CN217605132U - Temperature difference type power supply wireless sensor for high-temperature equipment - Google Patents

Temperature difference type power supply wireless sensor for high-temperature equipment Download PDF

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Publication number
CN217605132U
CN217605132U CN202221692724.3U CN202221692724U CN217605132U CN 217605132 U CN217605132 U CN 217605132U CN 202221692724 U CN202221692724 U CN 202221692724U CN 217605132 U CN217605132 U CN 217605132U
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heat
circuit board
fin
wireless sensor
sensor
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李林
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Sichuan Shuangyuan Intelligent Technology Co ltd
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Sichuan Shuangyuan Intelligent Technology Co ltd
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Abstract

The application provides a high temperature equipment temperature difference type power supply wireless sensor belongs to temperature difference type power supply wireless sensor technical field. This high temperature equipment temperature difference formula power supply wireless sensor, including sensor body and cooling component. In the above-mentioned realization process, influence to the circuit board when can reduce the inside heat-conducting plate heat conduction of sensor body, first fin can absorb the heat of circuit board, then blow to the heat exchanger inside through the fan, and then dispel the heat to the inside of heat exchanger, and then dispel the heat to second fin and circuit board, and the wind that enters into the heat exchanger inside can be followed the air outlet and discharged, the side insulates against heat to the circuit board, on the other hand is to the heat dissipation of blowing to the circuit board, make the difficult condition that the high temperature appears of circuit board, can delay the ageing of circuit board, and then can improve the life of circuit board, and then alright improve the life of sensor body.

Description

Temperature difference type power supply wireless sensor for high-temperature equipment
Technical Field
The utility model relates to a temperature difference formula power supply wireless sensor field particularly, relates to a high temperature equipment temperature difference formula power supply wireless sensor.
Background
Temperature difference type power supply wireless sensor, be the wireless sensor who independently supplies power through the difference in temperature, can be used to the household electrical appliances like the monitoring of insulating pot, electric teapot, the electromagnetism stove, the electric hot water bag etc., in the high temperature equipment temperature difference type power supply wireless sensor of application number CN201921102004.5, install a plurality of electrical components on its inside circuit board, and the circuit board is fixed on the heat-conducting plate through insulating plastic post, it insulates against heat as the thermal barrier to be air between circuit board and the heat-conducting plate, thermal-insulated effect is relatively poor, can heat the circuit board through the heat radiation during the heat conduction of heat-conducting plate, and the outside of circuit board still overlaps and is equipped with the shield cover, and the heat dissipation of circuit board and electrical component can be hindered to the shield cover, therefore in wireless sensor working process, the too high condition of temperature easily appears in the circuit board, and too high temperature can accelerate the ageing of circuit board, and then can shorten the life of circuit board, and then can shorten wireless sensor's life.
SUMMERY OF THE UTILITY MODEL
In order to make up for the above deficiencies, the present application provides a wireless sensor powered by a high temperature device in a temperature difference manner, which is aimed at solving the above-mentioned problems in the background art.
The embodiment of the application provides a high temperature equipment temperature difference type power supply wireless sensor, which comprises a sensor body and a cooling assembly.
The sensor is characterized in that a circuit board is arranged on the sensor body, and a heat insulation plate is arranged between the circuit board and the sensor body.
The cooling assembly comprises a heat shield, a first fin, a second fin and a fan, the heat shield is connected above the heat insulation plate, an air outlet is formed in one side of the heat shield, the heat shield is arranged outside the circuit board, the first fin is connected with the back of the circuit board, the circuit board is connected with the upper surface of the heat insulation plate, the second fin is connected with the first fin, a sheet body of the second fin is fixedly penetrated through the top wall of the heat shield, a blowing port of the fan is fixedly penetrated through the inside of the heat shield, and the blowing port of the fan is located above the circuit board.
In the above-mentioned realization in-process, the sensor body during operation, it is thermal-insulated to the circuit board through heat insulating board and heat shield, can reduce the influence to the circuit board when the inside heat-conducting plate of sensor body conducts heat, first fin can absorb the heat of circuit board, first fin can be with heat transfer to second fin, then blow to heat shield inside through the fan, and then dispel the heat to heat shield's inside, and then dispel the heat to second fin and circuit board, and the wind that enters into heat shield inside can be followed the air outlet and discharged, on the one hand insulate against heat to the circuit board, on the other hand dispels the heat to blowing to the circuit board, make the difficult condition that the high temperature appears of circuit board, can delay the ageing of circuit board, and then can improve the life of circuit board, and then alright improve the life of sensor body.
In a specific embodiment, the lower surface of the heat insulation plate is provided with a first support rod, and the bottom end of the first support rod is fixedly connected with the sensor body.
In a specific embodiment, four first supporting rods are provided, the top ends of the four first supporting rods are respectively and fixedly connected with four corners of the lower surface of the heat insulation plate in a one-to-one correspondence manner, and the bottom ends of the four first supporting rods are all fixedly connected with the sensor body.
In a specific implementation scheme, a threading hole is formed in one side, away from the air outlet, of the heat shield, an antenna hole is formed in the top wall of the heat shield, and a capacitor hole is formed in the top wall of the heat shield.
In a specific embodiment, the air outlet is provided with a plurality of air outlets which are uniformly distributed.
In a specific embodiment, a second support rod is arranged on the lower surface of the first fin, and the second support rod is fixedly connected with the upper surface of the heat insulation plate.
In a specific embodiment, the second supporting rod is provided with a plurality of second supporting rods, the plurality of second supporting rods are fixedly connected with the upper surface of the heat insulation plate, and the plurality of second supporting rods are uniformly distributed.
In a specific implementation scheme, the second fin is provided with a plurality of blocks, and a plurality of blocks the bottom surface of second fin all connect in the upper surface of first fin, a plurality of blocks second fin evenly distributed in the both sides of circuit board, a plurality of the lamellar body of second fin all fixed run through in the top of heat exchanger separates.
In a specific implementation scheme, a plurality of radiating holes are formed in the plate body of the plurality of second fins and are located outside the heat shield.
In a specific embodiment, the shielding layer is arranged outside the heat shield and is a shielding coating material layer.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a temperature-difference type power supply wireless sensor of a high-temperature device according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a circuit board and an insulating board portion according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a cooling assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of a heat shield configuration provided by an embodiment of the present application;
fig. 5 is a schematic top view structure diagram of a portion of a first fin and a second fin provided in an embodiment of the present application.
In the figure: 100-a sensor body; 110-a circuit board; 120-a heat insulation plate; 121-a first support bar; 200-a temperature reduction assembly; 210-a heat shield; 211-an air outlet; 212-threading holes; 213-antenna aperture; 214-capacitor hole; 220-a first fin; 221-a second support bar; 230-a second fin; 231-heat dissipation holes; 240-a fan; 300-shielding layer.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1, the present application provides a temperature-difference type wireless power supply sensor for high-temperature equipment, which includes a sensor body 100 and a cooling assembly 200.
Referring to fig. 1 to 3, a circuit board 110 is disposed on a sensor body 100, the circuit board 110 is disposed on a heat conducting plate inside the sensor body 100, a heat insulating plate 120 is disposed between the circuit board 110 and the sensor body 100, a first supporting rod 121 is disposed on a lower surface of the heat insulating plate 120, a bottom end of the first supporting rod 121 is fixedly connected to the sensor body 100, four first supporting rods 121 are disposed, top ends of the four first supporting rods 121 are fixedly connected to four corners of the lower surface of the heat insulating plate 120 in a one-to-one correspondence manner, bottom ends of the four first supporting rods 121 are fixedly connected to the sensor body 100, and bottom ends of the four first supporting rods 121 are fixedly connected to the heat conducting plate inside the sensor body 100.
Referring to fig. 1 to 5, the cooling assembly 200 includes a heat shield 210, a first fin 220, a second fin 230, and a fan 240, the heat shield 210 is connected above the heat insulating plate 120, one side of the heat shield 210 is provided with an air outlet 211, the air outlet 211 is provided with a plurality of air outlets 211, the plurality of air outlets 211 are uniformly distributed, on one hand, the air outlet 211 is used for outputting air, on the other hand, the heat shield 210 is used for passing through a power transmission line, one side of the heat shield 210 away from the air outlet 211 is provided with a threading hole 212, the threading hole 212 is also used for passing through a power transmission line, the top wall of the heat shield 210 is provided with an antenna hole 213, the top wall of the heat shield 210 is provided with a capacitor hole 214, the capacitor hole 214 is used for allowing a capacitor inside the sensor body 100 to penetrate through the inside of the heat shield 210, the heat shield 210 is arranged outside the circuit board 110, the first fin 220 is connected to the back of the circuit board 110, the circuit board 110 is connected to the upper surface of the heat insulating plate 120, the lower surface of the first fin 220 is provided with a second support rod 221, the second support rod 221 is fixedly connected to the upper surface of the heat insulating plate 120, and the second support rod 221 is uniformly distributed.
In this application, second fin 230 links to each other with first fin 220, the fixed roof that runs through in heat exchanger 210 of lamellar body of second fin 230, second fin 230 is provided with a plurality of pieces, the bottom surface of a plurality of second fins 230 all connects in the upper surface of first fin 220, a plurality of second fins 230 evenly distributed is in the both sides of circuit board 110, the lamellar body of a plurality of second fins 230 is all fixed the top that runs through in heat exchanger 210, louvre 231 has all been seted up to the plate body of a plurality of second fins 230, louvre 231 has seted up a plurality of, a plurality of louvre 231 all is located heat exchanger 210's outside, the fixed inside that runs through in heat exchanger 210 of mouth of blowing of fan 240, the mouth of blowing of fan 240 is located circuit board 110's top, fan 240 is fixed the roof that runs through in heat exchanger 210.
In the present embodiment, the shielding layer 300 is disposed outside the heat shield 210, and the shielding layer 300 is a shielding paint material layer.
Specifically, the working principle of the temperature difference type power supply wireless sensor for the high-temperature equipment is as follows: when the sensor body 100 works, the circuit board 110 is thermally insulated through the thermal insulation board 120 and the thermal insulation cover 210, the influence on the circuit board 110 when a heat conduction plate in the sensor body 100 conducts heat can be reduced, the first fin 220 can absorb heat of the circuit board 110, the first fin 220 can transfer the heat to the second fin 230, then the fan 240 blows air to the interior of the thermal insulation cover 210, and then the heat of the interior of the thermal insulation cover 210 is dissipated, and then the second fin 230 and the circuit board 110 are dissipated, and the air entering the interior of the thermal insulation cover 210 can be discharged from the air outlet 211, on one hand, the circuit board 110 is thermally insulated, on the other hand, the circuit board 110 is blown for dissipating heat, so that the circuit board 110 is not prone to have an over-high temperature condition, the aging of the circuit board 110 can be delayed, the service life of the circuit board 110 can be prolonged, and then the service life of the sensor body 100 can be prolonged.
It should be noted that the specific model specifications of the circuit board 110 and the fan 240 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.
The power supply of the circuit board 110 and the fan 240 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A temperature difference type power supply wireless sensor for high-temperature equipment is characterized by comprising
The sensor comprises a sensor body (100), wherein a circuit board (110) is arranged on the sensor body (100), and a heat insulation plate (120) is arranged between the circuit board (110) and the sensor body (100);
cooling subassembly (200), cooling subassembly (200) including heat exchanger (210), first fin (220), second fin (230) and fan (240), heat exchanger (210) connect in the top of heat insulating board (120), air outlet (211) have been seted up to one side of heat exchanger (210), heat exchanger (210) cover is located the outside of circuit board (110), first fin (220) with circuit board (110) back links to each other, circuit board (110) with the upper surface of heat insulating board (120) links to each other, second fin (230) with first fin (220) link to each other, the lamellar body of second fin (230) is fixed run through in the roof of heat exchanger (210), the mouth of blowing of fan (240) is fixed run through in the inside of heat exchanger (210), the mouth of blowing of fan (240) is located the top of circuit board (110).
2. The wireless sensor for supplying power in a temperature difference manner for high-temperature equipment according to claim 1, wherein a first supporting rod (121) is arranged on the lower surface of the heat insulation plate (120), and the bottom end of the first supporting rod (121) is fixedly connected with the sensor body (100).
3. The wireless sensor for supplying power in a temperature difference manner for high-temperature equipment according to claim 2, wherein four first supporting rods (121) are provided, the top ends of the four first supporting rods (121) are fixedly connected with the four corners of the lower surface of the heat insulation plate (120) in a one-to-one correspondence manner, and the bottom ends of the four first supporting rods (121) are fixedly connected with the sensor body (100).
4. The wireless sensor for temperature difference power supply of high-temperature equipment as claimed in claim 1, wherein a threading hole (212) is formed in one side of the heat shield (210) far away from the air outlet (211), an antenna hole (213) is formed in a top wall of the heat shield (210), and a capacitor hole (214) is formed in the top wall of the heat shield (210).
5. The wireless sensor of claim 1, wherein the plurality of air outlets (211) are formed, and the plurality of air outlets (211) are uniformly distributed.
6. The wireless sensor of claim 1, wherein a second support rod (221) is disposed on a lower surface of the first fin (220), and the second support rod (221) is fixedly connected to an upper surface of the heat insulation plate (120).
7. The wireless sensor of claim 6, wherein a plurality of second support rods (221) are provided, the plurality of second support rods (221) are fixedly connected to the upper surface of the thermal insulation plate (120), and the plurality of second support rods (221) are uniformly distributed.
8. The wireless sensor of claim 1, wherein the second fin (230) is provided with a plurality of blocks, the bottom surfaces of the plurality of blocks of second fin (230) are connected to the upper surface of the first fin (220), the plurality of blocks of second fin (230) are uniformly distributed on two sides of the circuit board (110), and the plurality of second fin (230) bodies are fixed to the top of the heat shield (210).
9. The wireless sensor of claim 8, wherein a plurality of heat dissipation holes (231) are formed in the plate body of the second fins (230), a plurality of heat dissipation holes (231) are formed in the heat dissipation holes (231), and a plurality of heat dissipation holes (231) are located outside the heat shield (210).
10. The wireless sensor of claim 1, wherein a shielding layer (300) is disposed outside the heat shield (210), and the shielding layer (300) is a shielding coating material layer.
CN202221692724.3U 2022-06-30 2022-06-30 Temperature difference type power supply wireless sensor for high-temperature equipment Active CN217605132U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221692724.3U CN217605132U (en) 2022-06-30 2022-06-30 Temperature difference type power supply wireless sensor for high-temperature equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221692724.3U CN217605132U (en) 2022-06-30 2022-06-30 Temperature difference type power supply wireless sensor for high-temperature equipment

Publications (1)

Publication Number Publication Date
CN217605132U true CN217605132U (en) 2022-10-18

Family

ID=83592749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221692724.3U Active CN217605132U (en) 2022-06-30 2022-06-30 Temperature difference type power supply wireless sensor for high-temperature equipment

Country Status (1)

Country Link
CN (1) CN217605132U (en)

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