CN208829786U - A kind of electroplanting device - Google Patents
A kind of electroplanting device Download PDFInfo
- Publication number
- CN208829786U CN208829786U CN201821191397.7U CN201821191397U CN208829786U CN 208829786 U CN208829786 U CN 208829786U CN 201821191397 U CN201821191397 U CN 201821191397U CN 208829786 U CN208829786 U CN 208829786U
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- CN
- China
- Prior art keywords
- anode
- cathode
- conducting copper
- slot
- electroplating bath
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- 238000009713 electroplating Methods 0.000 claims abstract description 47
- 238000003756 stirring Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 40
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000007788 liquid Substances 0.000 abstract description 20
- 238000007747 plating Methods 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Abstract
The utility model discloses a kind of electroplanting device, belongs to electroplating technology.The electroplanting device includes DC power supply, slot control machine, electroplating bath, attached slot, circulating pump, filter, anode, electroplate liquid, cathode, electrode seat, blender, temperature controller etc., electroplanting device described in the utility model is easy to operate, functional reliability is high, tank voltage can monitor in real time, interpolar is away from variable, electroplate liquid can be in anode, cathode internal circulation flow, it can be recycled simultaneously, the major parameter of electroplating technology such as current density, the stirring intensity of electroplate liquid etc. is adjustable, the current density of electroplated layer contact surface can be realized well, ion concentration uniformity consistency, to further increase the quality and efficiency of plating.
Description
Technical field
The utility model relates to a kind of electroplanting devices, belong to electroplating technology.
Background technique
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique for making attachment layer of metal film in the surface of metal or other materials product using electrolysis, can change original by plating
The appearance of material surface and various physicochemical properties, such as corrosion resistance, wearability, electrical property, magnetic property, and inside parts are still
It can keep original metallurgy and mechanical performance.
Plating needs the DC power supply powered to electroplating bath and by electroplate liquid, part to be plated (cathode) and anode structure
At electrolysis unit, Anodic is connected with the anode of DC power supply, and part (cathode) to be plated is connected with the cathode of DC power supply.
Electroplate liquid by the compound containing metal lining, conductive salt, buffer, pH adjusting agent and additive etc. aqueous solution group
At.After energization, metal ion in electroplate liquid is moved on cathode under the action of potential difference and forms coating.The metal of anode
It forms metal ion and enters electroplate liquid, to keep the concentration for the metal ion being plated.When plating, the quality of anode material, electricity
Ingredient, temperature, current density, conduction time, stirring intensity, the impurity of precipitation, power supply wave shape of plating solution etc. can all influence coating
Quality, need to be controlled in due course thus.
In view of the above-mentioned problems, propose one kind can improve it is existing in the prior art because of temperature of electroplating solution, current density, stir
Mix intensity, the factors such as impurity of precipitation influence the novel electroplating device of coating uniformity and quality of coating, while to situation in slot
It is monitored in real time, to control the process of plating.
Summary of the invention
The purpose of this utility model is to provide a kind of electroplanting device, including it is DC power supply 1, slot control machine 2, electroplating bath 3, attached
Slot 4, circulating pump 5, filter 6, anode 7, overflow port 8, cathode 9, electrode seat 10, blender 11, temperature controller 12, anode conducting copper bar
13, cathode conducting copper 14, inlet 15；The upper end of electroplating bath 3 is equipped with overflow port 8, and bottom is equipped with inlet 15, overflow port 8
Be connected to filter 6, filter 6, attached slot 4, circulating pump 5, electroplating bath 3 inlet 15 be sequentially communicated；It is equipped with inside electroplating bath 3
Temperature controller 12 and blender 11, temperature controller 12 and blender 11 are fixed on the top of electroplating bath 3；Anode 7, cathode 9 are in electroplating bath 3
Interior anode 7 is coated metal in being oppositely arranged, and passes through the anode with DC power supply 1, slot control machine 2 respectively of anode conducting copper bar 13
Connection, cathode 9 are workpiece to be plated, are connect respectively with the cathode of DC power supply 1, slot control machine 2 through cathode conducting copper 14；Slot control machine
2 connect with DC power supply 1, are powered by DC power supply 1 for it；Electrode seat 10 is located at 3 top of electroplating bath, and anode 7, cathode 9 are distinguished
Be fixed in electrode seat 10 by anode conducting copper bar 13, cathode conducting copper 14, can be slided in electrode seat 10 with change interpolar away from.
Preferably, the current regulation scope of DC power supply 1 described in the utility model is 0-20A.
Preferably, electrode seat 10 described in the utility model is in cuboid framework structure, and 10 two sides of electrode seat are equipped with slot, long
The height of square hole is consistent with the height of anode conducting copper bar 13, cathode conducting copper 14, and anode 7, cathode 9 can pass through anode
Conducting copper 13, cathode conducting copper 14 slide in slot.
Preferably, the interpolar of anode 7 described in the utility model, cathode 9 is away from for 60-150mm.
Preferably, the revolving speed of blender 11 described in the utility model is the temperature-measuring range of 200-2000r/min, temperature controller 12
It is 20-100 DEG C.
(1) according to the difference of electroplating technique and requirement, the type of anode 7, cathode 9, electroplate liquid is reasonably selected；Anode 7,
Cathode 9 is relatively placed side by side in electroplating bath 3, interpolar away from by anode conducting copper bar 13, cathode conducting copper 14 is in electrode seat 10
On sliding be achieved.
(2) anode 7, cathode 9 connected by conducting wire according to certain mode to (string may be selected in such as single anode, cathode
Connection；Parallel connection may be selected in muti-piece anode, cathode plate), anode conducting copper bar 13 is connected to the anode of DC power supply 1, and cathode is conductive
Copper bar 14 is connected to the cathode of DC power supply 1, the access in parallel of slot control machine 2, so that the tank voltage tested in electroplating bath 3 changes feelings
Condition.
(3) fill electroplate liquid to be reacted in attached slot 4, under the action of circulating pump 5, electroplate liquid by electroplating bath bottom end into
Liquid mouth 15 flows into electroplating bath, opens DC power supply 1, is adjusted to required size of current, opens simultaneously slot control machine 2, blender
11, temperature controller 12 so as to tank voltage, electroplate liquid in slot convection current and temperature monitored, electroplating reaction starts to carry out；With
The progress of electroplating reaction, the electroplate liquid in electroplating bath flow out through overflow port 8, then through 6 filtration treatment of filter, then flow back into
To recycle in attached slot 4.
(4) in the plating process, the size of current of plating, the speed of electroplate liquid convection current are adjusted, in time so as to accurate recording
Tank voltage situation of change；If there is the unreasonable situation of tank voltage, relevant parameter is adjusted in time.
The utility model has the following beneficial effects: device is easy to operate, functional reliability is high, tank voltage can be monitored in real time, pole
Spacing is variable, and electroplate liquid can be recycled, the major parameter of electroplating technology is such as simultaneously in anode, cathode internal circulation flow
Current density, the stirring intensity etc. of electroplate liquid are adjustable, can realize that the current density of electroplated layer contact surface, ion are dense well
Uniformity consistency is spent, to further increase the quality and efficiency of plating.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of electrode seat described in the utility model.
In figure: 1- DC power supply；2- slot control machine；3- electroplating bath；The attached slot of 4-；5- circulating pump；6- filter；7- anode；8-
Overflow port；9- cathode；10- electrode seat；11- blender；12- temperature controller；13- anode conducting copper bar；14- cathode conducting copper；15-
Inlet.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but the guarantor of the utility model
Shield range is not limited to the content.
Embodiment 1
A kind of electroplanting device, including DC power supply 1, slot control machine 2, electroplating bath 3, attached slot 4, circulating pump 5, filter 6, anode
7, overflow port 8, cathode 9, electrode seat 10, blender 11, temperature controller 12, anode conducting copper bar 13, cathode conducting copper 14, inlet
15；The upper end of electroplating bath 3 is equipped with overflow port 8, and bottom is equipped with inlet 15, and overflow port 8 is connected to filter 6, filter 6, attached
Slot 4, circulating pump 5, electroplating bath 3 inlet 15 be sequentially communicated；It is equipped with temperature controller 12 and blender 11 inside electroplating bath 3, is used for
The convection current and temperature of the electroplate liquid in electroplating process are monitored, temperature controller 12 and blender 11 are fixed on the top of electroplating bath 3；Anode
7, for cathode 9 in being oppositely arranged in electroplating bath 3, anode 7 is coated metal, by anode conducting copper bar 13 respectively with DC power supply
1, the anode connection of slot control machine 2, cathode 9 are workpiece to be plated, through cathode conducting copper 14 respectively with DC power supply 1, slot control machine 2
Cathode connection；Slot control machine 2 is connect with DC power supply 1, is powered by DC power supply 1 for it；Electrode seat 10 is located at 3 top of electroplating bath,
Anode 7, cathode 9 are fixed in electrode seat 10 by anode conducting copper bar 13, cathode conducting copper 14 respectively, can be slided in electrode seat 10
It is dynamic with change interpolar away from.
DC current needed for DC power supply 1 described in the present embodiment is used to provide plating；The slot control machine 2 is used for slot
Intracorporal tank voltage variation is monitored in real time, to judge whether plating process is smooth.
Specifically used process are as follows: electroplating bath 3, attached slot 4 are in opening, and electroplate liquid to be reacted is located in attached slot 4, electroplating bath
3 bottom ends are equipped with inlet 15, and electroplate liquid to be reacted is flowed out from attached slot, flow into electroplating bath 3, make under the action of circulating pump 5
It is circulated between anode 7, cathode 9, and then the overflow port 8 of electroplated slot 3 and filter 6 flow back in attached slot 4 after filtering, with
Just electroplate liquid recycles；The blender 11, temperature controller 12 are inserted into electroplating bath 3；In electroplating process, direct current electrode position electric current is
5A, interpolar is away from for 60mm, and temperature of electroplating solution is 40 DEG C, agitator speed 200r/min.
Embodiment 2
The present embodiment structure is same as Example 1, difference be the electrode seat 10 in cuboid framework structure, 10 liang of electrode seat
Side is equipped with slot, and the height of slot is consistent with the height of anode conducting copper bar 13, cathode conducting copper 14, anode 7,
Cathode 9 can be slided in slot by anode conducting copper bar 13, cathode conducting copper 14.
In electroplating process: direct current electrode position electric current is 10A, and interpolar is away from being 100mm, and temperature of electroplating solution is 30 DEG C, blender turn
Speed is 400r/min.
Claims (5)
1. a kind of electroplanting device, it is characterised in that: including DC power supply (1), slot control machine (2), electroplating bath (3), attached slot (4), follow
Ring pumps (5), filter (6), anode (7), overflow port (8), cathode (9), electrode seat (10), blender (11), temperature controller (12), sun
Pole conducting copper (13), cathode conducting copper (14), inlet (15)；The upper end of electroplating bath (3) is equipped with overflow port (8), bottom
Equipped with inlet (15), overflow port (8) is connected to filter (6), filter (6), attached slot (4), circulating pump (5), electroplating bath (3)
Inlet (15) be sequentially communicated；Temperature controller (12) and blender (11), temperature controller (12) and stirring are equipped with inside electroplating bath (3)
Device (11) is fixed on the top of electroplating bath (3)；In being oppositely arranged in electroplating bath (3), anode (7) is for anode (7), cathode (9)
Coated metal is connect with the anode of DC power supply (1), slot control machine (2) respectively by anode conducting copper bar (13), and cathode (9) is
Workpiece to be plated is connect with the cathode of DC power supply (1), slot control machine (2) respectively through cathode conducting copper (14)；Slot control machine (2) with
DC power supply (1) connection, is powered by DC power supply (1) for it；Electrode seat (10) is located at the top of electroplating bath (3), anode (7), yin
Pole (9) is fixed on electrode seat (10) by anode conducting copper bar (13), cathode conducting copper (14) respectively, can be on electrode seat (10)
Sliding with change interpolar away from.
2. electroplanting device according to claim 1, it is characterised in that: the current regulation scope of the DC power supply (1) is 0-
20A。
3. electroplanting device according to claim 1, it is characterised in that: the electrode seat (10) is in cuboid framework structure, electrode seat
(10) two sides are equipped with slot, the height of the height of slot and anode conducting copper bar (13), cathode conducting copper (14)
Unanimously, anode (7), cathode (9) can be sliding in slot by anode conducting copper bar (13), cathode conducting copper (14)
It is dynamic.
4. electroplanting device according to claim 1, it is characterised in that: anode (7), cathode (9) interpolar away from for 60-150mm.
5. electroplanting device according to claim 1, it is characterised in that: the revolving speed of the blender (11) is 200-2000r/
Min, temperature controller (12) temperature-measuring range be 20-100 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821191397.7U CN208829786U (en) | 2018-07-26 | 2018-07-26 | A kind of electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821191397.7U CN208829786U (en) | 2018-07-26 | 2018-07-26 | A kind of electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208829786U true CN208829786U (en) | 2019-05-07 |
Family
ID=66307391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821191397.7U Expired - Fee Related CN208829786U (en) | 2018-07-26 | 2018-07-26 | A kind of electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208829786U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110424047A (en) * | 2019-09-19 | 2019-11-08 | 衢州柯城幕布电子有限公司 | A kind of metal material surface plater |
| CN110846702A (en) * | 2019-12-20 | 2020-02-28 | 湖南化工职业技术学院 | Stainless steel electrochemical coloring potential control device |
| CN114016095A (en) * | 2021-12-17 | 2022-02-08 | 深圳市天熙科技开发有限公司 | Process method for uniformly electroplating inorganic non-metal substrate |
-
2018
- 2018-07-26 CN CN201821191397.7U patent/CN208829786U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110424047A (en) * | 2019-09-19 | 2019-11-08 | 衢州柯城幕布电子有限公司 | A kind of metal material surface plater |
| CN110424047B (en) * | 2019-09-19 | 2020-08-11 | 马鞍山佰斯予菲环保新材料科技有限公司 | Metal material surface plating device |
| CN110846702A (en) * | 2019-12-20 | 2020-02-28 | 湖南化工职业技术学院 | Stainless steel electrochemical coloring potential control device |
| CN110846702B (en) * | 2019-12-20 | 2024-04-05 | 湖南化工职业技术学院 | Stainless steel electrochemical coloring potential control device |
| CN114016095A (en) * | 2021-12-17 | 2022-02-08 | 深圳市天熙科技开发有限公司 | Process method for uniformly electroplating inorganic non-metal substrate |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190507 Termination date: 20190726 |
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| CF01 | Termination of patent right due to non-payment of annual fee |