CN217718573U

CN217718573U - Heat shunting type heat dissipation module

Info

Publication number: CN217718573U
Application number: CN202221116760.5U
Authority: CN
Inventors: 段海波; 曾伟忠
Original assignee: Suzhou Nodka Automation Technology Co ltd
Current assignee: Suzhou Nodka Automation Technology Co ltd
Priority date: 2022-05-10
Filing date: 2022-05-10
Publication date: 2022-11-01
Anticipated expiration: 2032-05-10

Abstract

The utility model relates to a heat shunting type heat radiation module, which comprises a substrate, wherein a heat conduction copper pipe is arranged on the substrate, a CPU contact copper sheet is arranged on the bottom surface of the substrate, and a heat conduction block and a fin type heat radiation component are arranged on the front surface of the substrate; the two ends of the heat conduction copper pipe are respectively connected with the heat conduction block and the fin heat dissipation assembly, the CPU contacts the copper sheet and contacts the heat conduction copper pipe, and heat on the CPU contacts the copper sheet is respectively transferred to the heat conduction block and the fin heat dissipation assembly through the heat conduction copper pipe; the scheme adopts a scheme of combining active heat dissipation and passive heat dissipation blocks of the turbofan; according to the principle of the heat circulating in the copper pipe, the heat of the CPU is distributed into two heat dissipation ways; the heat dissipation problem of a microcomputer with special appearance and volume limitation is solved, the product performance is more reliable through heat shunting, and the appearance effect of an appearance fan is solved through an internal heat dissipation module; and is beneficial to batch production, further reduces the product cost and can ensure the product quality reliably.

Description

Heat shunting type heat dissipation module

Technical Field

The utility model relates to a heat shunting heat dissipation module belongs to industry computer radiator technical field.

Background

CPU heat dissipation has been an important issue to be solved by industrial computers, because industrial computers require a more harsh environment than personal computers, and have higher requirements for high and low temperatures, generally, heat dissipation is generally performed in three ways: the industrial computer aims at the dustproof requirement of the shell, generally adopts a natural radiating fin without a fan to naturally radiate most, but the natural radiating structure of the radiating fin without the fan cannot meet the radiating requirement sometimes for a high-performance CPU.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the purpose is that the passive form that adopts combines the scheme of two kinds of active fusions, and the solution is smaller to the casing space, nevertheless to the performance requirement higher heat dissipation requirement again, and provides a heat shunting thermal module.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a heat shunting type heat radiation module comprises a substrate, wherein a heat conduction copper pipe is arranged on the substrate, a CPU contact copper sheet is arranged on the bottom surface of the substrate, and a heat conduction block and a fin radiation component are arranged on the front surface of the substrate; the two ends of the heat conduction copper pipe are respectively connected with the heat conduction block and the fin radiating assembly, the CPU contacts the copper sheet and contacts with the heat conduction copper pipe, and heat on the CPU contact copper sheet is respectively transferred to the heat conduction block and the fin radiating assembly through the heat conduction copper pipe.

Preferably, the fin heat dissipation assembly comprises internal heat conducting fins and a turbo axial flow fan.

Preferably, the turbine axial flow fan is of a horizontal structure, and the blowing direction of the turbine axial flow fan is parallel to the substrate.

Preferably, the CPU contact copper sheet is in contact with the middle position of the heat conduction copper pipe.

Preferably, the heat conduction block is installed on the substrate through a support, the support stretches across the heat conduction copper pipe, and the heat conduction copper pipe is connected to the heat conduction block through an elbow structure.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the heat shunting type heat dissipation module adopts the scheme of combining the active heat dissipation block and the passive heat dissipation block of the turbine fan; according to the principle of the heat circulating in the copper pipe, the heat of the CPU is distributed into two heat dissipation ways; the heat dissipation problem of a microcomputer with special appearance and volume limitation is solved, the product performance is more reliable through heat distribution, and the appearance effect of an appearance fan is solved through an internal heat dissipation module; and is beneficial to batch production, further reduces the product cost and can ensure the product quality reliably.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

fig. 1 is a schematic front structural view of a heat shunting type heat dissipation module according to the present invention;

fig. 2 is a schematic diagram of a reverse structure of a heat-shunting heat dissipation module according to the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1 and 2, the heat shunting type heat dissipation module of the present invention comprises a substrate 1, a heat conducting copper tube 2 is disposed on the substrate 1, a CPU contact copper sheet 3 is disposed on the bottom surface of the substrate 1, and the CPU contact copper sheet 3 contacts with the middle position of the heat conducting copper tube 2.

The heat conduction block 4 and the fin heat dissipation assembly are respectively arranged at two ends of the front face of the substrate 1, the fin heat dissipation assembly comprises an internal heat conduction fin 5 and a turbine axial flow fan 6, the turbine axial flow fan 6 is of a horizontal structure, the turbine axial flow fan 6 is located between the heat conduction block 4 and the internal heat conduction fin 5, the blowing direction of the turbine axial flow fan 6 is parallel to the substrate 1, and the module compactness is improved.

The heat conducting block 4 is arranged on the base plate 1 through a bracket, the bracket stretches across the heat conducting copper pipe 2, one end of the heat conducting copper pipe 2 is connected on the heat conducting block 4 through an elbow structure, the other end of the heat conducting copper pipe 2 is connected with the fin type heat radiating assembly,

the heat of the CPU contacting the copper sheet 3 is respectively transferred to the heat conducting block 4 and the fin radiating assembly through the heat conducting copper pipe 2; the heat of the CPU is distributed into two heat dissipation ways, namely, one part of heat is conducted to the right side of the drawing on the internal heat conduction fin through the copper pipe, the other part of heat is distributed to the left side of the drawing through the copper pipe and is conducted on the front heat conduction block, the heat on the right side is gathered on the heat conduction fin, and then the turbo fan actively blows to remove part of heat out of the box body; the heat on the left side is transferred upwards to the heat conducting block through the heat pipe and is contacted with the radiating fin exposed in the air, and the heat is gathered on the external radiating fin and is directly radiated by contacting with the air.

The heat radiation module is formed into a module whole by an internal heat conduction fin, a turbine axial flow fan, a heat conduction block, a heat conduction copper pipe, a CPU contact copper sheet and a substrate, and can be directly contacted and fixed with the CPU of the mainboard through a spring fastener.

The module can be applied to a miniature industrial computer mainframe with small volume and compact internal space, and is designed into a heat dissipation module with small volume and high performance; can support the desktop CPU core I7-8700 performance; and meets the high requirement of the high-temperature test at 60 ℃.

The above is only a specific application example of the present invention, and does not set any limit to the protection scope of the present invention; all technical solutions formed by adopting equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. The utility model provides a heat shunting thermal module which characterized in that: the heat-conducting copper-clad plate comprises a substrate (1), wherein a heat-conducting copper pipe (2) is arranged on the substrate (1), a CPU (central processing unit) contact copper sheet (3) is arranged on the bottom surface of the substrate (1), and a heat-conducting block (4) and a fin heat-radiating assembly are arranged on the front surface of the substrate (1); the two ends of the heat conduction copper pipe (2) are respectively connected with the heat conduction block (4) and the fin heat dissipation assembly, the CPU contact copper sheet (3) is in contact with the heat conduction copper pipe (2), and heat on the CPU contact copper sheet (3) is respectively transferred to the heat conduction block (4) and the fin heat dissipation assembly through the heat conduction copper pipe (2).

2. The thermal shunt heat dissipation module of claim 1, wherein: the fin heat dissipation assembly comprises internal heat conduction fins (5) and a turbo axial flow fan (6).

3. The thermal shunt heat dissipation module of claim 2, wherein: the turbine axial flow fan (6) is of a horizontal structure, and the blowing direction of the turbine axial flow fan (6) is parallel to the substrate (1).

4. The thermal shunt heat dissipation module of claim 1, wherein: the CPU contact copper sheet (3) is in contact with the middle position of the heat conduction copper pipe (2).

5. The thermal shunt heat dissipation module of claim 1, wherein: the heat conduction block (4) is arranged on the substrate (1) through a support, the support stretches across the heat conduction copper pipe (2), and the heat conduction copper pipe (2) is connected to the heat conduction block (4) through an elbow structure.