CN219536404U - Light-emitting diode lead frame - Google Patents
Light-emitting diode lead frame Download PDFInfo
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- CN219536404U CN219536404U CN202320176467.6U CN202320176467U CN219536404U CN 219536404 U CN219536404 U CN 219536404U CN 202320176467 U CN202320176467 U CN 202320176467U CN 219536404 U CN219536404 U CN 219536404U
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- lead frame
- frame shell
- groove
- circuit board
- spring
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Abstract
The utility model belongs to the technical field of light emitting diodes, and particularly relates to a light emitting diode lead frame, which comprises: a light emitting diode body mounted over the circuit board; a lead frame housing mounted on the circuit board, two brackets which can be inserted on the lead frame shell are arranged on the light-emitting diode body in parallel; the first mounting mechanism is used for mounting the bracket on the lead frame shell and can be dismounted, the bracket can be quickly dismounted on the lead frame shell through the first mounting mechanism, when the bracket is inserted into the lead frame shell, the limiting rod is abutted on the bracket under the elastic force of the first spring, the bracket is prevented from being separated from the lead frame shell through the elastic force of the first spring, the limiting rod is pulled outwards, the bracket is conveniently separated from the lead frame shell, and the problem that the existing lead frame is inconvenient to maintain or replace after the light-emitting diode is damaged is solved.
Description
Technical Field
The utility model belongs to the technical field of light-emitting diodes, and particularly relates to a light-emitting diode lead frame.
Background
Light emitting diodes are one type of electroluminescent light source; an electroluminescent light source is a light source in which a solid emits light directly under the action of an electric field.
The light emitting diode is a device for converting electric energy into light based on PN junction characteristics of a semiconductor diode, and the basic working principle is an electro-optical conversion process.
The existing light-emitting diode and the lead frame comprise epoxy resin colloid, a wafer, gold wires, silver colloid and a bracket, the bracket on the lead frame is welded on a printed circuit board through soldering tin, and peripheral components can be influenced by high temperature generated by a welding gun during welding, so that the peripheral components are heated to generate thermal stress, the service life of the circuit board is shortened, in addition, the process of maintenance and replacement is complicated after the light-emitting diode is damaged, and the disassembly is relatively troublesome and complex.
Disclosure of Invention
The utility model aims to provide a light-emitting diode lead frame, which solves the problems that the prior lead frame can cause thermal stress to peripheral components during installation and is not convenient for maintenance or replacement after a light-emitting diode is damaged.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a light emitting diode lead frame, comprising: a light emitting diode body mounted over the circuit board;
a lead frame housing mounted on the circuit board, two brackets which can be inserted on the lead frame shell are arranged on the light-emitting diode body in parallel;
the first mounting mechanism comprises a mounting groove horizontally arranged in the lead frame shell and a limiting rod movably arranged in the mounting groove, one end of the limiting rod extends to the outside of the lead frame shell, a first spring connected with the limiting rod is arranged in the mounting groove, and the first spring is sleeved on the limiting rod and is used for abutting the other end of the limiting rod on the support.
Preferably, the lead frame housing further comprises a second mounting mechanism for mounting the lead frame housing on a circuit board, the second mounting mechanism comprising:
the buckles are arranged on two symmetrical sides of the bottom of the lead frame shell;
the two clamping grooves penetrate through the circuit board, and the two buckles are respectively clamped in the two clamping grooves;
the groove is formed in the middle of the bottom of the lead frame shell, a second spring is vertically arranged in the groove, and the other end of the second spring is abutted against the circuit board;
the wiring mechanisms are arranged on two symmetrical sides of the bottom of the lead frame shell, two welding blocks are symmetrically arranged on the circuit board, and the two wiring mechanisms are respectively abutted to the two welding blocks.
Preferably, the wiring mechanism comprises a telescopic slot vertically arranged in the lead frame shell and positioned below the support, and a conductive column telescopically arranged in the telescopic slot, wherein the bottom end of the conductive column is abutted on the welding block, a third spring is arranged in the telescopic slot, and the bottom end of the third spring is abutted on the top end of the conductive column.
Preferably, the top of the lead frame shell is symmetrically provided with two jacks electrically connected with the two telescopic slots, and the two brackets are respectively inserted into the two jacks.
Preferably, the inner side of the bottom end of the clamping groove is provided with a hook groove, the inner side of the bottom end of the clamping buckle is fixed with a hook part matched with the groove, and the hook part is clamped into the hook groove.
Preferably, a wafer is mounted on the top of one of the brackets in the light-emitting diode body, a gold wire is connected between the wafer and the other bracket, and silver colloid is filled between the wafer and one of the brackets.
Compared with the prior art, the utility model has the following beneficial effects:
(1) According to the utility model, the bracket can be quickly disassembled and assembled on the lead frame shell through the first mounting mechanism, when the bracket is inserted into the lead frame shell, the limiting rod is abutted against the bracket under the elasticity of the first spring, the bracket is prevented from being separated from the lead frame shell through the elasticity of the first spring, the limiting rod is pulled outwards, the bracket is conveniently separated from the lead frame shell, and the problem that the existing lead frame is not convenient to maintain or replace after the light-emitting diode is damaged is solved.
(2) According to the utility model, through the second mounting mechanism, the lead frame shell can be stably mounted, the two buckles on the lead frame shell are respectively brought above the two clamping grooves, and the lead frame shell is pressed downwards, so that the two buckles are respectively clamped in the two clamping grooves, the lead frame shell is prevented from being separated from the circuit board, meanwhile, the second spring is compressed, the generated elastic force pushes the lead frame shell to the side far away from the circuit board, the lead frame shell is prevented from shaking on the circuit board, and the wiring mechanism on the lead frame shell is abutted against the welding block, so that the electrical connection between the lead frame shell and the circuit board is completed, the problem that the peripheral components generate thermal stress when the traditional lead frame is mounted is solved, and the service life of the circuit board is prolonged.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a front view of the present utility model;
FIG. 3 is a top view of a circuit board of the present utility model;
in the figure: the LED comprises a 1-LED body, a 2-jack, a 3-mounting groove, a 4-first spring, a 5-limit rod, a 6-conductive column, a 7-buckle, an 8-circuit board, a 9-clamping groove, a 10-hook part, an 11-hook groove, a 12-welding block, a 13-second spring, a 14-groove, a 15-lead frame shell, a 16-third spring, a 17-expansion groove and an 18-bracket.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, the present utility model provides the following technical solutions: a light emitting diode lead frame, comprising: a light emitting diode body 1 mounted above the circuit board 8;
a lead frame shell 15 arranged on the circuit board 8, and two brackets 18 which can be inserted on the lead frame shell 15 are arranged on the light-emitting diode body 1 in parallel;
the first mounting mechanism is used for mounting the bracket 18 on the lead frame shell 15 and can be detached, the first mounting mechanism comprises a mounting groove 3 horizontally arranged in the lead frame shell 15 and a limiting rod 5 movably mounted in the mounting groove 3, one end of the limiting rod 5 extends to the outside of the lead frame shell 15, a first spring 4 connected with the limiting rod 5 is mounted in the mounting groove 3, the first spring 4 is sleeved on the limiting rod 5, and the other end of the limiting rod 5 is abutted to the bracket 18.
Through the technical scheme:
the two limiting rods 5 are pulled outwards, meanwhile, the two brackets 18 on the light-emitting diode body 1 are spliced on the lead frame shell 15, the limiting rods 5 are loosened at the moment, the elastic force of the first springs 4 is released, so that the limiting rods 5 are abutted against the brackets 18, the brackets 18 are prevented from being separated from the lead frame shell 15, the brackets 18 are completed to be assembled quickly, when the light-emitting diode body 1 needs to be disassembled, the limiting rods 5 are pulled outwards, the limitation of the limiting rods 5 on the brackets 18 is relieved, the brackets 18 can be separated from the lead frame shell 15, and therefore the disassembly of the light-emitting diode body 1 is completed.
Further, for the above-mentioned led body 1, a wafer is mounted on the top of one of the brackets 18 in the led body 1, a gold wire is connected between the wafer and the other bracket 18, a silver paste is filled between the wafer and one of the brackets 18, the wafer is fixed on one of the brackets 18 by the silver paste, and meanwhile, the electrical connection between the wafer and the bracket 18 is completed, and the wafer is electrically connected with the other bracket 18 by the gold wire.
Referring to fig. 1-3, the lead frame housing 15 further includes a second mounting mechanism for mounting the lead frame housing 15 on the circuit board 8, the second mounting mechanism including:
the buckles 7 are arranged on two symmetrical sides of the bottom of the lead frame shell 15;
two clamping grooves 9 penetrating through the circuit board 8, and two buckles 7 are respectively clamped in the two clamping grooves 9;
a groove 14 arranged in the middle of the bottom of the lead frame shell 15, a second spring 13 is vertically arranged in the groove 14, and the other end of the second spring 13 is abutted against the circuit board 8;
the wiring mechanisms are symmetrically arranged on two sides of the bottom of the lead frame shell 15, two welding blocks 12 are symmetrically arranged on the circuit board 8, and the two wiring mechanisms are respectively abutted on the two welding blocks 12.
Through the technical scheme:
two buckles 7 on the lead frame shell 15 are respectively placed above two clamping grooves 9 on the circuit board 8, and the lead frame shell 15 is pressed downwards, so that the two buckles 7 are clamped in the two clamping grooves 9, in the process, the second spring 13 is compressed, the generated elastic force pushes the lead frame shell 15 to the side far away from the circuit board 8, the lead frame shell 15 is prevented from shaking on the circuit board 8, and at the moment, a wiring mechanism on the lead frame shell 15 is abutted on the welding block 12, so that the electric connection between the lead frame shell 15 and the circuit board 8 is completed.
Further, for the above-mentioned wiring mechanism that sets up, wiring mechanism includes the flexible groove 17 of seting up perpendicularly in lead frame casing 15 and being in support 18 below, and flexible conductive post 6 of installing in flexible groove 17, the bottom butt of conductive post 6 is on the welding piece 12, install third spring 16 in the flexible groove 17, the bottom butt of third spring 16 is on the top of conductive post 6, when lead frame casing 15 is installed on circuit board 8, one end of conductive post 6 is retracted into flexible groove 17, and extrude third spring 16, in this process the elasticity of third spring 16 presses conductive post 6 on the welding piece 12, avoid conductive post 6 and welding piece 12 virtual joint.
Further, to the above-mentioned expansion slot 17 that sets up, two jack 2 with two expansion slot 17 electric connection are seted up to the top symmetry of lead frame casing 15, and two supports 18 peg graft respectively in two jack 2, all are equipped with conductive material on the inner wall of expansion slot 17 and jack 2, when support 18 inserts in jack 2, let conductive column 6 and support 18 electric connection through conductive material, when conductive column 6 butt on welding block 12, accomplish the electric connection of support 18 and circuit board 8.
Further, the hook groove 11 is formed in the inner side of the bottom end of the clamping groove 9, the hook portion 10 matched with the groove is fixed in the inner side of the bottom end of the clamping groove 7, the hook portion 10 is clamped into the hook groove 11, the clamping groove 11 and the hook portion 10 are used for preventing the clamping groove 7 from being separated from the circuit board 8, the clamping groove 7 is outwards bent under the action of the hook portion 10 when the clamping groove 9 is inserted into the clamping groove 7, the clamping groove 7 is reset when the clamping groove 10 is positioned in the hook groove 11, the hook portion 10 is limited in the hook groove 11, and the lead frame shell 15 cannot be separated from the clamping groove 9.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The LED lead frame is characterized by comprising: a light emitting diode body (1) mounted above the circuit board (8);
the LED comprises a circuit board (8), a lead frame shell (15) arranged on the circuit board (8), and two brackets (18) which can be inserted on the lead frame shell (15) are arranged on the LED body (1) in parallel;
the mounting mechanism comprises a mounting groove (3) horizontally arranged in the lead frame shell (15) and a limiting rod (5) movably arranged in the mounting groove (3), one end of the limiting rod (5) extends to the outside of the lead frame shell (15), a first spring (4) connected with the limiting rod (5) is arranged in the mounting groove (3), and the first spring (4) is sleeved on the limiting rod (5) and is used for propping the other end of the limiting rod (5) against the support (18).
2. The led leadframe of claim 1, wherein: further comprising a second mounting mechanism for mounting the leadframe housing (15) on a circuit board (8), the second mounting mechanism comprising:
the buckles (7) are arranged on two symmetrical sides of the bottom of the lead frame shell (15);
two clamping grooves (9) penetrating through the circuit board (8), and the two buckles (7) are respectively clamped in the two clamping grooves (9);
the groove (14) is formed in the middle of the bottom of the lead frame shell (15), a second spring (13) is vertically arranged in the groove (14), and the other end of the second spring (13) is abutted to the circuit board (8);
the wiring mechanisms are arranged on two symmetrical sides of the bottom of the lead frame shell (15), two welding blocks (12) are symmetrically arranged on the circuit board (8), and the two wiring mechanisms are respectively abutted to the two welding blocks (12).
3. The led leadframe of claim 2, wherein: the wiring mechanism comprises a telescopic groove (17) which is vertically arranged in the lead frame shell (15) and is positioned below the support (18), and a conductive column (6) which is installed in the telescopic groove (17) in a telescopic mode, wherein the bottom end of the conductive column (6) is abutted to the welding block (12), a third spring (16) is installed in the telescopic groove (17), and the bottom end of the third spring (16) is abutted to the top end of the conductive column (6).
4. The led leadframe of claim 3, wherein: two jacks (2) electrically connected with the two telescopic slots (17) are symmetrically arranged at the top of the lead frame shell (15), and the two brackets (18) are respectively inserted into the two jacks (2).
5. The led leadframe of claim 2, wherein: the inner side of the bottom end of the clamping groove (9) is provided with a hook groove (11), the inner side of the bottom end of the buckle (7) is fixed with a hook part (10) matched with the groove, and the hook part (10) is clamped into the hook groove (11).
6. The led leadframe of claim 1, wherein: the LED is characterized in that a wafer is arranged in the LED body (1) and positioned at the top of one of the brackets (18), a gold thread is connected between the wafer and the other bracket (18), and silver colloid is filled between the wafer and one of the brackets (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320176467.6U CN219536404U (en) | 2023-02-10 | 2023-02-10 | Light-emitting diode lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320176467.6U CN219536404U (en) | 2023-02-10 | 2023-02-10 | Light-emitting diode lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219536404U true CN219536404U (en) | 2023-08-15 |
Family
ID=87586234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320176467.6U Active CN219536404U (en) | 2023-02-10 | 2023-02-10 | Light-emitting diode lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219536404U (en) |
-
2023
- 2023-02-10 CN CN202320176467.6U patent/CN219536404U/en active Active
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