CN217726282U - Sensor automatic soldering tin CCD detection equipment - Google Patents
Sensor automatic soldering tin CCD detection equipment Download PDFInfo
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- CN217726282U CN217726282U CN202221334323.0U CN202221334323U CN217726282U CN 217726282 U CN217726282 U CN 217726282U CN 202221334323 U CN202221334323 U CN 202221334323U CN 217726282 U CN217726282 U CN 217726282U
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Abstract
The utility model discloses a sensor automatic soldering CCD detection device, which comprises a frame, a controller, a first conveying device, a second conveying device, a material ejecting device, a soldering device and a CCD detection device; the tin soldering device is arranged on the rack and is positioned right above the first conveying device, and the tin soldering device is connected with the controller; the CCD detection device is arranged on the frame and positioned right above the material ejecting device, and the CCD detection device is connected with the controller. The first conveying device and the tin soldering device are arranged, so that a product can flow in through the first conveying device, and then the tin soldering device is used for carrying out automatic tin soldering on the product, and the automation degree of the tin soldering process of the sensor is improved; and the CCD detection device, the material ejecting device and the second conveying device are arranged in a matched manner, so that a product which is processed by soldering tin can be detected, and the stability of the welding effect can be ensured even if the product is processed in a large batch.
Description
Technical Field
The utility model belongs to the technical field of the sensor processing technique and specifically relates to indicate an automatic soldering tin CCD check out test set of sensor.
Background
Torque sensors, also called torque sensors, and torquers, are classified into dynamic and static types, wherein dynamic torque sensors may be called torque sensors, torque speed sensors, non-contact torque sensors, and rotation torque sensors. Torque sensors are the detection of the perception of torsional moments on various rotating or non-rotating mechanical components. The torque sensor converts the physical change of the torque force into an accurate electrical signal. The torque sensor can be applied to manufacture viscometers and electric (pneumatic and hydraulic) torque wrenches, and has the advantages of high precision, fast frequency response, good reliability, long service life and the like.
The torque sensor needs to perform soldering tin connection between the PCB and the wire rod in the processing process, the existing soldering tin mode mostly adopts tools to complete the soldering tin process manually, the automation degree is low, the labor cost is high, and meanwhile, when manual large-batch processing is performed, the quality of soldering tin cannot be guaranteed, so the manual soldering tin mode is not beneficial to large-batch processing; therefore, there is a need to develop a new technical solution to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a sensor automatic soldering CCD detection device, which can effectively solve the problems of low automation degree, high labor cost and being not suitable for mass processing of the existing sensor soldering method.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a sensor automatic soldering CCD detection device comprises a rack, a controller, a first conveying device, a second conveying device, a material ejecting device, a soldering device and a CCD detection device; the controller is arranged on the frame; the first conveying device is arranged on the rack and connected with the controller; the second conveying device is arranged on the rack and connected with the controller, and the input end of the second conveying device is positioned beside the output end side of the first conveying device; the material ejecting device is arranged on the rack and is positioned right below the first conveying device and beside the input end side of the second conveying device, and the material ejecting device is connected with the controller; the tin soldering device is arranged on the rack and is positioned right above the first conveying device, and the tin soldering device is connected with the controller; the CCD detection device is arranged on the frame and positioned right above the material ejecting device, and the CCD detection device is connected with the controller.
Preferably, the machine frame is further provided with a hood, the controller is arranged on the hood, and the first conveying device, the second conveying device, the material ejecting device, the soldering device and the CCD detecting device are all covered by the hood.
As a preferred scheme, still be provided with first display screen and second display screen on the aircraft bonnet, first display screen and second display screen all are connected with the controller.
As a preferable scheme, the first conveying device comprises a first conveying frame, a first conveying belt and a first conveying driving mechanism; the first conveying frame is arranged on the rack, the first conveying belt can be arranged on the first conveying frame in a reciprocating rotation mode, the first conveying driving mechanism is arranged on the first conveying frame and drives the first conveying belt to rotate back and forth, and the first conveying driving mechanism is connected with the controller.
As a preferable scheme, the second conveying device comprises a second conveying frame, a second conveying belt and a second conveying driving mechanism; the second conveying frame is arranged on the rack and located beside the first conveying device, the second conveying belt can be arranged on the second conveying frame in a reciprocating rotation mode, the second conveying driving mechanism is arranged on the second conveying frame and drives the second conveying belt to rotate back and forth, and the second conveying driving mechanism is connected with the controller.
Preferably, the conveying direction of the second conveying device is perpendicular to the conveying direction of the first conveying device.
As a preferred scheme, the material ejecting device comprises a mounting frame, a movable frame, a first material ejecting driving mechanism, a third conveying belt and a second material ejecting driving mechanism; the mounting rack is arranged on the rack; the movable frame can be movably arranged on the mounting frame up and down and back and forth; the first material ejecting driving mechanism is arranged on the mounting frame and drives the movable frame to move up and down and back and forth, and the first material ejecting driving mechanism is connected with the controller; the third conveyer belt is arranged on the movable frame in a back-and-forth rotating manner and moves back and forth up and down along with the movable frame, and the conveying direction of the third conveyer belt is the same as that of the second conveying device; the second material ejecting driving mechanism is arranged on the movable frame and drives the third conveying belt to move back and forth, and the second material ejecting driving mechanism is connected with the controller.
As a preferred scheme, the soldering device comprises a soldering tin frame, a movable rod, a first soldering tin driving mechanism, an installing head, a second soldering tin driving mechanism, an installing plate, a third soldering tin driving mechanism, a soldering tin head and a material clamping head; the soldering tin frame is arranged on the frame and is positioned right above the first conveying device; the movable rod can be longitudinally and movably arranged on the soldering tin frame back and forth; the first soldering tin driving mechanism is arranged on the soldering tin frame and drives the movable rod to longitudinally move back and forth, and the first soldering tin driving mechanism is connected with the controller; the mounting head can be transversely and movably arranged on the movable rod back and forth and can move back and forth along with the movable rod longitudinally; the second soldering tin driving mechanism is arranged on the mounting head and drives the mounting head to transversely move back and forth, and the second soldering tin driving mechanism is connected with the controller; the mounting plate can be movably arranged on the mounting head up and down and back and forth and can transversely move back and forth along with the mounting head; the third soldering tin driving mechanism is arranged on the mounting head and drives the mounting plate to move up and down and back and forth, and the third soldering tin driving mechanism is connected with the controller; the soldering tin head is arranged at the lower end of the mounting plate and moves up and down along with the mounting plate, and the soldering tin head is connected with the controller; the material clamping head is arranged at the lower end of the mounting plate and moves up and down along with the mounting plate, and the material clamping head is positioned beside the soldering tin head and connected with the controller.
As a preferred scheme, the soldering tin device further comprises a cleaning bin, the cleaning bin is arranged on the rack and located beside the soldering tin rack, and the cleaning bin is connected with the controller.
As a preferred scheme, the CCD detection device comprises a detection frame and a CCD detection head; the detection frame is arranged on the rack and positioned beside the first conveying device; the CCD detection head is arranged on the detection frame and is positioned right above the material ejecting device, and the CCD detection head is connected with the controller.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
the first conveying device and the soldering device are arranged, so that the product can flow in through the first conveying device, and then the soldering device is used for carrying out automatic soldering on the product, so that the automation degree of the soldering process of the sensor is improved, and the labor cost is greatly reduced; the CCD detection device, the material ejecting device and the second conveying device are arranged in a matched mode, products which are subjected to soldering tin processing can be detected, and products which are detected to be unqualified are conveyed out through the two ejecting devices and the second conveying device, so that the influence on the quality of subsequent products due to the fact that the products flow into subsequent stations is avoided; and the automatic processing mode can also ensure the stability of the welding effect even if the large-batch processing is carried out.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic perspective view of a preferred embodiment of the present invention;
FIG. 2 is a partial assembly view of the preferred embodiment of the present invention;
FIG. 3 is a schematic perspective view of a material ejecting device according to a preferred embodiment of the present invention;
FIG. 4 is a perspective view of a second conveyor according to a preferred embodiment of the present invention;
fig. 5 is a schematic perspective view of a soldering device according to a preferred embodiment of the present invention.
Description of the figures:
10. frame 11, hood
12. First display screen 13 and second display screen
20. Controller 30 and first conveying device
31. First carriage 32, first conveyor belt
33. First conveying drive mechanism 40 and second conveying device
41. Second conveying frame 42 and second conveying belt
43. Second conveying driving mechanism 50 and material ejecting device
51. Mounting frame 52 and movable frame
53. First liftout actuating mechanism 54, third conveyer belt
60. Soldering device 61 and soldering stand
62. Movable rod 63 and first solder driving mechanism
64. Mounting head 65, mounting plate
66. Third solder driving mechanism 67 and solder head
68. Clamping head 69, cleaning bin
70. CCD detection device 71 and detection frame
72. And a CCD detection head.
Detailed Description
Referring to fig. 1 to 5, a specific structure of a preferred embodiment of the present invention is shown, which includes a frame 10, a controller 20, a first conveying device 30, a second conveying device 40, a material ejecting device 50, a soldering device 60, and a CCD detecting device 70.
The controller 20 is arranged on the frame 10; in this embodiment, the rack 10 further has a hood 11, the controller 20 is disposed on the hood 11, and the first conveyor 30, the second conveyor 40, the ejector 50, the soldering device 60, and the CCD detection device 70 are all covered by the hood 11; the hood 11 is further provided with a first display screen 12 and a second display screen 13, and the first display screen 12 and the second display screen 13 are both connected with the controller 20.
The first conveying device 30 is arranged on the frame 10 and connected with the controller 20; the first conveying device 30 includes a first conveying frame 31, a first conveying belt 32 and a first conveying driving mechanism 33; the first conveying frame 31 is disposed on the frame 10, the first conveying belt 32 is disposed on the first conveying frame 31 in a reciprocating manner, the first conveying driving mechanism 33 is disposed on the first conveying frame 31 and drives the first conveying belt 32 to rotate back and forth, and the first conveying driving mechanism 33 is connected to the controller 20.
The second conveying device 40 is arranged on the frame 10 and connected with the controller 20, and the input end of the second conveying device 40 is positioned beside the output end side of the first conveying device 30; in this embodiment, the second conveying device 40 includes a second conveying frame 41, a second conveying belt 42, and a second conveying driving mechanism 43; the second conveying frame 41 is arranged on the frame 10 and located beside the first conveying device 30, the second conveying belt 42 is arranged on the second conveying frame 41 in a reciprocating manner, the second conveying driving mechanism 43 is arranged on the second conveying frame 41 and drives the second conveying belt 42 to rotate back and forth, and the second conveying driving mechanism 43 is connected with the controller 20; the conveying direction of the second conveying device 40 is perpendicular to the conveying direction of the first conveying device 30.
The material ejecting device 50 is arranged on the frame 10 and is positioned right below the first conveying device 30 and beside the input end side of the second conveying device 50, and the material ejecting device 50 is connected with the controller 20; in this embodiment, the material ejecting device 50 includes a mounting frame 51, a movable frame 52, a first material ejecting driving mechanism 53, a third conveying belt 54, and a second material ejecting driving mechanism (not shown); the mounting frame 51 is arranged on the frame 10; the movable frame 52 is movably arranged on the mounting frame 51 up and down and back and forth; the first material ejecting driving mechanism 53 is arranged on the mounting frame 51 and drives the movable frame 52 to move up and down and back and forth, and the first material ejecting driving mechanism 53 is connected with the controller 20; the third conveyer belt 54 is rotatably arranged on the movable frame 52 back and forth and moves back and forth up and down along with the movable frame 52, and the conveying direction of the third conveyer belt 54 is the same as that of the second conveying device 40; the second ejecting driving mechanism (not shown) is disposed on the movable frame 52 and drives the third conveyor belt 54 to move back and forth, and the second ejecting driving mechanism (not shown) is connected to the controller 20.
The soldering device 60 is arranged on the frame 10 and is positioned right above the first conveying device 30, and the soldering device 60 is connected with the controller 20; in the present embodiment, the soldering device 60 includes a soldering frame 61, a movable rod 62, a first soldering driving mechanism 63, an attachment head 64, a second soldering driving mechanism (not shown), an attachment plate 65, a third soldering driving mechanism 66, a soldering head 67, and a material clamping head 68; the soldering tin frame 61 is arranged on the frame 10 and is positioned right above the first conveying device 30; the movable rod 62 is movably arranged on the soldering tin frame 61 back and forth in the longitudinal direction; the first soldering tin driving mechanism 63 is arranged on the soldering tin frame 61 and drives the movable rod 62 to move back and forth longitudinally, and the first soldering tin driving mechanism 63 is connected with the controller 20; the mounting head 64 is transversely movably arranged on the movable rod 62 back and forth and longitudinally moves back and forth along with the movable rod 62; the second solder driving mechanism (not shown) is disposed on the mounting head 64 and drives the mounting head 64 to move back and forth laterally, and the second solder driving mechanism (not shown) is connected to the controller 20; the mounting plate 65 is movably disposed up and down and back and forth on the mounting head 64 and moves back and forth along with the mounting head 64 in the transverse direction; the third solder driving mechanism 66 is arranged on the mounting head 64 and drives the mounting plate 65 to move up and down and back and forth, and the third solder driving mechanism 66 is connected with the controller 20; the soldering tin head 67 is arranged at the lower end of the mounting plate 64 and moves up and down along with the mounting plate 64, and the soldering tin head 67 is connected with the controller 20; the material clamping head 68 is arranged at the lower end of the mounting plate 64 and moves up and down along with the mounting plate 64, and the material clamping head 68 is positioned beside the soldering tin head 67 and connected with the controller 20; the soldering device 60 further includes a cleaning bin 69, the cleaning bin 69 is disposed on the rack 10 and beside the soldering rack 61, and the cleaning bin 69 is connected to the controller 20.
The CCD detection device 70 is arranged on the frame 10 and is positioned right above the material ejecting device 50, and the CCD detection device 70 is connected with the controller 20; in this embodiment, the CCD detecting device 70 includes a detecting frame 71 and a CCD detecting head 72; the detection frame 71 is arranged on the frame 10 and is positioned beside the first conveying device 30; the CCD detection head 72 is arranged on the detection frame 71 and is positioned right above the material ejecting device 50, and the CCD detection head 72 is connected with the controller 20.
The working principle of the embodiment is detailed as follows:
during operation, a product to be processed is conveyed in by the first conveying device 30, then is conveyed to the position right below the soldering tin device 60, the soldering tin device 60 carries out soldering tin processing on the product through the soldering tin head 67, after the soldering tin processing is finished, the product with the soldering tin completed is conveyed to the position right above the material ejecting device 50 continuously by the first conveying device 30, the soldering tin position is detected by the CCD detecting device 70 through the CCD detecting head 72, the detection result is displayed in the display screen through the first display screen 12 for monitoring by an operator, if the detection is qualified, the product is conveyed backwards to the next procedure continuously by the first conveying device 30, and if the detection is unqualified, the first material ejecting driving mechanism 53 in the material ejecting device 50 drives the third conveying belt 54 to move upwards, the third conveying belt 54 is in contact with the product, and then the unqualified product is conveyed to the second conveying device 40 by the third conveying device 54 in the material ejecting device 50 and is conveyed out by the second conveying device 40.
The utility model discloses a design focus lies in: by arranging the first conveying device and the tin soldering device, the product can flow in through the first conveying device, and then the tin soldering device carries out automatic tin soldering on the product, so that the automation degree of the tin soldering process of the sensor is improved, and the labor cost is greatly reduced; and the CCD detection device, the material ejecting device and the second conveying device are arranged in a matched manner, products which are processed by soldering tin can be detected, unqualified products are conveyed out through the two ejecting devices and the second conveying device, the influence on the quality of subsequent products due to the fact that the products flow into subsequent stations is avoided, and the stability of a welding effect can be guaranteed even if the products are processed in large batch by an automatic processing mode.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides an automatic soldering tin CCD check out test set of sensor which characterized in that: the automatic soldering machine comprises a rack, a controller, a first conveying device, a second conveying device, a material ejecting device, a soldering device and a CCD (charge coupled device) detection device; the controller is arranged on the frame; the first conveying device is arranged on the rack and connected with the controller; the second conveying device is arranged on the rack and connected with the controller, and the input end of the second conveying device is positioned beside the output end side of the first conveying device; the material ejecting device is arranged on the rack and is positioned right below the first conveying device and beside the input end side of the second conveying device, and the material ejecting device is connected with the controller; the tin soldering device is arranged on the rack and is positioned right above the first conveying device, and the tin soldering device is connected with the controller; the CCD detection device is arranged on the frame and positioned right above the material ejecting device, and the CCD detection device is connected with the controller.
2. The sensor-automated solder CCD detecting apparatus according to claim 1, wherein: the machine frame is further provided with a machine cover, the controller is arranged on the machine cover, and the first conveying device, the second conveying device, the material ejecting device, the soldering device and the CCD detection device are all covered by the machine cover.
3. The sensor automated solder CCD inspection apparatus of claim 2, wherein: still be provided with first display screen and second display screen on the aircraft bonnet, first display screen and second display screen all are connected with the controller.
4. The sensor-automated solder CCD detecting apparatus according to claim 1, wherein: the first conveying device comprises a first conveying frame, a first conveying belt and a first conveying driving mechanism; the first conveying frame is arranged on the rack, the first conveying belt can be arranged on the first conveying frame in a reciprocating rotation mode, the first conveying driving mechanism is arranged on the first conveying frame and drives the first conveying belt to rotate back and forth, and the first conveying driving mechanism is connected with the controller.
5. The sensor-automated solder CCD detecting apparatus according to claim 1, wherein: the second conveying device comprises a second conveying frame, a second conveying belt and a second conveying driving mechanism; the second conveying frame is arranged on the rack and located beside the first conveying device, the second conveying belt can be arranged on the second conveying frame in a reciprocating rotation mode, the second conveying driving mechanism is arranged on the second conveying frame and drives the second conveying belt to rotate back and forth, and the second conveying driving mechanism is connected with the controller.
6. The sensor-automated solder CCD detecting apparatus according to claim 1, wherein: the conveying direction of the second conveying device is perpendicular to the conveying direction of the first conveying device.
7. The sensor automated solder CCD inspection apparatus of claim 1, wherein: the material ejecting device comprises a mounting frame, a movable frame, a first material ejecting driving mechanism, a third conveying belt and a second material ejecting driving mechanism; the mounting rack is arranged on the rack; the movable frame can be movably arranged on the mounting frame up and down and back and forth; the first material ejecting driving mechanism is arranged on the mounting frame and drives the movable frame to move up and down and back and forth, and the first material ejecting driving mechanism is connected with the controller; the third conveyer belt is arranged on the movable frame in a reciprocating rotation manner and moves up and down along with the movable frame, and the conveying direction of the third conveyer belt is the same as that of the second conveying device; the second material ejecting driving mechanism is arranged on the movable frame and drives the third conveying belt to move back and forth, and the second material ejecting driving mechanism is connected with the controller.
8. The sensor-automated solder CCD detecting apparatus according to claim 1, wherein: the tin soldering device comprises a tin soldering frame, a movable rod, a first tin soldering driving mechanism, an installation head, a second tin soldering driving mechanism, an installation plate, a third tin soldering driving mechanism, a tin soldering head and a material clamping head; the soldering tin frame is arranged on the frame and is positioned right above the first conveying device; the movable rod can be longitudinally and movably arranged on the soldering tin frame back and forth; the first soldering tin driving mechanism is arranged on the soldering tin frame and drives the movable rod to longitudinally move back and forth, and the first soldering tin driving mechanism is connected with the controller; the mounting head can be transversely and movably arranged on the movable rod back and forth and can move back and forth along with the movable rod longitudinally; the second soldering tin driving mechanism is arranged on the mounting head and drives the mounting head to transversely move back and forth, and the second soldering tin driving mechanism is connected with the controller; the mounting plate can be movably arranged on the mounting head up and down and back and forth and can transversely move back and forth along with the mounting head; the third soldering tin driving mechanism is arranged on the mounting head and drives the mounting plate to move up and down and back and forth, and the third soldering tin driving mechanism is connected with the controller; the soldering tin head is arranged at the lower end of the mounting plate and moves up and down along with the mounting plate, and the soldering tin head is connected with the controller; the material clamping head is arranged at the lower end of the mounting plate and moves up and down along with the mounting plate, and the material clamping head is positioned beside the soldering tin head and connected with the controller.
9. The sensor automated solder CCD inspection apparatus of claim 1, wherein: the soldering tin device further comprises a cleaning bin which is arranged on the rack and located beside the soldering tin rack, and the cleaning bin is connected with the controller.
10. The sensor-automated solder CCD detecting apparatus according to claim 1, wherein: the CCD detection device comprises a detection frame and a CCD detection head; the detection frame is arranged on the rack and positioned beside the first conveying device; the CCD detection head is arranged on the detection frame and is positioned right above the material ejecting device, and the CCD detection head is connected with the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221334323.0U CN217726282U (en) | 2022-05-31 | 2022-05-31 | Sensor automatic soldering tin CCD detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221334323.0U CN217726282U (en) | 2022-05-31 | 2022-05-31 | Sensor automatic soldering tin CCD detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217726282U true CN217726282U (en) | 2022-11-04 |
Family
ID=83838810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221334323.0U Active CN217726282U (en) | 2022-05-31 | 2022-05-31 | Sensor automatic soldering tin CCD detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217726282U (en) |
-
2022
- 2022-05-31 CN CN202221334323.0U patent/CN217726282U/en active Active
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