is movably connected to the inside of the shell 14, a driven gear 17 is fixedly connected to the outside of the connecting shaft 12, and a connecting column 10 is fixedly connected to the top end of the connecting shaft 12;

a tooth block is arranged outside the driven gear 17, a tooth block with the same size as the driven gear 17 is arranged outside the driving gear 16, and the driving gear 16 and the driven gear 17 are matched with each other;

specifically, as shown in fig. 1 and 3, the driving motor 13 is started, the driving motor 13 drives the driving gear 16 to rotate through the rotating shaft 15, and since the driving gear 16 and the driven gear 17 are matched with each other and the connecting column 10 is fixedly connected to the top end of the connecting shaft 12, the driving gear 16 rotates to drive the connecting column 10 at the top end of the connecting shaft 12 and the connecting shaft 12 to rotate, so that the wafer ring outside the supporting plate 11 can rotate, and the wafer ring can rotate to facilitate the polishing disc 5 to polish the wafer ring.

Example 2: a servo motor 8 is installed on the other side of the protective shell 9, a threaded rod 22 is fixedly connected to the output end of the servo motor 8, a limiting slide rod 7 is arranged at the top end of the threaded rod 22, a threaded sleeve 23 is arranged outside the limiting slide rod 7 and the threaded rod 22, a hydraulic oil cylinder 6 is installed at the bottom end of the threaded sleeve 23, a polishing disc 5 is installed at the bottom end of the hydraulic oil cylinder 6, an external thread is arranged outside the threaded rod 22, an internal thread matched with the external thread is arranged at the bottom end inside the threaded sleeve 23, and the top end inside the threaded sleeve 23 is arranged outside the limiting slide rod 7;

specifically, as shown in fig. 1 and 4, the servo motor 8 is started when the position of the polishing disc 5 needs to be adjusted, the servo motor 8 drives the threaded rod 22 to rotate, the threaded rod 22 and the threaded sleeve 23 are matched with each other, and the hydraulic oil cylinder 6 is installed at the bottom end of the threaded sleeve 23, so that the threaded rod 22 rotates to enable the threaded sleeve 23 to move left and right, the position of the polishing disc 5 can be adjusted when the threaded sleeve 23 moves left and right, and the polishing disc 5 can be conveniently polished at different positions of a wafer ring by adjusting the position of the polishing disc 5.

Example 3: the two sides of the connecting column 10 are provided with supporting plates 11, two ends between the supporting plates 11 and the connecting column 10 are fixedly connected with limiting springs 19, two sides of the connecting column 10 are fixedly connected with return springs 21, one side inside the return springs 21 is provided with a limiting sleeve rod 20, the other side inside the return springs 21 is provided with a limiting sleeve 18, the limiting sleeve 18 is sleeved on one side outside the limiting sleeve rod 20, and the limiting springs 19 are arranged at two ends of the return springs 21;

specifically, as shown in fig. 1 and 2, the supporting plate 11 is pressed, the supporting plate 11 extrudes the limiting spring 19 and the return spring 21, so that the distance between the supporting plates 11 can be shortened, then the wafer ring is sleeved outside the supporting plate 11, the supporting plate 11 is loosened after the wafer ring is sleeved, the limiting spring 19 and the return spring 21 enable the supporting plate 11 to support and limit the wafer ring through the elasticity of the limiting spring 19 and the return spring 21, and therefore the wafer ring can be fixed and can be conveniently polished.

The working principle is as follows: the utility model discloses press backup pad 11 when using, 11 extrusion limit spring 19 of backup pad and reset spring 21, thereby can make the distance between the backup pad 11 shorten, later cover the wafer ring in the outside of backup pad 11, loosen backup pad 11 after overlapping, limit spring 19 and reset spring 21 can make backup pad 11 support spacingly to the wafer ring through the elasticity of self, accomplish the installation to the wafer ring, make the wafer ring install the outside at backup pad 11 can conveniently polish the wafer ring, drive hydraulic cylinder 6 after fixing, hydraulic cylinder 6 drives the mill 5 decline, start servo motor 8 after mill 5 descends suitable position when mill 5 descends, servo motor 8 drives threaded rod 22 and rotates, threaded rod 22 rotates and to remove about can making threaded sleeve 23, then remove about threaded sleeve 23 and can adjust the position of mill 5, start driving motor 13 after adjusting the position, driving motor 13 drives driving gear 16 through pivot 15 and rotates, driving gear 16 rotates and can drive spliced pole 12 and the 10 rotations on connecting axle 12 tops, thereby can make the outside wafer ring rotation of backup pad 11, make the wafer ring rotate then can conveniently polish the mill 5 to the wafer ring.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A sander for wafer ring processing, comprising a connecting seat (1), characterized in that: one side fixedly connected with support frame (2) at connecting seat (1) top, the top of connecting seat (1) is provided with workstation (4), fixedly connected with stabilizer blade (3) between connecting seat (1) and workstation (4), the bottom of workstation (4) is provided with casing (14), the inside top of support frame (2) is provided with protecting crust (9), driving motor (13) are installed to the opposite side of the inside bottom of casing (14), output fixedly connected with pivot (15) of driving motor (13), one side fixedly connected with drive gear (16) of pivot (15), the inside swing joint of casing (14) has connecting axle (12), the outside fixedly connected with driven gear (17) of connecting axle (12), the top fixedly connected with spliced pole (10) of connecting axle (12).

2. A grinder for wafer ring machining as set forth in claim 1, wherein: the outside of driven gear (17) sets up the tooth piece, the outside of drive gear (16) is provided with the tooth piece the same with driven gear (17) external size, drive gear (16) and driven gear (17) are mutually supported.

3. A sander for wafer ring processing as set forth in claim 1, wherein: servo motor (8) are installed to the opposite side of protecting crust (9), the output fixedly connected with threaded rod (22) of servo motor (8), the top of threaded rod (22) is provided with spacing slide bar (7), the outside of spacing slide bar (7) and threaded rod (22) is provided with thread bush (23), hydraulic cylinder (6) are installed to the bottom of thread bush (23).

4. A grinder for wafer ring machining as set forth in claim 3, wherein: and the bottom end of the hydraulic oil cylinder (6) is provided with a polishing disc (5).

5. A grinder for wafer ring machining as set forth in claim 3, wherein: the threaded rod (22) is externally provided with an external thread, the bottom end inside the threaded sleeve (23) is provided with an internal thread matched with the external thread, and the top end inside the threaded sleeve (23) is arranged outside the limiting slide rod (7).

6. A grinder for wafer ring machining as set forth in claim 1, wherein: the utility model discloses a quick-witted connection structure, including spliced pole (10), both sides of spliced pole (10) are provided with backup pad (11), both ends fixedly connected with spacing spring (19) between backup pad (11) and spliced pole (10), the both sides fixedly connected with reset spring (21) of spliced pole (10), one side of reset spring (21) inside is provided with spacing loop bar (20), the opposite side of reset spring (21) inside is provided with spacing sleeve (18).

7. A grinder for wafer ring machining as set forth in claim 6, wherein: the limiting sleeve (18) is sleeved on one side of the outer portion of the limiting sleeve rod (20).

8. A sander for wafer ring processing as set forth in claim 6, wherein: the limiting springs (19) are arranged at two ends of the return spring (21).