CN217405398U

CN217405398U - Make things convenient for wave filter wafer bearing structure for striping

Info

Publication number: CN217405398U
Application number: CN202220556351.0U
Authority: CN
Inventors: 余文锦
Original assignee: RF360 Technology Wuxi Co Ltd
Current assignee: RF360 Technology Wuxi Co Ltd
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-09-09
Anticipated expiration: 2032-03-15

Abstract

The utility model provides a make things convenient for supporting structure for wave filter wafer striping, it is through playing the supporting role to the wafer for the atress is more even when it strips the membrane, has improved production efficiency and yields. The wafer fixing device comprises a supporting disc, wherein the supporting disc is annular and is arranged at the opening of a sucker for fixing a wafer, two notches are formed in the outer surface of the supporting disc, and the top points of the two notches correspond to two corner portions of the notch of the wafer respectively.

Description

Make things convenient for wave filter wafer bearing structure for striping

Technical Field

The utility model relates to a wave filter wafer striping technical field specifically is a make things convenient for wave filter wafer bearing structure for striping.

Background

In the grinding process of the filter wafer, a layer of protective film is required to be attached to the front surface of the filter wafer, the wafer after film attachment is subjected to rotary grinding, and after the wafer is ground to a target thickness, the thinned wafer is required to be transferred to a film tearing machine for film removal. However, when the film tearing machine is used for film tearing operation, the wafer is only fixed through the suction of the suction disc, and due to the lack of the supporting structure, the stress of the filter wafer is uneven when the film is torn, cracks are easy to generate, the defects of the cracks are difficult to see clearly through naked eyes on the wafer, the defects can be found only through detection under the high-power mirror, so that the wafer after the film is torn needs to be detected completely through the high-power mirror, and the production efficiency and the yield are greatly influenced.

SUMMERY OF THE UTILITY MODEL

Adopt the dyestripping machine dyestripping to current wave filter wafer after grinding attenuate technology, owing to lack bearing structure, make the wafer easily produce the crackle, lead to production efficiency and yields to produce the problem of great influence, the utility model provides a make things convenient for wave filter wafer to remove supporting structure for the membrane, it is through playing the supporting role to the wafer for the atress is more even when its membrane is removed, has improved production efficiency and yields.

The technical scheme is as follows: the utility model provides a make things convenient for supporting structure for wave filter wafer striping which characterized in that: the wafer fixing device comprises a supporting disc, wherein the supporting disc is annular and is arranged at the opening of a sucker for fixing a wafer, two notches are formed in the outer surface of the supporting disc, and the top points of the two notches correspond to two corner portions of the notch of the wafer respectively.

It is further characterized in that: an adhesive layer is arranged on the surface of the supporting disc corresponding to the contact part of the wafer, the adhesive layer is an EGT film, and the contact surface of the adhesive layer and the wafer is adhesive;

the periphery of the supporting disc is trimmed along four directions, and the size of the supporting disc after trimming is matched with the mouth of the material box for containing the wafer.

After having adopted above-mentioned structure, through add the supporting disk on the sucking disc that fixed wafer was used, then when the sucking disc adsorbs the wafer, this supporting disk plays the supporting role to the wafer periphery to fixed effect is better, can the atress even when making the dyestripping, still is equipped with two breach portions on this supporting disk simultaneously, fixes a position the wave filter wafer through breach portion, thereby can guarantee that the wafer is counterpointed when fixed accurate.

Drawings

FIG. 1 is a cross-sectional view of a filter wafer;

fig. 2 is a top view of the present invention;

in the figure: 1. a wafer; 2. a support disc; 3. a notch; 4. and (6) bonding layers.

Detailed Description

As shown in fig. 1, a support structure for facilitating film removal of a filter wafer includes a support disk 2, the support disk 2 is made of stainless steel material and has a thickness of 1.2mm, the support disk 2 is annular and is installed at an opening of a chuck for fixing the wafer, two notches 3 are provided on an outer surface of the support disk 2, and vertexes of the two notches 3 correspond to two corners of the notch of the wafer respectively. Before tearing the membrane machine and tearing the membrane, arrange the wafer in supporting disk 2, after the summit department through two bights of the incision department on the wafer corresponds the setting with the summit department in the bight of two breach 3 of supporting disk, the wafer position is looked for accurately, and it is fixed to inhale the vacuum through the vacuum equipment that inhales that is connected with the sucking disc again, tears the membrane operation through the membrane machine of tearing of outside at last, because the supporting role of supporting disk 2, makes the wafer can the atress even when removing the membrane, effectively prevents to produce the crackle.

Furthermore, the surface of the supporting disc 2 is provided with an adhesive layer 4 corresponding to the contact part of the wafer, the adhesive layer 4 is an EGT film, one side of the adhesive layer 4 is pasted on the surface of the wafer, and the other side of the adhesive layer is slightly sticky with the contact surface of the wafer, so that the wafer can be further prevented from being in serial position, and the fixing effect is better.

Further, all cut edge on the periphery of supporting disk 2 along four directions, because 2 sizes of supporting disk after cutting edge are adapted with the magazine oral area that holds the wafer to can conveniently take and put the wafer from the magazine.

The above description is only for the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a make things convenient for supporting structure for wave filter wafer striping which characterized in that: the wafer fixing device comprises a supporting disc, wherein the supporting disc is annular and is arranged at the opening of a sucker for fixing a wafer, two notches are formed in the outer surface of the supporting disc, and the top points of the two notches correspond to two corner portions of the notch of the wafer respectively.

2. The support structure of claim 1, wherein the support structure is configured to facilitate de-filming of a filter wafer: the wafer supporting structure is characterized in that an adhesive layer is arranged on the surface of the supporting disc corresponding to the contact position of the wafer, the adhesive layer is an EGT film, and the contact surface of the adhesive layer and the wafer is adhesive.

3. The support structure of claim 2, wherein the support structure is configured to facilitate de-filming of a filter wafer: the periphery of the supporting disc is trimmed along four directions, and the size of the supporting disc after trimming is matched with the mouth of the material box for containing the wafer.