CN217438324U - Electroplating equipment - Google Patents

Abstract

The utility model belongs to the technical field of electroplating equipment, and discloses electroplating equipment, which mainly comprises an electroplating cylinder, an electroplating swinging device and a spraying assembly, wherein electroplating solution is contained in the electroplating cylinder, the electroplating swinging device is arranged in the electroplating cylinder, the electroplating swinging device comprises two anode slots which are just opposite to each other along a first direction, one ends of the two anode slots are respectively and rotatably connected with the electroplating cylinder, and the other ends can be relatively opened or closed; the anode slot comprises anodes, the part to be plated is arranged between the two anodes, and the distance between the anodes and the part to be plated is shortened, so that positive ions fall off from the anodes and can rapidly reach the periphery of the part to be plated, and the electroplating efficiency is improved; the spraying assembly is arranged on the two sides and the bottom of the electroplating swing device along the second direction, can spray electroplating solution on the workpiece to be plated in an all-round manner, reduces the current difference on the surface of the workpiece to be plated, stirs the electroplating solution around the workpiece to be plated, greatly improves the electroplating efficiency and the electroplating uniformity of an electroplating system, prevents board burning, and achieves low energy consumption, high quality and high efficiency of plating.

Description

Electroplating equipment

Technical Field

The utility model relates to an electroplating device technical field especially relates to an electroplating device.

Background

In recent years, with the rapid development of the electronics industry, the demand for electronic Printed boards (PCB for short) has been increasing, and electroplating is an essential process in the manufacturing process of PCB. Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to play roles of preventing corrosion, improving wear resistance, conductivity and light reflection, enhancing the appearance and the like.

The PCB electroplating equipment mainly comprises an anode connected with a positive pole of a power supply, a cathode connected with a negative pole of the power supply and an electroplating bath filled with electrolyte, wherein the cathode is a product to be electroplated, the anode and the product to be electroplated are placed in the electroplating bath, metal of the anode can be oxidized (lose electrons) after the power supply is switched on, and positive ions in the solution are reduced (obtain electrons) at the cathode to form atoms and are accumulated on the surface layer of the cathode to form an electroplated layer.

However, in the electroplating process, because the problems of uneven distribution of positive ions in the electroplating solution, smaller size of the part to be plated on the cathode than that of the anode plate, and the like, cause uneven electric field effect, and uneven thickness of the upper and lower coatings of the part to be plated, which may cause different currents on the PCB plate, and cause plate burning, in order to obtain better coating quality, improve electroplating efficiency, and ensure that the metal ions around the part to be plated are continuously updated and are not depleted, the electroplating solution is usually stirred by using a cathode swing stirring mode or by placing a side spray pipe in front of the anode; but still has the problems of uneven plating, low plating efficiency, damage to the part to be plated in the swinging process and the like.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electroplating device can improve the homogeneity that PCB was electroplated, improves and electroplates efficiency to can improve and wait to plate the security of piece electroplating process, prevent to damage.

To achieve the purpose, the utility model adopts the following technical proposal:

an electroplating device is used for electroplating a piece to be plated; wherein, above-mentioned electroplating device includes:

an electroplating tank, wherein the electroplating tank is filled with electroplating liquid;

the electroplating swing device is arranged in the electroplating cylinder and comprises two anode slots, the two anode slots are arranged oppositely along a first direction, one ends of the two anode slots are respectively and rotatably connected to the electroplating cylinder, and the other ends of the two anode slots can be opened or closed relatively; the anode slot comprises anodes, and the part to be plated is arranged between the two anodes;

and the spraying assemblies are arranged in the electroplating cylinder, arranged at two sides and the bottom of the electroplating swing device along a second direction, and perpendicular to the first direction, and are configured to spray the electroplating solution to the workpiece to be plated.

Optionally, the electroplating swing device comprises:

the two swinging plate assemblies are respectively arranged on the two anode slots in a sliding manner along the second direction, the swinging plate assemblies are arranged between the two anodes, a cathode space is formed between the two swinging plate assemblies, and the part to be plated is arranged in the cathode space;

and the driving assembly is in driving connection with the swing plate assembly and is used for driving the swing plate assembly to reciprocate between the anode and the part to be plated along the second direction.

Optionally, the rocking plate assembly includes a rocking plate fixing frame, a rocking plate and a sliding assembly, the rocking plate and the sliding assembly are respectively and fixedly disposed on the rocking plate fixing frame, the rocking plate fixing frame is connected to an output end of the driving assembly, and the sliding assembly is slidably disposed on the anode slot along the second direction.

Optionally, the swing plate includes a plurality of fixing strips, and the plurality of fixing strips are fixed on the swing plate fixing frame at equal intervals along the second direction.

Optionally, the spraying assembly includes a spraying pipe, a spraying head and a circulating pump, the spraying pipe is disposed on two sides and a bottom of the electroplating swing device along a second direction, the spraying head is disposed on the spraying pipe, an opening of the spraying head faces the to-be-plated part, and the circulating pump is connected to the spraying pipe.

Optionally, the spray head is provided in plurality, and the plurality of spray heads are distributed at equal intervals along the axial direction of the spray pipe.

Optionally, the spraying assembly further comprises a pumping pipe, the pumping pipe is connected to the circulating pump, and the pumping pipe is used for pumping the plating solution in the plating cylinder to the circulating pump.

Optionally, above-mentioned electroplating cylinder includes cylinder body and overflow box, and above-mentioned overflow box sets up in the both sides of above-mentioned cylinder body, and above-mentioned overflow box includes the overflow mouth, and the inner wall of above-mentioned cylinder body is seted up to above-mentioned overflow mouth, and above-mentioned overflow box and above-mentioned cylinder body can be through above-mentioned overflow mouth intercommunication.

Optionally, the overflow box further comprises an adjusting member, the adjusting member is slidably disposed at the overflow port on the inner wall of the cylinder body along a third direction, and the adjusting member is used for adjusting the overflow height of the overflow port; the third direction is perpendicular to the first direction and the second direction.

Optionally, the plating cylinder includes a hanger, the hanger is erected at a top end of the plating cylinder along the second direction and is located at a middle portion of the plating cylinder along the first direction, and the to-be-plated member is detachably disposed on the hanger.

The utility model has the advantages that:

the utility model provides an electroplating device, which mainly comprises an electroplating cylinder, an electroplating swinging device and a spraying assembly, wherein electroplating solution is contained in the electroplating cylinder, the electroplating swinging device is arranged in the electroplating cylinder, the electroplating swinging device comprises two anode slots which are just opposite to each other along a first direction, one ends of the two anode slots are respectively and rotatably connected with the electroplating cylinder, and the other ends can be relatively opened or closed, thereby facilitating the putting in and taking out of a piece to be plated; the anode slot comprises anodes, and the part to be plated is arranged between the two anodes, so that the distance between the anodes and the part to be plated is shortened. During electroplating, positive ions fall off from the anode and can rapidly reach the periphery of a part to be plated, so that the electroplating efficiency is improved; the workpiece to be plated is placed in the mode, so that the workpiece to be plated can be prevented from contacting with the electroplating swing device and the spraying assembly, the workpiece to be plated is prevented from being collided and damaged, and the safety of the workpiece to be plated is improved; further, the spraying assembly is arranged on the two sides and the bottom of the electroplating swing device along the second direction, so that electroplating solution can be sprayed to a part to be plated in an all-round mode, the current difference on the surface of the part to be plated is reduced, the electroplating solution on the periphery of the part to be plated is stirred better, the electroplating efficiency and the electroplating uniformity of an electroplating system are greatly improved, the plate burning is prevented, and therefore the low-energy-consumption, high-quality and high-efficiency plated plate is achieved.

Drawings

FIG. 1 is a schematic structural view of an electroplating apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of an electroplating swing device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a fixing frame and a driving assembly according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of an anode slot according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a wobble plate assembly according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a spray assembly according to an embodiment of the present invention;

FIG. 7 is an exploded view of portion A of FIG. 6;

FIG. 8 is a schematic structural view of an electroplating tank according to an embodiment of the present invention.

FIG. 9 is a front view of an electroplating tank according to an embodiment of the present invention;

FIG. 10 is a cross-sectional view taken along line B-B of FIG. 9;

in the figure:

10. a part to be plated;

20. electroplating a cylinder;

21. a cylinder body; 211. an accommodating chamber; 212. a fixed block; 2121. a card slot; 213. an installation part;

22. an overflow box; 221. an overflow port; 222. an adjustment member; 2221. an adjustment port;

23. a hanger; 24. a support frame; 241. a footing;

30. electroplating the swinging device;

31. an anode slot; 311. an anode; 312. a slot wheel plate; 3121. a first groove; 3122. a guide rail; 313. a titanium mesh; 314. an anti-collision part;

32. a wobble plate assembly; 321. a wobble plate mount; 322. a wobble plate; 3221. a fixing strip; 323. a sliding assembly; 3231. a roller; 32311. a second groove; 3232. a guide bar; 32321. an anti-drop part; 32322. a through hole; 3233. a fastener; 3234. a shaft sleeve;

33. a drive assembly; 331. a drive shaft; 332. an eccentric wheel; 333. a driving connection seat; 3331. a first connection hole; 334. a motor;

34. a fixed mount; 341. a frame; 3411. a first connection portion; 3412. a second connecting portion; 3413. a second connection hole; 342. a connecting shaft;

40. a spray assembly;

41. a nozzle; 411. a third connection hole; 412. a nozzle base; 413. a first plug;

42. a spray head; 421. a first connecting seat; 422. a nozzle;

43. a tapping pipe;

44. a main water pipe; 441. a second plug;

45. a connector assembly; 451. a plug; 452. a second connecting seat.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected", "connected" and "fixed" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The embodiment provides an electroplating device for electroplating a PCB (printed circuit board), and as shown in fig. 1, the electroplating device mainly comprises an electroplating cylinder 20, an electroplating swing device 30 and a spraying assembly 40, wherein electroplating solution is contained in the electroplating cylinder 20, and the electroplating swing device 30 and the spraying assembly 40 are also arranged in the electroplating cylinder 20, so that the electroplating efficiency and the electroplating uniformity of a piece to be plated 10 can be improved, and further the piece to be plated 10 is electroplated with low energy consumption, high quality and high efficiency in the electroplating solution.

Specifically, the electroplating swing device 30 includes two anode slots 31, the two anode slots 31 are disposed opposite to each other along a first direction (a Y direction shown in fig. 1), one ends of the two anode slots 31 are respectively rotatably connected to the electroplating cylinder 20, the other ends of the two anode slots 31 can be opened or closed relatively, the anode slots 31 include anodes 311, and the to-be-plated part 10 is disposed between the two anodes 311, so that the to-be-plated part 10 can be conveniently put in and taken out. During electroplating, one end of the electroplating swinging device 30 is relatively opened, the part to be plated 10 is placed in the electroplating swinging device, and then the electroplating swinging device 30 is closed, so that the distance between the anode 311 and the part to be plated 10 is shortened. During electroplating, positive ions fall off from the anode 311 and can quickly reach the periphery of the part to be plated 10, so that the electroplating efficiency is improved; by placing the to-be-plated part 10 in the above manner, the to-be-plated part 10 can be prevented from contacting the electroplating swing device 30 and the spraying assembly 40, so that the to-be-plated part 10 is prevented from being damaged by collision, and the safety of the to-be-plated part 10 is improved. Further, the spraying assembly 40 is arranged at the two sides and the bottom of the electroplating swing device 30 along a second direction (such as the X direction shown in fig. 1), the second direction is perpendicular to the first direction, and can spray electroplating solution to the part to be plated 10 in an all-around manner, so that the current difference on the surface of the part to be plated 10 is reduced, positive ions in the electroplating solution around the part to be plated 10 are more uniform, the electroplating solution around the part to be plated 10 is better stirred, the electroplating efficiency and the electroplating uniformity of electroplating equipment are greatly improved, plate burning is prevented, and low energy consumption, high quality and high efficiency of plate plating are achieved. The member to be plated 10 in this embodiment is a PCB. It is understood that the anode slots 31 may be symmetrically arranged in two sets along the first direction.

In this embodiment, as shown in fig. 2, the electroplating swing device 30 further includes a swing plate assembly 32 and a driving assembly 33, and two sets of swing plate assemblies 32 and driving assemblies 33 are oppositely disposed along a first direction, the two swing plate assemblies 32 are respectively slidably disposed on the two anode slots 31 along a second direction, the swing plate assembly 32 is disposed between the two anodes 311, a cathode space is formed between the two swing plate assemblies 32, and the to-be-plated part 10 is disposed in the cathode space, so as to shorten a distance between the to-be-plated part 10 and the anodes 311. During electroplating, after positive ions on the anode 311 fall off, a coating can be quickly formed on the part to be plated 10, so that the electroplating efficiency is improved; and, the driving component 33 is connected to the swing plate component 32, and is used for driving the swing plate component 32 to reciprocate between the anode 311 and the to-be-plated part 10 along the second direction, so as to promote the flow of the electroplating solution, improve the uniformity of the to-be-plated part 10 and the positive ions in the electroplating solution around the anode 311, greatly improve the uniformity of the thickness of the coating of the to-be-plated part 10, prevent plate burning, and achieve low energy consumption, high quality and high efficiency of plate plating. In addition, the electroplating swing device 30 is not in contact with the piece to be plated 10, so that the piece to be plated 10 is not damaged, and the safety of the piece to be plated 10 is improved. It will be appreciated that the wobble plate assembly 32 and the drive assembly 33 may also be arranged symmetrically in two sets along the first direction.

Specifically, as shown in fig. 2 and 3, the plating swing device 30 further includes a fixing frame 34, the fixing frame 34 is a rectangular frame structure, and includes a frame 341 and a connecting shaft 342, the connecting shaft 342 is disposed at the bottom of the frame 341, and the connecting shaft 342 is rotatably disposed inside the plating cylinder 20 for fixing the plating swing device 30. Optionally, the frame 341 is provided with a first connecting portion 3411 and a second connecting portion 3412 at one side thereof for connecting the driving assembly 33. Optionally, the frame 341 is further provided with a second connecting hole 3413, and the second connecting hole 3413 is disposed on the frame 341 and is used for fixing the anode slot 31. Alternatively, the second connecting hole 3413 is provided in plurality, so that the anode insertion groove 31 is more stably fixed to the fixing frame 34. Preferably, in this embodiment, four second connecting holes 3413 are provided, and are symmetrically arranged two by two along the center of the frame 341.

Further, as shown in fig. 4, the anode slot 31 includes an anode 311, a slot wheel plate 312 and a titanium mesh 313, the titanium mesh 313 is a mesh structure and is fixedly disposed on the slot wheel plate 312, the surface of the anode slot 31 on which the titanium mesh 313 is disposed faces the wobble plate assembly 32, and the anode 311 is disposed between the slot wheel plate 312 and the titanium mesh 313. When the positive ions of the anode 311 fall off, the positive ions can flow out from the titanium mesh 313, but the particles falling from the anode 311 are intercepted by the titanium mesh 313 and cannot pass through, so that the phenomenon that the particles falling from the anode 311 are electroplated to the workpiece 10 to be plated when the workpiece 10 to be plated is electroplated, further the plate burning condition is caused, and the electroplating uniformity is improved.

Optionally, as shown in fig. 4 and 5, the socket pulley plate 312 has a cross-shaped plate structure, and a middle riser of the socket pulley plate 312 is provided with a first groove 3121 for inserting the anode 311. Guide rail 3122 sets up on the diaphragm of middle riser both sides, and every side all is equipped with two guide rail 3122, and guide rail 3122 extends along the second direction, sways board subassembly 32 and includes sliding assembly 323, sliding assembly 323 and guide rail 3122 sliding fit to realize swaying board subassembly 32 for the reciprocating motion of positive pole slot 31 along the second direction, and guide rail 3122 plays certain guide effect to the reciprocating motion of swaying board subassembly 32.

Further, as shown in fig. 5, the swing plate assembly 32 further includes a swing plate fixing frame 321 and a swing plate 322, the swing plate 322 and the sliding assembly 323 are fixedly disposed on the swing plate fixing frame 321, and the swing plate fixing frame 321 is connected to the output end of the driving assembly 33. During electroplating, the sliding assembly 323 is slidably disposed on the anode slot 31 along the second direction, so that the driving assembly 33 drives the swing plate fixing frame 321 to drive the swing plate 322 to reciprocate along the second direction, thereby stirring the electroplating solution around the workpiece 10.

Optionally, the rocking plate 322 includes a plurality of fixing bars 3221, the plurality of fixing bars 3221 are fixed on the rocking plate fixing frame 321 at equal intervals along the second direction, and a gap is formed between every two adjacent fixing bars 3221. When wobble plate assembly 32 carried out reciprocating motion along the second direction, the plating solution shuttled back and forth and flows between a plurality of clearances, can realize stirring the plating solution better, improved the homogeneity of treating plating piece 10 in the plating solution around the positive ion, and then improved the homogeneity of electroplating, avoided burning the board phenomenon.

Optionally, sliding assembly 323 includes a roller 3231 and a guide rod 3232, where guide rod 3232 is fixedly disposed on wobble plate holder 321, and roller 3231 is disposed on guide rod 3232, such that roller 3231 can rotate relative to guide rod 3232; and the roller 3231 is arranged on the guide rail 3122 in a sliding manner, so that the roller 3231 can slide along the guide rail 3122, the relative movement of the swing plate fixing frame 321 and the anode slot 31 is realized, the stirring of the electroplating solution is realized, and the electroplating uniformity is improved. Optionally, the roller 3231 has a second groove 32311 on its outer circumference for engaging with the guide rail 3122. It is understood that in other embodiments, the outer periphery of the roller 3231 can be provided with protrusions to engage the track 3122.

Preferably, the guide rod 3232 is further provided at one end with a retaining portion 32321, and an outer diameter of the retaining portion 32321 is larger than an inner diameter of the roller 3231, so as to prevent the roller 3231 from falling off the guide rod 3232. Optionally, guide rod 3232 is provided with a through hole 32322 along its axial direction, and slide assembly 323 further includes a fastener 3233, and fastener 3233 passes through hole 32322 to fix guide rod 3232 to wobble plate mount 321. Alternatively, the through hole 32322 is a counter-sunk hole to allow the top end of the fastener 3233 to be flush with the top end of the guide rod 3232, thereby preventing the fastener 3233 from protruding and interfering with other components. Optionally, the sliding assembly 323 further includes a shaft sleeve 3234, the shaft sleeve 3234 is sleeved on the guide rod 3232 and is disposed between the roller 3231 and the swing plate fixing frame 321, so that a certain gap exists between the roller 3231 and the swing plate fixing frame 321, and the roller 3231 is prevented from contacting with the swing plate fixing frame 321 to affect the normal rotation of the roller 3231. In addition, the roller 3231 is interposed between the anti-slip portion 32321 and the sleeve 3234, so that the roller 3231 is restricted in the degree of freedom in the first direction, and does not contact the workpiece 10, thereby reducing the possibility of damage to the workpiece 10.

Further, as shown in fig. 3 and 5, the driving assembly 33 includes a driving shaft 331, an eccentric wheel 332, a driving connecting seat 333 and a motor 334, the motor 334 is connected to the driving shaft 331, the driving connecting seat 333 is fixedly connected to the swing plate fixing frame 321, a first connecting hole 3331 is formed in the driving connecting seat 333, the eccentric wheel 332 passes through the first connecting hole 3331 and is fixedly secured to the driving shaft 331, and a hole wall of the first connecting hole 3331 abuts against the eccentric wheel 332. The motor 334 is started, the driving shaft 331 drives the eccentric wheel 332 to rotate, the eccentric wheel 332 drives the driving connecting seat 333 to reciprocate along the second direction through the hole wall of the first connecting hole 3331, and then the swinging plate assembly 32 reciprocates along the second direction, so that the electroplating solution is stirred, the electroplating uniformity is improved, and the plate burning phenomenon is avoided. Alternatively, the motor 334 is fixedly disposed at the first connecting portion 3411, and the driving shaft 331 extends downward through the first connecting portion 3411 and is stopped at the second connecting portion 3412 and is rotatably connected to the second connecting portion 3412.

Optionally, two eccentrics 332 are spaced apart along a third direction (e.g., the Z direction in fig. 1), which is perpendicular to the first and second directions, and two driving connecting seats 333 are correspondingly disposed, so that the movement stability of the wobble plate assembly 32 is improved. Optionally, the first connection hole 3331 is an oblong hole.

Optionally, the driving assembly 33 further includes a speed reducer disposed between the motor 334 and the driving shaft 331, and configured to realize uniform and slow rotation of the driving shaft 331, so as to realize stable control of the motion of the wobble plate assembly 32.

Optionally, as shown in fig. 2, the electroplating swing device 30 further includes an anti-collision portion 314, which is fixedly disposed at the top end of the anode slot 31 and is used for preventing two anode slots 31, which are oppositely disposed along the first direction, from colliding when one end of the electroplating swing device 30 is relatively closed, so as to avoid damage to the component and the to-be-plated part 10. Optionally, two anti-collision portions 314 are arranged at intervals along the second direction, so that two anode slots 31 are more effectively prevented from colliding, and damage to parts and the to-be-plated part 10 is better avoided.

In the embodiment, as shown in fig. 2 to 5, when the PCB is electroplated, the swing plate assembly 32 is disposed between the two anodes 311, the to-be-plated part 10 is disposed in the cathode space formed between the two swing plate assemblies 32, and the distance between the anode 311 and the to-be-plated part 10 is shortened, so that when positive ions fall off from the anode 311, and are filtered by the titanium mesh 313, a plating layer can be rapidly formed on the surface of the to-be-plated part 10, thereby improving the electroplating efficiency. Further, starter motor 334, it rotates to drive eccentric wheel 332 through drive shaft 331, make drive connecting seat 333 drive gyro wheel 3231 carry out reciprocating motion along the second direction on guide rail 3122, the plating solution is under a plurality of fixed strip 3221 effects, the flow in a plurality of clearances that shuttles back and forth, can realize stirring the plating solution better, make even distribution of positive ion in the plating solution around waiting to plate 10, and then make the homogeneity of waiting to plate 10 cladding material thickness obtain increasing substantially, the board phenomenon of burning has been avoided, thereby reach low energy consumption, high quality, the high efficiency plate of plating. And the piece to be plated 10 is not in contact with the swing plate assembly 32, so that the damage of the piece to be plated 10 is avoided, and the safety of the piece to be plated 10 is improved.

In the embodiment, as shown in fig. 6, the spraying assembly 40 includes a spraying pipe 41, a spraying head 42 and a circulating pump (not shown), the spraying pipe 41 is disposed at two sides and at the bottom of the electroplating swing device 30 along the second direction, the spraying head 42 is disposed on the spraying pipe 41, an opening of the spraying head 42 faces the workpiece 10 to be plated, and the circulating pump is connected to the spraying pipe 41. When electroplating, carry the plating solution for spray tube 41 through the circulating pump to spray the plating solution to waiting to plate 10 through the shower nozzle 42 that sets up on spray tube 41, reduced the electric current difference that waits to plate 10 surfaces, and can the omnidirectional stir wait to plate plating solution around 10, make wait to plate in the plating solution around 10 that positive ion distributes evenly, improved the homogeneity of electroplating better.

Alternatively, the spray head 42 is provided in plural, and the plural spray heads 42 are equally spaced in the axial direction of the spout 41. The plurality of spray heads 42 spray the electroplating solution to the workpiece 10, so that the current difference on the surface of the workpiece 10 can be reduced better, the electroplating solution around the workpiece 10 is stirred, and the uniformity is improved better. Alternatively, as shown in fig. 7, the nozzle 41 is provided with a plurality of third connecting holes 411 for connecting a plurality of spray heads 42. Alternatively, the nozzles 41 on each side can be arranged in one or more groups, and can be adaptively arranged according to the size of the accommodating cavity 211 of the plating cylinder 20. Optionally, the nozzle 41 further includes a nozzle base 412 disposed at the third connection hole 411, the spray head 42 includes a first connection seat 421 and a nozzle 422, the first connection seat 421 is fixedly connected to the nozzle base 412, so as to achieve connection between the spray head 42 and the nozzle 41, and the nozzle 422 is fixedly connected to the first connection seat 421 for spraying the plating solution. Optionally, as shown in fig. 6, the other end of the nozzle 41 is provided with a first plug 413, so as to prevent the plating solution entering the nozzle 41 from being sprayed out from the other end, thereby avoiding waste and damage to other parts.

Further, as shown in fig. 6, the spraying assembly 40 further includes a pumping pipe 43 connected to the circulating pump for pumping out the plating solution in the plating cylinder 20, flowing into the circulating pump, and spraying out through the nozzle 42 on the spraying pipe 41, so as to recycle the plating solution in the plating cylinder 20.

Optionally, the spraying assembly 40 further includes a filtering device disposed between the pumping pipe 43 and the circulating pump, so as to filter the electroplating solution after pumping out the electroplating solution, thereby reducing the replacement times of the electroplating solution.

Further, the shower assembly 40 also includes a main water pipe 44 and a connector 45. The main water pipe 44 is disposed at the bottom of the receiving cavity 211 for connecting the circulation pump and the plurality of spray pipes 41, and the connector 45 is disposed between the main water pipe 44 and the spray pipes 41 for connecting the main water pipe 44 and the spray pipes 41. With the above configuration, the plating liquid can be uniformly distributed to the nozzles 41. Optionally, the main water pipe 44 is of a square structure for easy placement. Optionally, two ends of the main water pipe 44 are respectively provided with a second plug 441 in a sealing manner, so that two ends of the main water pipe 44 are closed, and the plating solution can not flow out after entering the main water pipe 44. Optionally, the connector 45 includes a plug 451 and a second connecting seat 452, the plug 451 is disposed at one end of the spray pipe 41, the second connecting seat 452 is disposed at the top of the main water pipe 44, and the plug 451 is inserted into the second connecting seat 452, so that the spray pipe 41 and the main water pipe 44 can be detachably connected.

With the above configuration, the plating liquid enters the main water pipe 44 from the circulation pump, and is distributed to the nozzles 41 through the main water pipe 44. It will be appreciated that the nozzles 41 may also be connected directly to the circulation pump, so that the plating solution can be introduced directly into the nozzles 41 via the circulation pump. Further, the plating solution is sprayed to the workpiece 10 through the plurality of spray heads 42 disposed on the spray pipes 41, so that the fluidity of the plating solution around the workpiece 10 is increased, and further, new plating solution is injected around the workpiece 10. The electroplating solution around the drawing pipe 43 is drawn out through the drawing pipe 43, so that the old electroplating solution flows into the filtering device, and then enters the circulating pump through the filtering device to form new circulation, thereby improving the utilization rate of the electroplating solution, reducing the current difference on the surface of the part 10 to be plated, increasing the fluidity of the electroplating solution around the part 10 to be plated, ensuring that the positive ions are uniformly distributed in the electroplating around the part 10 to be plated, and better improving the electroplating uniformity.

In the present embodiment, as shown in fig. 8 to 10, the plating cylinder 20 includes a cylinder body 21 and overflow boxes 22, and the overflow boxes 22 are provided on both sides of the cylinder body 21. The cylinder 21 is used for accommodating the spray assembly 40 and the electroplating swinging device 30, so that the electroplating swinging device and the workpiece 10 are immersed into the electroplating solution in the electroplating cylinder 20 for electroplating. The overflow box 22 includes an overflow port 221 opened in an inner wall of the cylinder 21 for communicating the cylinder 21 with the overflow box 22. When the height of the electroplating solution in the electroplating cylinder 20 exceeds the bottom end of the overflow port 221, the electroplating solution overflows from the interior of the cylinder body 21 and flows into the overflow box 22, so that the phenomenon that the electroplating solution overflows from the top end of the electroplating cylinder 20 due to excessive electroplating solution, other equipment and parts are damaged, and the electroplating solution is wasted is avoided.

Specifically, the cylinder body 21 is provided with an accommodating cavity 211 for accommodating the electroplating swing device 30, the spraying assembly 40, the part to be plated 10 and the electroplating solution, so that a good electroplating space is provided for electroplating the part to be plated 10. Optionally, the cylinder body 21 is further provided with mounting portions 213 at both sides thereof, and the mounting portions 213 are used for placing power supply equipment so that the plating cylinder 20 can be electrified for plating. Optionally, as shown in fig. 10, a plurality of fixing blocks 212 are further disposed at the bottom of the accommodating cavity 211, and a locking slot 2121 is disposed on each fixing block 212 for fixing the electroplating swing device 30 and the spraying assembly 40. Optionally, the bottom of the cylinder 21 is further opened with a drain port for discharging the plating solution when the plating equipment is repaired or the plating solution is entirely replaced.

Further, as shown in fig. 8, the overflow box 22 further includes an adjusting member 222, and the adjusting member 222 is slidably disposed outside the overflow port 221 along a third direction, so as to adjust an overflow height of the overflow port 221, thereby adjusting a liquid level of the plating solution in the plating cylinder 20. Optionally, the adjusting part 222 of the overflow port 221 is provided with an adjusting port 2221 for adjusting the overflow height of the overflow port 221. By sliding the adjusting member 222 in the third direction, when the bottom end of the adjusting port 2221 coincides with the bottom end of the overflow port 221, the overflow height of the overflow port 221 is the lowest, and the opening degree of the overflow port 221 is the largest; when the bottom end of the adjustment port 2221 coincides with the top end of the overflow port 221, the overflow port 221 is closed. It can be understood that when the electroplating equipment is in the working state, the overflow port 221 is in a normally open state; when the electroplating equipment is in a stop state, the overflow port 221 can be closed, so that other substances are prevented from entering the overflow box 22, pollution is avoided, and the service life of the electroplating equipment is prolonged. Preferably, the adjustment port 2221 is the same size as the overflow port 221, so that the overflow port 221 is open to the maximum when the overflow port 221 and the adjustment port 2221 are fully coincident. It is understood that the size of the adjustment opening 2221 may not be equal to the size of the overflow opening 221. Optionally, the bottom of the overflow box 22 is also provided with an outlet for the plating solution inside the overflow box 22 to flow out.

Further, the plating cylinder 20 further includes a support frame 24 supported on an outer wall of the cylinder body 21. Four corners department of support frame 24 bottom is equipped with footing 241, through the setting of support frame 24 with footing 241, can realize placing whole electroplating device on any plane steadily, has improved electroplating process's stability. Optionally, the supporting frame 24 suspends the cylinder 21, so that a certain space is left between the cylinder 21 and the ground, which facilitates cleaning of the surrounding working environment, and can be used for placing other devices related to the electroplating equipment. Optionally, the supporting frame 24 is welded to the cylinder 21.

Further, the plating cylinder 20 further comprises a hanging rack 23, which is erected at the top end of the plating cylinder 20 along the second direction, and is located in the middle of the plating cylinder 20 along the first direction, for fixing the to-be-plated part 10, so that the to-be-plated part 10 is detachably connected to the hanging rack 23. Optionally, the hanger 23 is detachably connected to the top end of the plating cylinder 20.

In this embodiment, as shown in fig. 1 to 10, during the electroplating of the PCB, the electroplating solution is contained in the containing cavity 211 of the electroplating cylinder 20, and is rotatably disposed at the clamping groove 2121 through the connecting shaft 342, so that the electroplating swing device 30 can be opened or closed, the to-be-plated part 10 is placed in the electroplating swing device 30, the distance between the anode 311 and the to-be-plated part 10 is shortened, and after positive ions fall off from the anode 311, a plating layer can be rapidly formed on the surface of the to-be-plated part 10, thereby improving the electroplating efficiency. Further, drive eccentric wheel 332 through drive shaft 331 and rotate for drive connecting seat 333 drives gyro wheel 3231 and carries out reciprocating motion along the second direction on guide rail 3122, and the plating solution flows back and forth in the clearance of fixed strip 3221, can realize stirring the plating solution better, makes the even distribution of positive ion in the plating solution around waiting to plate 10, and then makes the homogeneity of waiting to plate 10 cladding material thickness obtain improving by a wide margin. Furthermore, the electroplating solution is sent into the spray pipe 41 through the circulating pump, and then is sprayed to the to-be-plated part 10 through the spray head 42, so that the current difference on the surface of the to-be-plated part 10 is reduced, the fluidity of the electroplating solution around the to-be-plated part 10 is increased, the positive ions in the electroplating around the to-be-plated part 10 are uniformly distributed, and the electroplating uniformity is better improved. The electroplating swing device 30 and the spraying assembly 40 are arranged in a double mode, so that the electroplating uniformity and the electroplating efficiency of the piece to be plated 10 can be better improved, and the piece to be plated 10 can be electroplated with low energy consumption, high quality and high efficiency in electroplating liquid. And the piece to be plated 10 is not in contact with the swing plate assembly 32, so that the damage of the piece to be plated 10 is avoided, and the safety of the piece to be plated 10 is improved.

It is to be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. An electroplating device is used for electroplating a piece (10) to be plated; characterized in that the electroplating apparatus comprises:

an electroplating cylinder (20), wherein the electroplating solution is contained in the electroplating cylinder (20);

the electroplating swing device (30) is arranged inside the electroplating cylinder (20), the electroplating swing device (30) comprises two anode slots (31), the two anode slots (31) are arranged oppositely along a first direction, one ends of the two anode slots (31) are respectively connected to the electroplating cylinder (20) in a rotating mode, and the other ends of the two anode slots (31) can be opened or closed oppositely; the anode slot (31) comprises anodes (311), and the to-be-plated part (10) is arranged between the two anodes (311);

the spraying assembly (40) is arranged inside the electroplating cylinder (20) and is arranged on two sides and the bottom of the electroplating swinging device (30) along a second direction, the second direction is perpendicular to the first direction, and the spraying assembly (40) is configured to spray the electroplating solution to the part to be plated (10).

2. Plating apparatus according to claim 1, characterized in that the plating swing device (30) comprises:

the two swinging plate assemblies (32) are respectively arranged on the two anode slots (31) in a sliding manner along the second direction, the swinging plate assemblies (32) are arranged between the two anodes (311), a cathode space is formed between the two swinging plate assemblies (32), and the piece to be plated (10) is arranged in the cathode space;

two driving assemblies (33), the driving assemblies (33) are in driving connection with the swinging plate assembly (32), and the driving assemblies (33) are used for driving the swinging plate assembly (32) to reciprocate between the anode (311) and the piece to be plated (10) along the second direction.

3. The electroplating apparatus according to claim 2, wherein the swing plate assembly (32) comprises a swing plate holder (321), a swing plate (322), and a sliding assembly (323), the swing plate (322) and the sliding assembly (323) are respectively and fixedly disposed on the swing plate holder (321), the swing plate holder (321) is connected to an output end of the driving assembly (33), and the sliding assembly (323) is slidably disposed on the anode slot (31) along the second direction.

4. The plating apparatus as claimed in claim 3, wherein said rocking plate (322) comprises a plurality of fixing bars (3221), and a plurality of said fixing bars (3221) are fixed to said rocking plate fixing frame (321) at equal intervals along said second direction.

5. The electroplating apparatus according to any one of claims 1 to 4, wherein the spray assembly (40) comprises a spray pipe (41), a spray head (42) and a circulating pump, the spray pipe (41) is arranged at two sides and at the bottom of the electroplating swing device (30) along the second direction, the spray head (42) is arranged on the spray pipe (41), the spray head (42) is opened towards the piece to be plated (10), and the circulating pump is connected to the spray pipe (41).

6. An electroplating apparatus according to claim 5, wherein the spray head (42) is provided in plurality, and the plurality of spray heads (42) are equally spaced in the axial direction of the spray pipe (41).

7. The plating apparatus as recited in claim 5, wherein said shower assembly (40) further comprises a suction pipe (43), said suction pipe (43) being connected to said circulation pump, said suction pipe (43) being adapted to suck said plating solution in said plating tank (20) into said circulation pump.

8. Electroplating apparatus according to any of claims 1-4, characterized in that the electroplating cylinder (20) comprises a cylinder body (21) and an overflow box (22), the overflow box (22) is arranged on both sides of the cylinder body (21), the overflow box (22) comprises an overflow port (221), the overflow port (221) opens on the inner wall of the cylinder body (21), and the overflow box (22) and the cylinder body (21) can communicate through the overflow port (221).

9. The plating apparatus as recited in claim 8, wherein the overflow box (22) further comprises an adjusting member (222), the adjusting member (222) is slidably disposed at the overflow port (221) on the inner wall of the cylinder (21) in a third direction, and the adjusting member (222) is configured to adjust an overflow height of the overflow port (221); the third direction is perpendicular to the first direction and the second direction.

10. The electroplating apparatus according to any one of claims 1 to 4, wherein the electroplating cylinder (20) comprises a hanging rack (23), the hanging rack (23) is erected at the top end of the electroplating cylinder (20) along the second direction and is positioned in the middle of the electroplating cylinder (20) along the first direction, and the piece to be plated (10) is detachably arranged on the hanging rack (23).

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