CN217561644U

CN217561644U - Novel line type probe test structure

Info

Publication number: CN217561644U
Application number: CN202220179559.5U
Authority: CN
Inventors: 钱晓晨; 卢祯松
Original assignee: Suzhou Helin Micro Technology Co ltd
Current assignee: Suzhou Helin Micro Technology Co ltd
Priority date: 2022-01-24
Filing date: 2022-01-24
Publication date: 2022-10-11
Anticipated expiration: 2032-01-24

Abstract

The utility model discloses a novel line type probe test structure, including roof, bottom plate, line type probe, surveyed wafer and PCB board, the roof sets up in the bottom plate top, the PCB board sets up in the bottom plate below, it sets up in the roof top to be surveyed the wafer, all be provided with a plurality of bullports on roof, the bottom plate, peg graft respectively in the bullport of roof, bottom plate at the both ends of line type probe, the roof includes first roof, second roof and third roof, the bottom plate includes first bottom plate, second bottom plate and third bottom plate, the axis of bullport sets up to an with the contained angle of vertical line, and 0 a is the a 30. The utility model discloses a set up the bullport of slope, when pressing tool for the line type probe in the PCB board, reduce the wearing and tearing that the line type probe slided and leads to in the bullport, through making the line type probe inflection, the elastic force of production can make the line type probe reliably with PCB board terminal contact, strengthen this test structure's test stability.

Description

Novel line type probe test structure

Technical Field

The utility model relates to a probe test technical field specifically is a novel line type probe test structure.

Background

Along with the development of semiconductor chips, more and more intelligent devices comprise 5G mobile phones, unmanned vehicles and the like are integrated into life, and chips are developed towards the direction of small size, so that the small-distance chips are born. The pitch becomes smaller, and a specific ultra-fine line probe is required to test the conduction and electrical characteristics, and the line probe has a very small diameter, usually less than or equal to 0.040mm, and can be used for testing wafers with the pitch (pitch) less than or equal to 0.065 mm. In order to ensure that both ends of the wire-type probes can be reliably brought into contact with the terminals of the wafer and the terminals of the PCB and abrasion of the wire-type probes is not easily generated, it is necessary to design a test fixture. When the operation of pressing the jig for the wire-type probe is repeated, the wire-type probe slides in the front and rear end side through hole. Therefore, wear is likely to occur particularly at the opening of the rear end side through hole. When the sliding resistance is increased due to abrasion, the wire-type probe cannot smoothly slide in the rear-end-side through hole, and the front end of the wire-type probe cannot contact with the wafer to be tested and the terminal of the PCB), and the problems of poor electrical performance testing and conduction occur.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel line type probe test structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel line type probe test structure, includes roof, bottom plate, line type probe, surveyed wafer and PCB board, the roof sets up in the bottom plate top, the PCB board sets up in the bottom plate below, it sets up in the roof top to be surveyed the wafer, all be provided with a plurality of bullports on roof, the bottom plate, peg graft respectively in the bullport of roof, bottom plate at the both ends of line type probe, the roof includes first roof, second roof and third roof, the bottom plate includes first bottom plate, second bottom plate and third bottom plate, the axis of bullport sets up to an with the contained angle of vertical line to a, and 0 institute a is restrainted 30.

As a further optimization, the first top plate, the second top plate and the third top plate are arranged in parallel with each other.

As a further optimization, the first bottom plate, the second bottom plate and the third bottom plate are arranged in parallel with each other.

As a further optimization, when the first top board, the second top board and the third top board are aligned, the axes of the guide holes on the first top board, the second top board and the third top board are correspondingly overlapped.

As a further optimization, when the first bottom plate, the second bottom plate and the third bottom plate are aligned, the axes of the guide holes on the first bottom plate, the second bottom plate and the third bottom plate are correspondingly overlapped.

Preferably, a support column is arranged between the first top plate and the first bottom plate.

And as further optimization, two end parts of the linear probe respectively penetrate through the top plate and the bottom plate to be conducted with the wafer to be tested and the PCB.

Advantageous effects

The utility model provides a novel line type probe test structure is through setting up the bullport of slope for line type probe slope is connected, when pressing tool for the line type probe in the PCB board, reduces the wearing and tearing that the line type probe slides and leads to in the bullport, through making the line type probe flexion, and the elastic force of production can make the line type probe contact with PCB board terminal reliably, strengthens this test structure's test stability.

Drawings

Fig. 1 is a schematic three-dimensional structure of the present invention;

FIG. 2 is a front view of the present invention;

fig. 3 is a schematic diagram of a prior art structure in the background art of the present invention.

Reference numerals

The device comprises a first top plate 1, a second top plate 2, a third top plate 3, a wafer 4 to be tested, a linear probe 5, a first bottom plate 6, a second bottom plate 7, a third bottom plate 8, a PCB 9 and a support pillar 10.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

Examples

Referring to fig. 1 and 2, a novel line type probe test structure, including a top plate, a bottom plate, a line type probe 5, a wafer 4 to be tested and a PCB plate 9, the top plate is disposed above the bottom plate, the PCB plate 9 is disposed below the bottom plate, the wafer 4 to be tested is disposed above the top plate, the top plate and the bottom plate are both provided with a plurality of guide holes, two ends of the line type probe 5 are respectively inserted into the guide holes of the top plate and the bottom plate, the top plate includes a first top plate 1, a second top plate 2 and a third top plate 3, the bottom plate includes a first bottom plate 6, a second bottom plate 7 and a third bottom plate 8, an included angle between an axis of the guide hole and a vertical line is set to be a, and a is 15 °, by adopting such a structure, when the line type probe 5 is pressed on the PCB plate by a jig, the line type probe is bent, the line type probe can be reliably contacted with a terminal of the PCB plate 9, the 3 plate structures respectively have one more guide hole than the structures of the conventional 2 plates, comparison of the 2 structure is favorable for adjusting a guide of the line type probe to make a test state more stable than that of the conventional 2 plates, and the jig is not easy to generate abrasion of the line type probe plates.

In this embodiment, when the first top plate 1, the second top plate 2 and the third top plate 3 are aligned, the axes of the guide holes on the first top plate 1, the second top plate 2 and the third top plate 3 are correspondingly overlapped, and when the first bottom plate 6, the second bottom plate 7 and the third bottom plate 8 are aligned, the axes of the guide holes on the first bottom plate 6, the second bottom plate 7 and the third bottom plate 8 are correspondingly overlapped, so that the linear probes 5 can be obliquely arranged, and when the jig for linear probes is pressed on a PCB, the abrasion caused by the sliding of the linear probes in the guide holes is reduced.

In this embodiment, a support column 10 is provided between the first top plate 1 and the first bottom plate 6 to prevent the wire probes 5 from being excessively bent to be broken.

In this embodiment, the two ends of the line probe 5 penetrate the top plate and the bottom plate respectively to be conducted with the wafer 4 and the PCB 9.

The working principle is as follows: when the jig is pressed on the device to be inspected, the linear probe is bent to generate an elastic force for protruding the front end of the linear probe from the jig for the linear probe, and the two end portions of the linear probe can reliably contact the PCB and the wafer to be inspected, thereby forming a stable conduction test circuit.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.

Claims

1. The utility model provides a novel line type probe test structure, includes roof, bottom plate, line type probe (5), is surveyed wafer (4) and PCB board (9), the roof sets up in the bottom plate top, PCB board (9) set up in the bottom plate below, being surveyed wafer (4) and setting up in the roof top, all be provided with a plurality of bullports on roof, the bottom plate, the both ends of line type probe (5) are pegged graft respectively in the bullport of roof, bottom plate, its characterized in that: the top plates comprise a first top plate (1), a second top plate (2) and a third top plate (3), the bottom plates comprise a first bottom plate (6), a second bottom plate (7) and a third bottom plate (8), the included angle between the axis of the guide hole and the vertical line is set to be a, and 0-layer a is formed by layer-woven fabrics.

2. The novel linear probe test structure of claim 1, wherein: the first top plate (1), the second top plate (2) and the third top plate (3) are arranged in parallel.

3. The novel linear probe test structure of claim 1, wherein: the first bottom plate (6), the second bottom plate (7) and the third bottom plate (8) are arranged in parallel.

4. The novel linear probe test structure of claim 2, wherein: when the first top plate (1), the second top plate (2) and the third top plate (3) are aligned, the axes of the guide holes on the first top plate (1), the second top plate (2) and the third top plate (3) are correspondingly overlapped.

5. The novel linear probe test structure of claim 3, wherein: when the first bottom plate (6), the second bottom plate (7) and the third bottom plate (8) are aligned, the axes of the guide holes on the first bottom plate (6), the second bottom plate (7) and the third bottom plate (8) are correspondingly superposed.

6. The novel linear probe test structure of claim 1, wherein: a supporting column (10) is arranged between the first top plate (1) and the first bottom plate (6).

7. The novel linear probe test structure of claim 1, wherein: two end parts of the linear probe (5) penetrate through the top plate and the bottom plate respectively to be conducted with the wafer (4) to be tested and the PCB (9).