CN217389104U

CN217389104U - PCB board, antenna module and electronic equipment

Info

Publication number: CN217389104U
Application number: CN202221263460.XU
Authority: CN
Inventors: 谷海川
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-09-06
Anticipated expiration: 2032-05-23

Abstract

The PCB (100) comprises at least two pad layers (101) and at least two dielectric layers (102), wherein the pad layers (101) and the dielectric layers (102) are alternately stacked, the at least two pad layers (101) are fixed together through the dielectric layers (102), connecting pieces (103) are arranged between the adjacent two pad layers (101), and two ends of each connecting piece (103) are fixedly connected with the corresponding pad layer (101). Through the technical scheme, the PCB can improve the performance of the anti-drawing force of the welding pad layer, so that the assembly yield is improved, and the cost is saved.

Description

PCB board, antenna module and electronic equipment

Technical Field

The present disclosure relates to the field of wireless communication technologies, and in particular, to a PCB, an antenna assembly, and an electronic device.

Background

The electric connection mode of the antenna feed point generally adopts a spring plate, and the electric connection mode of the spring plate is divided into a positive spring and a side spring. The side spring pieces are divided into a broken plate type and a surface-mounted type, the broken plate type spring pieces occupy large space, and the broken plate can reduce the usable area of a Printed Circuit Board (PCB); the surface-mounted type can avoid the defects, so that the surface-mounted type is welcomed. When the spring plate is used in a key feed point of the antenna, generally, only one layer of pad is left on the PCB for SMT (Surface mount Technology, but in the whole machine assembling process, the spring plate itself has a corresponding drawing force, and one layer of pad is subject to the drawing force, and is very easy to fall off, resulting in the scrapping of the motherboard, and resulting in the reduction of the assembling yield and the cost loss.

SUMMERY OF THE UTILITY MODEL

The purpose of the present disclosure is to provide a PCB capable of improving the anti-drawing performance of a pad layer, thereby improving the assembly yield and saving the cost.

In order to achieve the above object, the present disclosure provides a PCB, which includes at least two pad layers and at least two dielectric layers, wherein the pad layers and the dielectric layers are stacked alternately, and the at least two pad layers are fixed together through the dielectric layers, wherein a connecting member is disposed between two adjacent pad layers, and two ends of the connecting member are respectively and fixedly connected to the corresponding pad layers.

Optionally, the connecting member is configured as a metal member, and two adjacent pad layers are electrically connected through the connecting member.

Optionally, two adjacent pad layers are connected by a plurality of connecting pieces, and the connecting pieces are arranged at intervals.

Optionally, the dielectric layer covers the connecting member and fixes the connecting member in the dielectric layer.

On the basis of the technical scheme, the antenna assembly comprises a shell assembly and the PCB, wherein the PCB is arranged in the shell assembly and is electrically connected with the shell assembly through an elastic sheet.

Optionally, the housing assembly includes a metal frame and a metal middle frame, and the PCB is fixed to the metal middle frame and electrically connected to the metal frame through the spring piece.

Optionally, the housing assembly comprises a plastic housing and a metal middle frame, the plastic housing is fixedly provided with an FPC, and the PCB is fixed on the metal middle frame and electrically connected with the FPC through the elastic sheet.

Optionally, the elastic sheet is electrically connected with the pad layer of the PCB by welding.

Optionally, the elastic sheet and the PCB are arranged at a preset included angle, and the preset included angle is 0 ° to 90 °.

On the basis of the technical scheme, the present disclosure further provides an electronic device, which includes the antenna assembly.

Through the technical scheme, in the PCB provided by the disclosure, the pad layers and the dielectric layers are alternately stacked, namely, the first layer of the PCB is used as the pad layer, the second layer is used as the dielectric layer, the third layer is used as the pad layer, and the fourth layer is formed by sequentially recurrently stacking the dielectric layers in such a way, wherein the multiple pad layers are fixed together through the dielectric layers, and the two adjacent pad layers are fixedly connected together through the connecting piece.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:

fig. 1 is a schematic structural diagram of a PCB provided in an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of an antenna assembly provided by a first embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of an antenna assembly provided by a second embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of an antenna assembly provided by a third embodiment of the present disclosure;

fig. 5 is a schematic structural diagram illustrating an arrangement of a PCB board and a spring plate in an antenna assembly according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of another arrangement manner of a PCB board and a spring piece in an antenna assembly provided by the embodiment of the disclosure.

Description of the reference numerals

100-a PCB board; 101-a pad layer; 102-a dielectric layer; 103-a connector; 200-a housing assembly; 201-metal frame; 202-metal middle frame; 203-plastic shell; 300-a spring plate; 400-FPC; 500-display screen.

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, the use of the terms of orientation such as "inner and outer" in the absence of a contrary indication means "inner and outer" with respect to the profile of the corresponding component itself, which in the drawings provided in the present disclosure correspond to the lower and upper orientation in the plane of the drawings of figures 2 to 4, respectively. Furthermore, in the following description, when referring to the figures, the same reference numbers in different figures denote the same or similar elements, unless otherwise explained. The foregoing definitions are provided to illustrate and describe the present disclosure only and should not be construed to limit the present disclosure.

According to the specific embodiment of the present disclosure, referring to fig. 1, a PCB 100 is provided, where the PCB 100 includes at least two pad layers 101 and at least two dielectric layers 102, the pad layers 101 and the dielectric layers 102 are alternately stacked, and the at least two pad layers 101 are fixed together through the dielectric layers 102, where a connecting member 103 is disposed between two adjacent pad layers 101, and two ends of the connecting member 103 are respectively fixedly connected to the corresponding pad layers 101.

Through the technical scheme, in the PCB 100 provided by the disclosure, the pad layers 101 and the dielectric layers 102 are alternately stacked, that is, the first layer of the PCB 100 is the pad layer 101, the second layer is the dielectric layer 102, the third layer is the pad layer 101, and the fourth layer is the dielectric layer 102, which are sequentially stacked in a recursion manner, wherein the multiple pad layers 101 are fixed together through the dielectric layers 102, and the two adjacent pad layers 101 are fixedly connected together through the connecting piece 103, so that the multiple pad layers 101 can be connected into a whole through the dielectric layers 102 and the connecting piece 103, thereby enhancing the connection reliability between the pad layers 101 and the pad layers 101, preventing the pad layers 101 from falling off from the dielectric layers 102 due to an external acting force, enhancing the anti-pulling performance of the pad layers 101, thereby enhancing the assembly yield of the PCB 100, and saving the cost.

In the specific embodiment provided in the present disclosure, the PCB board 100 may include two or more pad layers 101, for example, three, four, five, six, seven, eight, nine, ten or more pad layers 101, according to actual requirements, which is not limited in the present disclosure.

In the embodiments provided in the present disclosure, the connection member 103 may be configured in any suitable manner, and it is sufficient to connect two adjacent pad layers 101 together, thereby improving the pull-out resistance of the pad layers 101. Alternatively, the connecting member 103 may be configured as a metal member, and two ends of the metal member may be electrically connected to the corresponding pad layers 101 in a welding manner, so as to achieve electrical connection between the two adjacent pad layers 101. In this embodiment, the metal member may be made of any one of aluminum, iron, tin, copper, silver, gold, and platinum, or any one of alloys of aluminum, iron, tin, copper, silver, gold, and platinum, and the disclosure is not particularly limited thereto.

In the specific embodiment provided in the present disclosure, referring to fig. 1, two adjacent pad layers 101 are connected by a plurality of connecting members 103, and the plurality of connecting members 103 are arranged at intervals to further improve the connection reliability between the

pad layers

101 and 101. The connecting pieces 103 can be arranged at intervals along the length direction and/or the width direction of the PCB 100, and thus, a plurality of connecting points exist between two adjacent layers of the pad layer 101, so that the connection reliability between the pad layer 101 and the pad layer 101 can be improved, the pad layer 101 is prevented from falling off from the dielectric layer 102 due to external acting force, the pull resistance of the pad layer 101 is improved, the assembly yield of the PCB 100 is improved, and the cost is saved.

In the specific embodiment provided by the present disclosure, the dielectric layer 102 may be made of a resin material, the resin material is applied between the pad layer 101 and the pad layer 101, the dielectric layer 102 is formed after the resin material is cured, the dielectric layer 102 covers the connecting member 103 and fixes the connecting member 103 in the dielectric layer 102, so that the multilayer pad layer 101 and the connecting member 103 are fixed by the dielectric layer 102, and the pad layer 101 and the connecting member 103 are fixedly connected, and thus when the pad layer 101 is subjected to an external acting force, a tensile force can be applied to the pad layer 101 by the connecting member 103, so that the pad layer 101 and the dielectric layer 102 are kept fixed in position, the pad layer 101 is prevented from falling off from the dielectric layer 102, and the anti-pull performance of the pad layer 101 is improved.

On the basis of the above technical solution, the present disclosure further provides an antenna assembly, as shown in fig. 2 to fig. 6, the antenna assembly includes a housing assembly 200 and the PCB 100, the PCB 100 is disposed in the housing assembly 200 and electrically connected to the housing assembly 200 through an elastic sheet 300, so that a circuit on the PCB 100 can be electrically connected to the housing assembly 200, the housing assembly 200 serves as a radiator of the antenna assembly, the elastic sheet 300 serves as a feed point of the antenna assembly, when a device at a radio frequency front end on the PCB 100 sends a signal, the signal can be transmitted to the elastic sheet 300 through a pad layer 101 on the PCB 100, and then transmitted to the housing assembly 200 through the elastic sheet 300, so that the signal is transmitted through the housing assembly 200, and a loop is formed between the PCB 100 and the housing assembly 200 through the elastic sheet 300, thereby implementing signal conduction. The antenna assembly has the advantages of being high in assembly yield and low in cost. In addition, the antenna component provided by the present disclosure also has the above features, and is not described herein again in order to avoid repetition.

In the specific embodiment provided by the present disclosure, referring to fig. 2 and 3, the housing assembly 200 may include a metal frame 201 and a metal middle frame 202, the PCB 100 is fixed to the metal middle frame 202 and electrically connected to the metal frame 201 through the elastic sheet 300, in this embodiment, the metal middle frame 201 serves as a radiator of an antenna assembly, the elastic sheet 300 serves as a feed point of the antenna assembly, when a device at the front end of radio frequency on the PCB 100 sends a signal, the signal may be transmitted to the elastic sheet 300 through the pad layer 101 on the PCB 100 and then transmitted to the metal frame 201 by the elastic sheet 300, so that the signal is transmitted through the metal frame 201, and a loop is formed between the PCB 100 and the metal middle frame 201 through the elastic sheet 300, thereby implementing signal conduction.

In this embodiment, the elastic sheet 300 may realize the electrical connection between the PCB board 100 and the metal frame 201 by a positive elastic manner or a side elastic manner. Fig. 2 shows that the elastic sheet 300 is used to electrically connect the PCB 100 and the metal frame 201 through positive elasticity, in this case, a part of the metal frame 201 is located below the PCB 100 (in the drawing direction of fig. 2), and the PCB 100 is electrically connected to the metal frame 201 through the elastic sheet 300. Fig. 3 shows that the elastic sheet 300 realizes the electrical connection between the PCB board 100 and the metal frame 201 through the side spring, in this case, the metal frame 201 is located at the side of the PCB board 100, and the elastic sheet 300 is in contact with the side wall of the metal frame 201.

The elastic sheet 300 may be electrically connected to the pad layer 101 of the PCB 100 by soldering, so as to electrically connect the PCB 100 and the metal frame 201. In addition, the elastic sheet 300 may also be electrically connected to the electrical connection portion on the PCB board 100 by a suitable manner, such as clamping, and the disclosure is not limited thereto.

Wherein, the spring plate 300 and the PCB 100 are arranged at a predetermined included angle, and the predetermined included angle is 0 to 90 °. In the embodiment shown in fig. 5, the elastic sheet 300 extends perpendicular to the PCB 100, that is, the preset included angle between the elastic sheet 300 and the PCB 100 is 90 °, that is, the elastic sheet 300 is connected to the PCB 100 through a positive spring, in the embodiment shown in fig. 6, the elastic sheet 300 extends obliquely to the PCB 100, that is, the elastic sheet 300 is connected to the PCB 100 through a side spring, and the preset included angle between the elastic sheet 300 and the PCB 100 may be designed arbitrarily according to actual requirements, which is not limited in the present disclosure.

In the specific embodiment provided by the present disclosure, referring to fig. 4, the housing assembly 200 includes a plastic housing 203 and a metal middle frame 202, the plastic housing 203 is fixedly provided with an FPC (Flexible Printed Circuit) 400, and the PCB 100 is fixed to the metal middle frame 202 and electrically connected to the FPC400 through an elastic sheet 300, so that the electrical connection between the PCB 100 and the housing assembly 200 is realized through the FPC 400. The FPC400 may be fixedly disposed on the plastic housing 203 in an adhesive manner, and when a device at the front end of the radio frequency on the PCB 100 transmits a signal, the signal may be transmitted to the elastic sheet 300 through the pad layer 101 on the PCB 100 and then transmitted to the FPC400 through the elastic sheet 300, so that the signal is transmitted through the FPC400, and a loop is formed between the PCB 100 and the FPC400 through the elastic sheet 300, thereby implementing signal conduction. In this embodiment, the elastic sheet 300 realizes the connection between the PCB 100 and the FPC400 by positive elasticity, in which case the FPC400 is positioned right above the PCB 100 (in the drawing direction of fig. 4), and the PCB 100 is electrically connected to the FPC400 through the elastic sheet 300.

On the basis of the technical scheme, the electronic equipment comprises the antenna assembly, and has the characteristics of high assembly yield and low cost. In addition, the electronic device provided by the present disclosure also has the above features, and is not described herein again in order to avoid redundancy.

In the present disclosure, the electronic device may include, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a personal digital assistant, a portable media player, a mobile internet access device, a wearable device, a vehicle-mounted terminal, an electronic book or a navigator, and the like, and the present disclosure is not limited thereto.

Furthermore, in the embodiment shown in fig. 2-4, the electronic device includes a display screen 500, the display screen 500 being mounted on the metal bezel 202.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

It should be noted that, in the above embodiments, the various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations will not be further described in the present disclosure.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims

1. The PCB is characterized by comprising at least two bonding pad layers and at least two dielectric layers, wherein the bonding pad layers and the dielectric layers are alternately stacked, the at least two bonding pad layers are fixed together through the dielectric layers, a connecting piece is arranged between every two adjacent bonding pad layers, and two ends of the connecting piece are respectively and fixedly connected with the corresponding bonding pad layers.

2. The PCB of claim 1, wherein the connecting member is configured as a metal member, and two adjacent pad layers are electrically connected by the connecting member.

3. The PCB board of claim 2, wherein two adjacent pad layers are connected by a plurality of connecting pieces, and the connecting pieces are arranged at intervals.

4. The PCB board of any one of claims 1-3, wherein the dielectric layer covers the connector and secures the connector in the dielectric layer.

5. An antenna assembly, characterized in that the antenna assembly comprises a housing assembly and a PCB board according to any of claims 1-4, the PCB board being arranged within the housing assembly and electrically connected with the housing assembly by a spring sheet.

6. The antenna assembly of claim 5, wherein the housing assembly comprises a metal bezel and a metal middle frame, and the PCB board is fixed to the metal middle frame and electrically connected to the metal bezel through the spring piece.

7. The antenna assembly of claim 5, wherein the housing assembly comprises a plastic housing and a metal middle frame, the plastic housing is fixedly provided with an FPC, and the PCB is fixed to the metal middle frame and electrically connected with the FPC through the elastic sheet.

8. The antenna assembly of claim 5, wherein the spring sheet is electrically connected to the land layer of the PCB board by soldering.

9. The antenna assembly of claim 5, wherein the spring plate is disposed at a predetermined angle with respect to the PCB, and the predetermined angle is 0 ° to 90 °.

10. An electronic device, characterized in that the electronic device comprises an antenna assembly according to any one of claims 5-9.