CN217641293U

CN217641293U - Embedded integrated circuit device

Info

Publication number: CN217641293U
Application number: CN202221044275.1U
Authority: CN
Inventors: 张明进; 李旭
Original assignee: Shenzhen Future Intelligent Technology Service Co ltd
Current assignee: Shenzhen Future Intelligent Technology Service Co ltd
Priority date: 2022-04-28
Filing date: 2022-04-28
Publication date: 2022-10-21
Anticipated expiration: 2032-04-28

Abstract

The utility model discloses an embedded integrated circuit device relates to embedded electronic device technical field, including the integrated circuit device body, the front and the equal fixed welding in the back of integrated circuit device body have the run-on, the fixed welding in bottom of run-on has the welding pin, the top of integrated circuit device body is provided with heat dissipation mechanism, the side of integrated circuit device body is provided with automatic fire extinguishing mechanism, heat dissipation mechanism includes graphite alkene attaching plate. The utility model discloses a heat absorption ring and heat absorption wing can absorb the heat, then cooperate arborescent heat transfer pole with heat transfer to tin silk in, when the integrated circuit device body catches fire, the heat can make tin silk fusing, remove the fixed to the sliding plate, can push down the sliding plate through the elasticity by compression spring, the film cover can be propped open thereupon, releases the ammonium phosphate fire extinguishing material, realizes the automatic function of putting out a fire to the integrated circuit device body.

Description

Embedded integrated circuit device

Technical Field

The utility model relates to an integrated circuit device relates to embedded electron device technical field, concretely relates to embedded integrated circuit device.

Background

An integrated circuit is a miniature electronic device or component, which is made up through such technological steps as interconnection of transistor, resistor, capacitor and inductor and wiring in a circuit on a small semiconductor wafer or medium substrate, and packaging in a tube to obtain a miniature structure with needed circuit function. The following problems exist in the prior art:

1. the common integrated circuit device does not have the function of automatic fire extinguishing, the integrated circuit device can frequently catch fire due to circuit aging when the service life of the integrated circuit device is close to, and the electronic device can be burnt due to untimely extinguishing of flame generated by the fire, so that the danger is high;

2. common integrated circuit devices do not have the function of efficient heat dissipation, the natural heat dissipation rate is low, and the service life of the integrated circuit devices is influenced due to the fact that high-temperature abnormity easily occurs in the working process.

SUMMERY OF THE UTILITY MODEL

The utility model provides an embedded integrated circuit device, one of which aims to have the function of automatic fire extinguishing and solve the problem that the electronic device is burnt due to untimely extinguishing of the flame generated by fire; the other purpose is to solve the problem that the natural heat dissipation rate of the integrated circuit device is low, so as to achieve the effect of improving the heat dissipation efficiency of the integrated circuit device.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

the utility model provides an embedded integrated circuit device, includes the integrated circuit device body, the equal fixed welding in front and the back of integrated circuit device body has the run-on, the fixed welding in bottom of run-on has the welding pin, the top of integrated circuit device body is provided with heat dissipation mechanism, the side of integrated circuit device body is provided with the automatic fire extinguishing mechanism.

The heat dissipation mechanism comprises a graphene attaching plate, the graphene attaching plate is fixedly connected to the top of the integrated circuit device body, an arc heat dissipation fin is fixedly welded to the top of the graphene attaching plate, and a bearing cylinder is fixedly welded to the top of the arc heat dissipation fin.

The automatic fire extinguishing mechanism comprises a support block, the support block is detachably connected to the side face of the integrated circuit device body, a top plate is fixedly mounted at the top of the support block, a connecting rod is fixedly connected to the inner wall of the top plate, and one end, far away from the inner wall of the top plate, of the connecting rod is fixedly connected with a fire extinguishing cylinder.

The utility model discloses technical scheme's further improvement lies in: the top fixed welding of a socket section of thick bamboo has hollow section of thick bamboo, the top fixedly connected with water conservancy diversion piece of hollow section of thick bamboo inner chamber, fixedly connected with collecting vessel on the outer wall of hollow section of thick bamboo.

The utility model discloses technical scheme's further improvement lies in: the fire extinguishing device is characterized in that a sliding plate is connected in the inner cavity of the fire extinguishing cylinder in a sliding mode, a compressed spring is fixedly mounted at the top of the sliding plate, and the top of the compressed spring is fixedly connected with the top of the inner cavity of the fire extinguishing cylinder.

The utility model discloses technical scheme's further improvement lies in: and an inner cavity of the fire extinguishing cylinder is filled with an ammonium phosphate fire extinguishing material positioned below the sliding plate, and the bottom of the fire extinguishing cylinder is fixedly connected with a film cover.

The utility model discloses technical scheme's further improvement lies in: the bottom of the fire extinguishing cylinder is fixedly provided with a fixed block, the inner wall of the fixed block is movably connected with a tin wire, the outer wall of the tin wire is fixedly connected with a heat absorption ring, and two ends of the tin wire are fixedly connected with the top of the sliding plate.

The utility model discloses technical scheme's further improvement lies in: the outer wall of the heat absorption ring is fixedly welded with a heat absorption fin, the inner wall of the heat absorption ring is fixedly connected with a tree-shaped heat transfer rod, and one end, far away from the heat absorption ring, of the tree-shaped heat transfer rod extends to the inside of the tin wire.

Owing to adopted above-mentioned technical scheme, the utility model discloses relative prior art, the technological progress who gains is:

1. the utility model provides an embedded integrated circuit device, adopt the heat absorption wing, arborescent heat transfer pole, the tin silk, by compression spring and the combination of ammonium phosphate fire extinguishing materials, can absorb the heat through heat absorption ring and heat absorption wing, then cooperate arborescent heat transfer pole with heat transfer to in the tin silk, when the integrated circuit device body catches fire, the heat can make tin silk fusing, remove the fixed to the sliding plate, elasticity through being compressed spring can push down the sliding plate, the film cover can be propped brokenly thereupon, release ammonium phosphate fire extinguishing materials, realize the automatic function of putting out a fire to the integrated circuit device body, the flame of avoiding catching fire production puts out the problem that can lead to the electronic device to burn when not in time, promote the security of this device.

2. The utility model provides an embedded integrated circuit device, adopt graphite alkene attaching plate, the arc heat dissipation wing, the bearing section of thick bamboo, the combination of hollow section of thick bamboo and surge drum, design through graphite alkene attaching plate, can absorb the heat on the integrated circuit device body, then in the cooperation through arc heat dissipation wing gives off the heat to the air, when dispelling the heat with the help of external fan, can catch radiating wind through the surge drum, then the surface of graphite alkene attaching plate is led to wind through the inner chamber of hollow section of thick bamboo and bearing section of thick bamboo, and then promote the heat-sinking capability of graphite alkene attaching plate, the realization carries out high-efficient radiating function to the integrated circuit device body, avoid the problem that the integrated circuit device body damaged because of natural heat dissipation rate is slower, prolong the life of integrated circuit device body.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the automatic fire extinguishing mechanism of the present invention;

FIG. 3 is a schematic view of the internal structure of the fire extinguisher cylinder of the present invention;

FIG. 4 is a schematic side view of the heat absorption ring of the present invention;

fig. 5 is a schematic structural view of the heat dissipation mechanism of the present invention.

In the figure: 1. an integrated circuit device body; 2. a connecting row; 3. welding pins;

4. a heat dissipation mechanism; 41. a graphene laminate; 42. arc-shaped heat dissipation fins; 43. a receiving cylinder; 44. a hollow cylinder; 45. a flow guide block; 46. a collection canister;

5. an automatic fire extinguishing mechanism; 51. supporting a block; 52. a top plate; 53. a connecting rod; 54. a fire extinguishing cylinder; 541. a sliding plate; 542. ammonium phosphate fire extinguishing materials; 543. a compressed spring; 544. a film cover; 545. a fixed block; 546. tin wire; 547. a heat absorption ring; 5471. a heat absorbing fin; 5472. tree-shaped heat transfer rods.

Detailed Description

The present invention will be described in further detail with reference to the following examples:

example 1

As shown in fig. 1-5, the utility model provides an embedded integrated circuit device, including integrated circuit device body 1, the equal fixed welding in front of integrated circuit device body 1 and the back has linkage 2, the fixed welding in bottom of linkage 2 has welding pin 3, the top of integrated circuit device body 1 is provided with heat dissipation mechanism 4, the side of integrated circuit device body 1 is provided with automatic fire extinguishing mechanism 5, heat dissipation mechanism 4 includes graphite alkene rigging plate 41, graphite alkene rigging plate 41 fixed connection is at the top of integrated circuit device body 1, the fixed welding in top of graphite alkene rigging plate 41 has arc heat dissipation wing 42, the fixed welding in top of arc heat dissipation wing 42 has a receiving cylinder 43, automatic fire extinguishing mechanism 5 is including a piece 51, a piece 51 dismantlement formula is connected in the side of integrated circuit device body 1, a piece 51's top fixed mounting has roof 52, fixedly connected with connecting rod 53 on roof 52's the inner wall, connecting rod 53 keeps away from the one end fixedly connected with fire extinguishing cylinder 54 of roof 52 inner wall, weld pin 3 with this device welding on electronic equipment, can normally use electronic equipment, a piece 51 passes through the outer wall connection of integrated circuit device body of viscose, can carry out the ageing mechanism again, the automatic fire extinguishing mechanism is convenient for adding of integrated circuit device 1 again.

Example 2

As shown in fig. 1-5, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the top fixed welding who accepts a section of thick bamboo 43 has hollow section of thick bamboo 44, the top fixedly connected with water conservancy diversion block 45 of the inner chamber of hollow section of thick bamboo 44, fixedly connected with collecting cylinder 46 on the outer wall of hollow section of thick bamboo 44, sliding connection has sliding plate 541 in the inner chamber of fire extinguishing section of thick bamboo 54, sliding plate 541's top fixed mounting has by compression spring 543, the top fixed connection of top and fire extinguishing section of thick bamboo 54 inner chamber by compression spring 543, design through graphite alkene rigging plate 41, can absorb the heat on the integrated circuit device body 1, then through arc heat dissipation fin 42's cooperation with the heat give off the air in, when dispelling the heat with the help of external fan, can catch radiating wind through collecting cylinder 46, then through hollow section of thick bamboo 44 with accept the inner chamber of a section of thick bamboo 43 with the surface of wind direction graphite alkene rigging plate 41, and then promote graphite alkene rigging plate 41's heat-sinking capability, the realization is carried out high-efficient radiating function to integrated circuit device body 1.

Example 3

As shown in fig. 1-5, on the basis of embodiment 1, the utility model provides a technical solution: preferably, an inner cavity of the fire extinguishing cylinder 54 is filled with an ammonium phosphate fire extinguishing material 542 located below the sliding plate 541, the bottom of the fire extinguishing cylinder 54 is fixedly connected with a film cover 544, the bottom of the fire extinguishing cylinder 54 is fixedly provided with a fixing block 545, an inner wall of the fixing block 545 is movably connected with a tin wire 546, an outer wall of the tin wire 546 is fixedly connected with a heat absorbing ring 547, two ends of the tin wire 546 are fixedly connected with the top of the sliding plate 541, the outer wall of the heat absorbing ring 547 is fixedly welded with heat absorbing fins 5471, the inner wall of the heat absorbing ring 547 is fixedly connected with a tree-shaped heat transfer rod 5472, one end of the tree-shaped heat transfer rod 5472, which is far away from the heat absorbing ring 547, extends into the tin wire 546, the heat absorbing ring 547 and the heat absorbing fins 5471 can absorb heat, then the heat is transferred into the tin wire 546 by matching with the tree-shaped heat transfer rod 5472, when the integrated circuit device body 1 is used, the heat can cause the tin wire 546 to be fused, the fixation of the sliding plate 541 is released, the fire extinguishing cylinder 541 can be pushed down by the elastic force of the compression spring 543, the fire extinguishing cylinder 544 can be pushed down, and the ammonium phosphate fire extinguishing material 542 can be automatically released to realize the function of the integrated circuit device 1.

The operation of the embedded integrated circuit device will be described in detail below.

As shown in fig. 1-5, the device is soldered on an electronic device through a soldering pin 3, and the electronic device can be normally used, heat on the integrated circuit device body 1 can be absorbed through the graphene attaching plate 41, and then the heat is dissipated into the air through the matching of the arc-shaped heat dissipation fins 42, if the integrated circuit device body 1 catches fire, the heat can be absorbed through the heat absorption ring 547 and the heat absorption fins 5471, and then the heat is transferred into the tin wire 546 through the tree-shaped heat transfer rod 5472, the heat can cause the tin wire 546 to be fused and release the fixation of the sliding plate 541, the sliding plate 541 is pushed down through the elasticity of the compression spring 543, and the film cover 544 can be broken along with the film cover 544 to release the ammonium phosphate fire extinguishing material 542, so as to realize the function of automatically extinguishing the integrated circuit device body 1.

The present invention has been described in detail with reference to the above general description, but it will be apparent to one of ordinary skill in the art that modifications and improvements can be made to the invention. Therefore, modifications or improvements without departing from the spirit of the invention are within the scope of the invention.

Claims

1. An embedded integrated circuit device comprising an integrated circuit device body (1), characterized in that: the front and the back of the integrated circuit device body (1) are fixedly welded with a connecting bar (2), the bottom of the connecting bar (2) is fixedly welded with a welding pin (3), the top of the integrated circuit device body (1) is provided with a heat dissipation mechanism (4), and the side of the integrated circuit device body (1) is provided with an automatic fire extinguishing mechanism (5);

the heat dissipation mechanism (4) comprises a graphene attaching plate (41), the graphene attaching plate (41) is fixedly connected to the top of the integrated circuit device body (1), arc-shaped heat dissipation fins (42) are fixedly welded to the top of the graphene attaching plate (41), and a receiving cylinder (43) is fixedly welded to the top of the arc-shaped heat dissipation fins (42);

automatic fire extinguishing mechanism (5) are including a piece (51), the side at integrated circuit device body (1) is connected to piece (51) dismantlement formula, the top fixed mounting of piece (51) has roof (52), fixedly connected with connecting rod (53) on the inner wall of roof (52), the one end fixedly connected with fire extinguishing tube (54) of roof (52) inner wall is kept away from in connecting rod (53).

2. An embedded integrated circuit device according to claim 1, wherein: the top of the bearing cylinder (43) is fixedly welded with a hollow cylinder (44), the top of the inner cavity of the hollow cylinder (44) is fixedly connected with a flow guide block (45), and the outer wall of the hollow cylinder (44) is fixedly connected with a collecting cylinder (46).

3. An embedded integrated circuit device according to claim 1, wherein: a sliding plate (541) is connected in the inner cavity of the fire extinguishing cylinder (54) in a sliding mode, a compressed spring (543) is fixedly installed at the top of the sliding plate (541), and the top of the compressed spring (543) is fixedly connected with the top of the inner cavity of the fire extinguishing cylinder (54).

4. An embedded integrated circuit device according to claim 3, wherein: an inner cavity of the fire extinguishing cylinder (54) is filled with an ammonium phosphate fire extinguishing material (542) located below the sliding plate (541), and the bottom of the fire extinguishing cylinder (54) is fixedly connected with a film cover (544).

5. An embedded integrated circuit device according to claim 4, wherein: the bottom of the fire extinguishing cylinder (54) is fixedly provided with a fixed block (545), the inner wall of the fixed block (545) is movably connected with a tin wire (546), the outer wall of the tin wire (546) is fixedly connected with a heat absorption ring (547), and two ends of the tin wire (546) are fixedly connected with the top of the sliding plate (541).

6. An embedded integrated circuit device according to claim 5, wherein: the outer wall of the heat absorption ring (547) is fixedly welded with heat absorption fins (5471), the inner wall of the heat absorption ring (547) is fixedly connected with tree-shaped heat transfer rods (5472), and one end, far away from the heat absorption ring (547), of each tree-shaped heat transfer rod (5472) extends into the tin wire (546).